Advincula
Abelardo Hadap Advincula, Singapore SG
Patent application number | Description | Published |
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20080237816 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATING FEATURES - An integrated circuit package system is provided including forming a lead frame includes forming a mold gate, providing a first surface, and providing a second surface opposite the first surface; and forming angled gate sides facing each other in the mold gate between the first surface and the second surface. | 10-02-2008 |
20080284002 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH THIN PROFILE - An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an integrated circuit die with the backside element, the backside element is on a first passive side of the integrated circuit die; connecting a first active side of the integrated circuit die and the external interconnect; and forming a first encapsulation over the integrated circuit die with the backside element exposed. | 11-20-2008 |
20080308933 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT CONNECTION STRUCTURES - An integrated circuit package system is provided including forming an external interconnect having a tip without a die-attach paddle; mounting a first integrated circuit device structure having a conductive ball over the tip; connecting a first wire between the first integrated circuit device structure and under the tip; and encapsulating the first integrated circuit device structure, the first wire, and the external interconnect with the external interconnect partially exposed. | 12-18-2008 |
Abelardo Jr. Hadap Advincula, Singapore SG
Patent application number | Description | Published |
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20100140789 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXPOSED TERMINAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on the connection pad; and encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation. | 06-10-2010 |
20110140252 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL ROW LEAD-FRAME HAVING TOP AND BOTTOM TERMINALS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming outer leads having outer terminal sections, the outer terminal sections having an upper terminal and a bottom terminal; forming inner leads having inner terminal sections wider than a distance between the outer terminal sections of the outer leads, and the inner terminal sections have an upper terminal and a bottom terminal; connecting an integrated circuit to the inner leads and the outer leads; and encapsulating the integrated circuit, the inner leads, and the outer leads with an encapsulation while leaving the upper terminals and the bottom terminals of the outer terminal sections and the upper terminals and bottom terminals of the inner terminal sections exposed from the encapsulation. | 06-16-2011 |
Arnold Advincula, Ann Arbor, MI US
Patent application number | Description | Published |
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20110004204 | Surgical Instrument and Method for Use Thereof - A surgical instrument for treating a tissue includes a handpiece and a tissue engaging portion arranged to be received by the handpiece. The tissue engaging portion includes first and second opposed jaw members having an open position and a closed position for engaging the tissue therebetween, where the first and second jaw members are arranged to receive surgical energy from a surgical generator. The tissue engaging portion further includes at least one cooling member spaced from at least one of the first and second jaw members, where the cooling member has an open position and a closed position for engaging the tissue. Positioning the jaw members in their closed position and applying surgical energy to the tissue allows for treatment of the tissue, and positioning the cooling member in its closed position provides at least one of a pressure gradient or a thermal gradient between the jaw members and the cooling member. | 01-06-2011 |
Jerry Galanga Advincula, Singapore SG
Patent application number | Description | Published |
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20110084684 | SWITCHING OF RESISTOR EPI BIASING FOR REVERSED RESISTOR CONNECTION IN OFFSET ELEMENT CANCELLATION SYSTEM - A method of improving voltage detection accuracy and precision by employing a switchable resistor epi bias design, which consists of switches to control connection of resistor epi bias. By constantly maintaining the resistor epi bias to its own resistor terminal bias via switches, higher accuracy detection than conventional resistor bias method can be achieved. | 04-14-2011 |
Rigoberto Advincula, Friendswood, TX US
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20090233077 | Anti-reflection coatings and methods of preparing and using same - Three dimensional anti-reflection porous films or coated substrates and method for forming the films or coated substrates are disclosed, where the films or coatings have optical transmittances of at least 86% or a reflectance of at most 4%. The 3D anti-reflection porous film or coating compositions (a) one polymer or a plurality of network polymers, (b) one particles and/or a plurality particles, (c) optionally one crosslinking agent or a plurality of crosslinking agents, (d) optionally one oligomer or a plurality of oligomers, (e) optionally one polymerized monomer or a plurality of polymerized monomers, and (f) optionally void spaces, where the composition has a transmittance value of at least 86% or a reflectance value of at most 4%. | 09-17-2009 |
20090236229 | METHODS FOR PREPARING POLYMER COATINGS BY ELECTROCHEMICAL GRAFTING OF POLYMER BRUSHES, COMPOSITIONS PREPARED THEREBY AND COMPOSITIONS FOR PREPARING THE COATINGS - New methods for the grafting of complex polymer coatings onto conducting surfaces, new grafting compositions and new substrates with grafted coating of the grafting compositions are disclosed. The method offers a new and convenient approach for the preparation of polymer coatings by electrochemically grafting and reactive crosslinking, and/or graft polymerizing. | 09-24-2009 |
20110207878 | KNOTTY POLYMERS VIA SUPRAMOLECULARLY TEMPLATED MACROINITIATORS AND LIVING POLYMERIZATION AND METHODS FOR MAKING AND USING SAME - A design, synthesis and use of templated chemical routes are disclosed for the synthesis of interlocked macromolecular structures and orderly entanglements that are dubbed “Knotty Polymers” using combined supramolecularly assembled macroinitiators and living polymerization. | 08-25-2011 |
20120015146 | TYPES OF ELECTRODEPOSITED POLYMER COATINGS WITH REVERSIBLE WETTABILITY AND ELECTRO-OPTICAL PROPERTIES - Novel coatings are disclosed prepared by electropolymerization of non-fluorinated conducting pre-grafted hydrophobic electropolymerizable monomers onto a conducting layer of a substrate, where the electropolymerized coating exhibit both unique reversible wettability and electro-optical properties. The coating may also include one or more layers of polymer particles upon which the non-fluorinated conducting pre-grafted hydrophobic electropolymerizable monomers are polymerized imparting a submicron structure to the coating. Methods for making and using the coatings are also disclosed. | 01-19-2012 |
20120164433 | POLYMER NANOCOMPOSITE PRECURSORS WITH CARBON NANOTUBES AND/OR GRAPHENE AND RELATED THIN FILMS AND PATTERNING - Nano-composites include a graphite material such as nanotubes or graphene sheets and a partial or complete coating of a polymer including sufficient π-conjugated moieties to interact with surfaces of the graphite material. The polymers may also include electropolymerizable or oxidatively polymerizable moieties so the films may be crosslinked. The films may be used to form layers on substrates or patterned layers on substrates. | 06-28-2012 |
20120263922 | SENSORS AND SEPARATION BASED ON MOLECULAR RECOGNITION VIA ELECTROPOLYMERIZATION AND COLLOIDAL LAYER TEMPLATES - Novel coatings are disclosed prepared from electropolymerization of electropolymerizable monomers-analyte complexes onto a conducting layer or non-conducting of a substrate, where the analyte is removed by electrochemically mediated washing permitting linear molecular sensing of the analyte over a wide concentration range. The coating may also include templating particles deposited on the electrode substrate prior to electropolymerization, where the particles can be removed to form a submicron structured coating. Methods for making and using the coatings are also disclosed. | 10-18-2012 |
Rigoberto C Advincula, Friendswood, TX US
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20130240437 | NANOCOMPOSITE POLYMER-CARBON BASED NANOMATERIAL FILTERS FOR THE SIMULTANEOUS REMOVAL OF BACTERIA AND HEAVY METALS - The disclosed subject matter provides a filter that is modified by a polymer-carbon based nanomaterial nanocomposite intended to significantly enhance the performance of filtration, separation, and remediation of a broad variety of chemicals, heavy metal ions, organic matters, and living organisms. Polymeric materials, such as but not limited to poly-N-vinyl carbazole (PVK), are combined with (1) graphene (G) and/or graphene-like materials based nanomaterials and (2) graphene oxide (GO) chemically modified with a chelating agent such as but not limited to EDTA. The nanocomposite is homogenously deposited on the surface of the membrane. | 09-19-2013 |