Patent application number | Description | Published |
20090200681 | Forming Compliant Contact Pads For Semiconductor Packages - In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes compliant conductive pads to provide electrical connections to the semiconductor die. In this way, improved connection between the semiconductor package and a socket is provided. Other embodiments are described and claimed. | 08-13-2009 |
20090201643 | INTEGRATED MICRO-CHANNELS FOR 3D THROUGH SILICON ARCHITECTURES - Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures. | 08-13-2009 |
20090250707 | Multi-chip assembly with optically coupled die - Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed. | 10-08-2009 |
20100246138 | METHOD, APPARATUS, AND SYSTEM FOR THIN DIE THIN THERMAL INTERFACE MATERIAL IN INTEGRATED CIRCUIT PACKAGES - Some embodiments of the invention include a thermal interface between a heat spreader and a die. The thermal interface may include a main layer of a single material or a combination of multiple materials. The thermal interface may include one or more additional layers covering one or more surfaces of the main layer. The thermal interface may be bonded to the die and the heat spreader at a low temperature, with flux or without flux. Other embodiments are described and claimed. | 09-30-2010 |
20110058419 | MULTI-CHIP ASSEMBLY WITH OPTICALLY COUPLED DIE - Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed. | 03-10-2011 |
20110175230 | Forming Compliant Contact Pads for Semiconductor Packages - In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes compliant conductive pads to provide electrical connections to the semiconductor die. In this way, improved connection between the semiconductor package and a socket is provided. Other embodiments are described and claimed. | 07-21-2011 |
20110239454 | Substrate With Raised Edge Pads - A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security. | 10-06-2011 |
Patent application number | Description | Published |
20110038441 | TRANSMISSION MODE DETECTION - A method of detecting if a transmitted signal was transmitted in a particular transmission mode, the method comprising receiving a signal in primary and secondary frequency bands and comparing a first part of a header of the signal in the primary frequency band with a corresponding first part of a header of the signal in the secondary frequency band. | 02-17-2011 |
20120314788 | QUANTIZATION METHOD FOR OFDM - A quantization method for OFDM is described. In an embodiment, the method uses an objective function which is defined as a function of the quantization error of the OFDM signal in frequency summed over data subcarriers. A search algorithm is used to optimize the objective function and the solution found is quantized by rounding. The quantized value of the solution may then be fed back into the objective function to compute a value of that function and if the value is less than the value computed in a previous iteration of the method, the method is repeated using the quantized value of the solution as the new starting point for the search algorithm. If the value of the function is, however, not less than the value computed in a previous iteration, the new solution is discarded and the quantized value of the solution from the previous iteration is output. | 12-13-2012 |
20130301625 | AGGREGATION OF INFORMATION UNITS IN A WIRELESS NETWORK - The present application relates to a method for transmitting information from a wireless access point to one or more wireless stations. The method comprises aggregating a plurality of information units of compatible types, such as MAC protocol data units (MPDUs) or acknowledgements into a single data frame, modulating the single data frame and transmitting the modulated data frame containing the plurality of information units to the one or more wireless stations. | 11-14-2013 |
Patent application number | Description | Published |
20100078661 | MACHINED SURFACE LED ASSEMBLY - A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination. | 04-01-2010 |
20100078662 | NON-GLOBAL SOLDER MASK LED ASSEMBLY - A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination. | 04-01-2010 |
20100078663 | TRANSPARENT SOLDER MASK LED ASSEMBLY - A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination. | 04-01-2010 |
20100079994 | MULTI-CUP LED ASSEMBLY - A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination. | 04-01-2010 |
Patent application number | Description | Published |
20150142659 | METHOD, APPARATUS AND SYSTEM FOR MOBILE PAYMENT - A mobile payment method is provided. The method includes a mobile terminal obtaining a user identifier stored in a portable terminal which establishes a communication connection with the mobile terminal and sending the user identifier to a payment platform server. The method also includes the mobile terminal receiving prompt information sent from the payment platform server, where the prompt information is used to prompt the mobile terminal to report payment information after the payment platform server authenticates successfully the user identifier sent from the mobile terminal. Further, the method includes the mobile terminal receiving the payment information inputted by a user in response to the prompt information and sending the payment information to the payment platform server to cause the payment platform server to perform a payment operation based on the payment information, where the payment information includes a payment account, a payment amount and a beneficiary account. | 05-21-2015 |
20150143481 | APPLICATION SECURITY VERIFICATION METHOD, APPLICATION SERVER, APPLICATION CLIENT AND SYSTEM - The disclosure discloses an application security verification method, an application server, an application client, and a system, wherein the application security verification method includes: detecting by an application server, an occurrence of a default security risk event on an application client; obtaining by the application server, default verification information associated with a login account of the application client; and sending by the application server, the default verification information to the application client in order to verify the application client. A user of an application client may therefore verify the security of the application client and the application server, thereby effectively prevents any forged and illegal APP from threatening the security of the user's private information and financial information. | 05-21-2015 |