Li-Tien
Li-Tien Chang, Taipei TW
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20100078207 | UNIVERSAL BUMP ARRAY STRUCTURE - A bump array structure for an integrated circuit is presented. An array of metal alloy bumps is disposed on a surface of the integrated circuit. The array of metal alloy bumps is configured to receive input from a multi-layer substrate package and transmit output to the multi-layer substrate package. The array defines a first portion of metal alloy bumps around the periphery of the surface of the integrated circuit configured to provide power and ground signals for the integrated circuit. The array further defines a second portion of metal alloy bumps providing power and ground for the integrated circuit, located between opposing sides of the periphery of the integrated circuit. Metal alloy bumps not contained in either the first or the second portion of the array are configured for input and output signals between the integrated circuit and the multi-level substrate package | 04-01-2010 |
20110095426 | Hybrid Package - The embodiments described herein provide for a packaging configuration that provides leads or connections for a packaging substrate from opposing surfaces of a package. Through silicon vias (TSV) are provided in order to accommodate additional input/output (I/O) pins that smaller dies are supporting. Various combinations of packages are enabled through the embodiments provided. | 04-28-2011 |
20120178217 | METHOD AND APPARATUS FOR LOW INDUCTIVE DESIGN PATTERN - Provided is an interleaved or wavy spatial arrangement of the micro-vias providing the electrical pathways for the power and ground leads are described. The spatial arrangement increases the coupling pairs between power and ground vias or leads. This spatial arrangement is maintained even as the micro-vias transition across a plane from a direction of travel. Thus, the charge from the decoupling capacitor is able to more efficiently be delivered as the inductances are minimized through this design. | 07-12-2012 |
Li-Tien Huang, New Taipei City TW
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20140231931 | IN-SITU NITRIDATION OF GATE DIELECTRIC FOR SEMICONDUCTOR DEVICES - A semiconductor substructure with improved performance and a method of forming the same is described. The semiconductor substructure includes a dielectric film over a substrate, the dielectric film including at least one metal dielectric layer, at least one oxygen-donor layer, and at least one nitride-incorporation layer. | 08-21-2014 |
Li-Tien Tseng, Bade City TW
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20080210841 | Height Adjustable Holding Apparatus - A height adjustable holding apparatus for supporting a display comprises a holding component, a moving component, an elastic component, an active component, a first rolling component, a driven component, a second rolling component, a first cable and a second cable. The moving component is movable along the holding component. The display is connected to the moving component and is movable along the holding component. The elastic component is disposed in one end of the holding component and is stretchable along the moving direction of the moving component. When the moving component generates a first displacement, the first cable drives the active component to rotate together with the driven component. The second rolling component rolls back the second cable and makes the elastic component to generate a second displacement smaller than the first displacement. | 09-04-2008 |
20110049652 | METHOD AND SYSTEM FOR MEMS DEVICES - A micro electro-mechanical (MEMS) device assembly is provided. The MEMS device assembly includes a first substrate that has a plurality of electronic devices, a plurality of first bonding regions, and a plurality of second bonding regions. The MEMS device assembly also includes a second substrate that is bonded to the first substrate at the plurality of first bonding regions. A third substrate having a recessed region and a plurality of standoff structures is disposed over the second substrate and bonded to the first substrate at the plurality of second bonding regions. The plurality of first bonding regions provide a conductive path between the first substrate and the second substrate and the plurality of the second bonding regions provide a conductive path between the first substrate and the third substrate. | 03-03-2011 |
Li-Tien Tseng, Taoyuang County TW
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20120146452 | MICROELECTROMECHANICAL SYSTEM DEVICE AND SEMI-MANUFACTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of the MEMS device disposes a conductive circuit to maintain various elements of the MEMS equi-potential thereby preventing electrostatic damages to various elements of the MEMS during the manufacturing process. | 06-14-2012 |
20120248615 | MEMS DEVICE AND MANUFACTURING PROCESS THEREOF - A manufacturing process of a MEMS device divides a substrate for fabricating a MEMS component into two electrically isolated regions, so that the MEMS component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A MEMS device manufactured by using the aforementioned process is also disclosed herein. | 10-04-2012 |
Li-Tien Wang, New Taipei City TW
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20160045288 | DENTAL IMPLANT PACKAGE - The present invention provides a dental implant package, comprising a healing abutment and a tooth-replacement implant. The healing abutment made of plastic materials and rubber material comprises a tooth-replacement implant cap and a first insertion; wherein the tooth-replacement implant cap including a first main body and a first groove is a polygonal prism with different sectional areas of upper level greater than low level and located in the first main body, and an external surface of the first insertion has a plane surface and a first fine thread. Further, an external surface of the tooth-replacement implant has an external thread section and circular arc thread section, and inside of the tooth-replacement implant has an internal thread section; wherein the first insertion is made of plastic materials or rubber materials; alternatively, the first insertion may be consisted by embracing a first metal screw with plastic materials or rubber materials. | 02-18-2016 |
Li-Tien Yang, Hsinchu City TW
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20090066349 | PROBE SYSTEM - A probe system including a body, a testing apparatus, a probe card, and a strengthening mechanism is provided. The testing apparatus is disposed above the body. The probe card is disposed between the testing apparatus and the body. The strengthening mechanism is disposed between the probe card and the testing apparatus to have the probe card leaned against it. The strengthening mechanism has at least one elastic element. | 03-12-2009 |