Patent application number | Description | Published |
20120076556 | FIXING DEVICE AND IMAGE FORMING APPARATUS - A fixing device includes a circularly moving member, the outer peripheral surface of which circularly moves; a belt-shaped member that has a substantially belt shape and that circularly moves while an outer peripheral surface of the belt-shaped member is in contact with the outer peripheral surface of the circularly moving member; a pressing member that presses the belt-shaped member onto the circularly moving member while being in contact with an inner peripheral surface of the belt-shaped member; and a lubricant dispersion member that includes a solid material and a lubricant dispersed in the solid material in the form of particles, wherein the lubricant dispersion member is worn by being rubbed on the inner peripheral surface of the belt-shaped member, and the lubricant is exposed on a surface of the solid material by wear, the surface contacting the inner peripheral surface of the belt-shaped member. | 03-29-2012 |
20140294457 | FIXING DEVICE, AND IMAGE FORMING APPARATUS - Provided is a fixing device including a rotatable rotating member, a tubular member that is movable while coming into contact with the rotating member, a pressure member that is arranged inside the tubular member and nips a recording medium holding an unfixed toner image at a nip portion formed between the rotating member and the tubular member by bringing the tubular member into pressure contact with the rotating member, to apply pressure for fixing the unfixed toner image on the recording medium, and a holding member that holds the pressure member, wherein the pressure member is made of an elastomer, and the end position of one surface of the elastomer that comes into contact with the tubular member is located further toward the upstream side in the transport direction of the recording medium than the end position of the other surface of the elastomer held by the holding member. | 10-02-2014 |
Patent application number | Description | Published |
20100231643 | IMAGE FORMING APPARATUS - An image forming apparatus includes a base member where a plurality of recording heads is provided, the recording heads being configured to jet liquid drops onto a recording medium; a carriage configured to elevatably support the base member; and an elevating part configured to elevate the base member relative to the carriage, wherein the elevating part is a plurality of slide cam members provided movably in a horizontal direction. | 09-16-2010 |
20110134187 | IMAGE FORMING APPARATUS - An image forming apparatus including a first carriage having a recording head that ejects black liquid droplets and is movable in a main scanning direction and a second carriage having a recording head that ejects color liquid droplets and is detachably attachable to the first carriage within a scanning range of the first carriage in the main scanning direction. The second carriage when attached to the first carriage is movable in the main scanning direction together with the first carriage. Attachment and detachment of the second carriage to and from the first carriage are performed based on a predetermined reference position of the first carriage in the main scanning direction. | 06-09-2011 |
20110134190 | IMAGE FORMING APPARATUS - An image forming apparatus including a first carriage having a recording head that ejects black liquid droplets and is movable in a main scanning direction, a second carriage having a recording head that ejects color liquid droplets and is detachably attachable to the first carriage to move in the main scanning direction together with the first carriage while attached to the first carriage, and a cap member that caps the recording head of the second carriage while the first carriage is moving with the second carriage separated from the first carriage. Attachment and detachment of the second carriage to and from the first carriage are performed within a scanning range through which the first carriage is movable. | 06-09-2011 |
20110141192 | IMAGE FORMING APPARATUS - An image forming apparatus including a first carriage having a first recording head and a first lifting/lowering unit, a second carriage having a second recording head and a second lifting/lowering unit, a drive source, a drive coupling unit provided to the drive source, a first coupling unit, a second coupling unit, a docking/separation unit that docks and separates the first and second carriages, and an accommodation/coupling unit. A first end of the second coupling unit is coupled to the drive coupling unit, and the accommodation/coupling unit couples the first coupling unit to a second end of the second coupling unit and accommodates the first coupling unit within the first carriage to uncouple the first coupling unit from the second end of the second coupling unit. Accommodation and coupling of the first coupling unit are performed in conjunction with docking and separation of the first and second carriages. | 06-16-2011 |
20110199410 | IMAGE FORMING APPARATUS - An image forming apparatus including a first carriage having a first recording head to eject black liquid droplets, a second carriage having a second recording head to eject color liquid droplets and separatably dockable with the first carriage, a position detector to detect a position of the second carriage relative to the first carriage in a state in which the first and second carriages are docked with each other, and a landing position corrector to correct landing positions of liquid droplets ejected from at least one of the first and second recording heads. The landing position corrector holds the position of the second carriage obtained by the position detector as a reference position and adjusts a correction amount for correcting the landing positions based on an amount of shift between the reference position and a present position of the second carriage docked with the first carriage. | 08-18-2011 |
20110205299 | IMAGE FORMING APPARATUS AND CARRIAGE DOCKING MECHANISM - An image forming apparatus including a first carriage movable in a main scanning direction, a second carriage separatably dockable with the first carriage, a first positioning unit to position the second carriage relative to the first carriage in a sub-scanning direction, a second positioning unit to position the second carriage relative to the first carriage in a rotary direction, and a third positioning unit to position the second carriage relative to the first carriage in the main scanning direction. The first positioning unit includes a reference shaft and notched positioning members to engage the reference shaft. The second positioning unit contacts one of the first and second carriages in the rotary direction upon docking of the first and second carriages. The third positioning unit includes a positioning member, parallel grooved members in the sub-scanning direction, and parallel shafts extending in the sub-scanning direction to engage the grooved members. | 08-25-2011 |
20110216113 | IMAGE FORMING APPARATUS AND METHOD FOR CORRECTING LANDING POSITIONS OF LIQUID DROPLETS - An image forming apparatus including a first carriage having at least two first recording heads, a second carriage separatably dockable with the first carriage, a pattern forming unit to control the at least two first recording heads to form on a recording medium adjustment patterns for correcting a shift in landing positions of liquid droplets ejected from the at least two first recording heads, a pattern detector provided to the first carriage to read the adjustment patterns, and a landing position corrector to correct the shift in the landing positions of the liquid droplets based on a result obtained by the pattern detector. The at least two first recording heads form multiple rows of the adjustment patterns, and the pattern detector successively reads at least two rows of the multiple rows of the adjustment patterns without docking and separation of the first and second carriages. | 09-08-2011 |
Patent application number | Description | Published |
20090278230 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device has a substrate, an insulating interlayer, an interconnect as one example of an electro-conductive pattern, a through-electrode, and a bump as one example of a connection terminal, wherein the insulating interlayer is positioned up above the surface of the substrate, the interconnect is positioned on the surface of the insulating interlayer, the through-electrode extends through the substrate and the insulating interlayer, from the back surface of the former to the surface of the latter, one end of which is connected to the interconnect, and the bump is provided on the back surface side of the substrate, and connected to the other end of the through-electrode. | 11-12-2009 |
20090302430 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r | 12-10-2009 |
20100144091 | Semiconductor device and method of manufacturing the same - A method of manufacturing a semiconductor device includes forming an interconnect member, mounting a first semiconductor chip having a semiconductor substrate in a face-down manner on the interconnect member, forming a resin layer on the interconnect member to cover a side surface of the first semiconductor chip, thinning the first semiconductor chip and the resin layer, forming an inorganic insulating layer on a back surface of the first semiconductor chip so as to be in contact with the back surface and to extend over the resin layer, and forming a through electrode so as to penetrate the inorganic insulating layer and the semiconductor substrate. | 06-10-2010 |
20100144154 | Method of manufacturing semiconductor device, and etching apparatus - Aimed at suppressing roughening in a circumferential portion of a layer to be etched in the process of removing a hard mask formed thereon, an etching apparatus of the present invention has a process chamber, an electrode, a stage, and a shadow ring, wherein the process chamber allows an etching gas to be introduced therein; the electrode is disposed in the process chamber, and is used for generating plasma by ionizing the etching gas; the stage is disposed in the process chamber, onto which a substrate is disposed; the shadow ring has an irregular pattern on the inner circumferential edge thereof, and is disposed in the process chamber and placed above the stage | 06-10-2010 |
20110024041 | Method of manufacturing semiconductor device, and etching apparatus - An etching apparatus includes a process chamber into which an etching gas is introduced, an electrode for generating plasma disposed in the process chamber, a stage disposed in the process chamber, on which a substrate is placed, and a shadow ring disposed in the process chamber and placed above the stage, so as to cover the circumferential portion and an inner region adjacent thereto of the substrate in a non-contact manner. The shadow ring has an irregular pattern on the inner circumferential edge thereof. | 02-03-2011 |
20110027987 | Method and apparatus for manufacturing semiconductor device - A method for manufacturing a semiconductor device includes forming a laminated structure of a plurality of metal films on a semiconductor substrate using an electroless plating method. The forming of the metal films includes: performing an electroless plating process including a reduction reaction using a first plating tank; and performing an electroless plating process by only a substitution reaction using a second plating tank. The electroless plating process including the reduction reaction that is performed using the first plating tank is performed in a shading environment, and the electroless plating process performed by only the substitution reaction using the second plating tank is performed in a non-shading environment. | 02-03-2011 |
20120083119 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device includes forming a first insulating interlayer positioned above one surface of a substrate, forming a first hole extended from the surface of the first insulating interlayer to midway of the substrate, forming a through-electrode in the first hole, forming an electro-conductive pattern positioned on the surface of the first insulating interlayer, and connected to one end of the through-electrode, making the other end of the through-electrode expose, by removing the other surface of the substrate, and forming a connection terminal connected to the other end of the through-electrode, on the other surface of the substrate. | 04-05-2012 |
20120100715 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE - The present invention provides a semiconductor device including at least one of an insulating layer and a semiconductor layer each including a hole formed therein, and a through electrode provided in the hole. In the semiconductor device, the side wall of the hole is constituted of a first region from the opening of the hole to a predetermined position between the opening of the hole and the bottom surface of the hole, and a second region from the predetermined position to the bottom surface of the hole. The through electrode includes a seed layer and a plating layer. The seed layer covers the second region and the bottom surface of the hole without covering the first region. In addition, the plating layer covers the seed layer and at least a part of the first region. | 04-26-2012 |
20120153501 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - In a semiconductor device in which the semiconductor chip including the external terminal(s) is embedded in an insulating layer and interconnect conductor(s) is (are) formed on the insulating layer, base hole(s) is (are) formed at position(s) of the insulating layer corresponding to the external terminal(s) in a state where the semiconductor chip has shrunk after having been embedded in the insulating layer. The interconnect conductor(s) is (are) electrically connected to the external terminal(s) through the base hole(s). | 06-21-2012 |
20120248602 | SEMICONDUCTOR DEVICE - In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r | 10-04-2012 |