Patent application number | Description | Published |
20120257764 | HEADSET ASSEMBLY WITH RECORDING FUNCTION FOR COMMUNICATION - A headset assembly with a recording function for communication includes a left earphone, a right earphone, a call module, and a recording module. The left and the right earphones respectively have a speaker and a microphone. The call module is electrically connected to the left or the right earphone. The recording module is electrically connected to the left and the right earphones. In a first operation mode, the call module communicates with an external communication device through the microphone and the speaker of the left or the right earphone. In a second operation mode, the recording module receives an ambient sound signal through the microphones simultaneously, and records and stores the ambient sound signal. As the microphones are placed in a left auricle and a right auricle, recorded sound may have an effect of a head-related transfer function (HRTF), thus achieving an effect of a stereo sound field during playback. | 10-11-2012 |
20130101131 | HEADPHONE WITH SPEAKER FUNCTION - A headphone with speaker function comprises a first playback unit, a second playback unit, a first audio source interface and a second audio source interface. Both the first playback unit and the second playback units have a speaker respectively. The first audio source interface is disposed on the first playback unit and is electrically connected to the two speakers simultaneously, while the second audio source interface can be disposed on the first playback unit or the second playback unit, and is electrically connected to the two speakers simultaneously via an amplifier circuit. From an external audio interface, an audio signal is transmitted to the headphone via the first audio source interface; at this moment, the headphone set is operated under a headphone mode. From an external audio interface, an audio signal is transmitted via the second audio source interface; at this moment, the headphone is operated under a speaker mode. | 04-25-2013 |
Patent application number | Description | Published |
20150118794 | SEMICONDUCTOR DEVICE WITH FACE-TO-FACE CHIPS ON INTERPOSER AND METHOD OF MANUFACTURING THE SAME - A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip. | 04-30-2015 |
20150130046 | SEMICONDUCTOR PACKAGE WITH PACKAGE-ON-PACKAGE STACKING CAPABILITY AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a method of making a semiconductor package with package-on-package stacking capability. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a metallic carrier with the chip inserted into a cavity of the metallic carrier, and the step of selectively removing portions of the metallic carrier to define a heat spreader for the chip. The heat spreader can provide thermal dissipation, electromagnetic shielding and moisture barrier, whereas the interposer provides a CTE-matched interface and fan-out routing for the chip. | 05-14-2015 |
20150137338 | SEMICONDUCTOR ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - A method of making a semiconductor assembly is characterized by the step of attaching a chip-on-interposer subassembly on a base carrier with the chip inserted into a through opening of the base carrier and the interposer laterally extending beyond the through opening. The base carrier provides a platform for the chip-on-interposer subassembly attachment, whereas the interposer provides primary fan-out routing for the chip. In the method, a buildup circuitry is electrically coupled to the interposer and an optional cover sheet or additional buildup circuitry can be provided on the chip. | 05-21-2015 |
20150155256 | SEMICONDUCTOR PACKAGE WITH PACKAGE-ON-PACKAGE STACKING CAPABILITY AND METHOD OF MANUFACTURING THE SAME - A method of making a semiconductor package with package-on-package stacking capability is characterized by the step of attaching a chip-on-interposer subassembly on a base carrier with the chip inserted into a through opening of the base carrier and the interposer laterally extending beyond the through opening. The interposer provides primary fan-out routing for the chip whereas dual buildup circuitries formed on both opposite sides of the base carrier provides further fan-out routing and are electrically connected to each other by plated through holes to provide the package with stacking capacity. | 06-04-2015 |
20150235935 | SEMICONDUCOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of making a semiconductor device is characterized by the step of attaching a chip-on-interposer subassembly to a heat spreader with the chip inserted into a cavity of the heat spreader and the interposer laterally extending beyond the cavity. The interposer backside process is executed after the chip-on-interposer attachment and encapsulation to form the finished interposer. The heat spreader provides thermal dissipation, and the finished interposer provides primary fan-out routing for the chip. In the method, a buildup circuitry is electrically coupled to the interposer to provide further fan-out routing. | 08-20-2015 |
20150257316 | METHOD OF MAKING THERMALLY ENHANCED WIRING BOARD HAVING ISOLATOR INCORPORATED THEREIN - A method of making a wiring board having a low CTE isolator incorporated in a resin core is characterized by the provision of an adhesive substantially coplanar with the metallized isolator and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface and connect the metallized isolator with a surrounding heat spreader on the bottom surface of the resin core. In the method, routing circuitries are also deposited on the adhesive at the smoothed lapped top surface so as to provide electrical connections between contact pads on the isolator and terminal pads on the resin core. | 09-10-2015 |
20150382444 | THERMALLY ENHANCED WIRING BOARD HAVING METAL SLUG AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING THE SAME - A method of making a wiring board having a metal slug incorporated in a resin core is characterized by the provision of a moisture inhibiting cap covering interfaces between metal and plastic. In a preferred embodiment, the metal slug is bonded to the resin core by an adhesive substantially coplanar with the metal slug and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the metal slug and the surrounding plastic material. In the method, conductive traces are also deposited on the resin core at the smoothed lapped top surface so as to provide electrical contacts for chip connection. | 12-31-2015 |
20150382468 | WIRING BOARD HAVING ELECTRICAL ISOLATOR AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING THE SAME - A method of making a wiring board having an electrical isolator and metal posts incorporated in a resin core is characterized by the provision of moisture inhibiting caps covering interfaces between the electrical isolator/metal posts and a surrounding plastic material. In a preferred embodiment, the electrical isolator and metal posts are bonded to the resin core by an adhesive substantially coplanar with the metal films on the electrical isolator, the metal posts and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface to completely cover interfaces between the electrical isolator/metal posts and the surrounding plastic material. Conductive traces are also deposited on the smoothed lapped top surface to provide electrical contacts for chip connection and electrically coupled to the metal posts. | 12-31-2015 |
20160005717 | SEMICONDUCTOR DEVICE WITH FACE-TO-FACE CHIPS ON INTERPOSER AND METHOD OF MANUFACTURING THE SAME - A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip. | 01-07-2016 |
Patent application number | Description | Published |
20120126388 | STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/FLANGE HEAT SPREADER AND DUAL BUILD-UP CIRCUITRY - A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a plated through-hole, first build-up circuitry and second build-up circuitry. The heat spreader includes a bump and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the first build-up circuitry and thermally connected to the bump. The bump extends into an opening in the adhesive and the flange extends laterally from the bump at the cavity entrance. The first build-up circuitry and the second build-up circuitry extend beyond the semiconductor device in opposite vertical directions. The plated through-hole extends through the adhesive and provides signal routing between the first build-up circuitry and the second build-up circuitry. The heat spreader provides heat dissipation for the semiconductor device. | 05-24-2012 |
20120126399 | THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY - A semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive and a build-up circuitry. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry includes a dielectric layer and conductive traces on the semiconductor device and the flange. The conductive traces provide signal routing for the semiconductor device. | 05-24-2012 |
20120126401 | STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING - A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device. | 05-24-2012 |
20120129298 | METHOD OF MAKING STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/FLANGE HEAT SPREADER AND DUAL BUILD-UP CIRCUITRY - A method of making a stackable semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive, a plated through-hole, first build-up circuitry and second build-up circuitry is disclosed. The heat spreader includes a bump and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the first build-up circuitry and thermally connected to the bump. The bump extends into an opening in the adhesive and the flange extends laterally from the bump at the cavity entrance. The first build-up circuitry and the second build-up circuitry extend beyond the semiconductor device in opposite vertical directions. The plated through-hole extends through the adhesive and provides signal routing between the first build-up circuitry and the second build-up circuitry. The heat spreader provides heat dissipation for the semiconductor device. | 05-24-2012 |
20120129299 | METHOD OF MAKING THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY - A method of making a semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive and a build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry includes a dielectric layer and conductive traces on the semiconductor device and the flange. The conductive traces provide signal routing for the semiconductor device. | 05-24-2012 |
20120129300 | METHOD OF MAKING STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY - A method of making a stackable semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device. | 05-24-2012 |
20130032938 | THREE DIMENSIONAL SEMICONDUCTOR ASSEMBLY BOARD WITH BUMP/FLANGE SUPPORTING BOARD, CORELESS BUILD-UP CIRCUITRY AND BUILT-IN ELECTRONIC DEVICE - A semiconductor assembly board includes a supporting board, a coreless build-up circuitry and a built-in electronic device. The supporting board includes a bump, a flange and a via hole in the bump. The built-in electronic device extends into the via hole and is electrically connected to the build-up circuitry. The build-up circuitry extends from the flange and the built-in electronic device and provides signal routing for the built-in electronic device. The supporting board provides mechanical support, ground/power plane and heat sink for the coreless build-up circuitry. | 02-07-2013 |