Lin, Jhubei City
Bo-Jiun Lin, Jhubei City TW
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20100123224 | HIGH MECHANICAL STRENGTH ADDITIVES FOR POROUS ULTRA LOW-K MATERIAL - A semiconductor device and method for making such that provides improved mechanical strength is disclosed. The semiconductor device comprises a semiconductor substrate; an adhesion layer disposed over the semiconductor substrate; and a porous low-k film disposed over the semiconductor substrate, wherein the porous low-k film comprises a porogen and a composite bonding structure including at least one Si—O—Si bonding group and at least one bridging organic functional group. | 05-20-2010 |
20110073998 | Adhesion Promotion Layer For A Semiconductor Device - Embodiments of semiconductor devices are provided. In one embodiment, the semiconductor device includes a substrate, an etch stop layer formed on the substrate, an adhesion promotion layer formed directly on the etch stop layer, and a dielectric layer formed directly on the adhesion promotion layer. The etch stop layer may include silicon, carbon, and nitrogen. The dielectric layer may include silicon, oxygen, and carbon. The adhesion promotion layer may include carbon, oxygen, and nitrogen. An example of an adhesion promotion layer includes polyimide. | 03-31-2011 |
20110115088 | INTERCONNECT WITH FLEXIBLE DIELECTRIC LAYER - An integrated circuit device has a dual damascene structure including a lower via portion and an upper line portion. The lower via portion is formed in a polyimide layer, and the upper line portion is formed in an inter-metal dielectric (IMD) layer formed of USG or polyimide. A passivation layer is formed on the IMD layer, and a bond pad is formed overlying the passivation layer to electrically connect the upper line portion. | 05-19-2011 |
20140239501 | INTEGRATED CIRCUIT INTERCONNECTS AND METHODS OF MAKING SAME - A dielectric layer is formed on a substrate and patterned to form an opening. The opening is filled and the dielectric layer is covered with a metal layer. The metal layer is thereafter planarized so that the metal layer is co-planar with the top of the dielectric layer. The metal layer is etched back a predetermined thickness from the top of the dielectric layer to expose the inside sidewalls thereof. A sidewall barrier layer is formed on the sidewalls of the dielectric layer. A copper-containing layer is formed over the metal layer, the dielectric layer, and the sidewall barrier layers. The copper-containing layer is etched to form interconnect features, wherein the etching stops at the sidewall barrier layers at approximately the juncture of the sidewall of the dielectric layer and the copper-containing layer and does not etch into the underlying metal layer. | 08-28-2014 |
20140252619 | INTERCONNECT STRUCTURE THAT AVOIDS INSULATING LAYER DAMAGE AND METHODS OF MAKING THE SAME - A method for forming an interconnect structure includes forming an insulating layer on a substrate. A damascene opening is formed through a thickness portion of the insulating layer. A diffusion barrier layer is formed to line the damascene opening. A conductive layer is formed overlying the diffusion barrier layer to fill the damascene opening. A carbon-containing metal oxide layer is formed on the conductive layer and the insulating layer. | 09-11-2014 |
20150179532 | SYSTEM AND METHOD FOR DARK FIELD INSPECTION - The present disclosure provides a method for fabricating a semiconductor structure. The method comprises providing a substrate and a patterned layer formed on the substrate, one or more overlay marks being formed on the patterned layer; performing a pre-film-formation overlay inspection using a bright field (BF) inspection tool to receive a pre-film-formation data on the one or more overlay marks on the patterned layer; forming one or more layers on the patterned layer; performing a post-film-formation overlay inspection using a dark field (DF) inspection tool to receive a post-film-formation data on the one or more overlay marks underlying the one or more layers; and determining whether the pre-film-formation data matches the post-film-formation data. | 06-25-2015 |
Che-Chuan Lin, Jhubei City TW
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20120216010 | CIRCUIT MODULE DEVICE WITH ADDRESS GENERATION FUNCTIONS - The present invention relates generally to a kind of circuit module device with address generation functions, which comprises: A plurality of circuit modules, wherein, each circuit module is a control unit, one signal input end and one signal output end; and thereat, the said control unit has an address generation function; and the signal input ends are being electrically connected in series with signal output ends at a plurality of said circuit modules; a plurality of said circuit modules at least consist of one primary circuit module and one secondary circuit module, in which, the signal output end of said primary circuit module is being electrically connected to the signal input end of said secondary circuit module; and wherein, when signal input end of the said primary circuit module is receiving one primary addressing command, the control unit of said primary circuit module will respond to the said primary addressing command and generate one primary address, and then it will send out one secondary addressing command to the signal input end of said secondary circuit module; in addition, when the signal input end of said secondary circuit module is receiving the said secondary addressing command, the control unit of said secondary circuit module will respond to the said secondary addressing command and generate one secondary address; and thus, it will in turn successfully generate address for each circuit module in this way. | 08-23-2012 |
Chien-Pang Lin, Jhubei City TW
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20080303109 | Optoelectronic device chip having a composite spacer structure and method making same - An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system. | 12-11-2008 |
Chih-Ping Lin, Jhubei City TW
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20090212789 | MODIFIED TDR METHOD AND APPARATUS FOR SUSPENDED SOLID CONCENTRATION MEASUREMENT - This invention utilizes the principle of time domain reflectometry (TDR) to develop an improved apparatus and method for suspended solid concentration (SSC) measurement. The apparatus comprises a TDR sensing waveguide for stably determining an electromagnetic-wave (EM-wave) travel time and a temperature sensor. The TDR sensing waveguide and the temperature sensor are submerged in a suspension to detect the EM-wave travel time and the temperature. A temperature-corrected relationship between EM-wave travel time and SSC is found and used to estimate the SSC. Although TDR has been used for measuring soil moisture content and high SSC, its accuracy is not satisfactory for typical SSC monitoring. The present invention improves the accuracy of TDR in SSC measurement by providing the apparatus and method disclosed herein, which are not affected by an electrical conductivity of the suspension and particle sizes of suspended solids therein, and therefore meet the requirements of general engineering applications and environmental monitoring. | 08-27-2009 |
Chin-Teng Lin, Jhubei City TW
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20160135748 | Inflatable Electroencephalogram Measuring Device - An inflatable electroencephalogram measuring device comprises an inflatable helmet applicable for an user's head and at least one measuring electrode. A plurality of supporting strips are disposed within the inflatable helmet and the at least one measuring electrode is well distributed upon the supporting strips. When the inflatable helmet is inflated, the measuring electrode accordingly moves to make contact with the use's head so as to measure an electroencephalogram signal. By designing the inflatable electroencephalogram measuring device with an inflatable helmet, the proposed invention is widely utilized for measuring various users with a variety of head sizes, and thus is characterized with a potential for becoming an important tool of medical measurement. | 05-19-2016 |
Chuen-An Lin, Jhubei City TW
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20090116603 | USB frequency synchronizing apparatus and method of synchronizing frequencies - A universal series bus (USB) frequency synchronous apparatus using a start of frame (SOF) signal generated by a master device to mark a reference interval is disclosed. The frequency synchronizing apparatus includes a frequency divider, a counter unit with a default pulse number, an arithmetic unit, and an adjusting unit. The frequency divider divides a high frequency signal by a variable frequency factor to generate a lock frequency signal. The counter is used to detect a pulse number of the lock frequency signal at a reference interval and obtain a pulse difference between the default pulse number and the detected pulse number of the lock frequency signal. | 05-07-2009 |
Chun-Fu Lin, Jhubei City TW
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20120144077 | MEMORY INTERFACE CHIP CORRESPONDING TO DIFFERENT MEMORIES AND METHOD OF ESTABLISHING MEMORY TRANSMISSION CHANNEL - A memory interface chip is disclosed and includes a data output unit and a control module, wherein the data output module receives data from an external source. The data output unit can be selectively connected to different memory structures. The data output unit includes a first output channel and a second output channel, wherein the channels respectively generate a first output signal and a second output signal based on the data received. The control module selectively closes off the first output channel or the second output channel based on the memory architecture of the memory connected to the data output unit. | 06-07-2012 |
Chung-Han Lin, Jhubei City TW
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20140264720 | Method and Structure for Nitrogen-Doped Shallow-Trench Isolation Dielectric - An isolation feature with a nitrogen-doped fill dielectric and a method of forming the isolation feature are disclosed. In an exemplary embodiment, the method of forming the isolation feature comprises receiving a substrate having a top surface. A recess is etched in the substrate, the recess extending from the top surface into the substrate. A dielectric is deposited within the recess such that the depositing of the dielectric includes introducing nitrogen during a chemical vapor deposition process. Accordingly, the deposited dielectric includes a nitrogen-doped dielectric. The deposited dielectric may include a nitrogen-doped silicon oxide. In some embodiments, the depositing of the dielectric disposes the nitrogen-doped dielectric in contact with a surface of the recess. In further embodiments, a liner material is deposited within the recess prior to the depositing of the dielectric within the recess. | 09-18-2014 |
Heng Chih Lin, Jhubei City TW
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20110295080 | Physiology Condition Detection Device and the System Thereof - A physiology condition detection device comprises a physiology condition sensor, a signal converter and an RFID processor. The physiology condition sensor is configured to sense physiology condition. The signal converter is configured to convert the sensed physiology condition to digitized physiology data. The RFID processor is configured to control the operation of the physiology condition sensor and the signal converter, and report the digitized physiology data. | 12-01-2011 |
Henry Lin, Jhubei City TW
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20120009961 | METHOD AND APPARATUS FOR BEAMFORMING IN A WIRELESS COMMUNICATION SYSTEM - Varying embodiments of the present invention describes a method and apparatus for beamforming in a wireless communication system. A first embodiment is a method for beamforming in a wireless communication system, the system comprising a transmitter and a receiver. The method comprises initiating beamforming on a communication channel between the transmitter and the receiver wherein the communication channel comprises at least two transmit chains, controlling the beamforming by mapping the data stream(s) to the at least two transmit chains and controlling the scaling of the at least two transmit chains within a transmit power constraint. | 01-12-2012 |
Hsiu-Jen Lin, Jhubei City TW
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20120322255 | Metal Bump Formation - A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps. | 12-20-2012 |
Jiin-Hong Lin, Jhubei City TW
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20100190095 | PELLICLE MOUNTING METHOD AND APPARATUS - Apparatus is provided for mounting a pellicle to a photomask. A chamber has at least one port for filling the chamber with extreme clean dry air (XCDA) or an inert gas. A pellicle mounter is provided within the chamber. A vacuum ultra violet (VUV) light source is provided for irradiating a mask held by the pellicle mounter while the chamber is filled with the XCDA or inert gas. The mask is irradiated with the VUV light in an atmosphere of the XCDA or inert gas, and the pellicle is mounted to the mask while the mask is in the atmosphere of the XCDA or inert gas and exposed to the VUV light. | 07-29-2010 |
20120308922 | PELLICLE MOUNTING APPARATUS AND ASSEMBLY WITH PELLICLE MOUNTED ON MASK - An apparatus is provided for mounting a pellicle to a photomask. A chamber has at least one port for filling the chamber with extreme clean dry air (XCDA) or an inert gas. A pellicle mounter is provided within the chamber. The mask is irradiated with a vacuum ultra violet (VUV) light in an atmosphere of the XCDA or inert gas, and the pellicle is mounted to the mask while the mask is in the atmosphere of the XCDA or inert gas and exposed to the VUV light. An assembly includes the mask attached to a pellicle frame by a pressure sensitive adhesive; and a pellicle joined to the pellicle frame, forming a sealed enclosure, the sealed enclosure being filled with extreme clean dry air (XCDA) or inert gas. | 12-06-2012 |
Kuo-Yin Lin, Jhubei City TW
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20140182633 | System and Method for CMP Station Cleanliness - System and method for CMP station cleanliness. An embodiment comprises a chemical mechanical polishing (CMP) station comprising a housing unit covering the various components of the CMP station. The CMP station further comprising various surfaces of a slurry arm shield, a slurry spray nozzle, a pad conditioning arm shield, a platen shield, a carrier head; and the interior, vertical surfaces of the housing unit. A cleaning liquid delivery system configured to dose a cleaning liquid on the various surfaces of the CMP station at set intervals. | 07-03-2014 |
20140183633 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a semiconductor device includes partially manufacturing a fin field effect transistor (FinFET) including a semiconductor fin comprising a first semiconductive material and a second semiconductive material disposed over the first semiconductive material. A top portion of the second semiconductive material of the semiconductor fin is removed, and a top portion of the first semiconductive material is exposed. A top portion first semiconductive material is removed from beneath the second semiconductive material. The first semiconductive material and the second semiconductive material are oxidized, forming a first oxide comprising a first thickness on the first semiconductive material and a second oxide comprising a second thickness on the second semiconductive material, the first thickness being greater than the second thickness. The second oxide is removed from the second semiconductive material, and manufacturing of the FinFET is completed. | 07-03-2014 |
20140206164 | Chemical Mechanical Polish in the Growth of Semiconductor Regions - A method includes performing a first planarization step to remove portions of a semiconductor region over isolation regions. The first planarization step has a first selectivity, with the first selectivity being a ratio of a first removal rate of the semiconductor region to a second removal rate of the isolation regions. After the isolation regions are exposed, a second planarization step is performed on the isolation regions and a portion of the semiconductor region between the isolation regions. The second planarization step has a second selectivity lower than the first selectivity, with the second selectivity being a ratio of a third removal rate of the portion of semiconductor region to a fourth removal rate of the isolation regions. | 07-24-2014 |
20140264362 | Method and Apparatus for Forming a CMOS Device - A method and apparatus for forming a CMOS device are provided. The CMOS device may include an N-type channel region formed of an III-V material and a P-type channel region formed of a germanium material. Over each channel may be formed corresponding gates and source/drain regions. The source/drain regions may be formed of a germanium material and one or more metallization layers. An anneal may be performed to form ohmic contacts for the source/drain regions. Openings may be formed in a dielectric layer covering the device and conductive plugs may be formed to provide contact to the source/drain regions. | 09-18-2014 |
20140273366 | Semiconductor Devices and Methods of Manufacture Thereof - Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a semiconductor device includes providing a workpiece including an n-type field effect transistor (N-FET) region, a p-type FET (P-FET) region, and an insulating material disposed over the N-FET region and the P-FET region. The method includes patterning the insulating material to expose a portion of the N-FET region and a portion of the P-FET region, and forming an oxide layer over the exposed portion of the N-FET region and the exposed portion of the P-FET region. The oxide layer over the P-FET region is altered, and a metal layer is formed over a portion of the N-FET region and the P-FET region. The workpiece is annealed to form a metal-insulator-semiconductor (MIS) tunnel diode over the N-FET region and a silicide or germinide material over the P-FET region. | 09-18-2014 |
20140273412 | Methods for Wet Clean of Oxide Layers over Epitaxial Layers - Methods for an oxide layer over an epitaxial layer. In an embodiment, a method includes forming an epitaxial layer of semiconductor material over a semiconductor substrate; forming an oxide layer over the epitaxial layer; applying a solution including an oxidizer to the oxide layer; and cleaning the oxide layer with a cleaning solution. In another embodiment, a densification process is applied to an oxide layer including treating with thermal energy, UV energy, or both. In an embodiment for a gate-all-around device, the cleaning process is applied to an oxide layer over an epitaxial portion of a fin. Additional methods are disclosed. | 09-18-2014 |
20150028389 | SEMICONDUCTOR DEVICES COMPRISING A FIN - A semiconductor device may include a fin disposed over a workpiece. The fin may include: a first semiconductive material disposed over the workpiece; an oxide of the first semiconductive material disposed over the first semiconductive material; a second conductive material disposed over and spaced apart from the oxide of the first semiconductive material; a first insulating material disposed around and lining the second semiconductive material; a conductive material disposed around the first insulating material; and a second insulating material disposed between the oxide of the first semiconductive material and a portion of the conductive material facing the workpiece, the second insulating material further lining sidewalls of the conductive material. | 01-29-2015 |
20150235858 | WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DEVICE MANUFACTURING PROCESSES - A wafer polishing process includes polishing a central area on the back side of a wafer, polishing a peripheral area on the back side of the wafer, buffing the central area, and buffing the peripheral area. The process can significantly reduce scratch-related wafer breakage, can correct focus spots on wafers, and can replace cleaning processes that use chemical etchants. Polishing and buffing can include polishing and buffing the bevel region. Further improvements include polishing with abrasive pads having a soft backing, polishing or buffing with pads having relatively soft abrasive particles, polishing or buffing with abrasive pads made from abrasive particles that have been sorted and selected for regularity of shape, irrigating the surface being polished or buffed with an aqueous solution that includes a friction-reducing agent, and buffing with abrasive pads having 20k or finer grit or non-abrasive pads. | 08-20-2015 |
20150263132 | BARC-ASSISTED PROCESS FOR PLANAR RECESSING OR REMOVING OF VARIABLE-HEIGHT LAYERS - An IC device manufacturing process effectuates a planar recessing of material that initially varies in height across a substrate. The method includes forming a bottom anti-reflective coating (BARC), baking to induce cross-linking in the BARC, CMP to remove a first portion of the BARC and form a planar surface, then plasma etching to effectuate a planar recessing of the BARC. The plasma etching can have a low selectivity between the BARC and the material being recessed, whereby the BARC and the material are recessed simultaneously. Any of the material above a certain height is removed. Structures that are substantially below that certain height can be protected from contamination and left intact. The method can be particularly effective when an abrasive used during CMP forms ester linkages with the BARC. | 09-17-2015 |
20150307747 | CMP SLURRY SOLUTION FOR HARDENED FLUID MATERIAL - A method for performing a Chemical Mechanical Polishing (CMP) process includes applying a CMP slurry solution to a surface of a hardened fluid material on a substrate, the solution comprising an additive to change a bonding structure on the surface of the hardened fluid material. The method further includes polishing the surface of the hardened fluid material with a polishing head. | 10-29-2015 |
20160099157 | BARC-ASSISTED PROCESS FOR PLANAR RECESSING OR REMOVING OF VARIABLE-HEIGHT LAYERS - The present disclosure provides a method of manufacturing an integrated circuit device in some embodiments. In the method, a semiconductor substrate is processed through a series of operations to form a topographically variable surface over the semiconductor substrate. The topographically variable surface varies in height across the semiconductor substrate. A polymeric bottom anti-reflective coating (BARC) is provided over the topographically variable surface. Chemical mechanical polishing is performed to remove a first portion of the BARC, and etching effectuates a top-down recessing of the BARC. | 04-07-2016 |
Lien-Chen Lin, Jhubei City TW
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20090059052 | Digital photo frame with photographing function - A digital photo frame with photographing function includes a digital frame, a lens module, a bracket, and a copy stand. The digital frame may further include a display module, a frame, a memory module, a control module, an input module, a power supply module, and a sense module. The display module is framed within the frame, and the lens module is disposed at a predetermined location on the frame. A paper photo can be disposed on the copy stand that is pivotally connected to the bracket. The input module can input a control signal to operate and control the lens module to copy photograph the paper photo into a digital photo and store the digital photo in the memory module and further display the digital photo on the display module. | 03-05-2009 |
20090068949 | Multifunctional bluetooth headset - The present invention provides a multifunctional Bluetooth headset. The multifunctional Bluetooth headset of the present invention includes a built-in earphone, a Bluetooth module, a connection port, a power module, a codec module, an extended earphone, an audio wire and a wire collector. The Bluetooth module supports at least one advanced audio distribution profile (A2DP) so as to receive and transmit a stereo sound wireless signal in compliance with the Bluetooth specification. The Bluetooth module can detect voltage of the connection port and allow the multifunctional Bluetooth headset to automatically switch to be reset as a Bluetooth dongle. The connection port and other peripherals allow the power module to charge. The extended earphone can incorporate with the built-in earphone as a dual channel earphone capable of playing stereo sound signals supported by the A2DP. The wire collector can collect the audio wire collected within the multifunctional Bluetooth headset. | 03-12-2009 |
20090085804 | GPS positioning and returning device - A GPS positioning and returning device is provided. The GPS positioning and returning device comprises a compass, a GPS module, an input interface, a memory, a display module and a control module. A marked direction on the GPS positioning and returning device pointing to the cardinal point of North on the compass is a reference direction. Through an input from the input interface, a first control signal is generated. The first control signal is received by the GPS module through the control module so as to generate first coordinates; the first coordinates are then stored in the memory. The input interface may further input a second control signal. The second control signal is received by the GPS module so as to generate second coordinates. After a relative direction and distance between the first coordinates and second coordinates are calculated, the display module is driven to display the relative direction and distance. | 04-02-2009 |
Meng-Chun Lin, Jhubei City TW
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20080212679 | Motion estimation with dual search windows for high resolution video coding - A memory-efficient motion estimation technique for high-resolution video coding is proposed. The main objective is to reduce the external memory access, especially for limited local memory resource. The reduction of memory access can successfully save the notorious power consumption. The key to reduce the memory access is based on center-biased algorithm in that the center-biased algorithm performs the motion vector searching with the minimum search data. While considering the data reusability, the proposed dual-search-windowing approaches use a secondary windowing as an option per searching necessity, by which the loading of search windows can be alleviated and hence reduce the required external memory bandwidth, without significant quality degradation. | 09-04-2008 |
Meng-Yung Lin, Jhubei City TW
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20110290987 | AMBIENT LIGHT SENSING MODULE - The present invention provides an ambient light sensing module, which comprises a sawtooth signal generating circuit, an optical sensing unit, and a comparing unit. The sawtooth signal generating circuit produces a sawtooth signal. The optical sensing unit senses a light source and produces a light-sensing signal. The comparing unit produces a pulse-width modulation (PWM) signal related to the intensity of the light source according to the light-sensing signal and the sawtooth signal so that the PWM signal can be used as the control signal of the electronic device. The ambient light sensing module further comprises at least a fuse for determining a processing parameter. A signal processing unit processes the light-sensing signal according to the processing parameter for outputting a converting signal. The comparing unit compares the converting signal with the sawtooth signal for producing the PWM signal. An adjusting unit produces an adjusting signal according to the PWM signal and the light intensity or according to the converting signal and the light intensity for controlling a trimming unit to trim the fuse and thus modifying the processing parameter. | 12-01-2011 |
Ming-Chieh Lin, Jhubei City TW
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20150061117 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the present invention, a chip package is provided. The chip package includes: a patterned conducting plate having a plurality of conducting sections electrically separated from each other; a plurality of conducting pads disposed on an upper surface of the patterned conducting plate; a chip disposed on the conducting pads; a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate; and an insulating support layer partially surrounding the conducting bumps. | 03-05-2015 |
20150087115 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - According to an embodiment of the present invention, a method for forming a chip package is provided. The method includes: providing a conducting plate, wherein a plurality of conducting pads are disposed on an upper surface of the conducting plate; forming a plurality of conducting bumps on a lower surface of the conducting plate; patterning the conducting plate by removing a portion of the conducting plate, wherein the patterned conducting plate has a plurality of conducting sections electrically insulated from each other, and each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate; forming an insulating support layer to partially surround the conducting bumps; and disposing a chip on the conducting pads. | 03-26-2015 |
Pojung (paul) Lin, Jhubei City TW
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20110122856 | AUTONOMOUS WIRELESS COMMUNICATION SYSTEM AND METHOD OF USE - An autonomous wireless system is disclosed. The system comprises a plurality of devices. Each of the plurality of devices includes a wireless interface. At least two devices directly communicate with each other through a direct link between the wireless interfaces of the at least two devices. Methods and apparatus for two or more devices equipped with wireless local area network (WLAN) interface to communicate and exchange selected information are disclosed. Accordingly, a system and method in accordance with the present invention enables a handheld, laptop, smart phone or the like, which is equipped with a WLAN interface, to communicate and exchange business contact, sales brochures, event announcements, presentation materials, alert messages, etc., to other devices that include a WLAN interface. | 05-26-2011 |
20110122857 | AUTONOMOUS WIRELESS COMMUNICATION SYSTEM AND METHOD OF USE - An autonomous wireless system is disclosed. The system comprises a plurality of devices. Each of the plurality of devices includes a wireless interface. At least two devices directly communicate with each other through a direct link between the wireless interfaces of the at least two devices. Methods and apparatus for two or more devices equipped with wireless local area network (WLAN) interface to communicate and exchange selected information are disclosed. Accordingly, a system and method in accordance with the present invention enables a handheld, laptop, smart phone or the like, which is equipped with a WLAN interface, to communicate and exchange business contact, sales brochures, event announcements, presentation materials, alert messages, etc., to other devices that include a WLAN interface. | 05-26-2011 |
Shen Po Lin, Jhubei City TW
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20100183010 | METHOD AND APPARATUS FOR FORWARDING PACKETS - A method for forwarding packets first checks a forwarding table of a bridge to find whether the destination information for a packet is included in the forwarding table. If the information is found, this packet is forwarded to the destination through a physical layer directly without passing through the bridge. This method improves the efficiency of the frame aggregation of an AP (Access Point) and enhances the throughput in a WLAN (Wireless Local Area Network). | 07-22-2010 |
Shih-Ho Lin, Jhubei City TW
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20130273735 | Oxidation-Free Copper Metallization Process Using In-situ Baking - A method of forming an integrated circuit structure includes providing a substrate; forming a metal feature over the substrate; forming a dielectric layer over the metal feature; and forming an opening in the dielectric layer. At least a portion of the metal feature is exposed through the opening. An oxide layer is accordingly formed on an exposed portion of the metal feature. The method further includes, in a production tool having a vacuum environment, performing a plasma process to remove the oxide layer. Between the step of forming the opening and the oxide-removal process, no additional oxide-removal process is performed to the metal feature outside the production tool. The method further includes, in the production tool, forming a diffusion barrier layer in the opening, and forming a seed layer on the diffusion barrier layer | 10-17-2013 |
Shyuh Der Lin, Jhubei City TW
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20090021318 | AUTOMATIC PAGE DETECTOR - The present invention discloses an automatic page detector, to determine which page of a book is open. The automatic page detector uses a sensor plate and an inductor as a sensor. In the invention, there is a sensor plate at each page of the book and the locations of the sensor plates for different pages are different. There is an array of inductors just beneath the sensor plates when the book is closed. The inductors are connected to the feedback loop of a LC oscillator through analog switches. The proximity of a sensor plate to an inductor will change the frequency of the LC oscillator. Scanning the analog switches by a microprocessor and detecting the variation of frequency of the LC oscillator during each scanning time period, the status of each sensor plate will be detected and we can determine which page of a book is opened. | 01-22-2009 |
20090102669 | ALARM CLOCK WITH A PROXIMITY DETECTOR - The present invention offers an alarm clock with a proximity detector consists of an alarm clock, an object proximity detector and sound generator. The alarm clock can be an analog clock or a digital clock with LCD display. When the time of clock meets the setting time, alarm signal will come from the sound generator, it is not necessary to touch a push button switch of the alarm clock to control the alarm signal, only the proximity of human body or a finger can stop the alarm signal of an alarm clock. The sensor of the object proximity detector can be a capacitive proximity sensor or a magnetic proximity sensor. Most of the technology use capacitive sensor because of low power consumption and low cost. | 04-23-2009 |
Ta-Jen Lin, Jhubei City TW
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20090259414 | Multi-dimension detector with half bridge load cells - A multi-dimension detector with half bridge load cells, which includes an analog to digital converter (ADC), a plurality of half bridge load cells, a multiplexer and a central processing unit (CPU). The CPU controls the multiplexer to form a plurality of full bridge load cells by selecting either-two of the half bridge load cells and detect a plurality of measures corresponding to an object. The ADC converts analog signals corresponding to the plurality of measures into digital signals. The CPU determines all dimension values of the object according to the plurality of measures corresponding to the digital signals. | 10-15-2009 |
20110050622 | Load cell touch control device - A load cell touch control device includes a touch panel, a plurality of load cells and a control unit. The touch panel receives a stress applied thereon. The load cells are implemented in the touch panel to detect respective components of the stress received by the touch panel. The control unit is connected to the load cells in order to receive magnitudes of the respective components to thereby calculate a magnitude, position and motion trace of the stress on the touch panel based on the respective components detected by the load cells in the touch panel. | 03-03-2011 |
20110202290 | MULTI-DIMENSION DETECTOR WITH HALF BRIDGE LOAD CELLS - A multi-dimension detector with half bridge load cells, which includes an analog to digital converter (ADC), a plurality of half bridge load cells, an analog multiplexer and a central processing unit (CPU). The CPU controls the analog multiplexer to form a plurality of full bridge load cells by selecting either two of the half bridge load cells and detect a plurality of measures corresponding to an object. The ADC converts analog signals corresponding to the plurality of measures into digital signals. The CPU determines all dimension values of the object according to the plurality of measures corresponding to the digital signals. | 08-18-2011 |
Teng-Tsai Lin, Jhubei City TW
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20090257740 | Switching Regulation Circuit and Dual-Winding Motor Apparatus - A switching regulation circuit for a dual-winding motor apparatus is provided. The switching regulation circuit comprises a gate-controlled device and a driving circuit. When one of the two windings generates an induced voltage signal greater than a threshold value, the driving circuit generates an output signal for turning on the gate-controlled transistor. Thereby, a parasitic diode of the gate-controlled device will not be turned on and damage the entire circuit. | 10-15-2009 |
Vilmar Lin, Jhubei City TW
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20090153078 | LED ARRAY CIRCUIT - The present invention relates to a LED array circuit having a plurality of LED units and each one of the LED units comprises a horizontal scanning line; a vertical scanning line; a first LED, which connects with the horizontal scanning line by the positive end and connects with the vertical scanning line by the negative end; and a second LED, which connects with the vertical scanning line by the positive end and connects with the horizontal scanning line by the negative end; wherein the LED units is aligned each other by the connected horizontal scanning line and vertical scanning line to form the LED array circuit. | 06-18-2009 |
Yi-Hung Lin, Jhubei City TW
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20100076560 | Interspinous Stabilization Device - An interspinous stabilization device includes: (1) a supporting member with a top surface and a bottom surface both being configured to engage spinous processes; (2) two side members connected to the supporting member; (3) a fastener attached to the side members; and optionally (4) two extendable arms each secured on one of the side members. | 03-25-2010 |
20120010139 | THERMAL RESPONSIVE COMPOSITION FOR TREATING BONE DISEASES - Thermal responsive compositions for treating bone diseases are provided. The thermal responsive composition for treating bone diseases includes a bone growth factor and a biodegradable copolymer. The biodegradable copolymer has a structure of Formula (I) or Formula (II): | 01-12-2012 |
20140220085 | METHOD FOR TISSUE ENGINEERING - In an embodiment of the disclosure, a biomedical material is provided. The biomedical material includes a biocompatible material having a surface and a carrier distributed over the surface of the biocompatible material, wherein both of the biocompatible material and the carrier have no charges, one of them has charges or both of them have charges with different electricity. The biomedical material is utilized for dentistry, orthopedics, wound healing or medical beauty and applied in the repair and regeneration of various soft and hard tissues. | 08-07-2014 |
Yu-Chin Lin, Jhubei City TW
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20090050305 | HEAT PIPE STRUCTURE OF A HEAT RADIATOR - The present invention provides a heat pipe structure of a heat radiator, which includes two vertically protruded radiating portions and heat-absorbing portions at a bottom of the two radiating portions. The heat-absorbing portions are assembled onto the heat-conducting pedestal. Two turning portions are formed at the intersection of the heat-absorbing portions and two radiating portions. The heat-absorbing portion has a curved shape. The heat-absorbing portions of adjacent heat pipes are misaligned, such that the turning portion of the heat-absorbing portion of one heat pipe aligns with the recessed space of the other heat pipe. A minimum of heat pipe assembly space obtains a maximum heating area, thus greatly improving the heat-radiating effect and reducing the manufacturing cost with better applicability and economic efficiency. | 02-26-2009 |
Yueh-Ling Lin, Jhubei City TW
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20110244991 | GOLF ASSISTING DEVICE AND METHOD OF AUTOMATICALLY SWITCHING TARGET GOLF HOLES - A method of automatically switch of target golf hole is applied in a golf assisting device. The golf assisting device utilizes the memory to store a plurality of golf-hole-region coordinates that define a plurality of regions belonged to every golf hole. A processor of the golf assisting device is used to determine which convex polygon region the golf assisting device is located in accordance with the stored golf-hole-region coordinates in order to automatically switch a corresponding target golf hole of the convex polygon region. The golf assisting device determines in accordance with the corresponding target golf hole of the convex polygon region to proceed and operate other various functions of the golf assisting device so that the golf assisting device can be operated and switched automatically without any manual operation from the golfer. | 10-06-2011 |
Yung-Fu Lin, Jhubei City TW
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20140157605 | THERMAL EXCHANGE FOOD PROCESSING DEVICE AND METHOD OF PRODUCING SAME - A thermal exchange food processing device is comprised of a thermal conductive body, thermal insulation layer and phase change material. The thermal conductive body consists of an acting region and an inner thermal conductive region disposed in accordance to and in thermal connection to the acting region. The thermal insulation layer has a lower thermal conductivity coefficient compared with the thermal conductive body and encapsulates at least in part the thermal conductive body, so that the acting region of the thermal conductive body is exposed while remaining regions of the thermal conductive body other than the acting region are thermally insulated from ambient temperature; wherein the thermal conductive body alone or together with the thermal insulation layer defines an accommodation space and the inner thermal conductive region is disposed to face the accommodation space; and the phase change material disposed within the accommodation space. | 06-12-2014 |
20150230662 | Microwave-Heatable Thermal Storage Pad and a Food Heating Kit Having the Same - A microwave-heatable thermal storage pad includes a main body and at least one thermal storage medium. The main body has at least one projecting portion and a holding flange extending outwardly from a peripheral edge of a bottom of the projecting portion. The projecting portion has an enclosing wall of low thermal conductivity, wherein the enclosing wall defines a recessed space. The thermal storage medium, being located in the recessed space, has an exposed top surface which is exposed to a top opening of the recessed space of the main body, and has a periphery which is at least partially surrounded by the enclosing wall of the projecting portion. The thermal energy stored in the thermal storage medium will be exchanged with the outside substantially through the exposed top surface thereof. | 08-20-2015 |