Patent application number | Description | Published |
20140009217 | CAPACITIVE TOUCH-CONTROL PANEL APPARATUS - A capacitive touch-control panel apparatus is illustrated. The capacitive touch-control panel apparatus includes a touch-control substrate and a hub circuit. The touch-control substrate has M touch areas, and each touch-control area includes an axial body and N electrodes. N electrodes are disposed corresponding to the axial body and are electrically connected to the hub circuit. One of the electrodes on each touch-control area is connected to one of the electrodes on the other touch-control area by one-to-one manner, wherein M and N are positive integer. | 01-09-2014 |
20140028379 | SINGLE-LAYER CAPACITIVE TOUCH-CONTROL PANEL APPARATUS - A single-layer capacitive touch-control panel apparatus is provided. The single-layer capacitive touch-control panel apparatus includes a touch-control substrate and a touch-control chip. The touch-control substrate has M touch areas, and each touch area of the plurality of the touch areas includes an axial body and N electrodes. The axial body is electrically connected to the touch-control chip through a first conductive line. N electrodes are disposed on the axial body and are electrically connected to the touch-control chip through a plurality of second conductive lines. The touch-control chip is disposed on the touch-control substrate of single-layer, wherein M | 01-30-2014 |
20140035864 | CAPACITIVE TOUCH-CONTROL PANEL AND APPARATUS THEREOF - The present disclosure provides a capacitive touch panel which includes a substrate, M driving electrodes and M×N sensing electrodes, wherein M driving electrodes and M×N sensing electrodes are formed on the substrate. The M driving electrodes are placed parallel to a first axis and are electrically isolated from each other. Each of the M driving electrodes has N sensing electrode regions defined thereon along a second axis, wherein each sensing electrode region has a sensing electrode disposed therein. Each sensing electrode electrically isolated from the driving electrode. The sensing electrode and the corresponding driving electrode generate mutual capacitance. The area associated with each driving electrode is larger than the overall area of the each corresponding sensing electrode. | 02-06-2014 |
Patent application number | Description | Published |
20140166002 | JOINT OF SPUTUM SUCTION TUBE - A joint of sputum suction tube includes a patient tube ( | 06-19-2014 |
20140180219 | NEEDLELESS CONNECTOR - A needleless connector includes a hollow connector, a spring, and a switch assembly. The inner perimeter of the hollow connector forms a first annular wall and a second annular wall. The spring is disposed in the hollow connector. The switch assembly has a stop member and a guide tube connected to the stop member, the stop member being pressed between the annular block and the spring, the guide tube being disposed in the hollow connector, the external perimeter of the stop member forming a first annular portion against the first annular wall and a second annular portion against the second annular wall, a groove being disposed between the first annular portion and the second annular portion of the stop member, the groove being connected to the guide tube. Thus, the integral structure stability and good closing performance are achieved such that the outside air cannot leak into the connector structure. | 06-26-2014 |
20140180258 | NEEDLE-FREE CONNECTOR - A needle-free connector includes a hollow connector, an elastic block, and a switch assembly. The inner perimeter of the hollow connector forms a first annular wall and a second annular wall. The elastic block is disposed in the hollow connector. The switch assembly has a stop member and a guide tube connected to the stop member, the stop member being pressed between the annular block and the elastic block, the guide tube being disposed in the hollow connector, the external perimeter of the stop member forming a first annular portion against the first annular wall and a second annular portion against the second annular wall, a groove being disposed between the first annular portion and the second annular portion of the stop member, the groove being connected to the guide tube. Thus, the structure stability and closing performance are achieved such that the outside air cannot leak into the connector. | 06-26-2014 |
20140194688 | CLOSED SUCTION SET INSERTABLE WITH BRONCHOSCOPE - A closed suction set insertable ( | 07-10-2014 |
Patent application number | Description | Published |
20140153109 | Zoom Lens - A zoom lens includes a first lens group, a second lens group, a third lens group and a fourth lens group, all of which are arranged in sequence from an object side to an image side along an optical axis. The first lens group is with positive refractive power and includes a first lens that is with negative refractive power and a second lens that is with positive refractive power. The second lens group is with negative refractive power. The third lens group is with positive refractive power and includes a third lens front group that is with positive refractive power and a third lens rear group that is with positive refractive power. The fourth lens group is with positive refractive power. | 06-05-2014 |
20140168500 | Image Capture Device and Converter Lens Assembly Thereof - An image capture device and a converter lens assembly thereof are provided. The image capture device includes a mobile phone and the converter lens assembly wherein the converter lens assembly is connected to the mobile phone. The converter lens assembly includes a first lens, a second lens, a third lens, a fourth lens and a fifth lens, all of which are arranged in sequence from an object side to an image side along an optical axis. The first lens is with positive refractive power. The fourth lens is with positive refractive power. The converter lens assembly satisfies the condition: 1<|f | 06-19-2014 |
20140204470 | ZOOM LENS - A zoom lens includes a first lens group, a second lens group, a third lens group and a fourth lens group, all of which are arranged in sequence from an object side to an image side along an optical axis. The first lens group is with positive refractive power. The second lens group is with negative refractive power. The third lens group is with positive refractive power. The fourth lens group is with positive refractive power. The first lens group includes a first lens and a second lens, both of which are arranged in sequence from the object side to the image side along the optical axis, wherein the first lens group and the first lens satisfy the following condition: −1.207-24-2014 | |
Patent application number | Description | Published |
20100132178 | QUICK-POSITIONING SCREW ASSEMBLY - A quick-positioning screw assembly includes a cap having an inside annular flange and a locating groove or locating rib extending around the inside wall, a mounting socket bonded to a mounting through hole of a first plate member and having a top positioning flange extending around the periphery and detachably forced into engagement with the locating groove or locating rib of the cap, a screw press-fitted into the inner diameter of the inside annular flange of the cap for threading into a screw hole on a second plate member to secure the first plate member to the second plate member, and a compression spring mounted in the cap around the screw and stopped between the inside annular flange of the cap and an inside annular flange of the mounting socket. | 06-03-2010 |
20100137116 | QUICK-POSITIONING SCREW ASSEMBLY MACHINING METHOD - A quick-positioning screw assembly machining method includes the step of attaching a quick-positioning screw assembly to a chucking device of a machine tool and then driving the chucking device to rotate the quick-positioning screw assembly, the step of moving a ramming member toward a relatively thinner front extension cap wall of a cap during rotation of the quick-positioning screw assembly to have the relatively thinner front extension cap wall of the cap be bent radially inwards into contact with a periphery of a mounting socket between two outside annular flanges of the mounting socket, and the step of stopping the rotation of the chucking device and removing the processed quick-positioning screw assembly from the machine tool. | 06-03-2010 |
20110121054 | SOLDER MATERIAL OVERFLOW PREVENTATIVE METAL PLATE MEMBER FIXATION DEVICE INSTALLATION METHOD - A solder material overflow preventive metal plate member fixation device installation method includes the step of preparing a barrel and inserting the barrel into a mounting through hole on a metal plate member to abut a bottom bonding surface of the barrel against a solder material at the metal plate member, the step of press-fitting a solder mask insert into the barrel to keep the solder mask insert in flush with the bottom edge of the barrel for stopping a solder material from flowing into the barrel, the step of bonding the barrel to the metal plate member through a soldering process, and the step of removing the solder mask insert from the barrel after the soldering process. | 05-26-2011 |
20110123291 | ANCHOR BOLT ASSEMBLY - An anchor bolt assembly includes a sleeve affixed to a first plate member and having a locating groove extending around the inside wall thereof, a retaining member having a shank and a head provided with a retaining ring and movable in and out of the sleeve, a spring member adapted for forcing the retaining member out of the sleeve to a locking position to lock a second plate member to the first plate member and a pull cap connected to the distal end of the shank for pulling by the user to move the retaining member away from the locking position to an unlocking position where the second plate member is unlocked from the first plate member and the retaining ring is engaged with the locating groove to hold the retaining member in the unlocking position. | 05-26-2011 |
20110135421 | METAL PLATE MEMBER FIXATION DEVICE - A metal plate member fixation device includes an adapter having a hollow base and a tubular bonding portion perpendicularly extended from the hollow base for bonding to a mounting through hole of a first metal plate member, and a locking device formed of a barrel, which is detachably connectable to the hollow base of the adapter before bonding of the adapter to the first metal plate member, a driving member, a lock screw and a spring member and adapted for detachably locking the first metal plate member to a second metal plate member. | 06-09-2011 |
20110302759 | FLOATING CAPTIVE SCREW INSTALLATION METHOD - A floating captive screw installation method includes the step of inserting a lock screw through a spring member and then inserting the lock screw with the spring member into a stepped barrel, the step of inserting the stepped barrel with the spring member and the lock screw into a rotary cap to keep the head of the lock screw outside the rotary cap, the step of forcing a toothed engagement portion of the head of the lock screw into engagement with a retaining groove in the top open side of the rotary cap tightly, and the step of letting a front coupling flange of the rotary cap be stopped against the bottom side of a top coupling flange of the stepped barrel. This installation method eliminates a secondary processing process, saving much installation labor and time. | 12-15-2011 |
20120040035 | CAPTIVE SCREW FABRICATION MOLD - A captive screw fabrication mold for molding a plastic or rubber knob on the head of a lock screw for captive screw is disclosed to include a bottom die having a tubular post vertically disposed in each bottom die cavity thereof for holding a lock screw for molding, and an upper die that has an annular rib vertically downwardly suspending in each upper die cavity thereof for stopping against the head of the lock screw in the associating bottom die cavity around the top protrusion of the lock screw to isolate the molding chamber in each upper die cavity, avoiding overflow of the applied molten material into the tool groove in the top protrusion of each lock screw. | 02-16-2012 |
20120099943 | Captive fastener - A captive fastener includes a mounting base member bonded to a first panel frame, a locking shank loaded with a spring member and axially movably mounted in the mounting base member hole for engaging into a mounting through hole of a second panel frame to detachably lock the second panel frame to the first panel frame, and a driving member, which is coated with a color index coating for identification and connected to the locking shank after bonding the mounting base member to the first panel frame and operable to move the locking shank between a locking position where the first panel frame and the second panel frame are locked and an unlocking position where the first panel frame is detachable from the second panel frame. | 04-26-2012 |
20120170993 | QUICK-POSITIONING CAPTIVE SCREW - A quick-positioning captive screw includes a mounting base member having an outer thread spirally extending around the peripheral wall of a top flange thereof, the outer thread having a leading end terminating in the top edge of the top flange and a tail end terminating in the bottom edge of the top flange and cutting a part of the top flange into a rib, a lock screw having an inner thread located on the inside wall of a plastic cap thereof for threading through the outer thread into the space around the periphery of the mounting base member below the bottom edge of the top flange after bonding of the mounting base member to an external panel frame by reflow soldering, and a spring member sleeved onto the threaded shank of the screw bolt of the lock screw and stopped between the head of the screw bolt and the inside step of the mounting base member. | 07-05-2012 |
20120189401 | FASTENING STRUCTURE - A fastening structure includes a thin, light weight, low torque metal plate member having a mounting through hole, and a fastening member, which has a shank body, a mounting flange extending around the periphery of the bottom end of the shank body and riveted to the mounting through hole and a screw hole on the shank body for the fastening of an external screw member to secure an external circuit board to the top end of the shank body at a distance from the plate member. The mounting flange has a tapered peripheral wall reducing gradually upwardly from the bottom end of the shank body toward the top end thereof and riveted to a mounting through hole of the plate member and a step located on the topmost edge of the tapered peripheral wall around the periphery of the shank body and kept in flush with the top wall of the plate member. | 07-26-2012 |
20140173877 | HOLELESS PLATE MEMBER RIVETING METHOD - A holeless plate member riveting method for riveting a retaining member to a holeless plate member using a press by: placing the holeless plate member on a first die of the press and attaching a mounting structure of the retaining member to the holeless plate member opposite to the first die, and then attaching a cavity of a second die of the press to the retaining member, and then operating the press to stamp the second die against the retaining member and the first die, forcing a cutting edge of the mounting structure of the retaining member to cut into the holeless plate member to the extent where a toothed portion and annular locating groove of an engagement structure of the retaining member are kept in permanent engagement with a deformed part of the holeless plate member. | 06-26-2014 |
Patent application number | Description | Published |
20100011141 | SIGNAL RELAY DEVICE AND METHOD FOR ACCESSING AN EXTERNAL MEMORY VIA THE SIGNAL RELAY DEVICE - A signal relay device for accessing an external memory is provided. The signal relay device includes a bus arbiter and a burst access engine. The bus arbiter performs bus arbitration among main masters on a bus. The burst access engine exchanges signals with the bus arbiter and an external memory controller. The signal relay device facilitates data transfer of large groups of read/write commands between the main masters and the external memory controller. | 01-14-2010 |
20110026846 | DISCRETE COSINE PROCESSING CIRCUIT AND IMAGE PROCESSING DEVICE UTILIZING THE SAME - A discrete cosine transformation circuit comprising a pipeline with a memory stage and an arithmetic stage. The arithmetic stage comprises first and second arithmetic logic units (ALU). Each of the ALUs receives from the memory a set of image data, performs a first calculation on the set of image data and outputs calculation result thereof in a first clock cycle. A path in the circuit directs the result to the memory stage, such that at least one ALU can selectively receive the result from the path in a clock cycle subsequent to the first clock cycle. | 02-03-2011 |
20110035425 | DISCRETE COSINE AND INVERSE DISCRETE COSINE TRANSFORM CIRCUIT - A discrete cosine transform (DCT) and inverse discrete cosine transform (IDCT) circuit includes a microcode memory, a processor, and a butterfly operation circuit. The microcode memory stores multiple microcode groups corresponding to DCT/IDCT operations and each of the microcode groups includes a series of microcodes. The processor obtains one of the microcode groups corresponding to one of the DCT/IDCT operations to be performed and retrieves microcodes in the obtained microcode group in sequence. The butterfly operation circuit performs butterfly operations according to the retrieved microcodes to execute one of the DCT/IDCT operations. | 02-10-2011 |
20120236109 | METHOD FOR SHARING RESOURCE OF A VIDEOCONFERENCE USING A VIDEO CONFERENCING SYSTEM - A resource sharing method for sharing user interfaces and multimedia files uses a video conferencing system which includes at least one computer, a local video terminal, a multipoint control unit (MCU), and at least one remote video terminal. The resource method includes steps where the at least one computer analyzes the format of the multimedia files and determines whether or not the local video terminal can support the format(s) of the multimedia files. The at least one computer may transmit the multimedia file(s) to the local video terminal and a multipoint control unit (MCU) and to the at least one remote video terminal through the MCU. | 09-20-2012 |
Patent application number | Description | Published |
20090027916 | LED lamp tube - An LED lamp tube is disclosed to include a tube that admits light, circuit boards respectively mounted inside the tube, each circuit board carrying an array of LEDs, two end caps respectively capped on the ends of the tube to hold the circuit boards inside the tube and connectable to connectors of a conventional fluorescent bulb holder to secure the tube to the conventional fluorescent bulb holder, and a power cord extending from the circuit boards out of the tube for connection to power supply to obtain the necessary working voltage for the LEDs. | 01-29-2009 |
20100005634 | Elastic clipping structure - The elastic clipping structure includes a body unit and an elastic unit. The body unit has a body portion, a clipping portion disposed on a first lateral side of the body portion, and an opening forming on a second lateral side of the body portion. The elastic unit has an elastic body with a U shape. The elastic body is disposed on the body portion, and the elastic body has an abutting portion abutted against the clipping portion and two movable portions passing through the opening. Therefore, the body unit and the elastic unit are mated to each other, so that when two opposite forces are acting on two opposite sides of the elastic unit, the elastic unit is compressed inwards. When the two opposite forces are released from the elastic unit, the elastic unit is restored to its original restriction position by the restriction portion. | 01-14-2010 |
Patent application number | Description | Published |
20150200095 | CUT FIRST SELF-ALIGNED LITHO-ETCH PATTERNING - The present disclosure relates to a method for performing a self-aligned litho-etch (SALE) process. In some embodiments, the method is performed by forming a first cut layer over a substrate having a multi-layer hard mask with a first layer and an underlying second layer. A first plurality of openings, cut according to the first cut layer, are formed to expose the second layer at a first plurality of positions corresponding to a first plurality of shapes of a SALE design layer. A spacer material is deposited onto sidewalls of the multi-layer hard mask to form a second cut layer. A second plurality of openings, cut according to the second cut layer, are formed to expose the second layer at a second plurality of positions corresponding to a second plurality of shapes of the SALE design layer. The second layer is etched according to the first and second plurality of openings. | 07-16-2015 |
20150200096 | CUT LAST SELF-ALIGNED LITHO-ETCH PATTERNING - The present disclosure relates to a method of performing a self-aligned litho-etch (SALE) process. In some embodiments, the method is performed by forming a spacer material over a substrate having a multi-layer hard mask with a first layer and an underlying second layer to provide a first cut layer, and forming a reverse material over the spacer material to form a second cut layer. A second plurality of openings, cut according to the second cut layer, are formed to expose the second layer at a positions corresponding to a second plurality of shapes of a SALE design layer. A first plurality of openings, cut according to the first cut layer, are formed to expose the second layer at a positions corresponding to a first plurality of shapes of the SALE design layer. The second layer is etched according to the first and second plurality of openings. | 07-16-2015 |
20150206792 | METHOD FOR FORMING CONDUCTING VIA AND DAMASCENE STRUCTURE - In accordance with some embodiments, a method for forming via holes is provided. The method includes providing a substrate with an etch stop layer and a dielectric layer sequentially formed thereon. The method also includes etching the dielectric layer to form a first via hole of a first size and a second via hole of a second size within the dielectric layer by a plasma generated from an etch gas, until both the first via hole and the second via hole are reaching the etch stop layer. The etch gas includes CH | 07-23-2015 |
Patent application number | Description | Published |
20080274589 | Wafer-level flip-chip assembly methods - A method of packaging integrated circuit structures is provided. The method includes providing a wafer having bonding conductors on a surface of the wafer, and applying a compound underfill onto the surface of the wafer. The compound underfill includes an underfill material and a flux material. A die is then bonded on the wafer after the step of applying the compound underfill, wherein solder bumps on the die are joined with the bonding conductors. | 11-06-2008 |
20080274592 | Process and apparatus for wafer-level flip-chip assembly - A method of forming an integrated circuit structure is provided. The method includes providing an interposer wafer; mounting the interposer wafer onto a handling wafer; thinning a backside of the interposer wafer; removing the handling wafer from the interposer wafer after the step of thinning; securing the interposer wafer on a fixture; and bonding a die on the interposer wafer. | 11-06-2008 |
20130093094 | Method and Apparatus for Die Assembly - Methods and apparatus for die assembly. A method includes forming a trench extending from an active surface of a semiconductor substrate comprising a plurality of integrated circuit dies having connector terminals extending from the active surface, the trench extending into, but not through, the semiconductor substrate; forming a protective layer overlying the active surface of the semiconductor substrate and the trench, and covering the lower portion of the connector terminals; opening a pre-dicing opening in the protective layer and within the trench; applying a tape over the active surface of the semiconductor wafer, the protective layer and the connector terminals; and performing an operation on a backside of the semiconductor substrate to remove material until the pre-dicing opening is exposed on the backside of the semiconductor wafer. An apparatus includes a semiconductor substrate with integrated circuits and a protective layer surrounding connector terminals of integrated circuits. | 04-18-2013 |
20130095607 | Methods and Apparatus For Alignment In Flip Chip Bonding - Methods and apparatus for alignment in a flip chip bonding. A method includes attaching an integrated circuit having connector terminals to a bonding arm, the bonding arm having a chuck for attaching the integrated circuit at the backside surface, the bonding arm having a plurality of CCD imagers mounted thereon; receiving a substrate having pads corresponding to the connector terminals; using the bonding arm, positioning the integrated circuit proximal to the substrate; aligning the integrated circuit connector terminals with the pads on the substrate using the CCD imagers on the bonding arm; positioning the connector terminals in contact with the pads on the substrate; and performing a solder reflow to attach the integrated circuit to the substrate. An apparatus includes a bonding arm with a chuck for carrying a component and CCD imagers mounted on the arm for alignment. | 04-18-2013 |
20130119565 | Rotating Curing - A system for and a method of curing a material is provided. A material, such as an underfill material, is rotated during a curing process. The curing system may include a chamber, a holder to support one or more workpieces, and a rotating mechanism. The rotating mechanism rotates the workpieces during the curing process. The chamber may include one or more heat sources and fans, and may further include a controller. The curing process may include varying the rotation speed, continuously rotating, periodically rotating, or the like. | 05-16-2013 |
20130168856 | Package on Package Devices and Methods of Packaging Semiconductor Dies - Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a bottom packaged die having solder balls disposed on the top surface thereof and a top packaged die having metal stud bumps disposed on a bottom surface thereof. The metal stud bumps include a bump region and a tail region coupled to the bump region. Each metal stud bump on the top packaged die is coupled to one of the solder balls on the bottom packaged die. | 07-04-2013 |
20140004660 | System and Method for Forming Uniform Rigid Interconnect Structures | 01-02-2014 |
20140041918 | Looped Interconnect Structure - Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder. | 02-13-2014 |
20140252609 | Package-on-Package Structure and Methods for Forming the Same - A method includes coining solder balls of a bottom package, wherein top surfaces of the solder balls are flattened after the step of coining. The solder balls are molded in a molding material. The top surfaces of the solder balls are through trenches in the molding material. | 09-11-2014 |
Patent application number | Description | Published |
20090206985 | CONTROL METHOD AND SYSTEM FOR CONTROLLING ACCESS THROUGH AN AUTOMATED DOOR - A control method for controlling access through an automated door is performed by a control system that includes a first communications unit, a processor and a storage space. The control method includes the steps of: a) through the first communications unit, receiving a communications signal transmitted from a second communications unit that has a second identification code and that transmits the communications signal upon dialing of the first identification code, and obtaining the second identification code of the second communications unit from the communications signal; and b) through the processor, comparing the second identification code obtained in step a) with at least one authorized identification code stored in the storage space, and controlling the automated door to permit access therethrough when a match is found. | 08-20-2009 |
20090272567 | ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME - An electronic device includes: first and second electronic parts, each of which has a conductive contact; and a plurality of first and second conductive filaments formed on the conductive contacts of the first and second electronic parts, respectively. The first and second electronic parts are connected detachably and coupled electrically to each other through interlocking between the first and second conductive filaments. | 11-05-2009 |
20100144164 | POWER CORD ASSEMBLY - A power cord assembly includes first and second cable units. The first cable unit includes a first cable having first and second ends, a device connector disposed on the first end of the first cable and adapted to be coupled to a power port of an electrical device, and a first connector disposed on the second end of the first cable. The second cable unit includes a second cable having first and second ends, a power plug disposed on the first end of the second cable and adapted to be coupled to a power outlet, and a second connector disposed on the second end of the second cable. The first and second connectors are coupled electrically, magnetically, and releasably to each other. | 06-10-2010 |
20100280658 | AUTOMATED VENDING SYSTEM AND METHOD - An automated vending system includes an automated vending machine and an account managing device for managing purchase transactions made with the automated vending machine. The automated vending machine includes an article dispenser operable to dispense an article, a memory unit storing a user phone number, a communication module, and a processing unit. The communication module is assigned with a first phone number and is adapted to receive a request made by a user through operating a mobile phone assigned with a second phone number to dial the first phone number. The processing unit is operable to determine if the second phone number contained in the request has a match with the user phone number stored in the memory unit, and controls the article dispenser to enable dispensing of the article when the second phone number has a match with the user phone number. | 11-04-2010 |