Rigg
Brian D. Rigg, Douglass, KS US
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20100070093 | TRANSITION TEMPERATURE ADJUSTMENT USER INTERFACES - Controllers for controlling heating, ventilating, air conditioning, and cooling (HVAC) systems are provided. The controllers include graphical user interfaces for user adjustment of system settings. The graphical user interfaces also may be designed to present information that facilitates user understanding of system operations. In certain embodiments, the controllers may allow users to adjust balance point and/or LTCO temperature values. In these embodiments, the graphical user interfaces may include slide bars for adjusting the balance point and/or LTCO temperature values. | 03-18-2010 |
20100076605 | HVAC System Controller Configuration - Control devices for configuring heating, ventilating, air conditioning, and cooling (HVAC) systems are provided. The control devices are designed to detect operational parameters of units within HVAC systems and present system configurations consistent with the detected parameters. In response to user selection of a system configuration, the control device may apply the system configuration to the HVAC system and may reconfigure settings of control circuits within system units. The system configurations presented by the control device may correspond to wiring diagrams that are familiar to service technicians. Methods of configuring HVAC systems with the control devices are also provided. | 03-25-2010 |
20130066472 | TRANSITION TEMPERATURE ADJUSTMENT USER INTERFACES - Controllers for controlling heating, ventilating, air conditioning, and cooling (HVAC) systems are provided. The controllers include graphical user interfaces for user adjustment of system settings. The graphical user interfaces also may be designed to present information that facilitates user understanding of system operations. In certain embodiments, the controllers may allow users to adjust balance point and/or LTCO temperature values. In these embodiments, the graphical user interfaces may include slide bars for adjusting the balance point and/or LTCO temperature values. | 03-14-2013 |
Christopher D. Rigg, Boulder, CO US
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20090041234 | METHOD AND APPARATUS FOR ENCRYPTING AND DECRYPTING DATA TO/FROM AN ESCON TAPE SYSTEM - A method and apparatus for encrypting data written to an Enterprise System Connection (ESCON) tape system and reading encrypted data from such a tape system and decrypting the encrypted data is described. One illustrative embodiment, in writing encrypted data to an ESCON tape system, receives from a computer over a first ESCON link a command to write a data block of specified size to the ESCON tape system; requests data constituting the data block from the computer in sub-blocks; compresses and encrypts each sub-block to produce a corresponding compressed and encrypted sub-block; and transmits to the ESCON tape system over a second ESCON link the compressed and encrypted sub-blocks using a series of chained-data write operations, the transmitted compressed and encrypted sub-blocks forming a compressed and encrypted data block on a tape of the ESCON tape system. | 02-12-2009 |
Dana Rigg, Austin, TX US
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20150186449 | METHODS AND SYSTEMS FOR RESOLVING CONFLICTS IN HIERARCHICALLY-REFERENCED DATA - In one aspect, a computer-implemented method for managing conflicts in a logical component hierarchy is provided. The logical component hierarchy includes an ancestor component and a descendant component associated with the ancestor component. The method uses a computer device in communication with a memory. The method includes determining, by the computer device, a requirement to replace the descendant component, within the logical component hierarchy, with an overriding component. The overriding component is associated with the ancestor component by an overriding reference. The method also includes replacing the descendant component with the overriding component within the logical component hierarchy. | 07-02-2015 |
David Rigg, Singapore SG
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20140138973 | DEPLOYMENT APPARATUS AND METHOD OF DEPLOYING AN UNDERWATER POWER GENERATOR - A deployment apparatus is described. The deployment apparatus is for deploying an underwater power generator having a power generating main body from a deployment vessel disposed on the surface of a body of water onto a pylon disposed on the bed of the body of water and the deployment apparatus includes: a frame including one or more connectors disposed on a base region of the frame, the connectors for releasable connection to catches disposed on an upper region of the power generating main body, the connectors being remotely operable between a connected position in which the connectors are engaged with the catches and a disconnected position in which the connectors are disengaged from the catches; and one or more cameras disposed on the frame for providing visual guidance to the vessel of the position of the underwater power generator relative to the pylon. A method for deployment of the underwater power generator is also described. | 05-22-2014 |
Graeme Rigg, Derby GB
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20140069460 | BOROSCOPE AND A METHOD OF PROCESSING A COMPONENT WITHIN AN ASSEMBLED APPARATUS USING A BOROSCOPE - A boroscope ( | 03-13-2014 |
20140305270 | SHAPING OF AEROFOIL EDGES - A portable device for shaping an edge of an aerofoil comprises a housing, a cutting tool mounted in the housing (the cutting tool having a cutting edge to remove material from the edge) and a plurality of guides mounted in the housing, so that in use the aerofoil engages with the guides to locate the edge of the aerofoil relative to the cutting edge and to permit movement of the housing in a cutting direction so as to remove material from the edge of the aerofoil. The device is characterised in that the cutting tool is mounted so that in use the cutting edge can move relative to the edge of the aerofoil in a direction generally perpendicular to the cutting direction. | 10-16-2014 |
Graeme E. Rigg, Derby GB
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20120067158 | FLEXIBLE TOOL - A flexible tool comprises stiffening means switchable in use from a first state of relatively low stiffness to a second state of relatively high stiffness, and subsequently switchable from the second state back to the first state. | 03-22-2012 |
Graeme Eric Rigg, Derby GB
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20130135457 | APPARATUS AND A METHOD OF INSPECTING A TURBOMACHINE - An apparatus for inspecting a turbomachine includes a plurality of horoscopes, a device to rotate the rotor of the turbomachine and a processor having reference measurements of the rotor blades and/or reference measurements between the rotor blades and the horoscopes. A boroscope is inserted in a casing aperture upstream of the blades to view the leading edge and a portion of one of the surfaces of each blade as the rotor is rotated. A boroscope is inserted in a casing aperture downstream of the blades to view the trailing edge and a portion of one of the surfaces of each blade as the rotor is rotated. The boroscopes supply the images of each of the blades to the processor. The processor analyses the images of the blades and uses the reference measurements to determine the position and size of any defect on any of the rotor blades. | 05-30-2013 |
20130247540 | INSPECTION DEVICE FOR AN INTERNAL COMBUSTION ENGINE - This invention relates to an internal combustion engine having a cavity for inspection, comprising: an inspection device mounted within a housing, the housing at least partially located within the cavity to be inspected and having a shutter which is actuable between a closed configuration and an open configuration; and an actuation mechanism for moving the shutter between the closed configuration and the open configuration. | 09-26-2013 |
Justin L. Rigg, Central HK
Patent application number | Description | Published |
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20100237591 | STROLLER - A stroller includes a lower carriage, an upper carriage and a foldable support assembly. The upper carriage is pivotally connected to the lower carriage. The foldable support assembly comprises a connecting member, an upper support member and a lower support member. One end of the upper support member is pivotally connected to the upper carriage. One end of the lower support member is pivotally connected to the lower carriage. At least one of the other end of the upper support member and the other end of the lower support member is pivotally connected to the connecting member. | 09-23-2010 |
Justin L. Rigg, Narvon, PA US
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20120292869 | STROLLER - A stroller includes a main frame, a seat, a wheel set, a tray, and a steer grip. The main frame has a handle bar. The seat is disposed on the main frame for holding an infant. The wheel set is attached to the main frame. The tray is disposed on the main frame corresponding to the handle bar. The steer grip projects from a side of the tray and is separate from the handle bar. | 11-22-2012 |
Marcia Rigg, Chicago, IL US
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20110107979 | Dressage whip and system and method for guiding a horse - A dressage whip for guiding a horse may have a curved segment and a tip. The curved segment may connect a first segment to a second segment, and the first segment and the second segment may be substantially co-linear. The curved segment may accommodate a thigh of a rider of a horse and may maintain the tip in a position proximate to the horse. The dressage whip may have a handle which may be a shaft having a substantially oval cross section formed by two opposed substantially flat sides and two opposed substantially curved sides. | 05-12-2011 |
Richard Rigg, Springfield Gardens, NY US
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20110150808 | METHOD FOR MANUFACTURE OF PIGMENT-CONTAINING COSMETIC COMPOSITIONS AND RELATED COMPOSITIONS - The present invention relates to pigment colorants and more directly to a pigment composition comprising a pigment treated with a water-dispersible polyester or polyesteramide polymer in the presence of added water. The invention also relates to a method grinding a mixture containing a pigment with a water-dispersible polyester or polyesteramide in the presence of added water. Such pigment compositions are particularly useful as the colorant in cosmetic composition | 06-23-2011 |
Richard T. Rigg, Cambria Heights, NY US
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20140080924 | SELF-EMULSIFYING AND STABILIZING GEL FOR STABILIZING COSMETIC COMPOSITIONS - A self-emulsifying and stabilizing gel is disclosed for stabilizing a water-in-oil emulsion or an anhydrous cosmetic to prevent decomposition of said cosmetic compositions, which consists essentially of a shear mixture of: | 03-20-2014 |
Sidney Rigg, Meridian, ID US
Patent application number | Description | Published |
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20100171217 | THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS - A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths. | 07-08-2010 |
20110233777 | THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS - A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths. | 09-29-2011 |
Sidney B. Rigg, Meridian, ID US
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20090155949 | MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES AND METHODS OF MANUFACTURING SUCH MICROELECTRONIC IMAGERS - Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports. | 06-18-2009 |
20090191701 | MICROELECTRONIC DEVICES AND METHODS FOR FORMING INTERCONNECTS IN MICROELECTRONIC DEVICES - Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material. | 07-30-2009 |
20110095429 | METHODS FOR FABRICATING AND FILLING CONDUCTIVE VIAS AND CONDUCTIVE VIAS SO FORMED - Methods for forming conductive vias include foiling one or more via holes in a substrate. The via holes may be formed with a single mask, with protective layers, bond pads, or other features of the substrate acting as hard masks in the event that a photomask is removed during etching processes. The via holes may be configured to facilitate adhesion of a dielectric coating that includes a low-K dielectric material to the surfaces thereof A barrier layer may be fowled over surfaces of each via hole. A base layer, which may comprise a seed material, may be formed to facilitate the subsequent, selective deposition of conductive material over the surfaces of the via hole. The resulting semiconductor devices, intermediate structures, and assemblies and electronic devices that include the semiconductor devices that result from these methods are also disclosed. | 04-28-2011 |
20110136336 | METHODS OF FORMING CONDUCTIVE VIAS - Methods of forming a conductive via may include forming a blind via hole partially through a substrate, forming an aluminum film on surfaces of the substrate, removing a first portion of the aluminum film from some surfaces, selectively depositing conductive material onto a second portion of the aluminum film, and exposing the blind via hole through a back side of the substrate. Methods of fabricating a conductive via may include forming at least one via hole through at least one unplated bond pad, forming a first adhesive over at least one surface of the at least one via hole, forming a dielectric over the first adhesive, forming a base layer over the dielectric and the at least one unplated bond pad, and plating nickel onto the base layer. | 06-09-2011 |
20110272806 | SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUDING SUCH SEMICONDUCTOR DICE, AND INTERMEDIATE PRODUCTS MADE WHILE FORMING AT LEAST ONE BLIND HOLE IN A SUBSTRATE - Semiconductor dice comprise at least one bond pad on an active surface of the semiconductor die. At least one blind hole extends from a back surface of the semiconductor die opposing the active surface, through a thickness of the semiconductor die, to an underside of the at least one bond pad. At least one quantity of passivation material covers at least a sidewall surface of the at least one blind hole. At least one conductive material is disposed in the at least one blind hole adjacent and in electrical communication with the at least one bond pad and adjacent the at least one quantity of passivation material. | 11-10-2011 |
20130043588 | SEMICONDUCTOR DICE INCLUDING AT LEAST ONE BLIND HOLE, WAFERS INCLUDING SUCH SEMICONDUCTOR DICE, AND INTERMEDIATE PRODUCTS MADE WHILE FORMING AT LEAST ONE BLIND HOLE IN A SUBSTRATE - Semiconductor dice comprise at least one bond pad on an active surface of the semiconductor die. At least one blind hole extends from a back surface of the semiconductor die opposing the active surface, through a thickness of the semiconductor die, to an underside of the at least one bond pad. At least one quantity of passivation material covers at least a sidewall surface of the at least one blind hole. At least one conductive material is disposed in the at least one blind hole adjacent and in electrical communication with the at least one bond pad and adjacent the at least one quantity of passivation material. | 02-21-2013 |
20130295766 | THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS - A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths. | 11-07-2013 |