Patent application number | Description | Published |
20090061593 | Semiconductor Wafer Re-Use in an Exfoliation Process Using Heat Treatment - Methods and apparatus for re-using a semiconductor donor wafer in a semiconductor-on-insulator (SOI) fabrication process provide for: (a) subjecting a first implantation surface of a donor semiconductor wafer to an ion implantation process to create a first exfoliation layer of the donor semiconductor wafer; (b) bonding the first implantation surface of the first exfoliation layer to a first insulator substrate; (c) separating the first exfoliation layer from the donor semiconductor wafer, thereby exposing a first cleaved surface of the donor semiconductor wafer, the first cleaved surface having a first damage thickness; and (d) subjecting the first cleaved surface of the donor semiconductor wafer to one or more elevated temperatures over time to reduce the first damage thickness to a sufficient level to produce a second implantation surface. | 03-05-2009 |
20090133807 | Method And Apparatus For Sealing A Glass Package - An apparatus for sealing a substrate assembly by applying a force to the assembly while simultaneously exposing the substrate assembly, and in particular a sealing material disposed between two substrates of the substrate assembly, to an irradiating beam of electromagnetic energy. The beam heats, cures and/or melts the sealing material, depending upon the sealing material to form the seal. The force is applied by directing a flow of fluid against the substrate assembly, and beneficially improves contact between the substrates of the substrate assembly and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates. | 05-28-2009 |
20090170416 | Methods and Apparatus for Forming a Slurry Polishing Pad - Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad. | 07-02-2009 |
20110073259 | METHOD AND APPARATUS FOR SEALING A GLASS PACKAGE - An apparatus for sealing a substrate assembly by applying a force to the assembly while simultaneously exposing the substrate assembly, and in particular a sealing material disposed between two substrates of the substrate assembly, to an irradiating beam of electromagnetic energy. The beam heats, cures and/or melts the sealing material, depending upon the sealing material to form the seal. The force is applied by directing a flow of fluid against the substrate assembly, and beneficially improves contact between the substrates of the substrate assembly and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates. | 03-31-2011 |
20110162786 | METHODS AND APPARATUS FOR FORMING A SLURRY POLISHING PAD - Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer peripheral edge towards the center; disposing a bladder opposite to the dome-shaped forming surface and the polishing pad pre-form; inflating the bladder with a fluid such that the dome-shaped forming surface of the bonnet form presses against the polishing pad pre-form from one side and the bladder presses against the polishing pad pre-form from an opposite side; and maintaining the pressing step for a predetermined period of time to achieve the semi-spherical polishing pad. | 07-07-2011 |
Patent application number | Description | Published |
20090131458 | Compounds - The present invention includes novel compounds useful in the treatment of various disorders in particular infectious diseases, cancer, and allergic diseases and other inflammatory conditions for example allergic rhinitis and asthma, and as vaccine adjuvants. | 05-21-2009 |
20110269781 | COMPOUNDS - The present invention includes novel compounds useful in the treatment of various disorders in particular infectious diseases, cancer, and allergic diseases and other inflammatory conditions for example allergic rhinitis and asthma, and as vaccine adjuvants. | 11-03-2011 |
20120283438 | COMPOUNDS - The present invention includes novel compounds useful in the treatment of various disorders in particular infectious diseases, cancer, and allergic diseases and other inflammatory conditions for example allergic rhinitis and asthma, and as vaccine adjuvants. | 11-08-2012 |