Patent application number | Description | Published |
20120246888 | Method of Sewing Fastener Stringer, Method of Manufacturing Product to Which Fastener is Attached, Product to Which Fastener is Attached, and Sewing Machine Foot - A fastener attached product is structured such that a slide fastener is sewn to right and left attached bodies which are bent in a U-shape, and the right and left attached bodies are arranged in a tape surface side to which the element rows of the fastener tape are sewn. Further, the right and left attached bodies come into contact with the outer surfaces of right and left flanges which are arranged in a slider, and the element rows are arranged and exposed between the right and left attached bodies. As a result of this configuration, since the fastener tape is invisible from the outside by the attached body, exposing the element rows can provide the fastener attached product with different design from conventional products and eliminate problems due to degradation in the appearance and design which is caused by the exposure of the fastener tapes. | 10-04-2012 |
20120246889 | Method of Sewing Fastener Stringer, Method of Manufacturing Product to Which Fastener is Attached, Product to Which Fastener is Attached, and Sewing Machine Foot - A method of sewing a fastener stringer includes the steps of conveying a fastener stringer and an attached body to a sewing section of a sewing machine in a state with the fastener stringer superposed on the attached body, and arranging an element guide section in the sewing section of the sewing machine, bending a fastener tape in a direction in which a tape bent section opens, guiding the element rows to the element guide section and sewing the fastener tape to the attached body. Accordingly, the method enables a sewing line formed by a sewing thread to be disposed at a predetermined position and the fastener tape and the attached body to be easily and efficiently sewn together. | 10-04-2012 |
Patent application number | Description | Published |
20130201601 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal. | 08-08-2013 |
20140376155 | Ceramic Electronic Component - A ceramic electronic component wherein outer electrode is placed over both end portions of a ceramic body. A first coating mainly containing Ni and a second coating containing Sn, solder, or the like are placed on a surface of the outer electrode. The outer electrode includes an end-surface portion and a side-surface turnover portion. The outer electrode includes a glass layer which is placed in a region within at least 5 μm in linear distance L from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si. The average thickness t of the glass layer is 3 μm to 10 μm. The content of a Si component is 11% by weight or more (preferably 40% by weight or less). | 12-25-2014 |
20150213959 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A monolithic ceramic electronic component having outer electrodes that include an inorganic substance containing at least Si, a crystal phase C containing at least Si, Ti, and Ba at the interfaces to a ceramic layer in peripheral end portions of the outer electrodes. A value of the crystal phase area ratio indicating the relationship between the area of the crystal phase C and the area of a glass phase G, which are formed at the interface to the ceramic layer, in a region within 5 μm from the peripheral end portion of the outer electrode is within a range of 75% to 98%. | 07-30-2015 |