Yoshitaka Takezawa
Yoshitaka Takezawa, Ibaraki-Shi JP
Patent application number | Description | Published |
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20100063182 | EPOXY COMPOSITION - There is disclosed an epoxy composition containing at least two kinds of epoxy compounds selected from the epoxy compounds of the formula (1): | 03-11-2010 |
20100144926 | EPOXY RESIN COMPOSITION - A resin composition comprising an epoxy compound denoted by the formula (1): | 06-10-2010 |
20100160555 | RESIN COMPOSITION - A resin composition comprising an epoxy compound denoted by the formula (1): | 06-24-2010 |
Yoshitaka Takezawa, Hitachi JP
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20090298976 | Fiber-Reinforced Composition Resin Composition, Adhesive and Sealant - An object of the present invention is to provide a fiber-reinforced composite resin composition for use as a sealant, adhesive, or filler, having a high transparency, and enabled to adequately meet recently required levels of low thermal expansion property, high strength, light weight, high thermal conductivity, and especially high, isotropic thermal conductivity. With the fiber-reinforced composite resin composition, the fibers have an average fiber diameter of 4 to 200 nm, a total light transmittance at wavelengths of 400 to 700 nm as measured with a 50 μm-thickness cured product, resulting from curing the composition to a plate-like form, is no less than 70%, both a thermal conductivity coefficient in a thickness direction and a thermal conductivity coefficient in a plate surface direction of the cured product are no less than 0.4 W/m·K, and the fibers are oriented randomly in the composition. | 12-03-2009 |
Yoshitaka Takezawa, Hitachinaka JP
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20080199987 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF LEAD FRAME - Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes in the atmosphere which has oxygen, crosslinkage density becoming high in resin of adhesives, a low molecular compound volatilizes and jumps out outside, therefore as a result, since a low molecular compound does not remain in resin of adhesives, the generation of copper migration can be prevented. | 08-21-2008 |
20090160048 | Semiconductor Unit, and Power Conversion System and On-Vehicle Electrical System Using the Same - A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating property. The radiator base has a cooling-medium channel therein or radiating fins on the outside. Alternatively, the radiator base is housed in a second radiator base. | 06-25-2009 |
Yoshitaka Takezawa, Hitachi-Shi JP
Patent application number | Description | Published |
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20090105388 | Epoxy Resin Composition and Cured Epoxy Resin - An epoxy resin composition comprising an epoxy compound represented by the formula (1): | 04-23-2009 |
20090123726 | FIBER-REINFORCED COMPOSITE MATERIAL, METHOD FOR MANUFACTURING THE SAME, AND APPLICATIONS THEREOF - The present invention relates to a fiber-reinforced composite material and a method for manufacturing the same, and also relates to a transparent multilayered sheet, a circuit board, and an optical waveguide. | 05-14-2009 |
Yoshitaka Takezawa, Tsukuba-Shi JP
Patent application number | Description | Published |
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20120244351 | MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME - A multilayer resin sheet is constituted by including a resin layer containing an epoxy resin having a mesogenic skeleton, a curing agent and an inorganic filler, and an insulating adhesive layer formed on at least either of the surfaces of the resin layer. | 09-27-2012 |
20120251830 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME - A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. | 10-04-2012 |
20120315487 | COMPOSITE PARTICLE, METHOD FOR PRODUCING THE SAME, AND RESIN COMPOSITION - A composite particle is constituted to include: an aluminum nitride particle; a first coating layer that contains α-alumina and coats at least a part of a region of a surface of the aluminum nitride particle; and a second coating layer that contains organic matter and coats a region other than the first coating layer of the surface of the aluminum nitride particle. | 12-13-2012 |
20130189514 | MULTILAYER RESIN SHEET AND PROCESS FOR PRODUCTION THEREOF, RESIN SHEET LAMINATE AND PROCESS FOR PRODUCTION THEREOF, CURED MULTILAYER RESIN SHEET, METAL-FOIL-CLADDED MULTILAYER RESIN SHEET, AND SEMICONDUCTOR DEVICE - A multilayer resin sheet including: a resin layer that includes an epoxy resin monomer, a curing agent, and a filler; and an adhesive layer positioned on at least one face of the resin layer, the filler having peaks in ranges of from 0.01 μm to less than 1 μm, from 1 μm to less than 10 μm, and from 10 μm to 100 μm, respectively, in terms of particle size distribution as measured by laser diffractometry, and the filler having a particle size of from 10 μm to 100 μm including a boron nitride filler. | 07-25-2013 |
20140248504 | RESIN COMPOSITION, RESIN SHEET, CURED RESIN SHEET, RESIN-ADHERED METAL FOIL AND HEAT DISSIPATION DEVICE - The present invention provides a resin composition, including: a filler that includes alumina particles and boron nitride particles; an elastomer having a weight-average molecular weight of from 10,000 to 100,000; and a curable resin. The present invention also provides a resin sheet, a cured resin sheet, a resin-adhered metal foil and a heat dissipation device, which are formed by using the resin composition. | 09-04-2014 |
20140283972 | RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD FOR PRODUCING THE SAME - A resin composition constituted by containing an epoxy resin monomer having a mesogenic structure, a novolac resin containing a compound having a structural unit represented by the following general formula (I), and an inorganic filler is superior in preservation stability before curing, and can attain high thermal conductivity after curing. | 09-25-2014 |
Yoshitaka Takezawa, Ibaraki JP
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20150144835 | PHENOLIC RESIN COMPOSITION - Provided is a phenolic resin composition containing: an epoxy resin curing agent that contains a hydroxybenzene derivative represented by the following Formula (I) and a phenol resin having at least one partial structure selected from the group consisting of the following Formulae (IIa), (IIb), (IIc) and (IId); and an epoxy resin. In these Formulae, each of R | 05-28-2015 |