Yoshisaka
Keiichi Yoshisaka, Osaka JP
Patent application number | Description | Published |
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20100014334 | ELECTRIC POWER SUPPLY CIRCUIT - An electric power supply circuit includes a diode bridge circuit ( | 01-21-2010 |
20100061128 | ELECTRIC POWER SUPPLY CIRCUIT - An electric power supply circuit includes a switching element (S) for causing a short-circuit for output power of a diode bridge circuit ( | 03-11-2010 |
20110026280 | POWER CONVERSION APPARATUS - The invention relates to a power conversion apparatus including a converter circuit and an inverter circuit. The invention allows more precise output control of the inverter circuit than a power conversion apparatus in which the output control is performed based on a current value only, thereby improving operation efficiency. A current sensor detects input current of the inverter circuit, and a voltage sensor detects input voltage of the inverter circuit. A power value calculator section in an inverter microcomputer obtains a power value based on the input current and the input voltage. The inverter microcomputer and the control microcomputer perform droop control of reducing the output of the inverter circuit to make the power value smaller than a predetermined power value. | 02-03-2011 |
Keiichi Yoshisaka, Sakai-Shi JP
Patent application number | Description | Published |
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20100061127 | POWER SUPPLY DEVICE - The power supply device according to the present invention converts alternating-current power into direct-current power, and supplies the direct-current power to a load. Further, the power supply device includes a buffer, a control section, a rectifier circuit, a smoothing circuit, and a switch. After a predetermined zero cross point is detected, the control section uses in common, over a predetermined period of the alternating-current power, predetermined parameters retained in the buffer in calculating a timing at which a PAM interrupt pulse is generated. | 03-11-2010 |
20100073977 | ELECTRIC POWER SUPPLY CIRCUIT AND PAM CONTROL METHOD FOR THE SAME - An increase in a ripple voltage of a capacitor in a smoothing circuit is prevented to achieve a compact capacitor and cost reduction for capacitors in an electric power supply circuit which performs PAM control using a switching element. | 03-25-2010 |
Takuma Yoshisaka, Shiga JP
Patent application number | Description | Published |
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20110303439 | ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME - Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins. | 12-15-2011 |
20110305883 | ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME - Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition. | 12-15-2011 |
Takuma Yoshisaka, Kouga-Shi JP
Patent application number | Description | Published |
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20120043118 | ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME - Provided is an adhesive resin composition containing (A) an epoxy resin and/or a phenoxy resin; (B) an epoxy-containing styrene copolymer containing a monomer unit having an epoxy group and a styrene monomer unit; (C) a thermoplastic resin; and (D) a curing agent, in which the content percentage of the epoxy-containing styrene copolymer (B) relative to the total amount of the resin components contained in the adhesive resin composition is 3% to 25% by mass. The adhesive resin composition is a halogen-free adhesive composition having good flame retardancy and a high peel strength. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition. | 02-23-2012 |