Abare
Amber C. Abare, Durham, NC US
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20120068198 | HIGH DENSITY MULTI-CHIP LED DEVICES - High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption. | 03-22-2012 |
20130322068 | LIGHT EMITTER PACKAGES, SYSTEMS, AND METHODS HAVING IMPROVED PERFORMANCE - Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode. | 12-05-2013 |
20130322070 | LIGHT EMITTER PACKAGES, SYSTEMS, AND METHODS - Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips. | 12-05-2013 |
20140217433 | LIGHT EMITTER DEVICES AND METHODS FOR LIGHT EMITTING DIODE (LED) CHIPS - Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm | 08-07-2014 |
20150048393 | HIGH DENSITY MULTI-CHIP LED DEVICES - High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption. | 02-19-2015 |
Amber Christine Abare, Cary, NC US
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20120298955 | GROUP III NITRIDE BASED LIGHT EMITTING DIODE STRUCTURES WITH A QUANTUM WELL AND SUPERLATTICE, GROUP III NITRIDE BASED QUANTUM WELL STRUCTURES AND GROUP III NITRIDE BASED SUPERLATTICE STRUCTURES - A semiconductor device is provided that includes a Group III nitride based superlattice and a Group III nitride based active region comprising at least one quantum well structure on the superlattice. The quantum well structure includes a well support layer comprising a Group III nitride, a quantum well layer comprising a Group III nitride on the well support layer and a cap layer comprising a Group III nitride on the quantum well layer. A Group III nitride based semiconductor device is also provided that includes a gallium nitride based superlattice having at least two periods of alternating layers of In | 11-29-2012 |
Charles A. Abare, Athens, AL US
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20100061053 | Ruggedized Computer Capable of Operating in High-Temperature Environments - Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment. | 03-11-2010 |
20110304980 | Ruggedized Computer Capable of Operating in High Temperature Environments - Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment. | 12-15-2011 |
Dave Abare, Plaistow, NH US
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20100050374 | GROMMET AND METHOD OF PRODUCTION - A device, system, and method for producing a flexible grommet for use against edges of an aperture. The exemplary method may involve producing a straight piece of flexible material with a U-shaped profile having two wall portions coupled by a central portion wherein an interior U-shaped profile is sized to produce a frictional fit with the edge of the aperture. Multiple slits may be produced in the wall portions at location of curves when the grommet is positioned within the aperture. The straight piece of flexible material may be bent along the slits. The grommet may be positioned within the aperture. | 03-04-2010 |
Dave Abare, Haverhill, MA US
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20090139598 | COVER ASSEMBLY - A system, method, and device for an assembly cover positioning on an end piece is disclosed. The exemplary device may have a sidewall portion made of a ring of material with an aperture in the center wherein the aperture is sized to produce a frictional fit on the end piece. The exemplary device also has a cover portion coupled to a top portion of the sidewall portion. | 06-04-2009 |