Patent application number | Description | Published |
20080230513 | METHOD OF MANUFACTURING INK-JET PRINT HEAD - A method for manufacturing an ink-jet print head including: preparing a single crystal silicon wafer having a (110) crystal plane orientation, as a substrate; forming a heater to heat an ink, on a front surface of a silicon substrate; forming a trench inward of the heater; forming a flow channel layer defining an ink passage, on the front surface of the substrate; forming a nozzle layer having a nozzle on the flow channel layer; and forming an ink supply channel from a rear surface of the substrate to the trench by anisotropic wet etching. | 09-25-2008 |
20080231665 | INKJET PRINTHEAD, PRINTING METHOD USING THE SAME, AND METHOD OF MANUFACTURING THE INKJET PRINTHEAD - The inkjet printhead includes substrate having an ink feed hole formed to supply ink, a chamber layer stacked on the substrate, and including a plurality of main ink chambers formed therein with the ink feed hole therebetween and a plurality of compensation ink chambers formed therein between the main ink chambers that face each other; and a nozzle layer stacked on the chamber layer, and including a plurality of main nozzles corresponding to the main ink chambers and a plurality of compensation nozzles corresponding to the compensation ink chambers. | 09-25-2008 |
20080283494 | METHOD OF MANUFACTURING THERMAL INKJET PRINTHEAD - A method of manufacturing a thermal inkjet printhead. The method includes forming on a substrate a chamber layer having an ink chamber, forming a sacrificial layer on the chamber layer wherein the sacrificial layer fills the ink chamber, and planarizing a top surface of the sacrificial layer and of the chamber layer using a primary Chemical Mechanical Polishing (CMP) process until the sacrificial layer and the chamber layer attain a desired height, wherein a slurry is used in the primary CMP process that includes polishing particles having an average particle size of 500 nm˜2 μm. | 11-20-2008 |
20080313900 | METHOD OF MANUFACTURING INKJET PRINT HEAD - A method of manufacturing an inkjet print head simplifies a manufacturing process and uniformly forms an ink channel and includes forming a chamber layer using a low-speed optical hardening material on a substrate, hardening regions of the chamber layer for the wall of an ink channel by selectively exposing the chamber layer to light, forming a nozzle layer using a high-speed optical hardening material, having a higher optical reaction speed than that of the low-speed optical hardening material, on the chamber layer, hardening regions of the nozzle layer other than nozzles by selectively exposing the nozzle layer to light, and forming the ink channel and the nozzles by developing the chamber layer and the non-exposed regions of the nozzle layer. | 12-25-2008 |
20090003064 | FLASH MEMORY DEVICE AND METHOD OF PROGRAMMING FLASH MEMORY DEVICE - A flash memory device and a method of programming the same include a memory cell array, a pass/fail check circuit and a control logic circuit. The memory cell array includes multiple memory cells arranged in rows and columns. The pass/fail check circuit verifies whether data bits selected by a column address during a column scan operation have program data values. The control logic circuit detects fail data bits from the selected data bits and stores the column address in response to the verification result of the pass/fail check circuit. The control logic circuit also compares a number of the fail data bits with a reference value and controls generation of the column address according to the comparison result. | 01-01-2009 |
20090154281 | SEMICONDUCTOR DEVICE WITH REDUCED STANDBY FAILURES - A semiconductor memory device includes a cell core storing data, a plurality of peripheral circuit components, collectively driving data to/from the cell core and providing a default state at an output signal state during an initialization process upon power-up, and an initialization circuit detecting a standby mode of operation for the semiconductor memory device, and upon detecting the standby mode controlling operation of the plurality of peripheral circuit components to provide the default state as the signal state during standby mode. | 06-18-2009 |
20090237451 | INKJET PRINT HEAD AND MANUFACTURING METHOD THEREOF - An inkjet print head including a substrate and a first film member stacked on the substrate to form an ink path, and a manufacturing method thereof. The first film member includes a path-defining layer made of a photosensitive material and formed with the ink path, and an adhesive layer made of a photosensitive material and used to stably bond the path-defining layer to the substrate. With this configuration, the path-defining layer and the adhesive layer can be simultaneously stacked on the substrate and also, can be patterned simultaneously. | 09-24-2009 |
20100033536 | INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - An inkjet printhead and a method of manufacturing the inkjet printhead. In the inkjet printhead, an anti reflective layer is formed of a material absorbing light on a chamber layer, and a nozzle layer including a plurality of nozzles is formed on the anti reflective layer. | 02-11-2010 |
20100060695 | INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - An inkjet printhead includes: a substrate in which an ink feed hole is formed; a chamber layer which is formed on the substrate by performing a photolithography process and which includes a first photosensitive resin; and a nozzle layer which is formed on the chamber layer by performing a photolithography process and which includes a second photosensitive resin. The first photosensitive resin and the second photosensitive resin are materials which are developed by different developing solutions, respectively. Additional layers and components may be incorporated into the inkjet printhead and may be formed on an upper surface of the substrate. The additional layers and components may include an insulating layer, one or more heaters, one or more electrodes, a passivation layer, a glue layer, and an anti-cavitation layer. | 03-11-2010 |
20100067303 | FLASH MEMORY DEVICE CAPABLE OF REDUCED PROGRAMMING TIME - A flash memory device comprising a high voltage generator circuit that is adapted to supply a program voltage having a target voltage to a selected word line is provided. The flash memory device is adapted to terminate the program interval in accordance with when the program voltage has been restored to the target voltage after dropping below the target voltage. A method for operating the flash memory device is also provided. | 03-18-2010 |
20100110142 | INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - Inkjet printheads and methods of manufacturing the inkjet printhead are disclosed. The inkjet printhead may include a glue layer disposed between the substrate and a chamber layer. The glue layer may contain a crosslink inhibitor that inhibits cross linkage of a photosensitive resin during an exposing process. | 05-06-2010 |
20100127295 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a light emitting device and a method of manufacturing the same. A light emitting device includes an active layer; a first conductive semiconductor layer on the active layer; a second conductive semiconductor layer on the active layer so that the active layer is disposed between the first and second conductive semiconductor layers; and a photonic crystal structure comprising a first light extraction pattern on the first conductive semiconductor layer having a first period, and second light extraction pattern on the first conductive semiconductor layer having a second period, the first period being greater than λ/n, and the second period being identical to or smaller than λ/n, where n is a refractive index of the first conductive semiconductor layer, and λ is a wavelength of light emitted from the active layer. | 05-27-2010 |
20100128091 | INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME - Disclosed are an inkjet printhead and a method of fabricating the same. The inkjet printhead can include a substrate; a chamber layer formed on the substrate and a nozzle layer formed on the chamber layer. The chamber layer defines one or more ink chambers in which ink to be ejected may be accommodated. The nozzle layer includes one or more nozzles through which the ink from the ink chambers are ejected. The nozzle layer may be formed of a cured product of a photosensitive dry film that includes an light absorption material. | 05-27-2010 |
20100165044 | INKJET PRTINTHEAD AND METHOD OF MANUFACTURING THE SAME - Provided are an inkjet printhead and a method of manufacturing the same. The inkjet printhead includes: a substrate including an ink feed hole; a chamber layer formed on the substrate and including a plurality of ink chambers in which ink supplied from the ink feed hole may be filled; and a nozzle layer formed on the chamber layer and including a plurality of nozzles through which ink may be ejected, wherein the chamber layer and the nozzle layer are respectively formed of cured products of a first negative photoresist composition and a second negative photoresist composition, wherein the first negative photoresist composition and the second negative photoresist composition include a bisphenol-A novolac epoxy resin represented by Formula 1; at least one epoxy resin selected from a first epoxy resin represented by Formula 2, and a second epoxy resin represented by Formula 3; a cationic photoinitiator; and a solvent. | 07-01-2010 |
20100211852 | METHOD OF READING DATA IN NON-VOLATILE MEMORY DEVICE - In a method of reading data from a non-volatile memory device, read data is generated based on a word line voltage. The read data includes data read from a plurality of sectors included in the non-volatile memory device. Bad sector data is transferred data based on read data and bad sector information. The bad sector data corresponds to data read from at least one bad sector included in the plurality of sectors. The bad sector information is updated by checking error bits of the bad sector data. The word line voltage is generated based on the updated bad sector information. | 08-19-2010 |
20100224854 | LIGHT EMITTING DEVICE - A light emitting device (LED) is provided. The LED comprises a light emitting structure and a mixed-period photonic crystal structure. The light emitting structure comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The mixed-period photonic crystal structure is on the light emitting structure. | 09-09-2010 |
20100237372 | LIGHT EMITTING DEVICE - A light emitting device including a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first photonic crystal structure on the light emitting structure; a lower encapsulant on the first photonic crystal structure; and a second photonic crystal structure on the lower encapsulant. | 09-23-2010 |
20110068355 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device and a light emitting device package including the same are provided. The light emitting device may include a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode on the light emitting structure, the first electrode including a pattern, and a pad electrode on the first electrode. | 03-24-2011 |
20110281426 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device and a method of forming the semiconductor device includes: forming gate electrodes on a semiconductor substrate and forming spacers on both side surfaces of the gate electrodes; forming capping patterns on the gate electrodes; and forming a metal contact between the gate electrodes. Each of the capping patterns is formed to have a width greater than a width of each of the gate electrodes. | 11-17-2011 |
20120012859 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a light emitting device and a method of manufacturing the same. A light emitting device includes an active layer; a first conductive semiconductor layer on the active layer; a second conductive semiconductor layer on the active layer so that the active layer is disposed between the first and second conductive semiconductor layers; and a photonic crystal structure comprising a first light extraction pattern on the first conductive semiconductor layer having a first period, and second light extraction pattern on the first conductive semiconductor layer having a second period, the first period being greater than λ/n, and the second period being identical to or smaller than λ/n, where n is a refractive index of the first conductive semiconductor layer, and λ is a wavelength of light emitted from the active layer. | 01-19-2012 |
20120080723 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME METHOD - A fabricating method of a semiconductor device includes providing a substrate having a first region and a second region, forming a plurality of first gates in the first region of the substrate, such that the first gates are spaced apart from each other at a first pitch, forming a plurality of second gates in the second region of the substrate, such that the second gates are spaced apart from each other at a second pitch different from the first pitch, implanting an etch rate adjusting dopant into the second region to form implanted regions, while blocking the first region, forming a first trench by etching the first region between the plurality of first gates, and forming a second trench by etching the second region between the plurality of second gates. | 04-05-2012 |
20120100645 | METHOD FOR FABRICATING LIGHT EMITTING DEVICE - A method for fabricating a light emitting device is provided. The method comprises forming a light emitting structure comprising a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer and forming a mixed-period photonic crystal structure on the light emitting structure. And the forming of the mixed-period photonic crystal structure includes defining a first photonic crystal structure through a lithography process and a dry etching process, and forming a second photonic crystal structure through a wet etching process. | 04-26-2012 |
20120164809 | SEMICONDUCTOR DEVICES INCLUDING STRAINED SEMICONDUCTOR REGIONS, METHODS OF FABRICATING THE SAME, AND ELECTRONIC SYSTEMS INCLUDING THE DEVICES - A method of fabricating a semiconductor device includes forming a gate pattern on a substrate, forming an amorphous silicon (a-Si) region adjacent to the gate pattern by implanting a dopant containing a Group IV or VIII element into portions of the semiconductor substrate, forming gate spacers on sidewalls of the gate pattern, forming a first cavity by etching the a-Si region and the substrate using a first etching process, forming a second cavity by etching the substrate, such that the second cavity expands a profile of the first cavity in lateral and vertical directions, and forming a strained semiconductor region in the second cavity. | 06-28-2012 |
20120302034 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device is provided. The method includes providing a substrate having a protruding channel region, forming a gate insulation layer surrounding the protruding channel region, forming a sacrificial layer having an etch selectivity varying in a thickness direction of the sacrificial layer, on the gate insulation layer, and performing a gate-last process to form a gate electrode on the gate insulation layer in place of the sacrificial layer. | 11-29-2012 |
20130211290 | OUTSOLE SHEET FOR GAIT DIAGNOSIS, AND FOOTWEAR SYSTEM FOR GAIT DIAGNOSIS AND SERVICE SYSTEM FOR GAIT POSTURE DIAGNOSIS USING SAME - A shoes system for walk diagnosis using an insole sheet for walk diagnosis includes shoes for walk diagnosis including a PCB installation groove having a stepped groove at one upper side of an insole to mount a system for detecting a gait, a cover attached onto the insole, a pressure detection sheet placed on the cover to generate a switching signal corresponding to a pressure applied by a walker, and a circuit unit that is installed in the PCB installation groove, is connected to a connecting unit of the pressure detection sheet, accumulates and manages signals detected from the connecting part for each time slot, supplies wireless power to the system, and wirelessly transmits data corresponding to walk information, and a charging stage including a mounting panel for mounting the shoes for walk diagnosis. | 08-15-2013 |
20140110757 | FABRICATING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME METHOD - A fabricating method of a semiconductor device includes providing a substrate having a first region and a second region, forming a plurality of first gates in the first region of the substrate, such that the first gates are spaced apart from each other at a first pitch, forming a plurality of second gates in the second region of the substrate, such that the second gates are spaced apart from each other at a second pitch different from the first pitch, implanting an etch rate adjusting dopant into the second region to form implanted regions, while blocking the first region, forming a first trench by etching the first region between the plurality of first gates, and forming a second trench by etching the second region between the plurality of second gates. | 04-24-2014 |
20140210017 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device and a method of forming the semiconductor device includes: forming gate electrodes on a semiconductor substrate and forming spacers on both side surfaces of the gate electrodes; forming capping patterns on the gate electrodes; and forming a metal contact between the gate electrodes. Each of the capping patterns is formed to have a width greater than a width of each of the gate electrodes. | 07-31-2014 |
20140326085 | SHOE INSOLE SENSOR FOR WALK DIAGNOSIS AND SHOE INSOLE FLEXIBLE BOARD COMBINED WITH THE SAME - A shoe insole sensor includes a body including a plurality of recessed regions formed at respective locations corresponding to vertexes of N-polygon, where N is an even number, a plurality of first protrusions formed in odd recessed regions of the recessed regions, where each of the first protrusions has a first height, and a plurality of second protrusions formed in even recessed regions of the recessed regions, where each of the second protrusions has a second height different from the first height. Here, the body is formed with a nonconductive material, each of the first protrusions is formed with a conductive material, and each of the second protrusions is formed with a conductive material. | 11-06-2014 |