Patent application number | Description | Published |
20110198638 | LIGHT-EMITTING DIODE (LED) PACKAGE SYSTEMS - A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure. | 08-18-2011 |
20110230043 | TAPE RESIDUE-FREE BUMP AREA AFTER WAFER BACK GRINDING - Organic-adhesive tapes are often used to secure and protect the bumps during wafer processing after bump formation. While residual organic-adhesive tape may remain on the wafer after tape de-lamination, applying a bump template layer on the bumps before laminating the tape allows any residue to be removed afterwards and results in a residue-free wafer. | 09-22-2011 |
20120097986 | WAFER LEVEL REFLECTOR FOR LED PACKAGING - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 04-26-2012 |
20130157395 | Light-Emitting Diode (LED) Package Systems - A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure. | 06-20-2013 |
20130299855 | Wafer Level Reflector for LED Packaging - An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter. | 11-14-2013 |
Patent application number | Description | Published |
20090130840 | Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging - Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress. | 05-21-2009 |
20110193056 | Vertical LED Chip Package on TSV Carrier - A method of forming a light-emitting device (LED) package component includes providing a substrate; forming an LED on the substrate; and lifting the LED off the substrate. A carrier wafer is provided, which includes a through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. The LED is bonded onto the carrier wafer, with the LED electrically connected to the TSV. | 08-11-2011 |
20110215354 | Double Flip-Chip LED Package Components - A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first and a second bond pad on a surface of the carrier chip; and a third and a fourth bond pad on the surface of the carrier chip and electrically connected to the first and the second bond pads, respectively. The first, the second, the third, and the fourth bond pads are on a same surface of the carrier chip. The LED package component further includes a first and a second metal bump bonding the first and the second bond pads, respectively, onto the LED chip through flip-chip bonding; and a window-type module substrate bonded onto the third and the fourth bond pads through flip-chip bonding. The window-type module substrate includes a window, with the LED chip configured to emit light toward the window. | 09-08-2011 |
20110215360 | LED Flip-Chip Package Structure with Dummy Bumps - A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip. | 09-08-2011 |
20110215361 | Thermally-Enhanced Hybrid LED Package Components - A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first bond pad and a second bond pad on a surface of the carrier chip and bonded onto the LED chip through flip-chip bonding, and a third bond pad and a fourth bond pad on the surface of the carrier chip and electrically connected to the first bond pad and the second bond pad, respectively. The first bond pad and the second bond pad are on a same side of the carrier chip facing the LED chip. The carrier chip further includes at least one through substrate via (TSV) connected to the first and second bond pads. | 09-08-2011 |
20120225509 | LED Flip-Chip Package Structure with Dummy Bumps - A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip bonding. The carrier chip includes a first active through-substrate via (TSV) and a second active TSV connected to the first and the second active bond pads, respectively. The carrier chip further includes a dummy TSV therein, which is electrically coupled to the first active bond pad, and is configured not to conduct any current when a current flows through the LED chip. | 09-06-2012 |
20130009316 | Apparatus and Methods for Dicing Interposer Assembly - Methods and apparatus for performing dicing of die on wafer interposers. Methods are disclosed that include receiving an interposer assembly including one or more integrated circuit dies mounted on a die side of an interposer substrate and having scribe areas defined in spaces between the integrated circuit dies, the interposer having an opposite side for receiving external connectors; mounting the die side of the interposer assembly to a tape assembly, the tape assembly comprising an adhesive tape and preformed spacers disposed between and filling gaps between the integrated circuit dies; and sawing the interposer assembly by cutting the opposite side of the interposer in the scribe areas to make cuts through the interposer, the cuts separating the interposer into one or more die on wafer assemblies. Apparatuses are disclosed for use with the methods. | 01-10-2013 |
20130075937 | Apparatus and Methods for Molding Die on Wafer Interposers - Methods and apparatus for performing molding on die on wafer interposers. A method includes receiving an interposer assembly having a die side and an opposite side including two or more integrated circuit dies mounted on the die side of the interposer, the interposer assembly having spaces formed on the die side of the interposer between the two or more integrated circuit dies; mounting at least one stress relief feature on the die side of the interposer assembly in one of the spaces between the two or more integrated circuit dies; and molding the integrated circuit dies using a mold compound, the mold compound surrounding the two or more integrated circuit dies and the at least one stress relief feature. An apparatus is disclosed having integrated circuits mounted on a die side of an interposer, stress relief features between the integrated circuits and mold compound over the integrated circuits. | 03-28-2013 |
20130119533 | Package for Three Dimensional Integrated Circuit - A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package. | 05-16-2013 |
20130122689 | Methods for De-Bonding Carriers - A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape. | 05-16-2013 |
20130217188 | Structures and Formation Methods of Packages with Heat Sinks - A device includes a package component, and a die over and bonded to the package component. The die includes a substrate. A heat sink is disposed over and bonded to a back surface of the substrate through direct bonding. | 08-22-2013 |
20130285241 | Apparatus For Dicing Interposer Assembly - Apparatus for performing dicing of die on wafer interposers. Apparatuses are disclosed for use with the methods of dicing an interposer having integrated circuit dies mounted thereon. An apparatus includes a wafer carrier mounted in a frame and having a size corresponding to a silicon interposer, a fixture mounted to the wafer carrier and comprising a layer of material to provide mechanical support to the die side of the silicon interposer, the fixture being patterned to fill spaces between integrated circuit dies mounted on an interposer; and an adhesive tape disposed on a surface of the fixture for adhering to the surface of a silicon interposer. Additional alternative apparatuses are disclosed. | 10-31-2013 |
20130299984 | Protected Solder Ball Joints in Wafer Level Chip-Scale Packaging - Protection of a solder ball joint is disclosed in which the solder ball joint is located below the surface level of the encapsulating buffer layer. The buffering layer is etched to expose one or more electrode posts, each of which may be made up of a single column or multiple columns. A top layer resulting either from a top conductive cap or a plating layer around the electrode posts also lies below the buffer layer. When the solder ball is placed onto the posts, the solder/ball joint is protected in a position below the surface of the buffer layer, while still maintaining an electrical connection between the various solder balls and their associated or capping/plating material, electrode posts, wiring layers, and circuit layers. Therefore, the entire ball joint is protected from direct stress. | 11-14-2013 |
20140038360 | Apparatus and Methods for Molding Die on Wafer Interposers - Methods and apparatus for performing molding on die on wafer interposers. A method includes receiving an interposer assembly having a die side and an opposite side including two or more integrated circuit dies mounted on the die side of the interposer, the interposer assembly having spaces formed on the die side of the interposer between the two or more integrated circuit dies; mounting at least one stress relief feature on the die side of the interposer assembly in one of the spaces between the two or more integrated circuit dies; and molding the integrated circuit dies using a mold compound, the mold compound surrounding the two or more integrated circuit dies and the at least one stress relief feature. An apparatus is disclosed having integrated circuits mounted on a die side of an interposer, stress relief features between the integrated circuits and mold compound over the integrated circuits. | 02-06-2014 |
20140322866 | Package for Three Dimensional Integrated Circuit - A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package. | 10-30-2014 |
20150083996 | VERTICAL LED CHIP PACKAGE ON TSV CARRIER - A light-emitting device (LED) package component includes a carrier wafer. The carrier wafer includes a first through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. A light-emitting device (LED) is bonded onto the carrier wafer. The LED are electrically connected to the first TSV. A conductive thermal interface material (TIM) is located between, and adjoining, the first TSV and the LED. | 03-26-2015 |
20150145133 | Apparatus for Dicing Interposer Assembly - Apparatus for performing dicing of die on wafer interposers. Apparatuses are disclosed for use with the methods of dicing an interposer having integrated circuit dies mounted thereon. An apparatus includes a wafer carrier mounted in a frame and having a size corresponding to a silicon interposer, a fixture mounted to the wafer carrier and comprising a layer of material to provide mechanical support to the die side of the silicon interposer, the fixture being patterned to fill spaces between integrated circuit dies mounted on an interposer; and an adhesive tape disposed on a surface of the fixture for adhering to the surface of a silicon interposer. Additional alternative apparatuses are disclosed. | 05-28-2015 |
Patent application number | Description | Published |
20140168928 | Pivoting Mechanism and Electronic Device Thereof - A pivoting mechanism capable of being passed through by a wire is disclosed. The pivoting mechanism includes a first fixing portion and a second fixing portion. The first fixing portion includes a pivot body. An accommodating slot is formed on a surface of the pivot body, and the accommodating slot stretches from a side of the pivot body to the other side of the pivot body. The second fixing portion includes an annular body corresponding to the pivot body, and a pivot hole is formed around the annular body. The pivot body passes through the pivot hole. The first fixing portion pivots to the second pivoting portion via a combination of the pivot body and the annular body, and the wire passes through the accommodating slot. The present invention has low manufacturing cost and preferred assembly convenience. | 06-19-2014 |
20140220790 | Electrical Hinge Assembly and Electric Device using the Same - The invention relates to an electrical hinge assembly and an electric device using the same. The electric device includes the electrical hinge assembly, a first slab and a second slab. The electrical hinge assembly includes a first holder and a second holder. The first holder comprises a shaft body. The shaft body includes a central shaft and a conductive layer. The conductive layer covers the central shaft. The second holder comprises a tube body. The tube body surrounds the shaft body capable of being rotated. The first slab is fastened with the first holder and comprises a first electrical component. The first electrical component is electrically connected to an end of the conductive layer. The second slab is fastened with the second holder and comprises a second electrical component. The second electrical component is electrically connected to another end of the conductive layer. | 08-07-2014 |
20140370748 | ELECTRICAL SIGNAL CONNECTOR - An electrical signal connector for connecting a coaxial cable to a mating connector is disclosed to include a locknut, a metal central tube inserted through the locknut and defining a stop flange at one end, a barbed retaining portion at an opposite end, a locating groove around the periphery between the stop flange and barbed retaining portion and an annular bearing surface portion extending around the periphery between the stop flange and the locating groove, a chuck unit including a collar, which is press-fitted onto the annular bearing surface portion of the metal central tube and having longitudinal clamping strips suspending around the barbed retaining portion of the metal central tube, and a constraint shell surrounding the collar, and an actuation sleeve mounted within the constraint shell around the collar and manually axially movable relative to the chuck unit between two positions to compress or release the longitudinal clamping strips. | 12-18-2014 |
20150101148 | Phase-Locked Pivot Assembly - The present invention is related to a phase-locked pivot assembly, which includes a support component. A first shaft and a second shaft pivot to the support component. A first annular body is configured to rotate with the first shaft. The first annular body includes a first outer annular surface and a first sunken arc portion. A second annular body is configured to rotate with the second shaft and corresponds to the first annular body. The second annular body includes a second outer annular surface and a second sunken arc portion. The first sunken arc portion and the second outer annular surface are matched and selectively contact to each other to lock the first shaft. The second sunken arc portion and the first outer annular surface are matched and selectively contact to each other to lock the second shaft. | 04-16-2015 |
Patent application number | Description | Published |
20080263823 | Hinge assembly - A hinge assembly is used to pivotally attach a cover to a base of an electronic device and has a stationary leaf, at least one barrel and a pintle assembly. The stationary leaf has an upper end and barrel housing. The barrel housing has a slot and two keyways. Each barrel is mounted in the barrel housing and has a neck and two keys. The neck has two sides. The two keys are formed respectively on the two sides of the neck and are mounted respectively in the keyways. The pintle assembly is mounted through the bushing of the at least one barrel. | 10-30-2008 |
20080307609 | Hinge - A hinge connects a display to a base of a notebook. The display has two sides and a bottom edge. The hinge has a stationary leaf, a bearing, a bracket and two pivoting leaves. The stationary leaf is mounted on the base. The bearing is formed on and at a relative incline to the stationary leaf. The bracket is parallel with respect to the base, but when the bracket rotates on the bearing, the bracket changes angle relative to the base until the bracket corresponds to the incline of the bearing. This raises an end of the bracket over the base and allows the display to rotate. | 12-18-2008 |
20090282645 | HINGE WITH MULTIPLE STRENGTH-ENHANCED RESILIENT FLAT WASHERS - A hinge has a stationary leaf, multiple resilient flat washers and a pintle. The stationary leaf has a sleeve. The resilient flat washers are mounted in the sleeve and each resilient flat washer has a ring and a key wing. The ring has a receiving recess formed in a first surface and a mounting rib formed in a second surface. The receiving recess of each resilient flat washer engages the mounting rib of a corresponding resilient flat washer. With the engagements of the receiving recesses and the mounting ribs, the resilient flat washers are connected to each other to enhance the strength of the resilient flat washers. Therefore, the resilient flat washers are strong enough to bear the abrasion for long term use. | 11-19-2009 |
20090311073 | RESILIENT FLAT WASHER AND A HINGE WITH RESILIENT FLAT WASHERS - A resilient flat washer has a ring and a keyed wing. The ring has an inner annular edge, an outer annular edge and at least one inner abrasion flange. The at least one inner abrasion flange is formed longitudinally on the inner annular flange. The keyed wing is formed transversely on the outer annular edge. A hinge has a stationary leaf, multiple resilient flat washers and a pintle. The resilient flat washers are mounted in a sleeve of the stationary leaf. The pintle is mounted rotatably in the rings and has a pivoting rod. The pivoting rod abuts the at least one inner abrasion flange, so the contact area between each resilient flat washer and the pivoting rod are increased. Therefore, the friction provided by the resilient flat washers is enhanced. | 12-17-2009 |
20110232032 | Hinge with spacers - A hinge has a pintle, a spacer assembly, a stationary bracket and a rotating bracket. The pintle is mounted through the spacer assembly and is connected to the stationary and rotating brackets. The spacer assembly has multiple spacers stacked with each other. Each spacer has a ring segment and a bearing segment. The ring segment is mounted around the pintle. The bearing segment has an absorbing space to absorb the stress acting on the ring segment. Therefore, the spacer sustains less stress to prevent breakage easily and a lifespan of the spacer is extended. Therefore, the hinge has a longer lifespan. | 09-29-2011 |
20110232034 | Hinge with spacers - A hinge has a pintle, a spacer assembly, a stationary bracket and a rotating bracket. The pintle is mounted through the spacer assembly and is connected to the stationary and rotating brackets. The spacer assembly has multiple spacers stacked with each other. Each spacer has a ring segment and a bearing segment. The ring segment is mounted around the pintle. The bearing segment has an absorbing space to absorb the stress acting on the ring segment. Therefore, the spacer sustains less stress to prevent breakage easily and a lifespan of the spacer is extended. Therefore, the hinge has a longer lifespan. | 09-29-2011 |
20120102675 | Torque-adjustable hinge and portable device with the same - A torque-adjustable hinge is mounted between a display panel and a base of a portable device and has a stationary bracket, a rotating bracket, a pintle, a torsional spring and an adjusting element. The stationary bracket is attached to the base. The rotating bracket is attached to the display panel. The pintle is attached to the rotating bracket and is mounted through the torsional spring. The torsional spring is attached to the stationary bracket and abuts against the adjusting element. By changing the height that the adjusting element protrudes above a receiving tag of the stationary bracket, the torsional spring is selectively tighter or looser wound around the pintle. Therefore, the torque generated by the hinge is adjusted without replacing any element. | 05-03-2012 |
Patent application number | Description | Published |
20120099193 | LIGHT EMITTING DIODE PACKAGING STRUCTURE AND LIGHT EMITTING DIODE STEREOSCOPIC DISPLAY DEVICE - A Light Emitting Diode (LED) packaging structure comprises an LED die, a package body, and an optical element. The package body wraps the LED die, and the optical element is disposed on the package body. A light beam emitted by the LED die passes through the optical element and is split into a plurality of sub-light beams, and each of sub-light beams is individually projected onto an image plane corresponding to the optical element. Therefore, the LED packaging structure is applied to an LED stereoscopic display device, so that left eye and right eye of a viewer may respectively receive light beams emitted by different LED dies, so as to view a stereoscopic image, thereby solving a problem of a conventional stereoscopic display device that the stereoscopic image may be viewed in only a single viewable area. | 04-26-2012 |
20130293953 | LIGHT EMITTING DIODE PACKAGING STRUCTURE AND LIGHT EMITTING DIODE STEREOSCOPIC DISPLAY DEVICE - A Light Emitting Diode (LED) packaging structure comprises an LED die, a package body, and an optical element. The package body wraps the LED die, and the optical element is disposed on the package body. A light beam emitted by the LED die passes through the optical element and is split into a plurality of sub-light beams, and each of sub-light beams is individually projected onto an image plane corresponding to the optical element. Therefore, the LED packaging structure is applied to an LED stereoscopic display device, so that left eye and right eye of a viewer may respectively receive light beams emitted by different LED dies, so as to view a stereoscopic image, thereby solving a problem of a conventional stereoscopic display device that the stereoscopic image may be viewed in only a single viewable area. | 11-07-2013 |
20130293954 | LIGHT EMITTING DIODE PACKAGING STRUCTURE AND LIGHT EMITTING DIODE STEREOSCOPIC DISPLAY DEVICE - A Light Emitting Diode (LED) packaging structure comprises an LED die, a package body, and an optical element. The package body wraps the LED die, and the optical element is disposed on the package body. A light beam emitted by the LED die passes through the optical element and is split into a plurality of sub-light beams, and each of sub-light beams is individually projected onto an image plane corresponding to the optical element. Therefore, the LED packaging structure is applied to an LED stereoscopic display device, so that left eye and right eye of a viewer may respectively receive light beams emitted by different LED dies, so as to view a stereoscopic image, thereby solving a problem of a conventional stereoscopic display device that the stereoscopic image may be viewed in only a single viewable area. | 11-07-2013 |
20130293955 | LIGHT EMITTING DIODE PACKAGING STRUCTURE AND LIGHT EMITTING DIODE STEREOSCOPIC DISPLAY DEVICE - A Light Emitting Diode (LED) packaging structure comprises an LED die, a package body, and an optical element. The package body wraps the LED die, and the optical element is disposed on the package body. A light beam emitted by the LED die passes through the optical element and is split into a plurality of sub-light beams, and each of sub-light beams is individually projected onto an image plane corresponding to the optical element. Therefore, the LED packaging structure is applied to an LED stereoscopic display device, so that left eye and right eye of a viewer may respectively receive light beams emitted by different LED dies, so as to view a stereoscopic image, thereby solving a problem of a conventional stereoscopic display device that the stereoscopic image may be viewed in only a single viewable area. | 11-07-2013 |
20140048828 | LED DISPLAY PANEL AND LED DISPLAY APPARATUS - An LED display panel includes: a semiconductor wafer having a top surface; a plurality of LED elements disposed over the top surface of the semiconductor wafer, each of the LED elements having an electrode contact; and a plurality of driving circuits formed in the semiconductor wafer. Each of the driving circuits has an electrode-connecting contact that is disposed on the top surface of the semiconductor wafer and that is bonded to the electrode contact of a respective one of the LED elements. | 02-20-2014 |
Patent application number | Description | Published |
20090066389 | Power Controlling Apparatus Applied to Biochip and Operating Method Thereof - The invention discloses a power controlling apparatus for a biochip including M regions. Each region includes a plurality of cells respectively. The power controlling apparatus includes a pulse generating module, a combinational circuit, and M controlling modules. The pulse generating module generates a pulse. The combinational circuit receives the pulse and generates M controlling signals. Each controlling signal has a predetermined phase which is different from the phase of the other controlling signal. The M controlling modules are electrically connected to the combinational circuit. Each of the M controlling signals corresponds to and activates one of the M controlling modules to selectively power on one corresponding region of the M regions. The cells in the corresponding region which is powered have an action potential refractory time that is longer than the power-on interval of the corresponding region. | 03-12-2009 |
20100060370 | VOLTAGE-CONTROLLED OSCILLATOR - A voltage-controlled oscillator comprises a variable inductor, a negative impedance circuit, an operating voltage source and a ground point. The variable inductor comprises a transformer and a transistor switch, the transformer comprising a primary side coil and a secondary side coil, the primary side coil comprising a first coil and a second coil, and the secondary side coil comprising a third coil and a fourth coil. The transistor switch is connected in parallel with the primary side coil to adjust an inductance value of the variable inductor based on a gate voltage. The negative impedance circuit is connected in parallel with the secondary side coil to compensate the power consumption of the voltage-controlled oscillator during oscillation. The operating voltage source is electrically connected between the third coil and the fourth coil, and the ground point is electrically connected between the first coil and the second coil. | 03-11-2010 |
20130147384 | DRIVING CIRCUIT AND ITS METHOD OF LIGHT EMITTING DIODE - A driving circuit comprising a control unit, a current control unit, a pulse width modulation control unit and a current driving unit is described. The control unit provides a first control signal and a second control signal. The current control unit is connected to the control unit, and converts a reference current into a plurality of current setting signals based on a data signal and the first control signal. The pulse width modulation control unit is connected to the control unit and outputs a pulse signal based on the data signal and the second control signal. The current driving unit is connected to the pulse width modulation control unit and drives the light emitting diode based on a driving current, wherein the control unit generates a continuous conduction time in a predetermined operation period based on the pulse signal and the current setting signals | 06-13-2013 |
20150327990 | OPTICAL AID AND RETINAL IMPLANT DEVICE THEREOF - An optical aid comprises a projecting device and a retinal implant device. The projecting device includes an image projector for outputting a projected image and a light generator for emitting an auxiliary light that differs in wavelength from the projected image. The retinal implant device includes an optical-to-electrical converter and an image sensor. The optical-to-electrical converter converts the auxiliary light received thereby into electricity for powering the image sensor. The image sensor is disposed in such a way that the auxiliary light is not received thereby, and generates an electrical stimulus signal associated with the projected image. | 11-19-2015 |
20150352361 | ARTIFICIAL RETINAL SYSTEM - An artificial retinal system includes an optical device and a retinal implant device. The optical device includes an image generator for generating (M) projected images, each having (N) projected blocks with (M) identical projected sub-blocks, based differently on an external image, and output ting the projected images in sequence through optical projection. The projected sub-blocks of each projected block of each projected linage are associated with a corresponding original sub-block of a corresponding original block. The retinal implant device includes a pixel array with (N) pixel units, each generating (M) electrical stimulus signals based on a respective one of the projected blocks, and combines the electrical stimulus signals to obtain a total electrical stimulus signal. | 12-10-2015 |