Patent application number | Description | Published |
20080236171 | MAGNETIC REFRIGERATING DEVICE AND MAGNETIC REFRIGERATING METHOD - A magnetic refrigerating device includes: at least one set of double-structured Halbach type magnet including a ring-shaped inner Halbach type magnet and a ring-shaped outer Halbach type magnet which are coaxially arranged one another so that a magnetic field generated by the inner Halbach type magnet is superimposed with a magnetic field generated by the outer Halbach type magnet; a magnetic refrigerant or a magnetic refrigeration working chamber including the magnetic refrigerant therein disposed in a bore space of the inner Halbach type magnet; and a rotating mechanism to rotate the outer Halbach type magnet while the inner Halbach type magnet is stationed. | 10-02-2008 |
20090075498 | Electrical connector - An electrical connector is disclosed. Connection targets have edges, respectively, on which conductive portions are formed. The electrical connector serves to electrically connect the conductive portions of connection targets with the edges facing each other. The electrical connector comprises an electrode sheet, a press member and a connection keeper. The electrode sheet comprises an insulation sheet and an electrode pattern formed on the insulation sheet. The press member is made of elastic material distinct from the electrode sheet. The press member is arranged to press the electrode pattern against the conductive portions of the connection targets when the press member is compressed, so that the conductive portions of the connection targets are connected to each other by the electrode pattern. The connection keeper is configured to keep the connection between the conductive portions of the connection targets with the press member compressed. | 03-19-2009 |
20090075510 | Socket - The present invention provides a socket for an element with an element electrode. The socket comprises a base shell, a cover shell and a contact member. The cover shell is engaged with the base shell so that the base shell and the cover shell define a cavity. Each of the base shell and the cover shell is made of a high thermal-conductive material. The contact member comprises an elastic member and a contact electrode provided on the elastic member and are designed and arranged so that the element is mountable on the contact member within the cavity with the element electrode connected to the contact electrode. | 03-19-2009 |
20090075515 | HEAT TRANSFER MEMBER AND CONNECTOR - A heat transfer member which is capable of enhancing efficiency of heat dissipation, and a connector including the heat transfer member. On the surface of an elastic body arranged between an LED and a heat sink, a heat conduction metal thin film that transfers heat generated in the LED to the heat sink is formed. | 03-19-2009 |
20090163054 | Electrical connector - An electrical connector for electrically connecting conductive portions formed on edges of connection objects, respectively. The electrical connector comprises an electrode sheet and a press member. The electrode sheet comprises an insulation sheet and an electrode formed on the insulation sheet. The press member comprises a plurality of springs arranged to press the insulation sheet against the conductive portions of the connection objects to force the electrode to be brought into contact with the conductive portions. | 06-25-2009 |
20100151744 | Electrical connection member adapted to bring conductive paths formed in an insulating film into pressure contact with a connection object using inclined springs - In an electrical connection member having elasticity and adapted to be interposed between connection objects for electrically connecting them together, an inner member has a plurality of spring pieces each extending from a base plate portion, an outer member including a flexible insulating film and a plurality of conductive paths formed at the flexible insulating film. Each conductive path has a first and a second contact portion for connection to the connection objects. Each spring piece includes a root portion formed adjacent to the base plate portion and faced to a portion, corresponding to the second contact portion, of an inner surface of an intermediate portion of the insulating film. Each spring piece further includes an inclined spring portion extending obliquely from the root portion and faced to a portion, corresponding to the first contact portion, of the inner surface of the intermediate portion. | 06-17-2010 |
20110244711 | CONNECTOR - A first connector has a first holding member holding first male and female terminals. Each first male terminal has a horizontally extending first male contact. Each first female terminal has a first female contact. A second connector has a second holding member holding second male and female terminals. Each second male terminal has a horizontally extending second male contact receivable in the first female contact. Each second female terminal has a second female contact which receives the first male contact. The first and second connectors are positioned at a predetermined position in a vertical direction whereas the first male contact is apart from the second female contact while the second male contact is apart from the first female contact. A guiding mechanism guides the first connector to a position where the first and second male contacts are respectively connected to the second and first female contacts. | 10-06-2011 |
20130072037 | HOUSINGLESS CONNECTOR - Provided is a housingless connector in which a plurality of cantilevers arranged in a comb shape and functioning as contacts is hardly damaged. A receptacle connector (housingless connector) is formed of a single metal plate and used to be mounted on a receptacle-side substrate. The receptacle connector includes a plurality of cantilevers arranged in a comb shape and functioning as contacts, and an outer frame body surrounding the cantilevers. The outer frame body includes a pair of side plates sandwiching the cantilevers in a direction parallel to a connector mounting surface of the receptacle-side substrate, and a top plate disposed on an opposite side of the receptacle-side substrate with the cantilevers interposed therebetween. | 03-21-2013 |
20130137305 | CONNECTOR - Provided is a connector that can be firmly mounted on the substrate. A plug connector is mounted on a plug substrate while making a metal plate function as a plurality of contacts by an insulting layer formed on the metal plate and a plurality of conductive patterns formed on the insulating layer. A plurality of protrusions that protrude toward the plug substrate are formed on a substrate opposing surface, which is a surface opposite to the plug substrate. The plurality of conductive patterns are formed to respectively overlap the plurality of protrusions. | 05-30-2013 |
20140004745 | HOUSINGLESS CONNECTOR | 01-02-2014 |
20140367737 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate of a first conductivity type, a first impurity region of a second conductivity type formed on a top surface side of the substrate, a second impurity region of the second conductivity type formed on the top surface side of the substrate and in contact with the first impurity region, the second impurity region laterally surrounding the first impurity region and having a greater depth than the first impurity region, as viewed in cross-section, and a breakdown voltage enhancing structure of the second conductivity type formed to laterally surround the second impurity region. A boundary between the first and second impurity regions has a maximum impurity concentration equal to or less than that of the second impurity region, and a current is applied between a top surface and a bottom surface of the substrate. | 12-18-2014 |
Patent application number | Description | Published |
20080284935 | LIQUID CRYSTAL DISPLAY UNITS WITH DATA AND/OR ADDRESS LINES BEING FORMED OF COPPER ALLOY AND METHOD OF FABRICATING THE SAME - Disclosed is a liquid crystal display device having a signal line of low electrical resistivity and high adhesion with an underlayer, wherein a copper alloy film is formed on an underlayer, and an oxide film, silicide film or nitride film, which are additive metal elements of the copper alloy, is formed at the boundary between the underlayer and the copper alloy film whereby the signal line is formed with a multi-layer film of the copper alloy film and the oxide film, the silicide film, or the nitride film. | 11-20-2008 |
20100060839 | LIQUID CRYSTAL DISPLAY DEVICE AND PROCESS OF MANUFACTURE - Provided is a liquid crystal display device capable of significantly reducing occurrence of a failure such as an interlayer short-circuit. In the liquid crystal device, a first layer formed of a copper film having a purity of 99.5% or more and a second layer formed of an alloy film containing copper as a main component are successively formed on a glass substrate or a substrate on which a transparent conductive film containing indium is formed. The alloy film serving as the second layer is made of an alloy containing copper as a main component, which has a higher etching rate in a wet etching process compared with that of copper. Accordingly, a patterned cross-section of the copper film having a large film thickness can be etched in a tapered shape, to thereby improve coverage of an insulating film or the like laminated on a wiring pattern. | 03-11-2010 |
20120320300 | Liquid Crystal Display Device and Process of Manufacture - A liquid crystal display device and method includes a pair of substrates with liquid crystal sandwiched therebetween, a plurality of intersecting scanning signal lines and image signal lines, a thin film transistor formed corresponding to each intersection, a pixel electrode which is formed in a pixel region and connected to the thin film transistor, a gate insulating film, and a protective insulating film. At least one of the scanning signal lines and the image signal lines are each formed of a laminated film including a first layer and a second layer, wherein the first layer is formed of a copper film having a purity of at least 99.5%, and the second layer is formed of an alloy film containing copper as a main component. The first layer and the second layer are collectively subjected to wet etching with an etchant having a predetermined pH. | 12-20-2012 |