Patent application number | Description | Published |
20090290348 | Thermal Management Of LED-Based Lighting Systems - An LED-based lighting system includes a housing forming one or more apertures, a PCB having conductors on its front-side, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a top surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing. A retrofit apparatus for a light fixture includes a PCB having conductors on its front-side thereof, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a surface of a mounting bracket that is configured for mounting to the light fixture, such that when the bracket mounts to the light fixture, heat generated by the one or more LEDs primarily dissipates through the conductors and the structural element to the light fixture. | 11-26-2009 |
20100053929 | LED Packaging Methods And LED-Based Lighting Products - A method of packaging a light-emitting diode (LED) chip includes coupling the LED chip to a printed circuit board (PCB) and forming a conductor on a cover plate. Conductive epoxy is applied to at least one of the LED chip and the conductor. The cover plate is coupled to the PCB such that the conductive epoxy forms a circuit connection between the LED chip and the conductor. An LED-based lighting product includes a PCB with one or more LED chips mounted directly thereon. A cover plate has conductors that couple at least to the one or more LED chips and to the PCB, such that the conductors form electrical connections between the one or more LED chips and the PCB. | 03-04-2010 |
20100285620 | LED PACKAGING METHODS AND LED-BASED LIGHTING PRODUCTS - A method of packaging a light-emitting diode (LED) chip includes coupling the LED chip to a printed circuit board (PCB) and forming a conductor on a cover plate. Conductive epoxy is applied to at least one of the LED chip and the conductor. The cover plate is coupled to the PCB such that the conductive epoxy forms a circuit connection between the LED chip and the conductor. An LED-based lighting product includes a PCB with one or more LED chips mounted directly thereon. A cover plate has conductors that couple at least to the one or more LED chips and to the PCB, such that the conductors form electrical connections between the one or more LED chips and the PCB. | 11-11-2010 |
20100308350 | LED Chip-Based Lighting Products And Methods Of Building - Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors. | 12-09-2010 |
20110121324 | LED Chip-Based Lighting Products And Methods Of Building - Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors. | 05-26-2011 |
20120042512 | LED Chip-Based Lighting Products And Methods Of Building - A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate. | 02-23-2012 |
20120313120 | Method For Depositing A Phosphor Layer On LEDs, And Apparatus Made Thereby - A method for depositing a phosphor layer on a light-emitting diode (“LED”) chip includes coating at least a light-emitting side of the LED chip with a phosphor-adhesive material, and applying phosphor particles to an exposed surface of the material such that the phosphor layer forms of phosphor particles that adhere to the exposed surface. A method for depositing phosphor layers on each of a plurality of LED chips includes mounting the LED chips to a common substrate, coating at least a light-emitting side of the LED chips with a phosphor-adhesive material, and applying phosphor particles to exposed surfaces of the material such that the phosphor layers form of phosphor particles that adhere to the material. A processed LED chip includes an unpackaged LED chip, a phosphor-adhesive material applied to a light-emitting side of the LED chip, and a phosphor layer formed of phosphor particles adhered to the material. | 12-13-2012 |
20130105829 | LED CHIP-BASED LIGHTING PRODUCTS AND METHODS OF BUILDING | 05-02-2013 |
20130107496 | Socketable LED Light Bulb | 05-02-2013 |
20130193463 | Methods Of Integrating LED Chips With Heat Sinks, And Led-Based Lighting Assemblies Made Thereby - An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB. | 08-01-2013 |
20130294060 | Thermal Management Of LED-Based Lighting Systems - An LED lighting element for use in a fluorescent lighting fixture includes first and second end caps formed as printed circuit boards for connecting with and obtaining physical support from respective first and second sockets of the fluorescent lighting fixture, and a blade supporting one or more LEDs between the first and second end caps. The blade includes a first compartment that contains high voltage circuitry, a second compartment, separated from the first compartment, that contains a low voltage assembly including the one or more LEDs, and a third compartment forming an optical cavity. The element also includes a power converter, located in one or both of the first and second end caps, that converts power from the fluorescent light socket into power for operating the LEDs. | 11-07-2013 |
20140125213 | Methods Of Integrating LED Chips With Heat Sinks, And LED-Based Lighting Assemblies Made Thereby - An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB. | 05-08-2014 |
20140320023 | LIGHTING SYSTEMS AND METHODS PROVIDING ACTIVE GLARE CONTROL - A light fixture includes a dimmable light source that emits light downwardly, and a downward-looking rangefinder proximate and operatively coupled with the light source. When the rangefinder detects an object at a measured height that exceeds a first threshold, the light source dims according to the measured height. A light fixture that provides illumination with active glare control for a lighted area includes one or more first light sources that emit high-angle light, and one or more dimmable second light sources that emit low-angle light, into the lighted area. The system also includes a camera that captures images of the lighted area, and an controller that is (a) operable to identify one or more activity locations within the lighted area from the images, and (b) operatively coupled to dim one or more of the light sources that illuminate the one or more activity locations. | 10-30-2014 |