Lee, Hwaseong-City
Dae Woo Lee, Hwaseong-City KR
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20090030594 | VIBRATION REDUCING SYSTEM AT KEY-OFF AND METHOD THEREOF - A system and method for controlling engine shutoff at vehicle ignition key-off. An ignition module performs ignition in the engine's cylinders according to a predetermined ignition sequence. An engine module detects the cylinder in which ignition currently occurs. An engine control module controls the engine to stop operating only after a predetermined condition is satisfied after key-off. The predetermined condition may be that the cylinder in which ignition currently occurs is a preselected cylinder, such as the cylinder closest to a flywheel. The method determines whether an ignition key is turned off, detects the cylinder in which ignition currently occurs if the ignition key is turned off, determines whether the cylinder in which ignition currently occurs is a preselected cylinder, and controls the engine to stop only if the cylinder in which ignition currently occurs is the preselected cylinder. The preselected cylinder may be closest to a flywheel. | 01-29-2009 |
Jae Kwon Lee, Hwaseong-City KR
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20100132662 | Piston of Gasoline Direct Injection Engine - A piston of a gasoline direct engine may include a protuberance portion protruding along a circular arc shape having a radius (R1) equal to the piston diameter to have a predetermined height (T) from the upper surface thereof, and the edge of the protuberance portion is rounded to be connected with the upper surface; a bowl (B) having a bottom surface (F1) having an asymmetrical ellipse shape from the center of the protuberance portion to the intake side direction thereof, wherein the bottom surface thereof becomes deeper in the exhaust side direction to have a predetermined slope angle (θ | 06-03-2010 |
Jaesik Lee, Hwaseong-City KR
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20130130472 | SEMICONDUCTOR CHIPS HAVING GUARD RINGS AND METHODS OF FABRICATING THE SAME - Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer. | 05-23-2013 |
Sungwon Lee, Hwaseong-City KR
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20100037869 | Fuel supply system for vehicle - A fuel supply system for a vehicle may include a fuel tank including a mounting portion protruding downwards from an upper inner surface of the fuel tank, a fuel limit vent valve and a rollover valve that is connected with the fuel limit vent valve within the fuel tank, and a mounting plate connecting the fuel limit vent valve and the rollover valve and configured to be mounted onto the mounting portion of the fuel tank. | 02-18-2010 |
20100132456 | Fuel Sender Assembly for Vehicle - A fuel sender assembly for a vehicle may include a main housing which is mounted at a reservoir cap and is provided with a boss therein, a variable resistance unit which is mounted inside the main housing and is provided with a ceramic resistance plate having a ground resistance, a contact arm unit disposed at an upper portion of the ceramic resistance plate and rotatably mounted at the boss inside the main housing, a main cover which has a penetrating hole in a corresponding position to the boss and is mounted at a front surface of the main housing, a float arm having one end which is bent and is rotatably mounted at a front surface of the main cover and the other end, and a float mounted at the other end of the float arm so as to rotate the float arm according to the residual fuel. | 06-03-2010 |
Ui-Hyoung Lee, Hwaseong-City KR
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20130256876 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a semiconductor chip having a plurality of contact pads on a surface thereof, a plurality of main bumps on the contact pads, respectively. Each of the plurality of main bumps includes a first pillar layer on one of the contact pads and a first solder layer on the first pillar layer, and the first solder layer includes an upper portion having an overhang portion. | 10-03-2013 |
Un Koo Lee, Hwaseong-City KR
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20100052475 | Energy Regeneration Device for Suspension System - An energy regeneration device for a suspension system may include a transforming body configured to be compressed or elongated by a chassis spring of the suspension system, and at least an electric generating member that are electrically connected each other and configured to be compressed or elongated with the transforming body. | 03-04-2010 |
20110042907 | ACTIVE GEOMETRY CONTROL SUSPENSION - An active geometry control suspension, may include an assist link of which a wheel is connected to one end portion thereof to guide a movement of the wheel, a moving member, one portion of which is pivotally fixed to the other end portion of the assist link, a guide formed in the moving member and including a slot to slidably receive the moving member therein so as to guide a movement of the moving member, a body that is fixed to a vehicle body to connect the guide thereto, and a driving portion coupled to the other portion of the moving member and moving the moving member along the slot to vary a position of the assist link and thus to vary an alignment angle of the wheel. | 02-24-2011 |
Wang Kweon Lee, Hwaseong-City KR
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20090156353 | Planetary gear set - A planetary gear set includes: a sun gear, a plurality of planetary gears externally meshed with the sun gear, and a carrier that interconnects the plurality of planetary gears such that the plurality of planetary gears revolve around a exterior circumference of the sun gear, and an arrangement of the plurality of planetary gears is rotationally non-symmetrical. | 06-18-2009 |
Yong-Joo Lee, Hwaseong-City KR
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20100190225 | D-PSICOSE PRODUCTION METHOD BY D-PSICOSE EPIMERASE - Provided is a method of producing D-psicose using a D-psicose epimerase derived from | 07-29-2010 |