Patent application number | Description | Published |
20120125414 | PHOTOELECTRIC CONVERTER - The photoelectric converter includes a substrate; and multiple cells located on the substrate so as to be overlaid. The first cell contacted with the substrate includes a transparent electrode located on the substrate, and a first photoelectric conversion layer located on the transparent electrode. The other cell or each of the others of the multiple cells includes a porous electroconductive layer located closer to the substrate and including an electroconductive material, and a photoelectric conversion layer located on the porous electroconductive layer. Each of the photoelectric conversion layers of the multiple cells includes an electron transport layer including an electron transport material, a dye connected with or adsorbed on the electron transport material, and a hole transport material. The hole transport material is also contained in voids of the porous electroconductive layer. | 05-24-2012 |
20140212705 | SOLID DYE SENSITIZATION TYPE SOLAR CELL AND SOLID DYE SENSITIZATION TYPE SOLAR CELL MODULE - A solid dye sensitization type solar cell includes a substrate, a first electrode disposed on the substrate, an electron transport layer including an electron transport semiconductor and disposed on the first electrode, the electron transport layer including a photosensitizing compound adsorbed on a surface of the electron transport semiconductor, a hole transport layer disposed on the electron transport layer, and a second electrode disposed on the hole transport layer. Each of the first electrode and the second electrode includes divided multiple electrodes. | 07-31-2014 |
20150287537 | NONAQUEOUS ELECTROLYTIC CAPACITOR ELEMENT - To provide a nonaqueous electrolytic capacitor element, which contains: a positive electrode containing a positive electrode active material capable of intercalating or deintercalating anions; a negative electrode containing a negative electrode active material; and a nonaqueous electrolyte, which contains a nonaqueous solvent, an electrolyte salt containing a halogen atom, and a compound having a site capable of bonding to an anion containing a halogen atom. | 10-08-2015 |
20150303512 | NONAQUEOUS ELECTROLYTIC STORAGE ELEMENT - To provide a nonaqueous electrolytic storage element, which contains: a positive electrode, which contains a positive electrode material layer including a positive electrode active material capable of reversibly accumulating and releasing anions; a negative electrode, which contains a negative electrode material layer including a negative electrode active material capable of reversibly accumulating and releasing cations; a separator provided between the positive electrode and the negative electrode; and a nonaqueous electrolyte containing an electrolyte salt, wherein a pore volume of the negative electrode material layer per unit area of the negative electrode is larger than a pore volume of the positive electrode material layer per unit area of the positive electrode. | 10-22-2015 |
20150303513 | NONAQUEOUS ELECTROLYTIC STORAGE ELEMENT - To provide nonaqueous electrolytic storage element, containing: a positive electrode, which contains a positive electrode active material capable of accumulating and releasing anions; a negative electrode containing a negative electrode active material capable of accumulating and releasing cations; and a nonaqueous electrolyte containing an electrolyte salt, wherein a capacity of the negative electrode per unit area is larger than a capacity of the positive electrode per unit area, and wherein an amount of the electrolyte salt in the nonaqueous electrode at the time of completion of charging after 50 cycles of charging and discharging is 0.2 mol/L to 1 mol/L, where the cycle of charging and discharging contains charging the nonaqueous electrolytic storage element to 5.2 V with constant electric current of 0.5 mA/cm | 10-22-2015 |
Patent application number | Description | Published |
20120167916 | NEUTRALIZING/REDUCING AGENT, AND DESMEAR METHOD - Disclosed is a neutralizing/reducing agent for neutralizing/reducing an oxidizing agent component that is adsorbed and remains on an object to be coated after the object is subjected to a desmear treatment with the oxidizing agent, which comprises a thioamide compound and a non-aromatic thiol compound. The neutralizing/reducing agent does not generate any gas during a neutralization/reduction treatment, and therefore the occurrence of defects caused by the neutralization/reduction on the surface of a through hole or a blind via hole can be prevented. Further, the neutralizing/reducing agent hardly dissolves copper, and therefore the occurrence of haloing can be prevented, and the blistering caused by the etching between an inner layer copper and a resin with the neutralizing/reducing agent can also be prevented. | 07-05-2012 |
20120171363 | CATALYST APPLICATION SOLUTION, ELECTROLESS PLATING METHOD USING SAME, AND DIRECT PLATING METHOD - Disclosed is a catalyst application solution for plating an insulating portion of an object to be plated that comprises the insulating portion. The catalyst application solution is characterized by containing a water-soluble palladium compound, a reducer, a dispersant, catechol, a copper antioxidant and a buffering agent, and by having a pH of not less than 4. When the catalyst application solution is compared with a Pd—Sn colloidal solution, the catalyst application solution has the following advantages: since the catalyst application solution is a colloidal solution of Pd only that does not contain Sn, a pre-dip process and an Sn removal process are unnecessary and thus the catalyst application process can be simplified; since the catalyst application solution has a pH of not less than 4, haloing does not occur; and since the catalyst application solution is in a reducing atmosphere due to the reducer contained therein, a copper surface is not oxidized and no copper dissolution occurs, thereby causing no palladium displacement reaction. | 07-05-2012 |
20120298505 | ELECTROLYTIC REGENERATION UNIT AND ELECTROLYTIC REGENERATION APPARATUS USING SAME - An anode pipe includes a main pipe portion and a secondary pipe portion. The anode pipe has an inner circumferential surface that functions as an anode. The main pipe portion has a first connection end portion and a second connection end portion. The main pipe portion forms a flow channel for a treatment liquid that continues from the first connection end portion to the second connection end portion. The secondary pipe portion extends in a tubular fashion from the intermediate section of the main pipe portion. The interior of the secondary pipe portion communicates with the flow channel inside the main pipe portion. The cathode is disposed at a distance from the inner circumferential surface of the anode pipe. The cathode extends from a cathode attachment end portion toward the main pipe portion inside the secondary pipe portion. | 11-29-2012 |
Patent application number | Description | Published |
20100059386 | DIRECT PLATING METHOD AND SOLUTION FOR PALLADIUM CONDUCTOR LAYER FORMATION - A surface of an object to be plated is subjected to a treatment for palladium catalyst impartation to impart a palladium catalyst to the surface of an insulating part thereof. A palladium conductor layer is formed on the insulating part from a solution for palladium conductor layer formation which contains a palladium compound, an amine compound, and a reducing agent. On the palladium conductor layer is then directly formed a copper deposit by electroplating. Thus, the work is converted to a conductor with the solution for palladium conductor layer formation, which is neutral, without using an electroless copper plating solution which is highly alkaline. Consequently, the polyimide is prevented from being attacked and no adverse influence is exerted on adhesion. By adding an azole compound to the solution for palladium conductor layer formation, a palladium conductor layer is prevented from depositing on copper. Thus, the reliability of connection between the copper part present on a substrate and the copper deposit formed by electroplating is significantly high. | 03-11-2010 |
20100181104 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill ( | 07-22-2010 |
20140053774 | SURFACE TREATING APPARATUS - A tank body | 02-27-2014 |
20140116334 | SURFACE TREATING APPARATUS - An tank such as an electroless copper plating tank | 05-01-2014 |
20140339463 | DESMEAR SOLUTION AND DESMEAR METHOD - The present invention provides a desmear solution and a desmear method using said desmear solution, the desmear solution being capable of certainly removing a smear inside a non-through hole formed in a resin substrate and also capable of forming a plating film excellent in adhesion without excessive roughening of a surface of the resin substrate. The present invention uses the desmear solution containing a permanganate having a concentration of 0.2 to 0.4 mol/L and an alkali metal hydroxide and having a molar concentration ratio of said permanganate to said alkali metal hydroxide of 1:5 to 1:20. | 11-20-2014 |
20150072070 | PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PRODUCTION OF PRINTED WIRING BOARD USING SAME - A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C | 03-12-2015 |
20150289382 | PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD PRODUCED BY SAID METHOD - This method includes the steps of forming a second resin layer ( | 10-08-2015 |