Patent application number | Description | Published |
20080235907 | MULTI-FUNCTIONAL HINGE - A multifunctional hinge is provided. In one embodiment, a device for coupling a panel relative to frame is provided. The device comprises a first body including an elongated cylindrical cavity; and a second body including a shaft having a tab extending from a lateral portion the shaft, the shaft having an axis of rotation about the center of the shaft. The first body is configured to accept insertion of the shaft of the second body into the elongated cylindrical cavity and further configured to allow movement of the second body about the axis of rotation. The first body further includes a slot connected to the elongated cylindrical cavity and configured to allow the tab of the second body to slide therethrough when the second body is rotated. | 10-02-2008 |
20080236791 | HEAT SINK WITH ANGLED FINS - A heat sink with angled fins comprising a first set of fins forming air channels, a second set of fins forming air channels and a heat sink base coupled to the first set of fins and the second set of fins. The first set of fins and the second set of fins are separated by a region along a length of the heat sink base. The fins in the first set of fins are at a first angle with respect to the length of the heat sink base and the fins in the second set of fins are at a second angle with respect to the length of the heat sink base. | 10-02-2008 |
20080237420 | RECONFIGURABLE MOUNTING BRACKET - A reconfigurable mounting bracket is disclosed. The bracket includes a first face plate configured to attach to an enclosure, a first flange that extends perpendicularly from a first end of the first face plate, and a second flange that extends perpendicularly from a second end of the first face plate, the second flange extending in an opposing direction from the first flange. The reconfigurable mounting bracket accommodates a plurality of attachment options. | 10-02-2008 |
20080238270 | MODULARIZED RADIO FREQUENCY BAND COMPONENTS ON REMOVABLE DOORS - A cabinet system comprises a chassis having a plurality of openings, a plurality of modular doors, and at least one radio frequency system. Each opening has removably attached chassis-hinge portions on one of two edges. Each modular door comprises an outside surface, an inside surface opposing the outside surface, and door-hinge receptacles on at least two edges. The door-hinge receptacles receive door-hinge portions. Each door-hinge portion is positioned in a respective door-hinge receptacle on one edge of the plurality of modular doors and is configured to mate with a respective chassis-hinge portion on the one edge of one of the plurality of openings so the mated chassis-hinge portion and door-hinge portion form a hinge to rotatably attach the modular door to the one of the openings. The radio frequency system comprises electronic components attached to the inside surface of at least one of the plurality of modular doors. | 10-02-2008 |
20080239632 | APPARATUS FOR IMPROVING THE ACCESSIBLITY OF A MOUNTED STRUCTURE - An electronic equipment apparatus is provided. The electronic equipment apparatus includes an enclosure for holding electronic equipment. The electronic equipment apparatus also includes a hinged pivot mount, wherein the enclosure is rotatably coupled to the hinged pivot mount. | 10-02-2008 |
20080239669 | COMBINED-NATURAL-AND-FORCED-CONVECTION HEAT SINK - A combined-natural-and-forced-convection heat sink system including a plurality of fins protruding from a first surface of a conductive material, a plurality of air channels formed between the first surface and an opposing second surface of the conductive material and at least one fan. The plurality of fins forms a natural-convection heat sink. The plurality of air channels forms a forced-convection heat sink. The natural-convection heat sink and the forced-convection heat sink form a combined-natural-and-forced-convection heat sink. Each air channel has an input end opening on an input surface of the conductive material and each air channel has an output end opening on an output surface of the conductive material. The at least one fan is configured to generate an air flow through the air channels when at least one of the fans is operating. | 10-02-2008 |
20080239673 | APPARATUS FOR TRANSFERRING HEAT BETWEEN TWO CORNER SURFACES - An apparatus for transferring heat between two corner surfaces is provided. In one embodiment, an apparatus for transferring heat between two corner surfaces is provided. The apparatus comprises a heat transfer body comprising: a first heat conducting side; a second heat conducting side intersecting with the first heat conducting side to form a corner; and a contact face oriented at an acute angle relative the first and second side. The apparatus further comprises at least one wedge having a slip face oriented at an angle configured to interface with the contact face; and at least one fastener configured to apply a force to the at least one wedge. The wedge is configured to translate the force applied by the fastener into a first component in a direction normal to the first heat conducting side and a second component in a direction normal to the second heat conducting side. | 10-02-2008 |
20080239688 | OPEN RAIL CARD CAGE - An open rail card cage for electronic assemblies is disclosed. The open rail card cage includes a base, an inlet side attached to the base, an outlet side attached to the base, the outlet side offset from the inlet side, a plurality of rail mounts attached to the base and positioned between the inlet side and the outlet side, wherein the plurality of rail mounts further comprise sets of layered guide rails that orient the electronic assemblies parallel to a direction of an airflow between the inlet side and the outlet side, and at least one first set of the layered guide rails spaced apart from at least one second set of the layered guide rails by at least one first air vent. | 10-02-2008 |
20080241571 | CLAMSHELL CHASSIS ASSEMBLY - A method of manufacturing a chassis is provided. The method comprises casting a first segment having a plurality of connected walls such that a window is cast in each of two of the plurality of connected walls in the first segment; casting a second segment having a plurality of connected walls such that a window is cast in each of two of the plurality of connected walls in the second segment; and coupling the first and second segments together to form the chassis having a window in four walls | 10-02-2008 |
20080245938 | CONSTANT TENSION POLE MOUNT BRACKET - A pole mount bracket is provided. The bracket includes at least one extruded portion, a pole mounting portion and a band. The at least one extruded portion has an engaging surface. The engaging surface has a plurality of grooves that allow the extruded portion to bend to the form of a pole. The pole mounting portion is connected to the at least one extruded portion. Moreover, the pole mounting portion is further configured to be selectively coupled to a device. The band is configured to deform the at least one extruded portion about the pole to attach the pole mount bracket to the pole. | 10-09-2008 |
20080278912 | THERMAL MANAGEMENT SYSTEMS AND METHODS FOR ELECTRONIC COMPONENTS IN A SEALED ENCLOSURE - Systems and methods for thermal management for electronic components in a sealed enclosure are provided. In one embodiment, a thermal management system for electronic components in a sealed enclosure comprises: an enclosure for housing electronic components, the enclosure sealed from an external environment; a card cage housed within the enclosure; at least one electronic device card installed in the card cage; and at least one baffle configured to form an airflow channel through at least part of the card cage, wherein the airflow channel directs air warmed by thermal energy from the at least one electronic device card to follow a circular path along an internal surface of the enclosure, wherein the internal surface is configured to conductively remove heat from the air to the environment external to the enclosure. | 11-13-2008 |
20080278915 | CHASSIS MOUNTED HEAT SINK SYSTEM - A heat sink for an electronics enclosure is disclosed. The heat sink comprises a thermal conduction section with an inner surface and an outer surface, the thermal conduction section having an extended profile that tapers from a first end having a first thickness to a second end having a second thickness that is larger than the first thickness. A mounting plate is contiguous with the second end, and the mounting plate is configured to couple the heat sink to a chassis of the electronics enclosure. A thermal interface pad is coupled to the outer surface of the thermal conduction section. | 11-13-2008 |
20080285231 | APPARATUS FOR ENCLOSING ELECTRONIC COMPONENTS - An apparatus for enclosing electronic components comprises a chassis enclosure defining an internal chamber and having an upper portion and a lower portion. The upper portion comprises a first front wall having a length dimension greater than a width dimension, and a first pair of opposing side walls that are each contiguous with the first front wall. The lower portion comprises a second front wall having a length dimension less than the length dimension of the first front wall, and a second pair of opposing side walls that are each contiguous with the second front wall. A plurality of heat sink fins are on each of the first front and side walls, and on each of the second front and side walls. Each of the heat sink fins are configured to be substantially parallel to the length dimension of the first front wall and the second front wall, and extend continuously along each wall. The plurality of heat sink fins has an arcuate-like end view profile on each wall of the chassis enclosure. | 11-20-2008 |
20090032217 | APPARATUS FOR SPREADING HEAT OVER A FINNED SURFACE - An apparatus for spreading heat over a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins on a first side of the heat dissipating member. The apparatus also includes a plurality of strips of thermal material having a thermal conductivity in a direction parallel to the heat dissipating member higher than a thermal conductivity of the heat dissipating member, the plurality of strips disposed on a side of the heat dissipating member opposite of the first side and configured to spread heat along the heat dissipating member. | 02-05-2009 |
20090032218 | APPARATUS FOR TRANSFERRING BETWEEN TWO HEAT CONDUCTING SURFACES - An apparatus for transferring heat between two surfaces is provided. The apparatus includes a first support plate, a sheet of thermal material adjacent the first support plate, and a second support plate adjacent the sheet of thermal material, wherein the sheet of thermal material is disposed between the first support plate and the second support plate. The apparatus also includes at least one bolt inserted through each of the first support member, the sheet of thermal material, and the second support plate, the at least one bolt configured to be secured into a chassis. Finally, at least one spring is disposed between a shoulder of the at least one bolt and the second support plate. | 02-05-2009 |
20090032234 | APPARATUS FOR TRANSFERRING HEAT IN A FIN OF A HEAT SINK - An apparatus for dissipating heat through a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins projecting from a first side of the heat dissipating member. Additionally, the apparatus includes a thermal material within at least one fin of the plurality of fins, the thermal material having a thermal conductivity greater than the thermal conductivity of the at least one fin in a direction normal to the first side of the heat dissipating member. Finally, a thermal spreader thermally coupled to the heat dissipating member, the thermal spreader configured to spread heat across the plurality of fins of the heat dissipating member is included. | 02-05-2009 |
20090034204 | APPARATUS FOR TRANSFERRING HEAT FROM A HEAT SPREADER - An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat spreading member configured to spread heat laterally across the heat dissipating member, the heat spreading member defining a heat conduction plane. The apparatus also includes a base adjacent to the heat spreading member, wherein the heat spreading member is between the base and the heat dissipating member, and at least one thermal via within the heat conduction plane, the thermal via thermally coupled to the heat spreading member, the at least one thermal via thermally coupled to the heat dissipating member and the base through surface-to-surface contact. | 02-05-2009 |
20090141452 | APPARATUS FOR DIRECTING HEAT TO A HEAT SPREADER - An apparatus for dissipating heat from a device is provided. The apparatus includes a heat sink having an elongated shape and defining a groove. A heat spreader composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat sink. The heat spreader is oriented such that the thermal conductor propagates heat along a length of the heat sink. A heat channel composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat spreader. The heat channel is oriented to propagate heat towards the heat spreader. | 06-04-2009 |
20090307983 | L-SHAPED DOOR WITH THREE-SURFACE SEAL FOR ENDPLATES - A water-resistant and electromagnetic interference shielded enclosure configured to enclose a plurality of electronic components is provided. The enclosure comprises a base having a channel, a first L-shaped door rotatably attached to a first side edge of the base, a second L-shaped door rotatably attached to a second side edge of the base, a door-to-door seal abutted to a flange on the first L-shaped door, and a compressible base-seal inserted into the channel. The compressible base-seal and the door-to-door seal form a three-surface seal when the first L-shaped door and the second L-shaped door are closed. | 12-17-2009 |
20090307984 | L-SHAPED DOORS WITH TRAPEZOIDAL SEAL - A water-resistant and electromagnetic interference shielded enclosure configured to enclose at least one electronic module is provided. The water-resistant and electromagnetic interference shielded enclosure includes a base having a channel, a first L-shaped door rotatably attached to a first edge of the base, a second L-shaped door rotatably attached to a second edge of the base, a flange seal attached to a first flange on the first L-shaped door, and a compressible base-seal inserted into the channel. The compressible base-seal and the flange seal form an enclosure seal when the first L-shaped door and the second L-shaped door are closed. | 12-17-2009 |
20090308572 | APPARATUS FOR ACCEPTING A SELF-DRILLING SCREW - An apparatus for accepting a self-drilling screw is provided. The apparatus comprises a base structure having at least one channel. The at least one channel has a first side, a second side, and a bottom, forming a generally āuā shaped cross section, wherein the first side and the second side are a distance apart such that threads of a self-drilling screw engage with both the first side and the second side when the screw is inserted into the channel. | 12-17-2009 |
20090308631 | SYSTEMS AND METHODS FOR CABLE MANAGEMENT - A method for cable management in an electronics enclosure is disclosed. The method involves extruding at least one length of material that forms a cable guide having a plurality of partitions defined by one or more cable dividers and two end clip flanges, where the end clip flanges each have at least one snap guide and at least one locking clip channel. The method further involves sizing at least one cable guide assembly from the length of material, based on a predetermined length for the cable guide assembly, and preparing one or more ends of the at least one cable guide assembly. | 12-17-2009 |
20090308655 | COMBINATION EXTRUDED AND CAST METAL OUTDOOR ELECTRONICS ENCLOSURE - A method for forming an electronics enclosure is disclosed. The method comprises extruding a backplane having a first extruded length, the backplane comprising slots on opposing sides of the backplane, wherein the slots extend along the first extruded length. The method further comprises extruding at least one door panel at the first extruded length, wherein the backplane and the door panel each have extruded hinge features for pivotally coupling the door panel to the backplane, and coupling at least two cast metal plates to opposing ends of the backplane, where each of the cast metal plates comprise a gland that aligns with the slots of the backplane to create a continuous channel for inserting a seal. | 12-17-2009 |
20090309467 | ANGLED DOORS WITH CONTINUOUS SEAL - In one embodiment, an electronics enclosure is provided. The electronics enclosure comprises a base operable to secure one or more electronic components in place. The base comprises a back wall to which the electronic components are secured; a first end plate extending from a first end of the back wall; and a second end plate extending from a second end of the back wall. The electronics enclosure further comprises a first side wall coupled to a first side of the base and operable to rotate between an open position and a closed position; a second side wall coupled to a second side of the base and operable to rotate between an open position and a closed position; and wherein each of the first and second side walls comprise a first section and a second section which form an angle such that, when in the closed position, the first and second side walls interconnect with each other and together abut the exposed perimeter of the first end plate, the second end plate and the back wall to enclose the one or more electronic components. | 12-17-2009 |
20090309469 | PULL-OUT SHELF FOR USE IN A CONFINED SPACE FORMED IN A STRUCTURE - A shelf assembly for a confined space formed within a structure is provided. The shelf assembly includes a fixed portion having a structure attachment interface to fixedly attach the shelf assembly to the structure and a slideable portion that is operable to slide out and extend from the fixed portion of the shelf assembly. The slideable portion has an enclosure attachment interface to attach an electronics enclosure to the slideable portion of the shelf assembly. The slideable portion has a first state and a second state in which the slideable portion is held in a first position or second position, respectively. In the first state, the entire slideable portion of the shelf assembly is positioned within the structure. In the second state, at least the enclosure attachment interface is positioned outside of the structure. | 12-17-2009 |
20090310301 | SYSTEMS AND METHODS FOR VENTURI FAN-ASSISTED COOLING - Systems and methods for Venturi fan-assisted cooling of electrical equipment are provided. In one embodiment, a cooling unit for an enclosure housing electronics is provided. The cooling unit comprises: a fan shroud having at least one electrical fan; and a Venturi chamber having a first inlet for receiving a heated airflow from a heatsink, a second inlet for receiving an airflow from a surrounding environment, and an outlet coupled to the fan shroud, the fan drawing air from the Venturi chamber via the outlet when the fan is on. The Venturi chamber comprises a wall for directing the airflow air from the surrounding environment in from the second inlet and across the heated airflow from the heatsink in a manner to as to draw the heated airflow through the heatsink using a Venturi effect, when the fan is on. | 12-17-2009 |
20090310309 | SYSTEMS AND METHODS FOR THERMAL MANAGEMENT - A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively. The first and second conductive paths are independent from each other. | 12-17-2009 |
20090310312 | APPARATUS FOR MOUNTING A MODULE AND ENABLING HEAT CONDUCTION FROM THE MODULE TO THE MOUNTING SURFACE - An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body. Each of the plurality of electronic modules comprises: a plurality of electronic components, a heat conducting side configured to contact the heat conducting surface of the heat dissipating body, a second flange adjacent the heat conducting side, the second flange configured to couple with the first flange, and a second part of the latch mechanism adjacent the heat conducting side, the second part of the latch mechanism configured to couple with the first part of the latch mechanism. The second flange and the second part of the latch mechanism are on opposite edges of the heat conducting side. | 12-17-2009 |
20090310326 | CAM SHAPED HINGES - A hinge comprises a first member having a protrusion, wherein the protrusion has a cam profile shape; and a second member having a cavity operable to receive the protrusion, wherein a cam profile shape of the cavity corresponds to the cam profile shape of the protrusion such that, when the protrusion is in a first position, a gap is present between the second member and the protrusion and, when the protrusion is in a second position, substantially no gap is present between the second member and the protrusion. | 12-17-2009 |
20090310972 | CIRCUIT CARD SUBASSEMBLIES FOR INTERCONNECTION OF ELECTRONIC COMPONENTS - A communication system is provided. The communication system includes a serialized radio frequency transceiver module and at least one radio frequency module. The serialized radio frequency transceiver module includes a plurality of optical-module connectors, and a remote serialized radio frequency interface including a plurality of high speed connectors. Each of the at least one radio frequency module includes an interface configured to be coupled to the remote serialized radio frequency interface of the serialized radio frequency transceiver module to pass and receive data signals, and a remote digital-analog radio transceiver input interface coupled to the interface. The remote digital-analog radio transceiver input interface is configured to pass data signals to and from the at least one radio frequency module. | 12-17-2009 |
20090311463 | SOLAR SHIELDS - Systems and methods for proving solar shields are provided. In one embodiment, a solar shield system comprises at least one solar shield having a first set of snap-fit features positioned on the first solar shield to engage with attachment channels of an enclosure; at least one solar shield cover having a flexible hinge integrated therein, the at least one solar shield cover further comprises a second set of snap-fit features for coupling the at least one solar shield cover with the at least one solar shield; and a plurality of fastening devices for securing the at least one solar shield and the at least one solar shield cover to the attachment channels of the enclosure. | 12-17-2009 |
20090311969 | COMMUNICATION MODULES - A communication module is provided. The module includes at least one transceiver, a filter, a power amplifier, an enclosure, an internal interface and an external interface. The power amplifier is in communication with the at least one transceiver and filter. Moreover, the at least one transceiver, filter and power amplifier are tuned and calibrated to work with each other. The enclosure is configured to physically retain the at least one transceiver, filter and power amplifier. The internal interface is configured to interface connections between the at least one transceiver and the power amplifier and the external interface configured to provided external connections to the module. In addition, the external interface is coupled to the internal interface. | 12-17-2009 |
20090311974 | SUSPENSION METHOD FOR COMPLIANT THERMAL CONTACT OF ELECTRONICS MODULES - A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis. | 12-17-2009 |
20100025068 | CABLE PROTECTION COVER - A cable protection cover for an enclosure is disclosed. The cable protection cover comprises a cover shroud, a pivot bracket for attaching to the enclosure, and a pivot pin for pivotally attaching the cover shroud to the pivot bracket. The pivot bracket and the cover shroud form a cable access aperture providing a through access to an interface of the enclosure for one or more cables. The cable protection cover forms a protective barrier with the cover shroud in a closed position preventing the one or more cables from being disconnected from the interface. | 02-04-2010 |
20110300815 | INTEGRAL LATCH MECHANISMS FOR MOUNTING ELECTRONICS MODULES - In one embodiment, a locking mechanism comprises: a lever-arm-component coupled to a first side of an module and a second side of the module that opposes the first side; the lever-arm-component rotates about a first axis; first and second latching-arm-components including latching-hooks, the first latching-arm-component coupled to the lever-arm-component on the first side and rotating about a second axis that run parallel to and offset from the first axis; the second latching-arm-component coupled to the lever-arm-component on the second side and rotating about the second axis; and a secondary fastener. The first and second axes are oriented in an over-center configuration such that when the lever-arm-component is rotated about the first axis from a first to second position, the second axis will pass through a locking axis and the latching-hooks apply a force against a mechanism of the enclosure that presses the module against a heat sink of the enclosure. | 12-08-2011 |