Patent application number | Description | Published |
20080199981 | METHOD FOR FORMING A FLUID EJECTION DEVICE - A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the second side defining a first fluid flow structure. The second glass layer includes a first side and a second side opposite the first side, with each respective first side and second side defining a second fluid flow structure. The second glass layer is bonded in a sandwiched position between the respective first glass layers with each respective second fluid flow structure of the second glass layer in fluid communication with the respective first fluid flow structure of the respective first glass layers to define a fluid flow pathway for ejecting a fluid. | 08-21-2008 |
20080259125 | MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME - A microfluidic device includes first and second glass substrates bonded together. The first glass substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second glass substrate is bonded to the second opposed surface of the first glass substrate whereby an outlet of a channel formed in the second glass substrate substantially aligns with the through slot. The channel of the second glass substrate has an inlet that is larger than the outlet. | 10-23-2008 |
20080272446 | Packaged MEMS device assembly - A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities. | 11-06-2008 |
20080280398 | System And Method For Direct Bonding Of Substrates - A method of forming a MEMS (Micro-Electro-Mechanical System), includes forming an ambient port through a MEMS cap which defines a cavity containing a plurality of MEMS actuators therein; and bonding a lid arrangement to the MEMS cap to hermetically seal the ambient port. | 11-13-2008 |
20100259583 | METHOD FOR FORMING A FLUID EJECTION DEVICE - A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the second side defining a first fluid flow structure. The second glass layer includes a first side and a second side opposite the first side, with each respective first side and second side defining a second fluid flow structure. The second glass layer is bonded in a sandwiched position between the respective first glass layers with each respective second fluid flow structure of the second glass layer in fluid communication with the respective first fluid flow structure of the respective first glass layers to define a fluid flow pathway for ejecting a fluid. | 10-14-2010 |
20110025782 | MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME - A microfluidic device includes first and second substrates bonded together. The first substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second substrate is bonded to the second opposed surface of the first substrate whereby an outlet of a channel formed in the second substrate substantially aligns with the through slot. The channel of the second substrate has an inlet that is larger than the outlet. | 02-03-2011 |
Patent application number | Description | Published |
20090273621 | SYSTEM AND METHOD FOR MAINTAINING OR RECOVERING NOZZLE FUNCTION FOR AN INKJET PRINTHEAD - A transducer capable of generating vibrational energy is positioned relative to an inkjet cartridge to impart a vibrational force to simultaneously vibrate at least a portion of each of a plurality of ink fluidic columns associated with a plurality of nozzles in a printhead of the inkjet cartridge to maintain or recover nozzle function. | 11-05-2009 |
20100328398 | THERMAL INKJET PRINT HEAD WITH SOLVENT RESISTANCE - An inkjet printing system includes a print head in fluid communication with an ink reservoir and having a plurality of orifices and a corresponding plurality of associated ejection chambers. The print head includes a substrate and a barrier layer disposed on the substrate. The barrier layer defines in part a plurality of fluid channels and the plurality of ejection chambers. The barrier layer includes a material selected from epoxy-based photo resist materials and methyl methacrylate-based photo resist materials. An orifice plate is disposed over the substrate. The orifice plate includes the plurality of orifices in fluid communication with the ejection chambers. The orifice plate comprises a material selected from polyimides and nickel. | 12-30-2010 |
20110141191 | SYSTEM AND METHOD FOR MAINTAINING OR RECOVERING NOZZLE FUCTION FOR A PRINTHEAD - A transducer capable of generating vibrational energy is positioned relative to an inkjet cartridge to impart a vibrational force to simultaneously vibrate at least a portion of each of a plurality of ink fluidic columns associated with a plurality of nozzles in a printhead of the inkjet cartridge to maintain or recover nozzle function. | 06-16-2011 |
20130257989 | THERMAL INKJET PRINT HEAD WITH SOLVENT RESISTANCE - A method of preparing an inkjet printing system with a print head in fluid communication with an ink reservoir and having a plurality of orifices and a corresponding plurality of associated ejection chambers includes providing a substrate and disposing a photoresist material on the substrate. A mask is provided between the UV light source and the photoresist material. The photoresist material is exposed to the UV light source to polymerize the photoresist material to form a barrier layer on the substrate. The barrier layer defines in part a plurality of fluid channels and the plurality of ejection chambers. An orifice plate is attached over the substrate. The orifice plate includes a plurality of orifices in fluid communication with the ejection chambers. | 10-03-2013 |
20140118441 | THERMAL INKJET PRINT HEAD WITH SOLVENT RESISTANCE - An inkjet printing system includes a print head in fluid communication with an ink reservoir and having a plurality of orifices and a corresponding plurality of associated ejection chambers. The print head includes a substrate and a barrier layer disposed on the substrate. The barrier layer defines in part a plurality of fluid channels and the plurality of ejection chambers. The barrier layer includes a material selected from epoxy-based photo resist materials and methyl methacrylate-based photo resist materials. An orifice plate is disposed over the substrate. The orifice plate includes the plurality of orifices in fluid communication with the ejection chambers. The system includes a reservoir containing an organic solvent-based ink composition, wherein the ink composition includes an organic solvent selected from C | 05-01-2014 |
20140333703 | Cantilevered Micro-Valve and Inkjet Printer Using Said Valve - A micro-valve includes an orifice plate including an orifice and a cantilevered beam coupled in spaced relation to the orifice plate and moveable between positions where the orifice is closed and opened by the cantilevered beam. The cantilevered beam includes one or more piezoelectric layers that facilitate bending of the cantilevered beam in response to the application of one or more electrical signals to the one or more piezoelectric layers. In response to respective application and termination of the one or more electrical signals to the one or more piezoelectric layers the cantilevered beam either: moves from a starting position spaced from the orifice plate toward the orifice plate and returns back to the starting position spaced from the orifice plate; or moves from a starting position adjacent the orifice plate away from the orifice plate and returns back to the starting position adjacent the orifice plate. | 11-13-2014 |