Patent application number | Description | Published |
20080199978 | System and method for film stress and curvature gradient mapping for screening problematic wafers - A method of testing a wafer after a current top layer is formed over the wafer. Stress data is collected for the wafer after forming the current top layer. The stress data is derived from changes in wafer curvature. The stress data includes: stress-xx in an x direction and stress-yy in a y direction for each area of a set of finite areas on the wafer, the stress-xx and stress-yy both being derived from wafer-curvature-change-xx in the x direction for each area of the set of finite areas and from wafer-curvature-change-yy in the y direction for each area of the set of finite areas; and the stress-xy being derived from wafer-curvature-change-xy, wherein wafer-curvature-change-xy is a change in wafer twist in the x-y plane for each area of the set of finite areas. A stress gradient vector (and/or its norm) is calculated and used to evaluate the investigating single or multiple accumulated layer. | 08-21-2008 |
20080261410 | METHOD FOR TREATING BASE OXIDE TO IMPROVE HIGH-K MATERIAL DEPOSITION - A method for forming a high-K material layer in a semiconductor device fabrication process including providing a silicon semiconductor substrate or thermally growing interfacial oxide layer comprising silicon dioxide over the silicon substrate; treating with an aqueous base solution or nitridation and depositing a high-K material layer. | 10-23-2008 |
20090060750 | Fluid transportation device - A fluid transportation device includes a valve seat, a valve cap, a valve membrane, multiple buffer chambers, a vibration film and an actuator. The valve membrane is arranged between the valve seat and the valve cap, and includes several hollow-types valve switches, which includes at least a first valve switch and a second valve switch. The multiple buffer chambers include a first buffer chamber between the valve membrane and the valve cap and a second buffer chamber between the valve membrane and the valve seat. The vibration film is separated from the valve cap when the fluid transportation device is in a non-actuation status, thereby defining a pressure cavity. The actuator is connected to the vibration film. When the actuator is driven to be subject to deformation, the vibration film connected to the actuator is transmitted to render a volume change of the pressure cavity and result in a pressure difference for moving the fluid. | 03-05-2009 |
20090137119 | NOVEL SEAL ISOLATION LINER FOR USE IN CONTACT HOLE FORMATION - A method is disclosed for etching a contact hole in a stack of dielectric layers. The method minimizes bridging defects between the contact hole and adjacent conductive structures. A substrate has a conductive material layer and an active device disposed thereon. An etch stop layer covers the device and the conductive material, A layer of interlevel dielectric and antireflective coating layers are then provided. A hole is etched through the stack using patterned photoresist. Ashing is used to remove all but the etch stop layer and the interlevel dielectric layer. An isolation liner is deposited over the interlevel dielectric layer, the sidewall surfaces of the hole and the exposed upper surface of the etch stop layer. Another etch removes the isolation liner disposed over the exposed upper surface of the etch stop layer, and removes the underlying etch stop layer to expose an upper surface of the conductive material layer. | 05-28-2009 |
20090159830 | Fluid transportation device - A fluid transportation device includes a valve seat, a valve cap, a valve membrane, multiple buffer chambers, and an actuating module. The valve seat has an inlet channel and an outlet channel. The valve cap is disposed on the valve seat. The valve membrane is arranged between the valve seat and the valve cap. The multiple buffer chambers include a first buffer chamber between the valve membrane and the valve cap and a second buffer chamber between the valve membrane and the valve seat. Each of the first buffer chamber and the second buffer chamber has a flow-guiding structure extended from an outer edge to a center thereof. The actuating module has a periphery fixed on the valve cap. A pressure cavity is defined between the actuating module and the valve cap. Another flow-guiding structure is formed at an inner edge of the pressure cavity. | 06-25-2009 |
20090242060 | Fluid transportation device having multiple double-chamber actuating structrures - A fluid transportation device includes a flow-gathering module and multiple double-chamber actuating structures. The flow-gathering module includes two surfaces opposed to each other, multiple first flow paths and multiple second flow paths running through the two surfaces, an inlet channel arranged between the two surfaces and communicated with the multiple first flow paths, and an outlet channel arranged between the two surfaces and communicated with the multiple second flow paths. The multiple double-chamber actuating structures are arranged on the flow-gathering module side by side. Each double-chamber actuating structure includes a first chamber and a second chamber symmetrically arranged on the two surface of the flow-gathering module. Each of the first chamber and the second chamber includes a valve cap arranged over the flow-gathering module, a valve membrane arranged between the flow-gathering module and the valve cap, and an actuating member having a periphery fixed on the valve cap. | 10-01-2009 |
20090242061 | Dual-cavity fluid conveying apparatus - A dual-cavity fluid conveying apparatus includes a flow-converging device, a first cavity body, and a second cavity body. The flow-converging device includes two sides corresponding to each other; a first channel and a second channel both passing through the two sides; and an inlet passage and an outlet passage both arranged between the two sides and communicated with the first channel and the second channel, respectively. The first cavity body and the second cavity body are symmetrically disposed at the two sides of the flow-converging device, wherein the first cavity body and the second cavity body each includes a valve cover disposed on one side of the flow-converging device, a valve membrane interposed between the one side of the flow-converging device and the valve cover, and an actuating device disposed circumferentially on the valve cover so as to define, together with the valve cover, a pressure chamber. | 10-01-2009 |
20100015814 | MOSFET Device With Localized Stressor - MOSFETs having localized stressors are provided. The MOSFET has a stress-inducing layer formed in the source/drain regions, wherein the stress-inducing layer comprises a first semiconductor material and a second semiconductor material. A treatment is performed on the stress-inducing layer such that a reaction is caused with the first semiconductor material and the second semiconductor material is forced lower into the stress-inducing layer. The stress-inducing layer may be either a recessed region or non-recessed region. A first method involves forming a stress-inducing layer, such as SiGe, in the source/drain regions and performing a nitridation or oxidation process. A nitride or oxide film is formed in the top portion of the stress-inducing layer, forcing the Ge lower into the stress-inducing layer. Another method embodiment involves forming a reaction layer over the stress-inducing layer and performing a treatment process to cause the reaction layer to react with the stress-inducing layer. | 01-21-2010 |
20100048007 | HIGH PLANARIZING METHOD FOR USE IN A GATE LAST PROCESS - A method for performing a chemical-mechanical polishing (CMP) is provided. The method includes processing a semiconductor substrate to form a dummy gate structure on the substrate, to form a hard mask on the dummy gate structure, and to form a contact etch stop layer (CESL) and an interlayer dielectric (ILD) layer on the hard mask, performing a first CMP process with a first slurry to modify a non-planar topography of the ILD layer, performing a second CMP process with a second slurry to remove the hard mask, and performing a third CMP process with a third slurry to remove an interfacial layer that forms between the dummy gate and hard mask during semiconductor processing. | 02-25-2010 |
20100279436 | Inspection Method For Integrated Circuit Manufacturing Processes - The present disclosure provides a method for manufacturing integrated circuit devices including an electron beam inspection. The method includes forming a silicide region on a substrate. In an embodiment, the silicide region is formed to provide contact to a device feature such as a source or drain region. An electron beam scan is then performed on the substrate. The electron beam scan includes a first scan and a second scan. The first scan includes a lower landing energy than the second scan. In an embodiment, the first scan provides a dark silicide image analysis and a bright image analysis. In an embodiment, the second scan provides a dark silicide image analysis. The method continues to form a conductive plug after performing the electron beam scan. | 11-04-2010 |
20100301701 | VOLTAGE CONVERTER AND DRIVING SYSTEM USING SUCH VOLTAGE CONVERTER - A voltage converter is provided for receiving a low input DC voltage and driving a piezoelectric actuator of a fluid transportation device. The voltage converter includes plural capacitors, a resistor and a boost chip. The boost chip is connected with the plural capacitors and the resistor, has a switch element and a polar switching circuit, and receives the low input DC voltage. The low input DC voltage is increased and multiplied to a high DC voltage by a switching operation of the switch element. The high DC voltage is converted into an output AC voltage by the polar switching circuit so as to drive the piezoelectric actuator. An operating frequency of the boost chip is controlled by the plural capacitors and the resistor. | 12-02-2010 |
20110232872 | LIQUID HEAT-DISSIPATING MODULE - The present invention is related to a liquid heat-dissipating module, for dissipating the heat generated by a heating element, at least comprising: a heat-absorbing unit, being connected with the heating element, for absorbing the heat generated by the heating element; a fluid delivery device, for delivering a fluid, the fluid delivery device being stacked with the heat-absorbing unit and having a heat-dissipating structure; and a connecting pipe, being connected with the heat-absorbing unit and the fluid delivery device for delivering the fluid into the heat-absorbing unit, so as to absorb the heat of the heat-absorbing unit; the fluid absorbing the heat is then delivered back to the fluid delivery device, letting the heat-dissipating structure to dissipate the heat contained in the fluid. | 09-29-2011 |
20120287655 | HEAT DISSIPATION DEVICE - The present invention relates to a heat dissipation device, which comprises: a fluid, a fluid delivery device, and a circular pipe. The fluid delivery device is for propelling and delivering the fluid, the circular pipe is connected with the fluid delivery device, at least a portion of the circular pipe itself contacting with a heat generation device for conducting heat to the portion of the circular pipe, so as letting the fluid to be delivered by the fluid delivery device for delivering heat to the rest portion of the circular pipe, and to dissipate the heat generation device. | 11-15-2012 |
20140029295 | HYBRID LIGHT GUIDE PLATE AND DISPLAY DEVICE - A display device includes a housing, a frame bonded to the housing, and a display module. The display module includes a back cover bonded to the frame, a light guide plate (LGP), a support element, a display panel, and an optical film set. The LGP is supported on the back cover and has a light exiting surface and an opposite back surface. At least two sides of the LGP's back surface are adhered on the back cover, and the LGP is made of glass. The support element and display panel are supported respectively on the LGP and support element. The optical film set is between the display panel and LGP. A hybrid LGP includes a first light guide sub-plates and a second light guide sub-plate. The second light guide sub-plate is stacked on and bonded to the first light guide sub-plate. | 01-30-2014 |