Patent application number | Description | Published |
20100019133 | PHOTOSENSITIVE CHIP - The present invention discloses a photosensitive circuit comprising a photosensitivity unit, a capacitance and a switch unit. The photosensitivity unit is capable of receiving a received light, and the capacitance is capable of storing a photoelectric current corresponding to the received light. The switch unit is used to respectively provide the positive voltage of the capacitance to a comparison unit at a first time period, and the negative voltage of the capacitance to a comparison unit at a second time period. The comparison unit outputs a detection value according to the positive voltage and the negative voltage of the capacitance, the detection value is related to the distance between an object and the photosensitive circuit. The present invention further disclose a photosensitive chip to drive a luminescent unit to provide a detective light. The photosensitive chip comprises a sampling clock generator, the ambient light sensor unit, a proximity sensor unit and a driving clock generator. | 01-28-2010 |
20120212453 | SENSOR APPARATUS WITH DIFFERENT PROXIMITY SENSORS AND SENSING METHOD THEREOF - The present invention discloses a proximity sensing apparatus and a method thereof. A sensor apparatus comprises a panel, an emitting device, and a proximity sensor module. The panel includes a first transparent area and a second transparent area; an emitting device is located under the panel and the emitting device emitting a light passing through the first transparent area. The proximity sensor module is located under the panel and the proximity sensor module includes at least one proximity sensor with high sensitivity which is a second proximity sensor and at least one proximity sensor with low sensitivity which is a first proximity sensor, and the proximity sensor module receives the light passing through the second transparent area. The light passing through the first transparent area and then reflecting from an object to passing through the second transparent area, and the panel is able to provide a touch function. | 08-23-2012 |
20120278604 | CONTROL METHOD APPLIED TO COMPUTER SYSTEM IN HYBRID SLEEP MODE - A control method applied to a computer system in a hybrid sleep mode is provided. The control method includes following steps: entering a first sleep mode of the computer after a system parameter is stored in a memory and a hard drive of the computer system; determining whether the computer system is resumed or not in a predetermined first period in the first sleep mode, if true, resuming the computer system by reading the system parameter from the memory; if false, entering a second sleep mode of the computer system; determining whether the computer is resumed or not in the second sleep mode; if true, resuming the computer system by reading the system parameter from the hard drive; and if false, keeping the computer system in the second sleep mode. | 11-01-2012 |
Patent application number | Description | Published |
20090236508 | Incremental encoder - An incremental encoder, which comprises a light source, a code wheel, a first photo-sensitive unit, a second photo-sensitive unit, a first inverse-phase photo-sensitive unit and a comparison circuit, is disclosed. The light source provides a detecting light. The code wheel comprises many diaphanous holes. The detecting light is sieved into a light pulse signal by the diaphanous holes when the code wheel is rotating. The first photo-sensitive unit, the second photo-sensitive unit and the first inverse-phase photo-sensitive unit generates the first electronic signal, the second electronic signal and the first inverse-phase electronic signal respectively based on the light pulse signal. The comparison circuit generates a voltage signal by composing the first electronic signal and the first inverse-phase electronic signal, generates a first digital signal based on the voltage signal and the first electronic signal, and generates a second digital signal based on the voltage signal and the second electronic signal. | 09-24-2009 |
20110198859 | GRAVITY-ASSISTED ROTATIONAL MECHANISM AND GENERATOR DEVICE COOPERATING THEREWITH - A gravity-assisted rotational mechanism and a generator device cooperating therewith. The gravity-assisted rotational mechanism includes multiple concentric rotational members having different sizes and rotatable about the same rotational center, several link members having equal weights for driving the same, and at least one connection member for pivotally connecting the rotational members with the link members. The rotational members can symmetrically push/pull each other. The link members and connection member are respectively mounted on interference sections of at least some of the rotational members to absorb gravitational energy. The energy of the link members is transmitted via the interference sections to the rotational members to form a cycle of energy storage and transmission. In condition of low energy loss, the gravity-assisted rotational mechanism forms a continuously swinging self-revolving device for lasting watching. The generator device serves to store the gravitational energy in the form of electrical energy for use of load. | 08-18-2011 |
20110221349 | Illuminating System and Method Thereof - The present invention discloses an illuminating system and a method thereof, comprising a light emitting module, a light sensor and a control module, wherein the control module connects to the light emitting module and the light sensor. The light emitting module emitting light with a first frequency, the light sensor detecting an intensity of incident light, and the control module controls the light emitting module to emit light with a second frequency according to the intensity of incident light. | 09-15-2011 |
20130127177 | GRAVITY-ASSISTED ROTATIONAL MECHANISM AND GENERATOR DEVICE COOPERATING THEREWITH - A gravity-assisted rotational mechanism and a generator device cooperating therewith. The gravity-assisted rotational mechanism includes multiple concentric rotational members having different sizes and rotatable about the same rotational center, several link members having equal weights for driving the same, and at least one connection member for pivotally connecting the rotational members with the link members. The rotational members can symmetrically push/pull each other. The link members and connection member are respectively mounted on interference sections of at least some of the rotational members to absorb gravitational energy. The energy of the link members is transmitted via the interference sections to the rotational members to form a cycle of energy storage and transmission, whereby the gravity-assisted rotational mechanism can lastingly continuously self-rotate as an ornamental device. The generator device serves to convert the gravitational energy and minimize the rotational inertia loss and increase yield rate of electrical energy. | 05-23-2013 |
20130168552 | Infrared Light Detecting Apparatus and Detecting Method Thereof - An infrared light detecting device and the infrared detecting method thereof. The device comprises a shield, a first photo detector and a second photo detector. The shield for blocking light is located above the first photo detector and the second photo detector. An opening is disposed on the shield above the first photo detector. In addition, there is a gap arranged between the first photo detector and the second photo detector. The first photo detector can detect the light passing through the opening to generate a photo sensing signal and couple an infrared light signal in the photo sensing signal to the second photo detector in order to output the infrared light signal. | 07-04-2013 |
20150021923 | GRAVITY-ASSISTED ROTATIONAL MECHANISM AND GENERATOR DEVICE COOPERATING THEREWITH - A gravity-assisted rotational mechanism and a generator device cooperating therewith. The gravity-assisted rotational mechanism includes multiple concentric rotational members having different sizes and rotatable about the same rotational center, several link members having equal weights for driving the same, and at least one connection member for pivotally connecting the rotational members with the link members. The rotational members can symmetrically push/pull each other. The link members and connection member are respectively mounted on interference sections of at least some of the rotational members to absorb gravitational energy. The energy of the link members is transmitted via the interference sections to the rotational members to form a cycle of energy storage and transmission, whereby the gravity-assisted rotational mechanism can lastingly continuously rotate as an ornamental device. The generator device serves to convert the gravitational energy and minimize the rotational inertia loss and increase yield rate of electrical energy. | 01-22-2015 |
Patent application number | Description | Published |
20130088210 | Power System and Power Controlling Method and Apparatus Thereof - A power controlling method includes the following steps. A first Proportional Integral (PI) computation is performed according to an input current signal and command. Next, whether the input current signal is greater than a maximum rated charging current of a battery unit is determined to generate a switching signal for controlling a brake unit correspondingly. Then, a second PI computation is performed in accordance with the output voltage signal and a predetermined voltage command. Thereafter, the output voltage signal and the voltage command are compared to set an output current command selectively. Next, a third PI computation is performed in accordance with the output current signal and command to adjust a first pair of switching signals and a second pair of switching signals, such that a switching unit performs a corresponding switching action to adjust the output voltage signal. A power system and a power controlling apparatus are provide. | 04-11-2013 |
20130230395 | BLADE SPEED CONTROL SYSTEM AND CONTROL METHOD THEREOF - A blade speed control system is disclosed and applied to a generator and a blade. A control method of the blade speed control system includes: setting the blade speed control system to a first mode; detecting a voltage value and a current value of the generator by a processing unit; generating a modulated signal according to the voltage value and the current value by the processing unit; switching the blade speed control system to a second mode by the processing unit; and adjusting the current value according to the modulated signal by a control unit. | 09-05-2013 |
20140015506 | POWER CONVERSION APPARATUS AND CONTROLLING METHOD THEREOF - A power conversion apparatus and a controlling method thereof are disclosed. The power conversion apparatus is applied with a power generation apparatus, which outputs a first signal. The power conversion apparatus includes a conversion-sensing circuit, a control signal generating circuit and a switching circuit. The conversion-sensing circuit converts the first signal into a second signal, and senses at least a voltage waveform change of the second signal to generate a time interval. The control signal generating circuit is electrically connected with the conversion-sensing circuit and outputs a control signal according to the time interval. The switching circuit is electrically connected with the power generation apparatus and the control signal generating circuit, and has a plurality switching elements. The switching circuit receives the first signal and conducts one of the switching elements according to the control signal so as to convert the first signal and output an output signal. | 01-16-2014 |
20140111141 | BATTERY CHARGING METHOD AND DEVICE USING THE SAME - The battery charging method includes: defining first to third charging regions according to a first predetermined voltage and the charging saturation voltage of a battery; determining a charging region of the battery according to the initial voltage of the battery, and determining a threshold charging current according to the charging regions of the battery; charging the battery according to the threshold charging current; continuously measuring a plurality of voltages in the battery during a predetermined period and determining an average voltage of the battery; determining if the previously determined charging region of the battery has changed according to the average voltage of the battery; and when the charging region of the battery has changed and the average voltage of the battery is lower than the charging saturation voltage, then lowering the threshold charging current and repeating the above steps. | 04-24-2014 |
20140312621 | WIND-POWER GENERATOR CONTROL SYSTEM, AND METHOD - A wind-power generator control system is provided. The wind-power generator control system includes a wind turbine, a power generator, a normally closed relay, and a control unit. The wind-power generator has a first output terminal and a second output terminal, and outputs a power output via the first and second output terminal when the wind turbine rotates. The normally closed relay is connected between the first and second output terminals. The control unit transmits a control signal to the normally closed relay by grid power. Also, when the normally closed relay does not receive the control signal, the first output terminal short-circuits the second output terminal by the normally closed relay for protecting the wind-power generator. When the normally closed relay receives the control signal, the first output terminal open-circuits the second output terminal by the normally closed relay for providing the power output. | 10-23-2014 |
Patent application number | Description | Published |
20110210444 | 3D Semiconductor Package Using An Interposer - A 3D semiconductor package using an interposer is provided. In an embodiment, an interposer is provided having a first die electrically coupled to a first side of the interposer and a second die electrically coupled to a second side of the interposer. The interposer is electrically coupled to an underlying substrate, such as a packaging substrate, a high-density interconnect, a printed circuit board, or the like. The substrate has a cavity such that the second die is positioned within the cavity. The use of a cavity may allow smaller conductive bumps to be used, thereby allowing a higher number of conductive bumps to be used. A heat sink may be placed within the cavity to aid in the dissipation of the heat from the second die. | 09-01-2011 |
20120306080 | Packaging Structures and Methods - A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier. | 12-06-2012 |
20130020698 | Pillar Design for Conductive Bump - A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material. | 01-24-2013 |
20130049220 | Through Silicon Via Keep Out Zone Formation Method and System - Keep out zones (KOZ) are formed for a through silicon via (TSV). A device can be placed outside a first KOZ of a TSV determined by a first performance threshold so that a stress impact caused by the TSV to the device is less than a first performance threshold while the first KOZ contains only those points at which a stress impact caused by the TSV is larger than or equal to the first performance threshold. A second KOZ for the TSV can be similarly formed by a second performance threshold. A plurality of TSVs can be placed in a direction that the KOZ of the TSV has smallest radius to a center of the TSV, which may be in a crystal orientation [010] or [100]. A plurality of TSV stress plug can be formed at the boundary of the overall KOZ of the plurality of TSVs. | 02-28-2013 |
20130140713 | Interposer Wafer Bonding Method and Apparatus - The present disclosure relates to a method for fast and precise alignment and mounting of a top die onto an interposer wafer. The method is performed by applying a hydrophobic self assembled monolayer to a carrier wafer in a pattern defining a top die placement region correlating to an arrangement of a top die on an interposer wafer. A liquid is provided into the top die placement region and a top die is placed into contact with the liquid. The surface tension of the liquid automatically aligns the top die by generating a force causing the top die to overlap with the top die placement region. The liquid is then eliminated and the top die is affixed to the carrier wafer. The carrier wafer is bonded to the interposer wafer, bringing the top die into contact with an interposer. | 06-06-2013 |
20140045332 | Through Silicon Via Keep Out Zone Formation Method and System - Keep out zones (KOZ) are formed for a through silicon via (TSV). A device can be placed outside a first KOZ of a TSV determined by a first performance threshold so that a stress impact caused by the TSV to the device is less than a first performance threshold while the first KOZ contains only those points at which a stress impact caused by the TSV is larger than or equal to the first performance threshold. A second KOZ for the TSV can be similarly formed by a second performance threshold. A plurality of TSVs can be placed in a direction that the KOZ of the TSV has smallest radius to a center of the TSV, which may be in a crystal orientation [010] or [100]. A plurality of TSV stress plug can be formed at the boundary of the overall KOZ of the plurality of TSVs. | 02-13-2014 |
20140131864 | Connector Design for Packaging Integrated Circuits - A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar. | 05-15-2014 |
Patent application number | Description | Published |
20120306073 | Connector Design for Packaging Integrated Circuits - A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar. | 12-06-2012 |
20130252378 | 3D Semiconductor Package Interposer with Die Cavity - A 3D semiconductor package using an interposer is provided. In an embodiment, an interposer is provided having a first die electrically coupled to a first side of the interposer and a second die electrically coupled to a second side of the interposer. The interposer is electrically coupled to an underlying substrate, such as a packaging substrate, a high-density interconnect, a printed circuit board, or the like. The substrate has a cavity such that the second die is positioned within the cavity. The use of a cavity may allow smaller conductive bumps to be used, thereby allowing a higher number of conductive bumps to be used. A heat sink may be placed within the cavity to aid in the dissipation of the heat from the second die. | 09-26-2013 |
20130270690 | Methods for Forming Silicon-Based Hermetic Thermal Solutions - A method includes forming a first oxide layer on a surface of an integrated heat spreader, and forming a second oxide layer on top surfaces of fins, wherein the fins are parts of a heat sink. The integrated heat spreader is bonded to the heat sink through the bonding of the first oxide layer to the second oxide layer. | 10-17-2013 |
20130273694 | Integrated Thermal Solutions for Packaging Integrated Circuits - A method includes attaching a wafer on a carrier through an adhesive, and forming trenches in the carrier to convert the carrier into a heat sink. The heat sink, the carrier, and the adhesive are sawed into a plurality of packages. | 10-17-2013 |
20140015106 | Thermal Structure for Integrated Circuit Package - One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips. | 01-16-2014 |
20140038405 | Packaging Structures and Methods with a Metal Pillar - A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier. | 02-06-2014 |
20140089876 | Thermal Analysis of Integrated Circuit Packages - A method includes retrieving a first component information of a secured portion of a package, wherein the first component information is encrypted. The step of retrieving includes decrypting the first component information. A thermal resistance-network (R-network) is generated from the decrypted first component information. A temperature map of the package is generated using the thermal R-network and a second component information of an unsecured portion of the package, wherein the secured portion and the unsecured portion are bonded to each other. | 03-27-2014 |
20140252591 | REINFORCEMENT STRUCTURE AND METHOD FOR CONTROLLING WARPAGE OF CHIP MOUNTED ON SUBSTRATE - A semiconductor device comprises a substrate, a die mounted on the substrate, a reinforcement plate bonded to the die, and an adhesive layer coupling the reinforcement plate to the die. | 09-11-2014 |
20140264698 | Image Sensor Device and Method - A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration. | 09-18-2014 |
20140264803 | PACKAGE DEVICE INCLUDING AN OPENING IN A FLEXIBLE SUBSTRATE AND METHODS OF FORMING THE SAME - Methods and apparatus are disclosed for forming ultra-thin packages for semiconductor devices on flexible substrates. A flexible substrate may comprise a plurality of insulating layers and redistribution layers. Openings of the flexible substrate may be formed at one side of the flexible substrate, two sides of the flexible substrate, or simply cut through the flexible substrate to divide the flexible substrate into two parts. Connectors may be placed within the opening of the flexible substrate and connected to redistribution layers of the flexible substrate. Dies can be attached to the connectors and electrically connected to the connectors and to the redistribution layers of the flexible substrate. Structure supports may be placed at another side of the flexible substrate on the surface or within an opening. | 09-18-2014 |
20160035771 | Image Sensor Device and Method - A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration. | 02-04-2016 |
Patent application number | Description | Published |
20100046157 | NONVOLATILE STORAGE DEVICE - A nonvolatile storage device includes a casing, a circuit substrate, a latch and a driving piece. The outer surface of the casing is provided with a slot. The slot is connected with a push button switch. The circuit substrate is fixed in the casing. The circuit substrate is provided with a connecting interface made according to the standard of serial advanced technology attachment, a control unit and a nonvolatile memory unit. The connecting interface protrudes outside the casing. The control unit and the connecting interface are electrically connected with the nonvolatile memory unit. One end of the latch is fixed to the outside of the connecting interface with a portion thereof suspended. The driving piece is provided in the casing. One end of the driving piece is fixed to the push button switch, and the other end of the driving piece presses the suspended portion of the latch selectively. | 02-25-2010 |
20100082819 | NETWORK BRIDGING APPARATUS FOR STORAGE DEVICE AND DATA STREAM TRANSMITTING METHOD THEREOF - A network bridging apparatus for a storage device and a data stream transmitting method thereof are provided. More particularly, a chip embedded with ATA over Ethernet (AoE) technology is incorporated into the network bridging apparatus. By which the independent-external storage device can be shared over a network. According to a preferred embodiment, a bridging module having the technology of AoE is included for converting either network packets or data being compatible with some standard data transmission formats. Preferably, one end of the apparatus is equipped with a network interface unit for connecting to the network, and further, the other end of the network bridging apparatus is connected to a storage device via a transmission interface. Therefore, the storage device using a standard transmission interface, such as USB, IEEE1394. eSATA or the like, can be shared with other computer systems within the local area network. | 04-01-2010 |