Patent application number | Description | Published |
20100258978 | ROLLER NANOIMPRINT APPARATUS, MOLD ROLLER FOR USE IN ROLLER NANOIMPRINT APPARATUS, FIXING ROLLER FOR USE IN ROLLER NANOIMPRINT APPARATUS, AND PRODUCTION METHOD OF NANOIMPRINT SHEET - A roller nanoimprint apparatus is disclosed which is capable of preventing a workpiece film with nanostructures having been transferred from the mold roller from being uneven in thickness and allowing easy replacement of the mold roller. At least one embodiment of the present invention is directed to a roller nanoimprint apparatus including a mold roller and continuously transferring nanosized protrusions to a surface of a workpiece film by rotating the mold roller, wherein the mold roller is a cylindrical body having an outer circumference surface with nanosized recesses formed thereon, the roller nanoimprint apparatus further includes a fluid container having an elastic film inflatable by injecting fluid into the container, the fluid container being arranged in a region defined by an inner circumference surface of the mold roller, the mold roller is mounted or demounted when the elastic film is shrunken, and the mold roller is supported from the inside when the elastic film is inflated. | 10-14-2010 |
20100272845 | Roller nanoimprint apparatus, mold roller for use in roller nanoimprint apparatus, fixing roller for use in roller nanoimprint apparatus, and production method of nanoimprint sheet - The present invention provides a roller nanoimprint apparatus capable of preventing a workpiece film with nanostructures having been transferred from the mold roller from being uneven in thickness and allowing easy replacement of the mold roller. The present invention is a roller nanoimprint apparatus including a mold roller and continuously transferring nanosized protrusions to a surface of a workpiece filmby rotating the mold roller,
| 10-28-2010 |
20100291317 | PRODUCTION METHOD OF NANOIMPRINT FILM, DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE - A method is disclosed for efficiently producing a nanoimprint film with high-accurately formed nanostructures even if a base on which the nanoimprint film is formed is capable of absorbing UV light. The production method of at least one embodiment of the present invention is a production method of a nanoimprint film formed on a base, the nanoimprint film having a surface with nanosized protrusions and recesses formed thereon. In at least one embodiment, the production method includes a first step of applying a UV-curable resin on a base containing a UV-absorbing component to form a film; a second step of irradiating the film with UV light from a top-side surface of the film to form a semi-cured film; a third step of imprinting nanosized protrusions and recesses on the semi-cured film to form a film having a surface with protrusions and recesses formed thereon; and a fourth step of curing the film with protrusions and recesses to form a nanoimprint film. | 11-18-2010 |
20110100827 | ANTIREFLECTION FILM, OPTICAL ELEMENT COMPRISING ANTIREFLECTION FILM, STAMPER, PROCESS FOR PRODUCING STAMPER, AND PROCESS FOR PRODUCING ANTIREFLECTION FILM - An antireflection film of the present invention includes a plurality of first raised portions, each of which has a two-dimensional size of not less than 1 μm and less than 100 μm when seen in a direction normal to the film, and a plurality of second raised portions, each of which has a two-dimensional size of not less than 10 nm and less than 500 nm when seen in a direction normal to the film. In at least one embodiment, the antireflection film has a first surface shape or a second surface shape that is inverse to the first surface shape relative to a film surface. In the first surface shape, the second raised portions are provided on the first raised portions and between the plurality of first raised portions, and the elevation angle α of a surface of the first raised portions relative to the film surface is about 90° or more. The antireflection film of the present invention has a more excellent antiglare function than conventional ones. | 05-05-2011 |
20120018613 | DIE AND METHOD OF MANUFACTURING SAME - A mold of the present invention includes: a base | 01-26-2012 |
20120043297 | Mold And Manufacturing Method Therefor - A mold of the present invention includes: a flexible polymer film; a curable resin layer provided on a surface of the polymer film; and a porous alumina layer provided on the curable resin layer, the porous alumina layer having an inverted moth-eye structure in its surface, the inverted moth-eye structure having a plurality of recessed portions whose two-dimensional size viewed in a direction normal to the surface is not less than 10 nm and less than 500 nm. According to the present invention, a method for easily forming a flexible moth-eye mold which can be deformed into the form of a roll is provided. | 02-23-2012 |
20120308678 | MOLD RELEASE TREATMENT METHOD, MOLD, METHOD FOR PRODUCING ANTI-REFLECTIVE FILM, MOLD RELEASE TREATMENT DEVICE, AND WASHING/DRYING DEVICE FOR MOLD - A mold release treatment method of the present invention includes: the step of providing a mold releasing agent and a mold which has a porous alumina layer over its surface, the mold releasing agent containing a fluoric compound which has mold releasability and a solvent; the step of applying over the surface of the mold a solvent that is capable of dissolving the fluoric compound; and thereafter, the step of applying the mold releasing agent over the surface of the mold according to a spray coating method. According to the present invention, a mold release treatment can be performed over a surface of the mold which has the porous alumina layer over its surface, without causing uneven application. | 12-06-2012 |
Patent application number | Description | Published |
20100044343 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD - A substrate treatment apparatus for treating a substrate on which a plurality of patterns are formed adjacently, has a first chamber which has resistance to a chemical and cleans the substrate with the chemical; a second chamber which is disposed above or below the first chamber, has higher pressure resistance than the first chamber, and supercritically dries the substrate; and a gate unit which is provided between the first and second chambers and can be opened/closed. | 02-25-2010 |
20110068480 | SEMICONDUCTOR DEVICE AND ADHESIVE SHEET - The present invention provides a semiconductor device which comprises a substrate, a first semiconductor chip on a substrate, a second semiconductor chip on the first semiconductor chip, and an adhesive sheet between the first and second semiconductor chips. The second semiconductor chip has a mirrored back surface, and the adhesive sheet contains a metal impurity ion trapping agent. | 03-24-2011 |
20110230054 | SEMICONDUCTOR SUBSTRATE CLEANING METHOD - In one embodiment, a semiconductor substrate cleaning method is disclosed. The method can clean a semiconductor substrate by using a chemical of 80° C. or above. The method can rinse the semiconductor substrate by using pure water of 40° C. or above after the cleaning of the semiconductor substrate. The method can then rinse the semiconductor substrate by using pure water of 30° C. or below. In addition, the method can dry the semiconductor substrate. | 09-22-2011 |
20110244131 | METHOD AND APPARATUS FOR TEMPLATE SURFACE TREATMENT, AND PATTERN FORMING METHOD - According to an embodiment, a template surface treatment method includes hydroxylating the surface of a template having an uneven pattern surface or absorbing water onto the surface to distribute OH radicals on the surface, and coupling a coupling agent onto the template surface on which the OH radicals are distributed. These processes are performed in an environment in which amines are controlled to be in a predetermined concentration or less. | 10-06-2011 |
20110289793 | SUPERCRITICAL DRYING METHOD - According to one embodiment, a semiconductor substrate having a surface wetted with a chemical solution is introduced into a chamber, and a supercritical fluid is supplied into the chamber. The temperature in the chamber is adjusted to the critical temperature of the chemical solution or higher, so that the chemical solution is put into a supercritical state. The pressure in the chamber is then lowered, and the chemical solution in the critical state is turned into gaseous matter. The gaseous matter is then discharged from the chamber. | 12-01-2011 |
20110314689 | SUBSTRATE DRYING METHOD - According to one embodiment, a semiconductor substrate whose surface is wet with a chemical solution (solvent) and formed with patterns having an aspect ratio of 10 or more is loaded into a chamber. Then, while the chemical solution (solvent) remains on the semiconductor substrate, its temperature is increased to a predetermined temperature in the range of 160° C. or more and less than the critical temperature of the chemical solution (solvent), and the evaporated chemical solution (solvent) is discharged from the chamber. | 12-29-2011 |
20120118332 | SUPERCRITICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE - In one embodiment, after rinsing a semiconductor substrate having a fine pattern formed thereon with pure water, the pure water staying on the semiconductor substrate is substituted with a water soluble organic solvent, and then, the semiconductor substrate is introduced into a chamber in a state wet with the water soluble organic solvent. Then, the water soluble organic solvent is turned into a supercritical state by increasing a temperature inside of the chamber. Thereafter, the inside of the chamber is reduced in pressure while keeping the inside of the chamber at a temperature enough not to liquefy the pure water (i.e., rinsing pure water mixed into the water soluble organic solvent), and further, the water soluble organic solvent in the supercritical state is changed into a gaseous state, to be discharged from the chamber, so that the semiconductor substrate is dried. | 05-17-2012 |
20120186097 | SUPERCRITICAL DRYING DEVICE AND METHOD - Certain embodiments provide a supercritical drying device, comprising a sealable first vessel; a fluorine adsorbent provided inside the first vessel; a second vessel being provided inside the first vessel and housing a semiconductor substrate; a heater heating the inside of the first vessel; a pipe connected to the first vessel; and a valve provided on the pipe. Free fluorine generated by heating a fluorine containing solvent is adsorbed to the fluorine adsorbent. | 07-26-2012 |
20120240426 | SUPERCRITICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE - According to one embodiment, a supercritical drying method for a semiconductor substrate includes introducing a semiconductor substrate formed with a metal film into a chamber, the surface of the substrate being wet with alcohol, supplying a supercritical fluid of carbon dioxide into the chamber, setting a temperature inside the chamber to a predetermined temperature, to replace the alcohol on the semiconductor substrate with the supercritical fluid, and discharging the supercritical fluid and the alcohol from the chamber while keeping the temperature inside the chamber at the predetermined temperature, to lower a pressure inside the chamber. The predetermined temperature is not lower than 75° C. but lower than a critical temperature of the alcohol. | 09-27-2012 |
20120247516 | SUPERCRITICAL DRYING METHOD AND APPARATUS FOR SEMICONDUCTOR SUBSTRATES - According to one embodiment, a supercritical drying method comprises cleaning a semiconductor substrate with a chemical solution, rinsing the semiconductor substrate with pure water after the cleaning, changing a liquid covering a surface of the semiconductor substrate from the pure water to alcohol by supplying the alcohol to the surface after the rinsing, guiding the semiconductor substrate having the surface wetted with the alcohol into a chamber, discharging oxygen from the chamber by supplying an inert gas into the chamber, putting the alcohol into a supercritical state by increasing temperature in the chamber to a critical temperature of the alcohol or higher after the discharge of the oxygen, and discharging the alcohol from the chamber by lowering pressure in the chamber and changing the alcohol from the supercritical state to a gaseous state. The chamber contains SUS. An inner wall face of the chamber is subjected to electrolytic polishing. | 10-04-2012 |
20120304485 | SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, AND STORAGE MEDIUM - A substrate processing method and apparatus which can remove an anti-drying liquid, which has entered a three-dimensional pattern with recessed portions formed in a substrate, in a relatively short time. The substrate processing method includes the steps of: carrying a substrate, having a three-dimensional pattern formed in a surface, into a processing container, said pattern being covered with an anti-drying liquid that has entered the recessed portions of the pattern; heating the substrate and supplying a pressurizing gas or a fluid in a high-pressure state into the processing container, thereby forming a high-pressure atmosphere in the processing container before the anti-drying liquid vaporizes to such an extent as to cause pattern collapse and bringing the anti-drying liquid into a high-pressure state while keeping the liquid in the recessed portions of the pattern; and thereafter discharging a fluid in a high-pressure state or a gaseous state from the processing container. | 12-06-2012 |
20130019905 | SUPERCRITICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE AND SUPERCRITICAL DRYING APPARATUS - According to one embodiment, a supercritical drying method for a semiconductor substrate, comprises introducing the semiconductor substrate into a chamber in a state, a surface of the semiconductor substrate being wet with alcohol, substituting the alcohol on the semiconductor substrate with a supercritical fluid of carbon dioxide by impregnating the semiconductor substrate to the supercritical fluid in the chamber, and discharging the supercritical fluid and the alcohol from the chamber and reducing a pressure inside the chamber. The method further comprises performing a baking treatment by supplying an oxygen gas or an ozone gas to the chamber after the reduction of the pressure inside the chamber. | 01-24-2013 |
20130055584 | SUPERCRlTICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE - According to one embodiment, a supercritical drying method for a semiconductor substrate comprises introducing a semiconductor substrate, a surface of the semiconductor substrate being wet with a water-soluble organic solvent, to the inside of a chamber, hermetically sealing the chamber and increasing a temperature inside the chamber to not lower than a critical temperature of the water-soluble organic solvent, thereby bringing the water-soluble organic solvent into a supercritical state, decreasing a pressure inside the chamber and changing the water-soluble organic solvent in the supercritical state to a gas, thereby discharging the water-soluble organic solvent from the chamber, starting a supply of an inert gas into the chamber as the pressure inside the chamber decreases to atmospheric pressure, and cooling the semiconductor substrate in a state where the inert gas exists inside the chamber. | 03-07-2013 |
20130061492 | SUPERCRITICAL DRYING METHOD AND SUPERCRITICAL DRYING APPARATUS FOR SEMICONDUCTOR SUBSTRATE - According to one embodiment, a supercritical drying apparatus comprises a chamber being hermetically sealable and configured to store a semiconductor substrate, a heater configured to heat an inner side of the chamber, a supply unit configured to supply carbon dioxide to the chamber, a discharge unit configured to discharge carbon dioxide from the chamber, and a rotation unit configured to rotate the chamber by an angle equal to or greater than 90 degrees and equal to or smaller than 180 degrees with respect to the horizontal direction. | 03-14-2013 |
20130122706 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a method of manufacturing of a semiconductor device is provided. In the method, a front surface of a semiconductor substrate and a front surface of a support substrate are bonded to each other by an adhesive. A part of a circumferential part of the support substrate is subjected to water-repellent treatment to thereby form a water-repellent area on the part of the circumferential part in such a manner that the water-repellent area and an end face of the adhesive are in contact with each other. The semiconductor substrate is removed from a rear surface side by wet etching. | 05-16-2013 |
20140174482 | SUPERCRITICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE - In one embodiment, after rinsing a semiconductor substrate having a fine pattern formed thereon with pure water, the pure water staying on the semiconductor substrate is substituted with a water soluble organic solvent, and then, the semiconductor substrate is introduced into a chamber in a state wet with the water soluble organic solvent. Then, the water soluble organic solvent is turned into a supercritical state by increasing a temperature inside of the chamber. Thereafter, the inside of the chamber is reduced in pressure while keeping the inside of the chamber at a temperature enough not to liquefy the pure water (i.e., rinsing pure water mixed into the water soluble organic solvent), and further, the water soluble organic solvent in the supercritical state is changed into a gaseous state, to be discharged from the chamber, so that the semiconductor substrate is dried. | 06-26-2014 |
20140250714 | SUPERCRITICAL DRYING METHOD FOR SEMICONDUCTOR SUBSTRATE AND SUPERCRITICAL DRYING APPARATUS - According to one embodiment, a supercritical drying method for a semiconductor substrate, comprises introducing the semiconductor substrate into a chamber in a state, a surface of the semiconductor substrate being wet with alcohol, substituting the alcohol on the semiconductor substrate with a supercritical fluid of carbon dioxide by impregnating the semiconductor substrate to the supercritical fluid in the chamber, and discharging the supercritical fluid and the alcohol from the chamber and reducing a pressure inside the chamber. The method further comprises performing a baking treatment by supplying an oxygen gas or an ozone gas to the chamber after the reduction of the pressure inside the chamber. | 09-11-2014 |
Patent application number | Description | Published |
20100284087 | OPTICAL ELEMENT, ROLLER TYPE NANOPRINTING APPARATUS, AND PROCESS FOR PRODUCING DIE ROLL - To provide an optical element having excellent adhesion to a lamination film, a roller nanoimprint apparatus, and a production method of a mold roller are disclosed. In at least one embodiment of the present invention, an optical element includes a nanostructure film including recesses and protrusions in nanometer size formed continuously on a surface of the nanostructure film and a lamination film laminated on the nanostructure film. The nanostructure film includes a nanostructure-free region free from the recesses and protrusions in nanometer size in both ends along a longitudinal direction of the nanostructure film. | 11-11-2010 |
20110315557 | MOLD MANUFACTURING METHOD AND ELECTRODE STRUCTURE FOR USE THEREIN - A method of fabricating a motheye mold according to the present invention includes the steps of: (a) anodizing a surface of an aluminum film ( | 12-29-2011 |
20120318772 | DIE, PROCESS FOR PRODUCING DIE, AND PROCESS FOR PRODUCING ANTIREFLECTION FILM - A method is provided for manufacturing a mold that has a porous alumina layer over its surface, which is capable of preventing formation of pits (recesses). A moth-eye mold manufacturing method of an embodiment of the present invention is a method for manufacturing a mold which has a porous alumina layer over its surface, including the steps of: providing a mold base which includes an aluminum base and an aluminum film deposited on a surface of the aluminum base, the aluminum film having a purity of not less than 99.99 mass %; anodizing a surface of the aluminum film to form a porous alumina layer which has a plurality of minute recessed portions; and bringing the porous alumina layer into contact with an etching solution to enlarge the plurality of minute recessed portions of the porous alumina layer. | 12-20-2012 |
20120325670 | METHOD FOR FORMING ANODIZED LAYER, METHOD FOR PRODUCING MOLD AND METHOD FOR PRODUCING ANTIREFLECTIVE FILM - An anodized layer formation method of an embodiment of the present invention includes the step a of providing an aluminum film which is formed on a first principal surface of a support and the step b of anodizing a surface of the aluminum film to form a porous alumina layer which has a plurality of minute recessed portions. In the step a, a second principal surface of the support which is opposite to the first principal surface is provided with a low heat conduction member that has a predetermined pattern. According to an embodiment of the present invention, a porous alumina layer can be formed which includes regions of different minute structures in the predetermined pattern. | 12-27-2012 |
20130004612 | DIE, DIE PRODUCTION METHOD, AND PRODUCTION OF ANTIREFLECTION FILM - One of the objects of the present invention is to provide a method for readily manufacturing a seamless mold in the form of a roll which has a porous alumina layer over its surface. The mold manufacturing method of the present invention is a method for manufacturing a mold which has a porous alumina layer over its surface, including the steps of: providing a hollow cylindrical support; forming an insulating layer on an outer perimeter surface of the hollow cylindrical support; depositing aluminum on the insulating layer to form an aluminum film; and anodizing a surface of the aluminum film to form a porous alumina layer which has a plurality of minute recessed portions. | 01-03-2013 |
20130063725 | DIE INSPECTION METHOD - A method is disclosed for inspecting a mold which has a porous alumina layer over its surface. The method includes providing, based on a relationship between a first parameter indicative of a thickness of the porous alumina layer and a color parameter indicative of a color of reflected light from the porous alumina layer, first color information which represents a tolerance of the first parameter of a porous alumina layer which has an uneven structure that is within a tolerance; providing a mold which is an inspection subject, the mold having a porous alumina layer over its surface; obtaining a color parameter which is indicative of a color of reflected light from the porous alumina layer of the inspection subject mold; and determining a suitability of the first parameter of the inspection subject mold based on the obtained color parameter and the first color information. | 03-14-2013 |
20130094089 | MOLD AND PROCESS FOR PRODUCTION OF MOLD - A mold manufacturing method of an embodiment of the present invention includes the steps of: (a) providing a mold base; (b) partially anodizing the aluminum layer to form a porous alumina layer, the porous alumina layer having a porous layer which defines a plurality of minute recessed portions and a barrier layer which is provided at a bottom of each of the plurality of minute recessed portions; and (c) after step (b), performing etching, thereby enlarging the plurality of minute recessed portions of the porous alumina layer, wherein in step (c) the etching is performed such that an average depth of the plurality of minute recessed portions increases but does not exceed a 1/7 of an average thickness of the barrier layer before the etching. | 04-18-2013 |
20130153537 | METHOD FOR FORMING ANODIZED LAYER AND MOLD PRODUCTION METHOD - An anodized layer formation method includes: providing an aluminum film provided on a support or an aluminum base; and forming a porous alumina layer which has minute recessed portions by applying a voltage between an anode which is electrically coupled to a surface of the aluminum film or the aluminum base and a cathode which is provided in an electrolytic solution with the surface of the aluminum film or the aluminum base being in contact with the electrolytic solution. The forming of the porous alumina layer includes increasing the voltage to a target value and, before the voltage is increased to the target value, increasing the voltage to a first peak value which is lower than the target value and thereafter decreasing the voltage to a value which is lower than the first peak value. As such, an anodized layer with reduced variation of recessed portions can be formed. | 06-20-2013 |
20130206600 | METHOD FOR PRODUCING ANODIZED FILM - A method for manufacturing an anodized film according to an embodiment of the present invention includes the steps of: (a) providing a multilayer structure that includes a base, a sacrificial layer which is provided on the base and which contains aluminum, and an aluminum layer which is provided on a surface of the sacrificial layer; (b) partially anodizing the aluminum layer to form a porous alumina layer which has a plurality of minute recessed portions; and (c) after step (b), separating the porous alumina layer from the multilayer structure. According to an embodiment of the present invention, a self-supporting anodized film which includes a porous alumina layer can be manufactured more conveniently as compared with the conventional methods. | 08-15-2013 |
20130341823 | MOLD, METHOD FOR PRODUCING MOLD, AND METHOD FOR PRODUCING NANOIMPRINT FILM - A mold is disclosed, which is capable of producing a nanoimprint film without a problem of clogging of irregularities of the mold with a resin material. A method for producing the mold and a method for producing a nanoimprint film using the mold are further disclosed. In an embodiment, the mold includes: a first surface having a nanostructure including plural recesses spaced at an interval of less than 1 μm between bottom points of adjacent recesses; and at least two second surfaces substantially not having the nanostructure, wherein the first surface is coplanar with the at least two second surfaces and is positioned between two second surfaces. | 12-26-2013 |
20140090983 | ELECTRODE STRUCTURE, SUBSTRATE HOLDER, AND METHOD FOR FORMING ANODIC OXIDATION LAYER - An electrode structure of the present invention includes: an aluminum electrode which is to be in contact with a surface of an aluminum base; a fixing member for fixing the aluminum electrode on the surface of the aluminum base; an elastic member provided between the fixing member and the aluminum base; a lead wire which is electrically connected to the aluminum electrode at least under a certain condition; and a cover member which is tightly closed with the lead wire penetrating through an opening. | 04-03-2014 |
20150015961 | DIE REPAIRING METHOD AND METHOD FOR MANUFACTURING FUNCTIONAL FILM USING SAME - This is a mold repairing method for removing a resin material deposited on a mold, of which the surface is a porous film with a plurality of recesses that have been created through anodization. The mold repairing method includes the steps of: (I) removing the resin material that is exposed on the surface of the mold over the plurality of recesses without performing atmospheric pressure plasma processing; and (II) removing at least partially the resin material that is still left inside the plurality of recesses by the atmospheric pressure plasma processing, after the step (I) has been performed, thereby recovering the original function of the mold. | 01-15-2015 |
Patent application number | Description | Published |
20100156350 | Battery packs - One aspect according to the present invention includes a battery pack and a shock absorbing device interposed between a battery cell holder and a case body and capable of keeping the battery cell holder and the battery cells not to directly contact with an inner surface of the case body. | 06-24-2010 |
20120045678 | TOOL BATTERIES - A battery housing of a tool battery has a hook accommodation chamber and a battery cell accommodation chamber defined therein. A hook is accommodated within the hook accommodation chamber and is operable to lock and unlock the tool battery against a tool body of a power tool. Battery cells are disposed within the battery cell accommodation chamber. The hook accommodation chamber and the battery cell accommodation chamber are partitioned from each other. | 02-23-2012 |
20120096298 | BATTERY PACK - A tool battery pack can include a current detection element for detecting a discharge current or a charge current, a monitoring section for inputting a current signal of the discharge current or the charge current through the current detection element and for inputting voltage signals of each cell battery, and a control microcomputer for performing discharge control or charge control based on the signals from the monitoring section. Further, the tool battery pack is constructed such that the current signal through the current detection element is input to both the monitoring section and the control microcomputer, | 04-19-2012 |
20120208048 | BATTERIES FOR POWER TOOLS AND METHODS OF MOUNTING BATTERY TERMINALS TO BATTERY HOUSINGS - A battery includes a battery housing and a plurality of battery terminals. The battery housing has a terminal mounting portion made of resin. The battery terminals are connectible with external terminals and are mounted to the terminal mounting portion so as to extend through the terminal mounting portion, so that each of the battery terminals has a first end positioned on one side of the terminal mounting portion and a second end positioned on an opposite side of the terminal mounting portion. At least one of the battery terminals is integrated with the terminal mounting portion, so that there is no substantial clearance between the at least one of the battery terminals and a part of the terminal mounting portion, through which the at least one of the battery terminals extends. | 08-16-2012 |
20130029197 | BATTERY PACK INCLUDING A SHOCK ABSORBING DEVICE - One aspect according to the present invention includes a battery pack and a shock absorbing device interposed between a battery cell holder and a case body and capable of keeping the battery cell holder and the battery cells not to directly contact with an inner surface of the case body. | 01-31-2013 |
20130224539 | BATTERY PACK - A battery pack may include a drainage device provided at a bottom portion of the housing case. The drainage device may include a drain hole communicating between the inside and the outside of the housing case, so that water introduced into the housing case is discharged to the outside of the housing case. The drainage device may be disposed between two of the terminal members that are connected to electrodes of the battery cells. | 08-29-2013 |
20140087236 | BATTERY PACK INCLUDING A SHOCK ABSORBING DEVICE - One aspect according to the present invention includes a battery pack and a shock absorbing device interposed between a battery cell holder and a case body and capable of keeping the battery cell holder and the battery cells not to directly contact with an inner surface of the case body. | 03-27-2014 |
20140356665 | BATTERY PACK - A battery pack may include a drainage device provided at a bottom portion of the housing case. The drainage device may include a drain hole communicating between the inside and the outside of the housing case, so that water introduced into the housing case is discharged to the outside of the housing case. The drainage device may be disposed between two of the terminal members that are connected to electrodes of the battery cells. | 12-04-2014 |