Oka, Osaka-Shi
Fumiaki Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20120229482 | GRAPHICS VERTEX PROCESSING DEVICE, IMAGE PROCESSING DEVICE, GRAPHICS VERTEX PROCESSING METHOD AND RECORDING MEDIUM - A microcode RAM obtains, from a host computer, a microcode including an instruction sequence and a composite instruction sequence coupling a plurality of instruction sequences together to sort the micro instructions and to process the plurality of instruction sequences in a parallel manner and stores the obtained microcode. An address table obtains the header address of the microcode from the host computer, and stores the obtained header address. An FIFO buffer stores information on a vertex subjected to an arithmetic processing and an instruction sequence index for identifying the content of the arithmetic processing for the information on the vertex. An instruction determination unit selects the microcode based on the successive instruction sequence indexes obtained from the FIFO buffer. An arithmetic processing execution unit executes the arithmetic processing on the information on the vertex based on the microcode selected by the instruction determination unit. | 09-13-2012 |
Hidekazu Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20100302226 | LIGHT SOURCE DEVICE AND DISPLAY DEVICE INCLUDING THE SAME - A light source device with an improved contrast ratio between a bright portion and a dark portion of a displayed image and a display divide including the light source device. In order to change a reflectance of a portion of a reflection sheet | 12-02-2010 |
Hiroyuki Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20130069209 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device and a method for manufacturing the semiconductor device are provided. A semiconductor substrate has a surface on which an abrasion trace is formed, and a dopant diffusion region includes a portion extending in the direction at an angle within the range of −5° to +5° with respect to the direction in which the abrasion trace extends | 03-21-2013 |
Hisao Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20140363249 | DRILL - A small diameter portion having an outside diameter smaller than a diameter of the drill is formed on a front end side of a body of the drill in which a cutting edge includes at least two portions, that is, a rotation center side cutting edge portion and an outer peripheral side cutting edge portion and point angles of the respective cutting edge portions reducing gradually from the rotation center side cutting edge portion to the outer peripheral side cutting edge portion. The cutting edge with the point angles varied is formed in the small diameter portion. A flat cutting edge having an inclination angle β of 30° or less with respect to a line perpendicular to an axis of the drill is provided in a step portion formed between the small diameter portion and a large diameter portion. | 12-11-2014 |
Kouhei Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20160052565 | Hollow Structure Body and Vehicular Component - According to one aspect of the present invention, there is provided a hollow structure body having a hollow structure, in which a first shaped product constituted by a first fiber-reinforced resin material containing first reinforcing fibers and a first matrix resin and a second shaped product constituted by a second fiber-reinforced resin material containing second reinforcing fibers and a second matrix resin are combined, | 02-25-2016 |
Kozo Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20090023729 | Trisubstituted amine compound - The present invention relates to a compound of the general formula (1): | 01-22-2009 |
20090029994 | Trisubstituted amine compound - The present invention relates to a compound of the general formula (1): | 01-29-2009 |
20110092506 | TRISUBSTITUTED AMINE COMPOUND - The present invention relates to a compound of the general formula (1): | 04-21-2011 |
Nobuhiko Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20150295291 | ELECTRODE BODY FOR BATTERIES, ANODE, AND METAL AIR BATTERY - An electrode body for batteries of the invention includes a first metal portion configured to include metal as an electrode active material as a main component, a first structural member configured to cover a part of a surface of the first metal portion, and a coating member configured to cover the other part of the surface of the first metal portion. The first metal portion, the first structural member, and the coating member are provided such that the first metal portion is divided between the first structural member and the coating member or the coating member is separated from the first metal portion to expose the metal included in the first metal portion. | 10-15-2015 |
Nobumasa Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20150158216 | RING-SHAPED INSERT MOLDED ARTICLE - A molded article | 06-11-2015 |
Takahiro Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20100006190 | PROCESS FOR PRODUCING BEND PIPE FOR LINE PIPE AND BEND PIPE FOR LINE PIPE - A steel pipe is prepared, which contains, by mass, at most 0.009% C, at most 1.0% Mn, at most 1.0% Si, at most 0.04% P, at most 0.005% S, 0.01 to 0.2% Ti, 0.01 to 0.10% V, 0.001 to 0.1% Al, at most 0.1% N, 4.0 to 8.0% Ni, 9.0 to 15.0% Cr, and 1.5 to 7.0% Mo, the balance being Fe and impurities. The prepared steel pipe is bent into a bend pipe. The bend pipe is quenched at a quenching temperature lower than 950° C. The quenched bend pipe is tempered. Accordingly, the bend pipe in accordance with the present invention has excellent SSC resistance. | 01-14-2010 |
Tetsuya Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20100067036 | BILLING MANAGEMENT SYSTEM, IMAGE PROCESSING APPARATUS, BILLING CONTROL METHOD AND RECORDING MEDIUM - Before executing a job, a printer performs an estimation of a billing amount with use of a simplified billing table, and if the estimated billing amount exceeds a balance, execution of the job is cancelled, and if within the balance, the job is executed. After the job is finished, the printer judges whether the estimated billing amount is correct according to detailed job information and a detailed billing table. If an error exists, the printer corrects the error and performs the correct billing. | 03-18-2010 |
20110214167 | IMAGE PROCESSING APPARATUS, IMAGE PROCESSING SYSTEM, AND DISPLAY SCREEN CONTROLLING METHOD - An image processing apparatus comprises: a display part on which various information is displayed; an authentication information inputting part for receiving entry of authentication information made by a user; a setting information inputting part for receiving an operation to set made by the user, and inputting setting information; an authentication processing part for starting authentication processing to execute user authentication based on the authentication information in response to the entry of the authentication information; and a display controlling part for displaying an initial operation screen operable for the user to make setting on the display part in parallel with the authentication processing executed by the authentication processing part, and for reflecting the setting information received by the setting information inputting part before obtaining a result of the authentication processing to the initial operation screen. So, a waiting time of the user after the entry of the authentication information is reduced. Also, the user is allowed to start making operation relatively-early, and convenience of the image processing apparatus is enhanced. | 09-01-2011 |
Yasuhiro Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20140201941 | CLEANING ROBOT - A cleaning robot that comprises: a main case ( | 07-24-2014 |
Yoshio Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20100044094 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - The printed wiring board | 02-25-2010 |
20100116525 | FLEXIBLE PRINTED WIRING BOARD - A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings which the through holes open. | 05-13-2010 |
20120031656 | SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHODS FOR PRODUCING SAME - Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate | 02-09-2012 |
20140166495 | SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHODS FOR PRODUCING SAME - Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate | 06-19-2014 |
20140332258 | DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME - An object of the present invention is to provide a double-sided printed wiring board in which a blind via hole can be easily and reliably formed, which can be accurately applied to lands of a surface-mounted component that are arranged at a narrow pitch, and in which an impedance mismatch can be effectively suppressed. The double-sided printed wiring board according to the present invention includes a substrate having an insulating property, a first conductive pattern stacked on a surface of the substrate and having a first land portion, a second conductive pattern stacked on another surface of the substrate and having a second land portion opposing the first land portion, and a blind via hole penetrating through the first land portion and the substrate, in which an average diameter of an outer shape of the first land portion is larger than an average diameter of an outer shape of the second land portion. The blind via hole, the first land portion, and the second land portion preferably have substantially circular outer shapes, and are preferably formed so as to be substantially concentric with each other. | 11-13-2014 |
Yuji Oka, Osaka-Shi JP
Patent application number | Description | Published |
---|---|---|
20090145316 | Letterpress printing plate - A letterpress printing plate, made of a material having flexibility, includes a plurality of raised parts to applying ink to, the raised parts including a raised part for solid shade, and a buildup part formed at a backside position of the raised part for solid shade with respect to the printing plate. | 06-11-2009 |