Young Kyu
Young Kyu Chang, Uiwang-Si KR
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20090261303 | Electroconductive Thermoplastic Resin Composition and Plastic Article Including the Same - Disclosed herein are an electrically conductive thermoplastic resin composition and a plastic article. The electrically conductive thermoplastic resin composition comprises about 80 to about 99% by weight of a thermoplastic resin, about 0.1 to about 10% by weight of carbon nanotubes and about 0.1 to about 10% by weight of an organo nanoclay. | 10-22-2009 |
20090321687 | Electroconductive Thermoplastic Resin Composition and Plastic Article Including the Same - Disclosed herein are an electrically conductive thermoplastic resin composition and a plastic article including the same. The electrically conductive thermoplastic resin composition comprises about 80 to about 99.9 parts by weight of a thermoplastic resin, about 0.1 to about 10 parts by weight of carbon nanotubes, about 0.1 to about 10 parts by weight of an impact modifier, based on a total of about 100 parts by weight of the thermoplastic resin and the carbon nanotubes, and about to about 10 parts by weight of conductive metal oxide, based on a total of about 100 parts by weight of the thermoplastic resin and the carbon nanotubes. | 12-31-2009 |
20100144932 | Natural Fiber Reinforced Polylactic Acid Resin Composition and Molded Product Using the Same - Disclosed is a natural fiber reinforced polylactic acid resin composition that includes (A) a mixed resin including (A-1) a polylactic acid resin and (A-2) a natural fiber, (B) a coupling agent, and (C) carbon nanotubes. | 06-10-2010 |
20100218979 | Conductivity Enhanced Transparent Conductive Film and Method of Making the Same - Disclosed herein is a method of fabricating a transparent conductive film, including preparing a carbon nanotube composite composition by blending a carbon nanotube in a solvent; coating the carbon nanotube composite composition on a base substrate to form a carbon nanotube composite film, and acid-treating the carbon nanotube composite film by dipping the carbon nanotube composite film in an acid solution, followed by washing the carbon nanotube composite film with distilled water and drying the washed carbon nanotube composite film to form a transparent electrode on the base substrate. The transparent conductive film can have excellent conductivity, transparency and bending properties following acid treatment, so that it can be used in touch screens and transparent electrodes of foldable flat panel displays. Further, the carbon nanotube composite conductive film can have improved conductivity while maintaining transparency after acid treatment. | 09-02-2010 |
20110147640 | Thermoplastic Resin Composition Having Electrical Conductivity, Wear Resistance and High Heat Resistance - The thermoplastic resin composition of present invention comprises (A) about 50 to about 90% by weight polyphenylene sulfide resin; (B) about 5 to about 30% by weight graphite; (C) about 5 to about 30% by weight fluoropolyolefin resin; (D) about 1 to about 10% by weight whiskers; and (E) about 0.01 to about 10% by weight carbon nanotubes. The thermoplastic resin composition can exhibit electrical conductivity, wear resistance and heat resistance. | 06-23-2011 |
20110195013 | Supported Catalyst for Synthesizing Carbon Nanotubes, Method for Preparing the Same and Carbon Nanotubes Made Using the Same - The present invention provides a supported catalyst for synthesizing carbon nanotubes. The supported catalyst includes a metal catalyst supported on a supporting body, and the supported catalyst has a surface area of about 15 to about 100 m | 08-11-2011 |
20110204298 | Electro-Conductive Thermoplastic Resin Compositions and Articles Manufactured Therefrom - Disclosed herein is an electro-conductive thermoplastic resin composition with controllable superior electro-conductivity and excellent impact resistance. The electro-conductive thermoplastic resin composition comprises 80 to 99.7 parts by weight of a thermoplastic resin, 0.1 to 5 parts by weight of a carbon nanotube, 0.1 to 5 parts by weight of an impact modifier, and 0.1 to 10 parts by weight of a hydrophobic polymer additive, based on a total of 100 parts by weight of the electro-conductive thermoplastic resin composition. | 08-25-2011 |
20130165604 | Method for Continuously Producing Thermoplastic Resin From Conjugated Diene and Thermoplastic Resin Produced by the Same - A method for continuously producing a thermoplastic resin from a conjugated diene includes: primarily polymerizing a conjugated diene monomer with an aromatic vinyl monomer in a first solvent in a first reactor, and feeding a hydroxyl group-containing polymerization inhibitor and a polar hydrocarbon to the first reactor to prepare a rubber solution; and adding an aromatic vinyl monomer and a monomer copolymerizable with the aromatic vinyl monomer to the rubber solution, and subjecting the mixture to secondary polymerization in a second solvent of the same kind as the first solvent in a second reactor. The method can provide a thermoplastic resin that can have excellent color and low gloss characteristics. | 06-27-2013 |
20130256011 | Conductivity Enhanced Transparent Conductive Film and Method of Making the Same - Disclosed herein is a method of fabricating a transparent conductive film, including preparing a carbon nanotube composite composition by blending a carbon nanotube in a solvent; coating the carbon nanotube composite composition on a base substrate to form a carbon nanotube composite film, and acid-treating the carbon nanotube composite film by dipping the carbon nanotube composite film in an acid solution, followed by washing the carbon nanotube composite film with distilled water and drying the washed carbon nanotube composite film to form a transparent electrode on the base substrate. The transparent conductive film can have excellent conductivity, transparency and bending properties following acid treatment, so that it can be used in touch screens and transparent electrodes of foldable flat panel displays. Further, the carbon nanotube composite conductive film can have improved conductivity while maintaining transparency after acid treatment. | 10-03-2013 |
Young Kyu Chang, Gunpo-Si KR
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20100247891 | Transparent Film and Intermediate Transfer Belt Having Multilayered Structure Using the Same - Disclosed herein is a transfer belt for an image forming apparatus comprising (A) a base layer comprising a thermoplastic resin; and (B) a surface layer comprising a thermoplastic resin composite in which carbon nanotubes are dispersed, wherein the surface layer is laminated on one side of the base layer. The transfer belt for an image forming apparatus can have high surface electrical resistance, resistance homogeneity, homogeneous electrical conductivity, and good mechanical properties. | 09-30-2010 |
20110155965 | Polycarbonate Resin Composition Having Excellent Wear Resistance and Electric Conductivity and Method of Preparing the Same - The present invention provides a polycarbonate resin composition comprising a polycarbonate (A), a styrene copolymer resin (B), carbon nano-tubes (C) and a carbon black (D). | 06-30-2011 |
20110212016 | Supported Catalysts for Synthesizing Carbon Nanotubes, Method for Preparing the Same, and Carbon Nanotubes Made Using the Same - The present invention provides a supported catalyst for synthesizing carbon nanotubes. The supported catalyst includes a metal catalyst supported on a supporting body and a water-soluble polymer, and has an average diameter of about 30 to about 100 μm. | 09-01-2011 |
Young Kyu Choi, Suwon KR
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20140109398 | AUTOMATIC CAPILLARY REPLACEMENT SYSTEM - An automatic capillary replacement system includes a base on which a clamping loader is detachably mounted. A main stage is disposed on the base so as to reciprocate horizontally along the X axis. A sub-stage is disposed on the main stage so as to reciprocate horizontally along the Y axis. A capillary mounting unit is mounted on the sub-stage so as to reciprocate horizontally along the Z axis. A new capillary to be supplied is mounted on the capillary mounting unit. A capillary collecting/supplying unit has a capillary clamper which is movable on the main stage along the X, Y and Z axes. An unclamping unit is disposed on the sub-stage, and selectively releases a clamping part of the clamping loader so that the capillaries can be separated and mounted. First to third drive parts drive the main stage, the sub-stage and the capillary collecting/supplying unit to reciprocate. | 04-24-2014 |
Young Kyu Hwang, Buk-Gu KR
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20130171337 | METHOD FOR FABRICATING TRANSFER PRINTING SUBSTRATE USING CONCAVE-CONVEX STRUCTURE, TRANSFER PRINTING SUBSTRATE FABRICATED THEREBY AND APPLICATION THEREOF - A method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling substrate. The substrate includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. This process of manufacturing provides a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process. | 07-04-2013 |
20150174940 | METHOD FOR FABRICATING TRANSFER PRINTING SUBSTRATE USING CONCAVE-CONVEX STRUCTURE, TRANSFER PRINTING SUBSTRATE FABRICATED THEREBY AND APPLICATION THEREOF - The present disclosure provides a method for fabricating a substrate for transfer printing using a concave-convex structure and a substrate for transfer printing fabricated thereby. The method includes preparing a handling substrate having a concave-convex structure formed thereon; forming a sacrificial layer along the concave-convex structure on the handling substrate; coating a polymer on the handling substrate having the sacrificial layer formed thereon to form a polymer substrate having bumps filling a concave portion of the concave-convex structure; and removing the sacrificial layer from the handling to substrate. The substrate for transfer printing includes a handling substrate having a concave-convex structure formed thereon; and a polymer substrate placed on the concave-convex structure and having bumps filling a concave portion of the concave-convex structure of the handling substrate. The present invention allows a process of manufacturing a device to be stably performed on an ultrathin substrate and may secure high degree of alignment and high transfer yield in a transfer printing process. | 06-25-2015 |
Young Kyu Hwang, Yuseong-Gu KR
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20120197029 | METHOD FOR PRODUCING CYCLICISED COMPOUNDS FROM ORGANIC ACIDS HAVING FROM 4 TO 6 CARBON ATOMS - The present invention relates to a method for producing a cyclic compound that has high selectivity, high yield, and stability over a long period of time depending on a metal content ratio of a catalyst, specifically a lactone compound or a heterocyclic compound including oxygen, which includes hydrogenating an organic acid, organic acid ester, or a mixture of the organic acid and organic acid ester, which are having 4 to 6 carbon atoms, by using a selective hydrogenated catalyst. | 08-02-2012 |
Young Kyu Hwang, Dajeon KR
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20140200361 | METHOD FOR PREPARING POROUS ORGANIC-INORGANIC HYBRID MATERIALS - The present invention relates to a method for preparing a porous organic-inorganic hybrid, which comprises gelling a reaction mixture containing a metal precursor, a water-soluble additive and water or water-containing organic solvent at a gelling temperature of 30° C.˜100° C. to obtain an organogel-containing solution having a viscosity of 2 to 50,000 (cps), subsequently ageing the solution at said gelling temperature under stirring; and subsequently heating the organogel-containing solution at a temperature between said gelling temperature and 250° C. to crystallize the solution. | 07-17-2014 |
20140287235 | COMPLEX COMPRISING CRYSTALLINE HYBRID NANOPOROUS MATERIAL POWDER - The present invention relates to a complex and a method for manufacturing same, the complex comprising: at least one crystalline hybrid nanoporous material powder, in which a metal ion, or a metal ion cluster to which oxygen is bound, and an organic ligand, or the organic ligand and a negative ion ligand are in a coordinate covalent bond; and at least one organic polymer additive, or at least one organic polymer additive and an inorganic additive, wherein the shape of the complex is spherical or pseudo-spherical, the size of the complex is 0.1 to 100 mm, a total volume of pores is 5 or more volume % based on the sum of a total volume of nanoporous material having a size of at most 10 nm and a total volume of pores having a size of at least 0.1 μm, and wherein a non-surface value per weight (m | 09-25-2014 |
20150239863 | METHOD FOR PRODUCING LACTIDE DIRECTLY FROM LACTIC ACID AND A CATALYST USED THEREIN - The present invention provides a method for directly producing lactide by subjecting lactic acid to a dehydration reaction in the presence of a catalyst comprising a tin compound, preferably, a tin (IV) compound, wherein lactide can be produced directly or by one step from lactic acid, without going through the step of producing or separating lactic acid oligomer. The method of the present invention has advantages of causing no loss of lactic acid, having a high conversion ratio to lactic acid and a high selectivity to optically pure lactide, and maintaining a long life time of the catalyst. Further, since lactic acid oligomer is not or hardly generated and the selectivity of meso-lactide is low, the method also has an advantage that the cost for removing or purifying this can be saved. | 08-27-2015 |
Young Kyu Hwang, Taejeon-Si KR
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20100260661 | PREPARATION METHOD OF CHALCOPYRITE-TYPE COMPOUNDS WITH MICROWAVE IRRADIATION - A method for preparing a chalcopyrite-type semiconductor compound which is widely used as a sunlight-absorbing material. More specifically, disclosed is a method for preparing a chalcopyrite-type compound, in which microwaves are used as heat sources in the preparation of the chalcopyrite-type compound, and the chalcopyrite-type compound can be produced in a large amount in a short reaction time using a batch or continuous reactor. | 10-14-2010 |
20100273642 | PREPARATION OF SURFACE FUNCTIONALIZED POROUS ORGANIC-INORGANIC HYBRID MATERIALS OR MESOPOROUS MATERIALS WITH COORDINATIVELY UNSATURATED METAL SITES AND CATALYTIC APPLICATIONS THEREOF - Disclosed herein is a method of surface-functionalizing a porous organic-inorganic hybrid material or a organic-inorganic mesoporous material, in which organic substances, inorganic substances, ionic liquids and organic-inorganic hybrid substances are selectively functionalized on the coordinatively unsaturated metal sites of a porous organic-inorganic hybrid material or organic-inorganic mesoporous material, and thus the porous organic-inorganic hybrid material can be used for adsorbents, gas storage devices, sensors, membranes, functional thin films, catalysts, catalytic supports, and the like, and the applications of the surface-functionalized porous organic-inorganic hybrid material prepared using the method to catalytic reactions. | 10-28-2010 |
Young Kyu Hwang, Yuseong-Gu Daejeon KR
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20150258489 | CYCLICAL METHOD OF PRODUCING HIGH-PURITY NITROGEN AND OPTIONALLY A HIGH-PURITY HYDROCARBON FROM A FEEDSTOCK CONTAINING NITROGEN AND A HYDROCARBON - The invention relates to a cyclical method for producing a nitrogen fraction, the purity of which is greater than or equal to 95 mol %, and a hydrocarbon-enriched fraction from a filler containing nitrogen and a hydrocarbon, said method using a specific class of porous hybrid solids as an adsorbent in a pressure-swing adsorption (PSA) process. The invention also relates to equipment for implementing said method. | 09-17-2015 |
Young Kyu Jang, Seoul KR
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20110279224 | REMOTE CONTROL METHOD AND APPARATUS USING SMARTPHONE - A remote control method using a smartphone is disclosed. In the method, a smartphone adapted for mobility interworks with a stationary computer to overcome performance limitations thereof and to provide more advanced services. The method, for remotely controlling a stationary computer using a smartphone, includes: accepting user manipulation and sensing results; generating a control signal for an application running on the stationary computer through filtering and optimizing the accepted results; transmitting the control signal to the stationary computer; applying the control signal to the application; and receiving a response signal of the application from the stationary computer. Hence, a smartphone interworks with a stationary computer through a wired or wireless network, and the user of the smartphone may utilize various types of applications without performance and resource limitations by transmitting control signals corresponding to user manipulation or sensing results to the stationary computer executing actual applications. | 11-17-2011 |
Young Kyu Jeong, Seoul KR
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20110089435 | LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - A light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second conductive semiconductor layers; a passivation layer at least partially on the light emitting structure; a first electrode on the first conductive semiconductor layer; and a second electrode on the first electrode and the passivation layer. | 04-21-2011 |
20110175124 | LIGHT EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, AND LIGHT EMITTING DEVICE PACKAGE - A light emitting device according to the embodiment includes a conductive support member having a step portion at an outer peripheral region thereof, a protective member for filling the step portion formed at the outer peripheral region of the conductive support member, a reflective layer over the conductive support member, and a light emitting structure over the reflective layer and the protective member. | 07-21-2011 |
20110175125 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided is a light emitting device. The light emitting device comprises: In one embodiment, a light emitting device includes: a light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a conductive support member under the light emitting structure. The conductive support member comprises a first conductive support member and a second conductive support member. The second conductive support member has a thermal conductivity higher than that of the first conductive support member. | 07-21-2011 |
20110198618 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Disclosed is a light emitting device. The light emitting device includes a light emitting structure layer including a first semiconductor layer, an active layer, and a second semiconductor layer, an electrode electrically connected to the first semiconductor layer, an electrode layer under the light emitting structure layer, and a conductive support member under the electrode layer. The conductive support member includes a protrusion projecting from at least one edge. | 08-18-2011 |
20110198659 | LIGHT EMITTING DEVICE AND LIGHT UNIT - Provided are a light emitting device and a light unit. The light emitting device includes a package body including a body, a plurality of electrodes on the body, and a concave portion on at least one of the plurality of electrodes, a light emitting chip including a convex portion corresponding to the concave portion to couple and attach the concave portion to the convex portion, the light emitting chip including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and an adhesion layer on a bottom surface of the light emitting chip. | 08-18-2011 |
20110198660 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE - Provided is a light emitting device. In one embodiment, a light emitting device including: a support member; a light emitting structure on the support member, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a protective member at a peripheral region of an upper surface of the support member; an electrode including an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode. | 08-18-2011 |
20110215350 | LIGHT EMITTING DEVICE AND METHOD THEREOF - Disclosed are a method of fabricating a light emitting device includes the steps of: forming a plurality of compound semiconductor layers on a substrate, the substrate including a plurality of chip regions and isolation region; selectively etching the compound semiconductor layers to form a light emitting structure on each chip region and form a buffer structure on the isolation region; forming a conductive support member on the light emitting structure and the buffer structure; removing the substrate by using a laser lift off process; and dividing the conductive support member into the a plurality of chips of the chip regions, wherein the buffer structure is spaced apart from the light emitting structure. | 09-08-2011 |
20120007121 | LIGHT EMITTING DEVICE - A light emitting device is provided that includes a light emitting structure (including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer), a conductive layer, an insulation layer, and a current blocking layer. The conductive layer may have a first conductive portion that passes through the second conductive type semiconductor layer and the active layer to contact the first conductive type semiconductor layer. The insulation layer may have a first insulation portion that surrounds the first conductive portion of the conductive layer. The current blocking layer may substantially surround the first insulation portion of the insulation layer, the first insulation portion provided between the current blocking layer and the first conductive portion. | 01-12-2012 |
20120061704 | LIGHT EMITTING DEVICE AND LIGHTING INSTRUMENT INCLUDING THE SAME - Disclosed is a light emitting device including, a second electrode layer, a light emitting structure that includes a second conductive semiconductor layer, an active layer and a first conductive semiconductor layer and that is provided on the second electrode layer, a first electrode layer that includes a pad part and an electrode part connected to the pad part and that is provided on the light emitting structure, and a current blocking layer arranged between the second electrode layer and the light emitting structure in such a way that a part of the current block layer overlaps to correspond to the first electrode layer, wherein a width of the current blocking layer corresponding to the electrode part is different depending upon a clearance with the pad part. | 03-15-2012 |
20130087814 | LIGHT EMITTING DEVICE AND LIGHTING APPARATUS INCLUDING THE SAME - A light emitting device is disclosed. The disclosed light emitting device includes a light emitting structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, a second electrode layer disposed beneath the light emitting structure and electrically connected to the second-conductivity-type semiconductor layer, a first electrode layer including a main electrode disposed beneath the second electrode layer, and at least one contact electrode branching from the main electrode and extending through the second electrode layer, the second-conductivity-type semiconductor layer and the active layer, to contact the first-conductivity-type semiconductor layer, and an insulating layer interposed between the first electrode layer and the second electrode layer and between the first electrode layer and the light emitting structure. The first-conductivity-type semiconductor layer includes a first region and a second region having a smaller height than the first region, and the first region overlaps with the contact electrode. | 04-11-2013 |
20130240940 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Disclosed is a light emitting device. The light emitting device includes a light emitting structure layer including a first semiconductor layer, an active layer, and a second semiconductor layer, an electrode electrically connected to the first semiconductor layer, an electrode layer under the light emitting structure layer, and a conductive support member under the electrode layer. A channel layer is between the second semiconductor layer and the electrode layer. A protrusion projected from at least one of edges of the conductive support member includes and having a rough surface. | 09-19-2013 |
20140209965 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM - Provided is a light emitting device. The light emitting device comprises: In one embodiment, a light emitting device includes: a light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; and a conductive support member under the light emitting structure. The conductive support member comprises a first conductive support member and a second conductive support member. The second conductive support member has a thermal conductivity higher than that of the first conductive support member. | 07-31-2014 |
20140252394 | LIGHT EMITTING DEVICE - Provided is a light emitting device. In one embodiment, a light emitting device including: a support member; a light emitting structure on the support member, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a protective member at a peripheral region of an upper surface of the support member; an electrode including an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer between the side surface of the light emitting structure and the electrode. | 09-11-2014 |
20150014713 | LIGHT EMITTING DEVICE AND LIGHTING APPARATUS INCLUDING THE SAME - A light emitting device is disclosed. The disclosed light emitting device includes a light emitting structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, a second electrode layer disposed beneath the light emitting structure and electrically connected to the second-conductivity-type semiconductor layer, a first electrode layer including a main electrode disposed beneath the second electrode layer, and at least one contact electrode branching from the main electrode and extending through the second electrode layer, the second-conductivity-type semiconductor layer and the active layer, to contact the first-conductivity-type semiconductor layer, and an insulating layer interposed between the first electrode layer and the second electrode layer and between the first electrode layer and the light emitting structure. The first-conductivity-type semiconductor layer includes a first region and a second region having a smaller height than the first region, and the first region overlaps with the contact electrode. | 01-15-2015 |
Young Kyu Jeong, Gwangsan-Gu KR
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20100308358 | LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM HAVING THE SAME - Embodiments relate to a light emitting device and a light emitting device package having the same. The light emitting device a light emitting structure including a first conductive type semiconductor layer including a first semiconductor layer and a second semiconductor layer under the first semiconductor layer, an active layer under the second semiconductor layer, and a second conductive type semiconductor layer under the active layer; an electrode layer under the second conductive type semiconductor layer; a first insulating layer on a periphery between the first semiconductor layer and the second semiconductor layer; and a second insulating layer under the first insulating layer, the second insulating layer covering a periphery of the second semiconductor layer, the active layer and the second conductive type semiconductor layer. | 12-09-2010 |
Young Kyu Kim, Gyeongsangnam-Do KR
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20100310887 | Decoration Panel And Home Appliance With Decoration Panel - Provided are a decoration panel and a home appliance with the decoration panel. The decoration panel includes a transparent green glass defining an outer appearance and a decoration film adhered to the green glass to realize a color and pattern seen through the green glass to the outside. The decoration film includes a print layer on which the color and pattern expressed to the outside are printed using a gravure printing process and a reflective layer in which a printing ink containing a white inorganic pigment for improving a color reflectance is printed using the gravure printing process to conceal a green color of the green glass, the reflective layer being disposed on a back surface of the print layer. Thus, an outer appearance of the home appliance may be improved. | 12-09-2010 |
20110279000 | APPLIANCE HAVING MICRO-PATTERN AND METHOD FOR FABRICATING STRUCTURE HAVING MICRO-PATTERN FOR APPLIANCE - The present invention relates to an appliance having a micro-pattern ( | 11-17-2011 |
20120138500 | REFRIGERATOR HAVING A DECORATIVE MEMBER CAPABLE OF DISPLAYING HUMIDITY AND METHOD FOR FABRICATING THE DECORATIVE MEMBER - A decorative member of a refrigerator and a method for fabricating the same are disclosed. A refrigerator includes a storage container provided in a storage chamber; and a decorative member provided in the storage container, the decorative configured to generate light refraction and guide a movement of condensate condensed in the storage container, and configured to be capable of displaying humidity inside the storage container according to the movement degree of condensate. | 06-07-2012 |
Young Kyu Kim, Changwon-Si KR
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20120152888 | METHOD FOR MANUFACTURING A MASTER MOLD WHICH IS USED TO FORM A MICROPATTERNED FILM APPLIED TO AN EXTERIOR OF A HOUSEHOLD APPLIANCE AND MANUFACTURING APPARATUS AND METHOD OF THE FILM USING THE MASTER MOLD - An apparatus and a method of manufacturing a micropatterned film are disclosed. More particularly, a method for manufacturing a master mold capable of forming a micropattern on a film applied to an exterior of a household appliance, an apparatus and a method for production of a micropatterned film using the above master mold, and appliances having such micropatterned films attached thereto are disclosed. The method for manufacturing a master mold used for forming a micropatterned film applied to an exterior of a household appliance includes, applying photoresist ( | 06-21-2012 |
20120189962 | METHOD FOR MANUFACTURING STAMPER FOR INJECTION MOLDING - The present invention relates to a method for manufacturing a stamper for injection molding, and more particularly, to a method for manufacturing a stamper for injection molding which can prevent a scratch from forming thereon and has an excellent durability owing to high hardness even after manufacturing of the metal stamper with micro patterns formed thereon is finished. The method for manufacturing a stamper for injection molding includes a pattern forming step for forming a predetermined micro pattern on a substrate, a metal plating step for making metal plating on the substrate to form a stamper having the micro pattern transcribed thereto, a stamper separating step for separating the stamper of the metal plating from the substrate, and a protective layer coating step for coating a protective layer on the stamper for maintaining a mirror surface. | 07-26-2012 |
Young Kyu Lee, Ansung-Si KR
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20100009037 | EBALLISTRA LINEATA CM602(KCTC 10945BP) AND PHYTASE PRODUCED THEREFROM - The present invention relates to a novel yeast strain, | 01-14-2010 |
Young Kyu Lee, Yongin-Si KR
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20110222595 | POWER LINE COMMUNICATION METHOD FOR TRANSMITTING DATA SIGNAL WITH SPLITTING OF POWER TRANSMISSION INTERVAL - A power line communication method is provided, which divides the entire interval for transmitting power and data signals into a power transmission interval and a data transmission interval, and carries one or a plurality of data signals at the data transmission interval in the divided intervals. | 09-15-2011 |
Young Kyu Lee, Seoul KR
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20110172621 | CLEANABLE AND REUSABLE BODY FLUID-ABSORBING FABRIC PAD - Disclosed is a cleanable and reusable body fluid-absorbing fabric pad to move moisture including sweat and urine away from the skin of a wearer, the body fluid-absorbing fabric pad including, a diffusive fabric layer coming into contact with the skin of the wearer to remove moisture from the skin, an absorbent non-woven layer coming into contact with the diffusive fabric layer, the absorbent non-woven layer comprising at least 5 wt % of a superabsorbent fiber to remove moisture transported from the diffusive fabric layer, and a waterproof film coming into contact with the absorbent non-woven layer and exhibiting waterproofing properties and breathability. The absorbent non-woven layer is formed by needle-punching or thermally bonding superabsorbent fibers, polyethylene/polypropylene bi-component fibers and rayon fibers, wherein the diffusive fabric layer, the absorbent non-woven layer and the waterproof film are stacked and sewed to form the body fluid-absorbing fabric pad. The body fluid-absorbing fabric pad can utilize constituent fabrics having a multiple sublayer structure of the absorbent layer to increase diffusion rate of moisture from the skin of the wearer. | 07-14-2011 |
Young Kyu Lim, Busan KR
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20080257742 | Method of manufacturing printed circuit board for semiconductor package - Disclosed is a method of manufacturing a printed circuit board for a semiconductor package, which minimizes or completely obviates masking work upon the plating of each pad for the surface treatment of a printed circuit board for a semiconductor package, thereby simplifying the overall process and increasing the mounting reliability. | 10-23-2008 |
20150053456 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: coating a first solder resist on an upper surface of a substrate having a circuit pattern formed thereon; removing the first solder resist in the remaining portion except a first specific area by performing primary development after exposing the substrate coated with the first solder resist; coating a second solder resist, which has different properties from the first solder resist, on the upper surface of the substrate having the first solder resist remaining in the first specific area; and removing the second solder resist in the remaining portion except a second specific area by performing secondary development after exposing the substrate coated with the second solder resist. | 02-26-2015 |
Young Kyu Moon, Buk-Gu KR
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20120267993 | REFRIGERATOR WITH SLIDABLE SHELF - A refrigerator includes a sliding rail assembly of a triple rail type, which is slidably installed to a sidewall of a storage compartment, a rail cover to cover the sliding rail assembly, and a sliding shelf removably coupled at one end thereof to the rail cover so as to slide forward or rearward relative to the storage compartment, which prevents sagging of the sliding shelf despite an increased withdrawal distance of the shelf, and results in enhanced quality. | 10-25-2012 |
Young Kyu Oh, Gwacheon-Si KR
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20150059667 | OIL SUPPLY DEVICE - An oil supply device includes a plurality of hollow cam shafts, cam shaft journals, and a shaft side path. The hollow cam shafts have through holes that pass in a longitudinal direction from interior to exterior thereof. The cam shaft journals are provided on every position at which the through holes are formed. Each of the cam shaft journals has a path connected with an associated through hole and is coupled with a cylinder head. The shaft side path is formed to supply oil into each hollow cam shaft after the oil sequentially passing from an oil pump through an associated cam shaft journal and an associated through hole. | 03-05-2015 |
20150068476 | ENGINE HAVING CONTINUOUSLY VARIABLE VALVE TIMING MECHANISM - An engine having a variable valve timing mechanism may include a camshaft having a cam formed thereon for moving an intake or exhaust valve, a variable rotation unit disposed on the same axis with the camshaft to rotate the camshaft to have a retard angle chamber and an advance angle chamber for controlling a retard angle and an advance angle of the camshaft, a variable valve bolt having a fastening portion for fastening the variable rotation unit to the camshaft, and an oil control valve for making selective supply of hydraulic oil to the retard angle chamber and the advance angle chamber, and a valve controller disposed on an outer side of the variable rotation unit for controlling the oil control valve in the variable valve bolt. | 03-12-2015 |
20150101553 | ENGINE HAVING CONTINUOUS VARIABLE TIMING DEVICE - A control method of an engine having a variable valve timing may include selecting one of a first mode and a second mode as a driving mode, retarding an intake cam to a first predetermined angle range in the first mode, and advancing an intake cam to a second predetermined angle range in the second mode. | 04-16-2015 |
Young Kyu Park, Gyeonggi-Do KR
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20120125589 | HEAT SINK - A heat sink allowing circuit elements to be simply coupled thereto and allowing a size and a thickness thereof to be adjusted according to the number and capacity of circuit elements. The heat sink includes: a support plate; a plurality of heat radiation pins vertically protruded from one surface of the support plate; an element insertion groove formed to be depressed in a longitudinal direction from the other surface of the support plate; and element support parts formed to be protruded from the element insertion groove and supporting a circuit element. The circuit element slides and is coupled thereto. In addition, the circuit element is freely moved, thereby making it possible to simply correct mounting position. | 05-24-2012 |
20120200288 | Apparatus for Measuring Hall Effect - The present invention relates to a hall-effect measuring apparatus for measuring characteristic values of a semiconductor using hall-effect. In an embodiment of the present invention, the hall-effect measuring apparatus for measuring characteristic values of a semiconductor sample using hall-effect comprises a magnetic flux density applying device for accommodating a sample holder where the sample is set therein and moving permanent magnets by an electric motor installed at one side thereof to form a certain magnetic field at the sample; and a sample temperature control means for setting temperature of the sample by controlling temperature of the sample holder, in which current is applied to the sample, and hall voltage outputted from the sample is measured. | 08-09-2012 |
Young Kyu Park, Hwasun-Gun KR
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20130137603 | NEWLY IDENTIFIED COLON CANCER MARKER AND DIAGNOSTIC KIT USING THE SAME - Provided are a newly identified colon cancer marker and a diagnostic kit using the same. More particularly, the present invention relates to an identified colon cancer specific marker, a composition and a kit including agents determining presence of the marker, and a method of diagnosing colon cancer using the same. The diagnostic marker according to the present invention capable of detecting metastasis and prognosis of colon cancer may provide useful information for the treatment and management of colon cancer and be used for the development of colon cancer-specific anticancer agents. | 05-30-2013 |
Young Kyu Shin, Cheongju-Si KR
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20130147781 | LIQUID CRYSTAL DISPLAY DEVICE - An LCD device is discussed which includes: a plurality of gate lines and a plurality of data lines arranged on a substrate; a data driver configured to apply data voltages the data lines; a gamma generator configured to apply a plurality of gamma voltages to the data driver, wherein the data line receives the data voltage which has an inverted polarity to those of data voltages on the adjacent data lines thereto, is inverted n times in polarity for every frame, and is over-driven for the gate lines opposite to time points of the polarity inversions. | 06-13-2013 |
Young Kyu Son, Gwangjoo-Si KR
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20100043207 | STEPPING MOTOR BEING CONVENIENTLY ASSEMBLED - A stepping motor includes a bracket, a housing having a first end coupled to the bracket and a second end having a reduced width compared with the first end, a stator disposed in the housing to form electric field, a first supporting unit formed on a first end of the bracket, a magnet fixed corresponding to the stator to provide the electric field, a second supporting unit supported on the second end of the housing, a rotor supported by the first and second supporting units, and a stopper fitted on an opened end of the second end of the housing to support the second supporting unit. | 02-25-2010 |
Young Kyu Song, San Diego, CA US
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20140252568 | ELECTROMAGNETIC INTERFERENCE ENCLOSURE FOR RADIO FREQUENCY MULTI-CHIP INTEGRATED CIRCUIT PACKAGES - One feature pertains to a multi-chip package that includes a substrate and an electromagnetic interference (EMI) shield coupled to the substrate. At least one integrated circuit is coupled to a first surface of the substrate. The EMI shield includes a metal casing configured to shield the package from radio frequency radiation, a dielectric layer coupled to at least a portion of an inner surface of the metal casing, and a plurality of signal lines. The signal lines are coupled to the dielectric layer and electrically isolated from the metal casing by the dielectric layer. At least one other integrated circuit is coupled to an inner surface of the EMI shield, and at least a portion of the inner surface of the EMI shield faces the first surface of the substrate. The signal lines are configured to provide electrical signals to the second circuit component. | 09-11-2014 |
20140266508 | BANDPASS FILTER IMPLEMENTATION ON A SINGLE LAYER USING SPIRAL CAPACITORS - A planar capacitor includes, in part, a first metal line forming spiral-shaped loops around one of its end point, and a second metal line forming spiral-shaped loops between the loops of the first metal line. The first and second metal lines are coplanar, formed on an insulating layer, and form the first and second plates of the planar capacitor. The planar capacitor may be used to form a filter. Such a filter includes a first metal line forming first spiral-shaped loops, a second metal line forming second spiral-shaped loops, and a third metal line—coplanar with the first and second metal lines—forming loops between the loops of the first and second metal lines. The filter further includes a first inductor coupled between the first and third metal lines, and a second inductor coupled between the second and third metal lines. | 09-18-2014 |
20140319652 | HIGH QUALITY FACTOR FILTER IMPLEMENTED IN WAFER LEVEL PACKAGING (WLP) INTEGRATED DEVICE - Some implementations provide an integrated device that includes a capacitor and an inductor. The inductor is electrically coupled to the capacitor. The inductor and the capacitor are configured to operate as a filter for an electrical signal in the integrated device. The inductor includes a first metal layer of a printed circuit board (PCB), a set of solder balls coupled to the PCB, and a second metal layer in a die. In some implementations, the capacitor is located in the die. In some implementations, the capacitor is a surface mounted passive device on the PCB. In some implementations, the first metal layer is a trace on the PCB. In some implementations, the inductor includes a third metal layer in the die. In some implementations, the second metal layer is an under bump metallization (UBM) layer of the die, and the third metal is a redistribution layer of the die. | 10-30-2014 |
20150048480 | INTEGRATED PASSIVE DEVICE (IPD) ON SUBTRATE - Some novel features pertain to a semiconductor device that includes a substrate, a first cavity that traverses the substrate. The first cavity is configured to be occupied by a interconnect material (e.g., solder ball). The substrate also includes a first metal layer coupled to a first side wall of the first cavity. The substrate further includes a first integrated passive device (IPD) on a first surface of the substrate, the first IPD coupled to the first metal layer. In some implementations, the substrate is a glass substrate. In some implementations, the first IPD is one of at least a capacitor, an inductor and/or a resistor. In some implementations, the semiconductor device further includes a second integrated passive device (IPD) on a second surface of the substrate. The second IPD is coupled to the first metal layer. | 02-19-2015 |
20150091132 | STIFFENER WITH EMBEDDED PASSIVE COMPONENTS - Systems and methods for preventing warpage of a semiconductor substrate in a semiconductor package. A continuous or uninterrupted stiffener structure is designed with a recessed groove, such that passive components, such as, high density capacitors are housed within the recessed groove. The stiffener structure with the recessed groove is attached to the semiconductor substrate using anisotropic conductive film (ACF) or anisotropic conductive paste (ACP). The stiffener structure with the recessed groove surrounds one or more semiconductor devices that may be formed on the semiconductor substrate. The stiffener structure with the recessed groove does not extend beyond horizontal boundaries of the semiconductor substrate. | 04-02-2015 |
20150092314 | CONNECTOR PLACEMENT FOR A SUBSTRATE INTEGRATED WITH A TOROIDAL INDUCTOR - A system includes a first connector coupled to a first surface of a substrate. The first connector enables the system to be electrically coupled to a first device external to the substrate. The system includes a second connector coupled to a second surface of the substrate. The system also includes a plurality of conductive vias extending through the substrate from the first surface to the second surface. The plurality of conductive vias surrounds the first connector and the second connector. The plurality of conductive vias is electrically coupled together to form a toroidal inductor. A first lead of the toroidal inductor is electrically coupled to the first connector. A second lead of the toroidal inductor is electrically coupled to the second connector. | 04-02-2015 |
20150115403 | TOROID INDUCTOR IN AN INTEGRATED DEVICE - Some novel features pertain to an integrated device that includes a substrate, a first cavity through the substrate, and a toroid inductor configured around the first cavity of the substrate. The toroid inductor includes a set of windings configured around the first cavity. The set of windings includes a first set of interconnects on a first surface of the substrate, a set of though substrate vias (TSVs), and a second set of interconnects on a second surface of the substrate. The first set of interconnects is coupled to the second set of interconnects through the set TSVs. In some implementations, the integrated device further includes an interconnect material (e.g., solder ball) located within the first cavity. The interconnect material is configured to couple a die to a printed circuit board. In some implementations, the interconnect material is part of the toroid inductor. | 04-30-2015 |
20150124418 | EMBEDDED LAYERED INDUCTOR - An embedded layered inductor is provided that includes a first inductor layer and a second inductor layer coupled to the first inductor layer. The first inductor layer comprises a patterned metal layer that may also be patterned to form pads. The second inductor layer comprises metal deposited in a dielectric layer adjacent the patterned metal layer. | 05-07-2015 |
20150130021 | SOLONOID INDUCTOR IN A SUBSTRATE - Some implementations provide an integrated device (e.g., semiconductor device) that includes a substrate and an inductor in the substrate. In some implementations, the inductor is a solenoid inductor. The inductor includes a set of windings. The set of windings has an inner perimeter. The set of windings includes a set of interconnects and a set of vias. The set of interconnects and the set of vias are located outside the inner perimeter of the set of windings. In some implementations, the set of windings further includes a set of capture pads. The set of interconnects is coupled to the set of vias through the set of capture pads. In some implementations, the set of windings has an outer perimeter. The set of pads is coupled to the set of interconnects such that the set of pads is at least partially outside the outer perimeter of the set of windings. | 05-14-2015 |
20150130024 | EMBEDDED SHEET CAPACITOR - A multilayer capacitor is provided that includes a plurality of vias configured to receive interconnects from a die. | 05-14-2015 |
20150146340 | MULTILAYER CERAMIC CAPACITOR INCLUDING AT LEAST ONE SLOT - An apparatus includes a two-terminal MLCC. The two-terminal MLCC includes a conductive layer, where the conductive layer includes at least one slot. The apparatus may also include a second conductive layer that includes at least one slot and an insulating layer that separates the two conductive layers. In one example, a first (e.g., positive) terminal of the two-terminal MLCC is formed by a first set of plates, where each plate in the first set includes at least one slot. A second (e.g., negative) terminal of the two-terminal MLCC is formed by a second set of plates, where each plate in the second set also includes at least one slot. The first set of plates and the second set of plates are interleaved, and each pair of plates is separated by an insulating layer. | 05-28-2015 |
20150187731 | LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY - A high-speed, high-density Input/Output bridge couples dies on a substrate to each other using a flexible connector that is attached to the substrate using solder balls disposed in openings in the substrate. Thus, the bulky, male-to-female connectors and/or silicon bridges are eliminated while still permitting dies disposed on the substrate to be coupled together. | 07-02-2015 |
20150228707 | INDUCTOR DESIGN ON FLOATING UBM BALLS FOR WAFER LEVEL PACKAGE (WLP) - An inductor design on a wafer level package (WLP) does not need to depopulate the solder balls on the die because the solder balls form part of the inductor. One terminal on the inductor couples to the die, the other terminal couples to a single solder ball on the die, and the remaining solder balls that mechanically contact the inductor remain electrically floating. The resulting device has better inductance, direct current (DC) resistance, board-level reliability (BLR), and quality factor (Q). | 08-13-2015 |
20150236681 | EMBEDDED MULTI-TERMINAL CAPACITOR - An embedded multi-terminal capacitor embedded in a substrate cavity includes at least one metal layer patterned into a plurality of power rails and a plurality of ground rails. The substrate includes an external power network. | 08-20-2015 |
20150237732 | LOW-PROFILE PACKAGE WITH PASSIVE DEVICE - A low-profile passive-on-package is provided that includes a plurality of recesses that receive corresponding interconnects. Because of the receipt of the interconnects in the recesses, the passive-on-package has a height that is less than a sum of a thickness for the substrate and an interconnect height or diameter. | 08-20-2015 |
Young Kyu Sung, Osan-Si KR
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20150126022 | METHOD FOR FORMING ELECTRODE OF N-TYPE NITRIDE SEMICONDUCTOR, NITRIDE SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF - According to an example embodiment, a method includes forming a nitrogen vacancy surface layer by treating a surface of an n-type nitride semiconductor with inert gas plasma, and forming an oxygen-added nitride film by treating a surface of the nitrogen vacancy surface layer with oxygen-containing gas plasma, and forming an electrode on the oxygen-added nitride film. The nitrogen vacancy surface layer lacks a nitrogen element. | 05-07-2015 |
Young-Kyu Ahn, Gyeongsangnam-Do KR
Young-Kyu Bae, Bucheon-Si KR
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20090054042 | METHOD, APPARATUS, AND SYSTEM PROVIDING MULTI-CONTENT IN MOBILE BROADCAST SERVICE - Disclosed is a method and system for efficiently providing a multi-content, including a plurality of contents in one service, by means of a service guide upon providing the multi-content in an Open Mobile Alliance (OMA) mobile broadcasting system. When a broadcast transmitting apparatus provides a broadcast receiving apparatus with a multi-content by inserting a plurality of content into one service, the broadcast transmitting apparatus sets one of the plurality of content as a primary content, and provides a service guide including primary-content setting information to the broadcast receiving apparatus. The primary content represents a content set to be primarily provided to a user, among a plurality of content included in one service and simultaneously provided during a specific time period. The primary-content setting information represents information for identifying the primary content. The primary-content setting information may be included in a content fragment or schedule fragment of a service guide. | 02-26-2009 |
20090083786 | SYSTEM AND METHOD FOR DIGITAL RIGHTS MANAGEMENT OF DIGITAL VIDEO BROADCASTING - A system and method for Digital Right Management (DRM) of Digital Video Broadcasting (DVB). The system for DRM of DVB includes a DVB transmitting device for transmitting content for the DVB and information on user's rights object for the content, and a DVB receiving device for receiving and storing the transmitted content, and playing the stored data in accordance with the information on the user's rights object. A sneak post view problem occurring during the DVB is solved, and thus the digital rights for the DVB content are efficiently protected. In solving the sneak post view problem, the existing rights object and the construction of the security association database can be used, without adding a separate construction. | 03-26-2009 |
20090094633 | METHOD AND TERMINAL FOR RECORDING BROADCAST STREAM - A method and a terminal for recording a broadcast stream so that, when the recorded broadcast stream is reproduced, a viewing restriction is placed. The method includes receiving a broadcast stream transmitted in real time and a message containing viewer rating information, and storing the viewer rating information together with the broadcast stream as a media file of a particular file at a broadcast stream recording request. When the stored broadcast stream is reproduced, the same viewing restriction is placed as when the broadcast is watched in real time. | 04-09-2009 |
20090100471 | DIGITAL BROADCASTING SYSTEM AND METHOD FOR TRANSMITTING AND RECEIVING ELECTRONIC SERVICE GUIDE DATA IN DIGITAL BROADCASTING SYSTEM - Disclosed are a digital broadcasting system and a method for transmitting and receiving electronic service guide data in a digital broadcasting system, which communicates applications capable of executing content files downloaded through a file download service. The digital broadcasting system includes a digital broadcasting transmitter for broadcasting Electronic Service Guide (ESG) data which includes application information corresponding to respective content files, and a digital broadcasting receiver for receiving the broadcasted ESG data and executing applications corresponding to the respective content files by using the application information included in the ESG data. | 04-16-2009 |
20090193462 | APPARATUS AND METHOD FOR TRANSMITTING/RECEIVING ELECTRONIC SERVICE GUIDE IN DIGITAL VIDEO BROADCASTING SYSTEM - Provided is an apparatus and a method for transmitting/receiving Electronic Service Guide (ESG) data in a digital video broadcasting system. The method includes creating ESG data bursts by grouping ESG data supporting a plurality of languages for each ESG support language; establishing sessions corresponding to respective ESG data bursts; creating ESG setting data including session information and ESG grouping criteria information, the session information including Internet Protocol (IP) addresses and port numbers corresponding to the entire sessions, respectively, the ESG grouping criteria information indicating that the ESG data bursts are grouped for each ESG support language; and broadcasting the ESG setting data via a specific session and broadcasting the ESG data bursts via the established sessions. | 07-30-2009 |
Young-Kyu Cho, Seongam-Si KR
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20090026515 | Semiconductor memory device and method of forming the same - Example embodiments relate to a semiconductor memory device and a method of forming the semiconductor memory device. The semiconductor memory device may include a first interlayer insulating layer on a semiconductor substrate. A bit line may be arranged in a first direction on the first interlayer insulating layer. A bit line contact pad may be disposed in the first interlayer insulating layer and electrically connected to the bit line. A storage contact pad may be disposed in the first interlayer insulating layer. A top surface of the bit line contact pad may be lower than a top surface of the storage contact pad. | 01-29-2009 |
Young-Kyu Cho, Seoul KR
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20090279714 | APPARATUS AND METHOD FOR LOCALIZING SOUND SOURCE IN ROBOT - An apparatus and method for localizing a sound source in a robot are provided. The apparatus includes a microphone unit implemented by one or more microphones, which picks up a sound from a three-dimensional space. The apparatus also includes a sound source localizer for determining a position of the sound source in accordance with Time-Difference of Arrivals (TDOAs) and a highest power of the sound picked up by the microphone unit. Thus, the robot can rapidly and accurately localize the sound source in the three-dimensional space with minimum dead space, using a minimum number of microphones. | 11-12-2009 |
Young-Kyu Cho, Gyeonggi-Do KR
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20090068814 | Semiconductor Devices Including Capacitor Support Pads and Related Methods - A semiconductor device may include a semiconductor substrate and a plurality of first capacitor electrodes arranged in a plurality of parallel lines on the semiconductor substrate with each of the first capacitor electrodes extending away from the semiconductor substrate. A plurality of capacitor support pads may be provided with each capacitor support pad being connected to first capacitor electrodes of at least two adjacent parallel lines of the first capacitor electrodes and with adjacent capacitor support pads being spaced apart. A dielectric layer may be provided on each of the first capacitor electrodes, and a second capacitor electrode may be provided on the dielectric layer so that the dielectric layer is between the second capacitor electrode and each of the first capacitor electrodes. Related methods are also discussed. | 03-12-2009 |
20110079879 | Semiconductor Devices Including Capacitor Support Pads - A semiconductor device may include a semiconductor substrate and a plurality of first capacitor electrodes arranged in a plurality of parallel lines on the semiconductor substrate with each of the first capacitor electrodes extending away from the semiconductor substrate. A plurality of capacitor support pads may be provided with each capacitor support pad being connected to first capacitor electrodes of at least two adjacent parallel lines of the first capacitor electrodes and with adjacent capacitor support pads being spaced apart. A dielectric layer may be provided on each of the first capacitor electrodes, and a second capacitor electrode may be provided on the dielectric layer so that the dielectric layer is between the second capacitor electrode and each of the first capacitor electrodes. Related methods are also discussed. | 04-07-2011 |
Young-Kyu Choi, Gyeongbuk KR
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20140015108 | METHOD OF MANUFACTURING SINGLE CRYSTAL INGOT, AND SINGLE CRYSTAL INGOT AND WAFER MANUFACTURED THEREBY - A method of manufacturing a single crystal ingot, and a single crystal ingot and a wafer manufactured thereby are provided. The method of manufacturing a single crystal ingot according to an embodiment includes forming a silicon melt in a crucible inside a chamber, preparing a seed crystal on the silicon melt, and growing a single crystal ingot from the silicon melt, and pressure of the chamber may be controlled in a range of 90 Torr to 500 Torr. | 01-16-2014 |
Young-Kyu Choi, Bupyeong-Gu KR
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20080259899 | Apparatus and method for uplink scheduling considering characteristic of power amplifier in mobile communication terminal - An UpLink (UL) scheduling method and apparatus considering a characteristic of a power amplifier in a mobile communication terminal are provided. The UL scheduling method includes calculating a packet transmission time, which minimizes energy consumed in packet transmission, by using a Direct Current (DC) voltage used in a power amplifier for signal amplification and by using nonlinear amplification efficiency; and scheduling UL data by using the calculated packet transmission time. | 10-23-2008 |
Young-Kyu Han, Daejeon KR
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20100133465 | DISPERSANT CONTAINING METAL COMPLEX FOR CARBON NANOTUBE - Disclosed is a composite formed by physical and chemical bonding of (a) a carbon nanotube (CNT); and (b) a metal complex with at least one kind of ligand coordinated to a central metal, the CNT being connected to the metal within the metal complex by a direct bond to the metal. Also, provided is a dispersant for a CNT containing a metal complex comprising (i) a complex ion with at least one kind of ligand (Ln) chemically bonded to a central metal; and (ii) a counter ion. By using a metal complex as a dispersant for a CNT, various characteristics possessed by the metal complex can be provided to the CNT, and the dispersibility of the CNT can be meaningfully increased by introducing a ligand and/or a counter ion having dispersion medium-affinitive properties. | 06-03-2010 |
20100239917 | ELECTROLYTE COMPRISING EUTECTIC MIXTURE AND SECONDARY BATTERY USING THE SAME - Disclosed is an electrolyte for a secondary battery, comprising an eutectic mixture consisting of: (a) am amide group-containing compound with at least one EDG introduced into the N-position thereof; and (b) an ionizable lithium salt. Also, provided are a secondary battery comprising such an electrolyte, and a method of adjusting an electrochemical stability window of an eutectic mixture consisting of an amide group-containing compound and a lithium salt by regulating electron donating properties of at least one substituent group introduced into the N-position of the amide group-containing compound. | 09-23-2010 |
Young-Kyu Hwang, Gyeonggi-Do KR
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20090304462 | Apparatus for transferring slurry - Provided is an apparatus for transferring slurry, which is used to transfer minerals from the bottom of the sea to the ground; and, more particularly, to an apparatus for transferring slurry, which can efficiently transfer the slurry in the state of a solid-liquid mixture containing the minerals without clogging of a transfer pipe. | 12-10-2009 |
Young-Kyu Kim, Suwon-Si KR
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20130238348 | HEALTH MANAGEMENT SYSTEM USING HOME NETWORK AND OPERATION METHOD THEREOF - A health management system. A method of operating a home gateway for a home network connectable with at least one home device in the health management system includes receiving health information for at least one user from a health management server, generating environment control information for configuring an environment corresponding to the health information for the at least one user, and transmitting the environment control information to the at least one home device to control the at least one home device. | 09-12-2013 |
Young-Kyu Kim, Gyeonggi-Do KR
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20110066163 | Hemostatic Clip and Hemostatic Clip Operation Apparatus Using the Same - Provided are a hemostatic clip and a hemostatic clip operation apparatus using the same that can rapidly stop bleeding from a bleeding area of a blood vessel when a middle or large diameter blood vessel partially bleeds during an abdominal operation or a surgery using an endoscope. The hemostatic clip operation apparatus includes a handle, a first gripper configured to primarily stop bleeding from a bleeding area of a blood vessel, a second gripper configured to receive the first gripper and symmetrically bend a closed-loop shaped-hemostatic clip to secondarily clip a periphery of the bleeding area stopped by the first gripper, and a gripper driver configured to connect the handle to the first and second grippers to be interlocked with operation of the handle to operate sequential stopping of bleeding and clipping of the first and second grippers. | 03-17-2011 |
Young-Kyu Kim, Seoul KR
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20110320288 | METHOD FOR PLAYING CONTENTS - A method for playing contents is disclosed. The method for playing contents includes the contents providing system receiving a selection of a first contents from a device, playing at least one of a second contents before the first contents plays or while the first contents is playing, outputting information requesting user input to the device, and the first contents begins to play or resumes playing, when a user input corresponding to the information requesting user input was input. | 12-29-2011 |
Young-Kyu Lee, Daejeon KR
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20100009666 | METHOD AND SYSTEM FOR PROVIDING MOBILE TELEPHONE CALL TERMINATION SERVICE OVER OPEN SEA - Disclosed herein are method and system for providing mobile telephone call termination service over open sea. The system includes a ticketing system which applies to a mobile communication service provider of a customer's mobile telephone for a call termination service; a call termination service provision system which transmits a call termination signal when a call connection to the mobile telephone number is requested, according to the call termination service application, and establishes a call connection; and an internal switching system which is mounted in the airplane or the ship, receives the call termination signal from the call termination service provision server, searches for the customer corresponding to the telephone number, notifies the customer that the call termination signal is received, and transmits/receives voice data to/from the call termination service provision system according to a call connection request of the customer. | 01-14-2010 |
Young-Kyu Lee, Dobong-Gu KR
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20120313151 | SEMICONDUCTOR DEVICE INCLUDING CONTACT STRUCTURE, METHOD OF FABRICATING THE SAME, AND ELECTRONIC SYSTEM INCLUDING THE SAME - A semiconductor device includes a gate structure on a semiconductor substrate, an impurity region at a side of the gate structure and the impurity region is within the semiconductor substrate, an interlayer insulating layer covering the gate structure and the impurity region, a contact structure extending through the interlayer insulating layer and connected to the impurity region, and an insulating region. The contact structure includes a first contact structure that has a side surface surrounded by the interlayer insulating layer and a second contact structure that has a side surface surrounded by the impurity region. The insulating region is under the second contact structure. | 12-13-2012 |
Young-Kyu Lim, Gyeonggi-Do KR
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20080205746 | METHOD OF INSPECTING AN IDENTIFICATION MARK, METHOD OF INSPECTING A WAFER USING THE SAME, AND APPARATUS FOR PERFORMING THE METHOD - In a method of inspecting an identification mark, an image of the identification mark on a semiconductor wafer is obtained. The identification mark may be identified using the identification mark image. A region where the identification mark is formed may be inspected using the identification mark image after the identification mark is identified. | 08-28-2008 |
Young-Kyu Park, Suwon-Si KR
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20150237240 | SUSPENSION FOR CAMERA MODULE AND CAMERA MODULE HAVING THE SAME - A suspension for a camera module and a camera module having the suspension are disclosed. A suspension for a camera module is installed between an optical unit and housing having the optical unit received therein in such a way that the suspension is extended in a direction of optical axis, and the suspension supports the optical unit in such a way that the optical unit is floated from a bottom face of the housing. The suspension includes: a first wire having one end thereof coupled with the optical unit; a second wire having one end thereof coupled with the housing; and a plate member interposed between the first wire and the second wire and comprising a plurality of openings. | 08-20-2015 |
Young-Kyu Park, Suwon KR
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20110279221 | RESISTOR AND METHOD OF FORMING A RESISTOR - A resistor and a method of forming a resistor are disclosed. The method of forming a resistor in accordance with an embodiment of the present invention can include: providing an electric conductor having a resistance area in which a plurality of through-holes are formed; measuring a resistance value of the resistance area; and compensating the resistance value of the resistance area by selectively removing a portion connecting the plurality of through-holes. Since it is possible to compensate the resistance value precisely by simply removing a portion connecting through-holes, the resistance value can be readily compensated. Moreover, since most of the through-holes needed for the adjustment of the resistance value can be formed by a common process, the production cost for forming a precise resistor can be saved. | 11-17-2011 |
Young-Kyu Seo, Suwon-Si KR
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20100325482 | METHOD AND APPARATUS FOR BOOTING TO DEBUG IN PORTABLE TERMINAL - A booting method and an apparatus thereof for debugging in a portable terminal are provided. The method includes, when a booting event occurs; stacking a boot loader in a preset boot loader region of a Random Access Memory (RAM), and executing, and stacking an Operating System (OS) in a preset OS region of the RAM, wherein the boot loader region and the OS region of the RAM are set such that they do not overlap each other. | 12-23-2010 |