Patent application number | Description | Published |
20100039748 | CASE-MOLDED CAPACITOR AND METHOD FOR USING THE SAME - In a case-molded capacitor, an electrode of a capacitor element is connected with a busbar having an electrode terminal for external connection. The capacitor element and the busbar are placed in a metal case having an upper surface opening and are resin molded. A thermally-conductive insulator layer is provided between the capacitor element and a bottom surface of the metal case, hence providing the case-molded capacitor with a heat resistance. | 02-18-2010 |
20100091425 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - The present invention provides an electronic component which can reduce the size of a capacitor and the number of constitutional parts of the capacitor without using a case. The electronic component of the present invention includes a capacitor element, an outer package made of a norbornene resin covering the capacitor element, and external connection terminal portions electrically connected to the capacitor element and protruded from the outer package. | 04-15-2010 |
20100226065 | METALLIZATION FILM CAPACITOR - A metallization film capacitor that achieves both high heat resistance and high withstand voltage at the same time. A metal-deposited electrode is formed on a PEN film in each of a pair of metalized films. These metalized films are wound such that the metal-deposited electrodes face each other via the dielectric film in between. A metalized contact electrode is formed on both end faces of these wound metalized films to configure the metallization film capacitor. A divisional electrode is provided on the metal-deposited electrode. In addition, a fuse is coupled to this divisional electrode for providing a self-maintaining function. Pass rate a/b of a deposition pattern is set to 4.0 or smaller, where ‘a’ is the fuse width, and ‘b’ is the length of the divisional electrode in a lengthwise direction of the metalized films. | 09-09-2010 |
20110090618 | METALIZED FILM CAPACITOR - A metalized film capacitor includes a first dielectric film, a first metal thin-film electrode provided on a surface of the first dielectric film, a second dielectric film provided on the first metal thin-film electrode, and a second metal thin-film electrode provided on the second dielectric film, such that the second metal thin-film electrode faces the first metal thin-film electrode across the second dielectric film. The surface of the first dielectric film has a surface energy ranging from 25 mN/m to 40 mN/m. The metalized film capacitor exhibits high heat resistance and a preferable self-healing effect. | 04-21-2011 |
20110102966 | MOLDED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - A molded capacitor includes a capacitor-element assembly, a package covering the capacitor-element assembly, and a supporter embedded in the package. The capacitor-element assembly includes a capacitor element having a first electrode, and a busbar joined to the electrode of the capacitor element. The busbar has a terminal. The package is made of norbornene-based resin and covers the capacitor-element assembly while exposing the terminal of the busbar. The supporter has first and second end section and is made of heat-conductive insulating material. The first end section contacts the capacitor-element assembly. The second end section is exposed from the package. This molded capacitor has high heat resistance and a small, light-weighted body, and can be manufactured inexpensively. | 05-05-2011 |
20120218679 | METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME - A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size. | 08-30-2012 |
20140009865 | METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME - A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size. | 01-09-2014 |
20140036405 | METALIZED FILM CAPACITOR - A metalized film capacitor includes metalized films, each of which is formed of an insulating film made of dielectric, and a vapor deposited metal electrode formed on an upper surface of the insulating film. An end of the vapor deposited metal electrode extends together with an end of the insulating film, and both the ends are connected to an electrode terminal. The vapor deposited metal electrode of the metalized film includes a center region and a low resistance section that is made of Al—Zn—Mg alloy. The low resistance section is disposed at an end of the electrode and is thicker than the center region. This metalized film capacitor has high humidity resistance. | 02-06-2014 |
20140376154 | METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME - A metallized film capacitor includes first and second metal electrodes, a dielectric film disposed between the first and second metal electrodes, and first and second external electrodes which are connected to the first and second metal electrodes, respectively. At least one of the first metal electrode and the second metal electrode comprises magnesium. The magnesium is distributed unevenly in the at least one of the first metal electrode and the second metal electrode. | 12-25-2014 |
Patent application number | Description | Published |
20090222913 | SYSTEM FOR CONTROLLING SHARED SERVICE RESOURCE, AND METHOD FOR CONTROLLING SHARED SERVICE RESOURCE - An owner code (service-recipient code) assigned to a package, which is an object to which a service is provided by transportation installations or facilities (i.e., shared service resource) including a pickup branch office | 09-03-2009 |
20100070668 | INTERRUPT CONTROL APPARATUS, INTERRUPT CONTROL SYSTEM, INTERRUPT CONTROL METHOD, AND INTERRUPT CONTROL PROGRAM - An interrupt control unit provides controls on an interrupt from an accelerator to a CPU based on a packet transmitted to or received from a controlled object. The interrupt control unit includes: a storage part for storing therein an interrupt control timing table in which a condition of switching a mode of the interrupt control is described; and an interrupt control mode switching part for switching the mode of the interrupt control to the CPU between a permission mode and a mask mode, based on the interrupt control timing table in the storage part. | 03-18-2010 |
20110045973 | COLOR-DEVELOPING COMPOSITIONS AND RECORDING MATERIAL CONTAINING SAME - Provided is a color-developing composition for recording materials having a superior heat resistance. The color-developing composition is a reaction composition containing a mixture of compounds represented by formula (III) obtained by reacting a dihydroxydiphenylsulfone derivative represented by formula (I) with a dihalide represented by formula (II) X-Y-X (II), wherein, in a composition where the content of a compound with n=1 in said reaction composition is from 5 to 80% by mass of the total solid content of the composition, at least 10% by mass of the compound with n=1 is a crystalline material. | 02-24-2011 |
20110287931 | Rewritable recording material - A rewritable recording material can be provided which contains at least one kind of phenolic compounds represented by formula (I) and which is capable of stably repeating coloring and discoloring for a long period of time as well as exerting superior storage properties such as heat resistance and moisture and heat resistance of the colored image and light resistance of the background. Also provided are a composition for forming a rewritable color-forming layer which is capable of forming a color-forming layer of the recording material, and a composition of a color-developing agent for a rewritable recording material. | 11-24-2011 |
Patent application number | Description | Published |
20090003191 | Common Mode Noise Filter - A common mode noise filter includes a nonmagnetic layer, first and second magnetic layers sandwiching the nonmagnetic layer between the magnetic layers and contacting the nonmagnetic layer, a plane coil provided between the first and second magnetic layers and contacting the nonmagnetic layer, and an external electrode connected electrically with the plane coil. The first and second magnetic layers include a magnetic oxide layer and an insulator layer provided on the magnetic oxide layer. The insulator layer contains glass component. This common mode noise filter has a large bonding strength between the external electrode and the insulator layer. | 01-01-2009 |
20090073638 | CHIP TYPE SOLID ELECTROLYTIC CAPACITOR - A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal. | 03-19-2009 |
20090160579 | DIGITAL SIGNAL PROCESSOR - A digital signal processor includes a component for processing a digital signal, a power line for supplying a power to the component, and a decoupling capacitor connected between the power line and a ground. The decoupling capacitor has an equivalent series resistance larger than zero and not larger than 25 mΩ at 100 kHz and an equivalent series inductance larger than zero and not larger than 800 pH at 500 MHz. This digital signal processor does not generate a lot of digital noise, and has a small, thin size. | 06-25-2009 |
20100259868 | CHIP TYPE SOLID ELECTROLYTIC CAPACITOR - A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal. | 10-14-2010 |
Patent application number | Description | Published |
20080196691 | Direct Injection Internal Combustion Engine and Injector Used for Direct Injection Internal Combustion Engine - It is necessary to attain the combustion stability when performing ignition retarding in order to reduce exhaust gas and raise the exhaust gas temperature under a cold start condition, as well as soot reduction under a fully open throttle valve condition. | 08-21-2008 |
20080208438 | Control Method of Direct Injection Engine, Controller for Implementing the Control method, and Control Circuit Device Used for the Controller - An object of the present invention is to provide a fuel injection control technique which maximizes engine power according to fuel evaporation characteristics. The fuel injection timing in the intake stroke is delayed according as a physical quantity affecting the fuel evaporation time changes such that the fuel evaporation time decreases. Further, the fuel injection timing when a physical quantity affecting the fuel evaporation time is such that the fuel evaporation time decreases is set closer to the end of the intake stroke than the fuel injection timing when the physical quantity is such that the fuel evaporation time increases. The fuel injection timing is controlled so as to maximize engine power according to fuel evaporation times. | 08-28-2008 |
20090025680 | Multi-Hole Injector, in-Cylinder Gasoline Injection Type Internal Combustion Engine and Control Method for the Engine - Improvement of combustion stability in retard ignition at the time of starting in a cold state, high output in a full throttle condition, reduction of smoke, and prevention of wear of the cylinder liner caused by oil dilution, are to be attained. In connection with the flow of fuel into each hole and a fuel inflow angle which is determined by the axis of each hole formed in a plate, the fuel inflow angle of an hole directed to a spark plug is set large to reduce an effective flow path area, thereby making the amount of fuel in the hole smaller than in other holes. A shallow cavity is formed in a piston crown face and a small prominence confronting fuel sprays is formed within the cavity. | 01-29-2009 |
20090169197 | Imaging apparatus and open/close device - An imaging apparatus include a lens, a first blade slidable between a covering position where the first blade covers the front side of the lens and a retract position where the first blade retracts from the front side of the lens, and a second blade pivotally supported by the first blade, the second blade moving along with the first blade between the covering position and the retract position in response to the slide motion of the first blade, the second blade rotating relative to the first blade in such a way that the second blade more largely overlaps with the first blade in the retract position than in the covering position. | 07-02-2009 |
20150179480 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device, includes providing a lead frame including a frame portion, including a through hole penetrating the lead frame, a device forming portion surrounded by the frame portion in plan view, including a die pad, and a semiconductor chip mounted on the die pad; after the providing step, sealing the semiconductor chip with sealing resin by supplying the sealing resin to the device forming portion via a first region of the frame portion in which the through hole is formed in plan view, thereby forming a sealing body sealing the device forming portion and the first region of the frame portion; and after the sealing step, removing a first part of the sealing body located at the first region of the frame portion from the lead frame by inserting a pin into the through hole. | 06-25-2015 |
Patent application number | Description | Published |
20120108013 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mechanically removed using a punching die, there is a high possibility of causing cracks of the main body of the package or terminal deformation. When a spacing is provided between the punching die and the main body of the package in order to avoid such damages, a resin residue is produced to hinder complete removal of this lead-to-lead resin protrusion. The present invention provides a method for manufacturing semiconductor device of a QFN type package using multiple leadframes having a dam bar for tying external end portions of a plurality of leads. This method includes a step of removing a sealing resin filled between the circumference of a mold cavity and the dam bar by using laser and then carrying out surface treatment, for example, solder plating. | 05-03-2012 |
20150294870 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mechanically removed using a punching die, there is a high possibility of causing cracks of the main body of the package or terminal deformation. When a spacing is provided between the punching die and the main body of the package in order to avoid such damages, a resin residue is produced to hinder complete removal of this lead-to-lead resin protrusion. The present invention provides a method for manufacturing semiconductor device of a QFN type package using multiple leadframes having a dam bar for tying external end portions of a plurality of leads. This method includes a step of removing a sealing resin filled between the circumference of a mold cavity and the dam bar by using laser and then carrying out surface treatment, for example, solder plating. | 10-15-2015 |