Patent application number | Description | Published |
20100146608 | Multi-Level Secure Collaborative Computing Environment - In some embodiments, a collaborative computing environment includes a federated identity manager coupled to a multi-level secure computing network and a client having a biometric reading device. The multi-level secure computing network includes multiple data repositories that store information according to a ranked classification system comprising multiple security levels. The federated identity manager has a storage device that is operable store a plurality of identity tokens each associated with a corresponding one of a plurality of users. In operation, the federated identity manager receives, from the biometric reading device, a biometric signature associated with a particular one of the users, initiates a login session with the client according to the received biometric signature associated with the particular user, and restricts access to the information stored in the data repositories according to one or more security levels associated with the particular user as specified by the identity token associated with the particular user. | 06-10-2010 |
20110258701 | Protecting A Virtualization System Against Computer Attacks - In certain embodiments, protecting a virtualization system against computer attacks comprises facilitating operation of hypervisors comprising operation zone hypervisors and one or more forensic hypervisors. Each hypervisor operates on a corresponding physical machine, and each operation zone hypervisor manages one or more virtual machines. An assurance procedure is initiated for the hypervisors. At least one virtual machine of a first operation zone hypervisor is moved to a forensic hypervisor to analyze the potential attack. The first operation zone hypervisor is cleaned. | 10-20-2011 |
20110288904 | System, Method, and Software for Analyzing Maneuvers of an Application in a Distributed Computing Environment - In certain embodiments, an application maneuvering analysis tool accesses application characteristics information indicating one or more characteristics of an application for which a maneuver evaluation is desired. Using the accessed application characteristics information, the application maneuvering analysis tool determines a maneuverability index representing a maneuvering efficiency of the application and determines an implementation difficulty level according to the determined maneuverability index. | 11-24-2011 |
20120030733 | ACCESSING RESOURCES OF A SECURE COMPUTING NETWORK - According to one embodiment of the present invention, a method for accessing resources of a secure computing network may be provided. The method may include receiving a request to allow a user to access a secure computing network. The user may be associated with an avatar that has a unique set of one or more identifiers that are associated with the user. A security clearance level of the avatar may be determined from the unique set of identifiers of the avatar. The avatar may be authorized to access one or more virtual compartments of the secure computing network according to the security clearance level of the avatar. The virtual compartment may comprise one or more resources of the secure computing network. The method may further include facilitating display of one or more resources of a virtual compartment accessed by the avatar. | 02-02-2012 |
Patent application number | Description | Published |
20110231231 | MINIATURE BILLBOARD ADVERTISEMENTS - Street-level advertising billboards may offer advertisers an additional method to reach consumers, either while they are driving or walking through city streets. The billboards may be located on stoplights, walk/don't walk signs, or the like. The billboards may include an electronic display panel for displaying an advertisement, a network interface for wirelessly sending collected data to and receiving advertisement display data from the advertisement system, and a sensor for collecting external data. | 09-22-2011 |
20120113254 | MINIATURE BILLBOARD ADVERTISEMENTS HAVING SECURITY FEATURES - Street-level advertising billboards may offer advertisers an additional method to reach consumers, either while they are driving or walking through city streets. The billboards may be located on stoplights, walk/don't walk signs, or the like. The billboards may include an electronic display panel for displaying an advertisement, a network interface for wirelessly sending collected data to and receiving advertisement display data from the advertisement system, and a sensor for collecting external data. The billboards may include one or more additional sensors for sensing security threats. | 05-10-2012 |
20120242816 | RECOGNITION SYSTEM FOR FIREARMS - A recognition system recognizes and prevents the unlawful use of a firearm. The present invention also provides a means for tracking and tracing the history of a firearm movement and registered ownership. The recognition system may include a variety of scanning devices that may be adapted to scan for a firearm and/or may scan for a special component formed into the firearm material. The scanning devices may be made visible to people to act as a deterrent, or may be hidden in various everyday items, such as in exit signs, advertisement displays and the like. The scanning devices may not only detect firearms, but other items that may be restricted in their carry, such as knives, narcotics, explosives, or the like. | 09-27-2012 |
20120330888 | DATA BACKUP DEVICE - A data backup device is built into a device charging mechanism to provide automated data backup when a device is charged. Such a system results in regular data backups, as most users consistently charge their devices, such as their cell phones, smart phones, tablet computers, and the like. The charger/data backup device can integrate into a wireless network to provide remote access and additional backup options. The charger/data backup device can be configured to move data between electronic devices from multiple manufacturers or between electronic devices having different operating systems. | 12-27-2012 |
20130173391 | LISTENING DEVICE - A listening device can be configured to receive an audio signal from a specific source. For example, the listening device may be configured to receive commentary at a sporting event or may be configured to receive audio from a television transmission. The listening device may be part of a system adapted to send the audio signal, and may also be configured to insert advertising into the audio stream where appropriate. For example, at a baseball game, the stadium may send an audio signal that with game stats, commentary and the like. Many fans may desire to receive such commentary and may, rent or buy a listening device specifically designed to receive the audio signal from the stadium. The stadium may then insert advertising in between innings, for example. This may permit the stadium to gain revenue through advertising, while also provide the fans with advertising that may be of interest. | 07-04-2013 |
Patent application number | Description | Published |
20090121330 | Clip Mount For Integrated Circuit Leadframes - A leadframe having a die thereon connects a high current conductive area on the die to a leadframe contact using copper clip that include a structure portion that is received with a recess-like “tub” that is formed in the leadframe contact which tub is shaped to conform to the geometric shape of the clip. In the preferred embodiment, a leadframe structure fabricated by etching includes at least one contact that is a half-etch recess or “tub” that receives one end of the clip structure and is retained in the tub by an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and a also effect a reliable mechanical connection. | 05-14-2009 |
20090121331 | Self-Aligning Structures and Method For Integrated Circuits - A lead frame having a die thereon connects a high current conductive area on the die to a lead frame contact using a copper clip that includes a structure portion that is received with a recess-like “tub” formed in the lead frame contact. In the preferred embodiment, a lead frame structure fabricated by etching includes at least one contact that is a half-etch recess or “tub” that receives one end of the clip structure and is retained in the tub by solder paste or an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and a also effect a reliable mechanical connection. One or more solder-holding pockets are formed a surface portion of the tub and/or the end of the clip that is received in the tub so that a volume of liquefied solder formed during the solder reflow step will effect alignment of any mis-aligned parts by “drawing” at least one of the parts against a “stop” surface. | 05-14-2009 |
20110033724 | Tie-Bar Configuration For Leadframe Type Carrier Strips - A conductive clip having a riser or post formed along a side thereof includes a notch or opening formed in the riser or post to create a first riser or post section and second riser or post section separated by the notch or opening through which a tiebar extends. The conductive clip organization is will suited for formation as elongated strips of such conductive clips for automated machine assembly of the conductive clips in an integrated circuit package context. | 02-10-2011 |
20120032317 | Self-Aligning Structures and Method for Integrated Chips - A lead frame having a die thereon connects a conductive area on the die to a lead frame contact using a conductive clip that includes a structural portion that is received with a recess-like “tub” formed in the lead frame contact. The end of the clip received in the tub is held in place during subsequent handling by a solder paste deposit until the clip and leadframe undergo solder reflow to effect a reliable electrical connection. The effective surface area between one side of the clip and the other side of the clip within the tub is different so that the surface tension of the liquefied solder formed during the solder reflow step will “draw” the clip into a preferred alignment against a “stop” surface. | 02-09-2012 |
20120133037 | CLIP INTERCONNECT WITH ENCAPSULATION MATERIAL LOCKING FEATURE - A clip interconnect comprises a columnar part, a bridge part, and a locking feature. The bridge part has a plurality of sides. The columnar part and the bridge part are configured to form an angle at an interface between the columnar part and the bridge part. The locking feature is located in at least one of the plurality of sides of the bridge part. The locking feature comprises an alternating pattern of teeth and valleys. | 05-31-2012 |
20130099366 | SYSTEMS AND METHODS FOR LEAD FRAME LOCKING DESIGN FEATURES - Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle. | 04-25-2013 |
20150014835 | SOLDER FLOW IMPEDING FEATURE ON A LEAD FRAME - One embodiment is directed towards a packaged chip including a lead frame. At least one chip is mounted on the lead frame. At least one edge the lead frame has a solder flow impeding feature located thereon. The solder flow impeding feature includes an integral portion of the lead frame that extends in a first projection outward at an edge of the lead frame and parallel to an external surface of the lead frame. An internal surface of the first projection is aligned with an internal surface of the main portion of the lead frame. The solder flow impeding feature also includes a second projection that extends from an external side of the first projection in a direction generally perpendicular to the first projection. | 01-15-2015 |
20150054147 | LEAD FRAME HAVING A PERIMETER RECESS WITHIN PERIPHERY OF COMPONENT TERMINAL - Embodiments described herein relate to a packaged circuit including a lead frame having at least one recess pattern on an internal surface thereof. The at least one recess pattern includes a perimeter recess that defines a perimeter around one or more raised surfaces. The packaged circuit also includes a component having one or more terminals. One of the terminals is mounted to the one or more raised surfaces such that the terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the terminal. The packaged circuit also includes component attach adhesive between the single terminal of the component and the one or more raised surfaces of the lead frame. | 02-26-2015 |
Patent application number | Description | Published |
20130270701 | SYSTEM AND METHODS FOR WIRE BONDING - A semiconductor package comprises a bond pad formed on a first semiconductor die, a surface of the bond pad exposed through an opening in a passivation layer on the first semiconductor die; a raised conductive area formed on top of a passivation layer on a second semiconductor die; and a bond wire having a first end coupled to the bond pad via a ball bond and a second end coupled directly to a surface of the raised conductive area via a stitch bond. The raised conductive area is comprised of a plurality of metal layers, each of the metal layers comprised of a respective material and having a respective thickness. The thickness and material of at least one of the plurality of metal layers is selected such that a hardness of the raised conductive area is at least as hard as a hardness of the bond wire. | 10-17-2013 |
20130285226 | SYSTEMS AND METHODS FOR LEAD FRAME LOCKING DESIGN FEATURES - Systems and methods for lead frame locking design features are provided. In one embodiment, a method comprises: fabricating a lead frame for a chip package, the lead frame having a paddle comprising a step-out bottom locking feature profile across at least a first segment of an edge of the paddle that provides an interface with a mold compound; etching the paddle to have at least a second segment of the edge having either an extended-step-out bottom locking feature profile or an overhanging top locking feature profile; and alternating first and second segments along the edge of the paddle. | 10-31-2013 |
20140001618 | SOLDER FLOW IMPEDING FEATURE ON A LEAD FRAME | 01-02-2014 |
20140097529 | SOLDER FLOW-IMPEDING PLUG ON A LEAD FRAME - Embodiments described herein relate to a method of manufacturing a packaged circuit having a solder flow-impeding plug on a lead frame. The method includes partially etching an internal surface of a lead frame at dividing lines between future sections of the lead frame as first partial etch forming a trench. A non-conductive material that is adhesive to the lead frame is applied in the trench, such that the non-conductive material extends across the trench to form the solder flow-impeding plug. One or more components are attached to the internal surface of the lead frame and encapsulated. An external surface of the lead frame is etched at the dividing lines to disconnect different sections of lead frame as a second partial etch. | 04-10-2014 |
20140175627 | LEAD FRAME HAVING A PERIMETER RECESS WITHIN PERIPHERY OF COMPONENT TERMINAL - Embodiments described herein relate to manufacturing a device. The method includes etching at least one recess pattern in an internal surface of a lead frame, the at least one recess pattern including a perimeter recess that defines a perimeter of a mounting area. The method also includes attaching a component to the internal surface of the lead frame such that a single terminal of the component is attached in the mounting area and the single terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the single terminal. | 06-26-2014 |