Patent application number | Description | Published |
20100255376 | GAS PHASE DEPOSITION OF BATTERY SEPARATORS - In certain embodiments, a gas phase deposited porous separator is provided. The porous separator can be deposited onto an electrode. The electrode can include at least one cavity or protrusion, and the separator layer can be gas phase deposited onto a surface of the at least one cavity or protrusion. In certain embodiments, a method of gas phase depositing a separator layer is provided. | 10-07-2010 |
20110020701 | CARBON ELECTRODE STRUCTURES FOR BATTERIES - In certain embodiments, an electrode includes a body of material formed in substantial part of carbon, the body having an exterior surface and an interior located within the exterior surface, and a plurality cavities located in the interior of the body. Each of the cavities is in communication with the exterior of the body and has an interior surface. The cavities can each be sized to accommodate a battery separator located therein and substantially covering the interior surface of the cavity. | 01-27-2011 |
20110177393 | COMPOSITE MATERIALS FOR ELECTROCHEMICAL STORAGE - Composite materials and methods of forming composite materials are provided. The composite materials described herein can be utilized as an electrode material for a battery. In certain embodiments, the composite material includes greater than 0% and less than about 90% by weight silicon particles, and greater than 0% and less than about 90% by weight of one or more types of carbon phases. At least one of the one or more types of carbon phases can be a substantially continuous phase. The method of forming a composite material can include providing a mixture that includes a precursor and silicon particles, and pyrolysing the precursor to convert the precursor into one or more types of carbon phases to form the composite material. | 07-21-2011 |
20140170482 | ELECTRODES, ELECTROCHEMICAL CELLS, AND METHODS OF FORMING ELECTRODES AND ELECTROCHEMICAL CELLS - Electrodes and methods of forming electrodes are described herein. The electrode can be an electrode of an electrochemical cell or battery. The electrode includes a current collector and a film in electrical communication with the current collector. The film may include a carbon phase that holds the film together. The electrode further includes an electrode attachment substance that adheres the film to the current collector. | 06-19-2014 |
20140170498 | SILICON PARTICLES FOR BATTERY ELECTRODES - Silicon particles for active materials and electro-chemical cells are provided. The active materials comprising silicon particles described herein can be utilized as an electrode material for a battery. In certain embodiments, the composite material includes greater than 0% and less than about 90% by weight silicon particles, the silicon particles having an average particle size between about 10 nm and about 40 μm, and greater than 0% and less than about 90% by weight of one or more types of carbon phases, wherein at least one of the one or more types of carbon phases is a substantially continuous phase. | 06-19-2014 |
Patent application number | Description | Published |
20120280245 | High Voltage Cascoded III-Nitride Rectifier Package with Stamped Leadframe - Some exemplary embodiments of high voltage cascoded III-nitride semiconductor package with a stamped leadframe have been disclosed. One exemplary embodiment comprises a III-nitride transistor having an anode of a diode stacked atop a source of the III-nitride transistor, and a stamped leadframe comprising a first bent lead coupled to a gate of the III-nitride transistor and the anode of the diode, and a second bent lead coupled to a drain of the III-nitride transistor. The bent leads expose respective flat portions that are surface mountable. In this manner, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since multiple packages may be assembled at a time, high integration and cost savings may be achieved compared to conventional methods requiring individual package processing and externally sourced parts. | 11-08-2012 |
20120280246 | High Voltage Cascoded III-Nitride Rectifier Package with Etched Leadframe - Some exemplary embodiments of high voltage cascaded III-nitride semiconductor package with an etched leadframe have been disclosed. One exemplary embodiment comprises a III-nitride transistor having an anode of a diode stacked over a source of the III-nitride transistor, and a leadframe that is etched to form a first leadframe paddle portion coupled to a gate of the III-nitride transistor and the anode of the diode, and a second leadframe paddle portion coupled to a drain of the III-nitride transistor. The leadframe paddle portions enable the package to be surface mountable. In this manner, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since multiple packages may be assembled at a time, high integration and cost savings may be achieved compared to conventional methods requiring individual package processing and externally sourced parts. | 11-08-2012 |
20120280247 | High Voltage Cascoded III-Nitride Rectifier Package Utilizing Clips on Package Support Surface - Some exemplary embodiments of high voltage cascoded III-nitride semiconductor package utilizing clips on a package support surface have been disclosed. One exemplary embodiment comprises a III-nitride transistor attached to a package support surface and having an anode of a diode stacked over a source of the III-nitride transistor, a first conductive clip coupled to a gate of the III-nitride transistor and the anode of the diode, and a second conductive clip coupled to a drain of the III-nitride transistor. The conductive clips are connected to the package support surface and expose respective flat portions that are surface mountable. In this manner, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since a low cost printed circuit board (PCB) may be utilized for the package support surface, expensive leadless fabrication processes may be avoided for cost effective manufacturing. | 11-08-2012 |
20140030854 | High Voltage Cascoded III-Nitride Rectifier Package - Some exemplary embodiments of high voltage cascoded III-nitride semiconductor package utilizing clips on a package support surface have been disclosed. One exemplary embodiment comprises a III-nitride transistor attached to a package support surface and having an anode of a diode stacked over a source of the III-nitride transistor, a first conductive clip coupled to a gate of the III-nitride transistor and the anode of the diode, and a second conductive clip coupled to a drain of the III-nitride transistor. The conductive clips are connected to the package support surface and expose respective flat portions that are surface mountable. In this manner, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since a low cost printed circuit board (PCB) may be utilized for the package support surface, expensive leadless fabrication processes may be avoided for cost effective manufacturing. | 01-30-2014 |
20140327014 | III-Nitride Rectifier Package - Some exemplary embodiments of high voltage cascoded III-nitride semiconductor package utilizing clips on a package support surface have been disclosed. One exemplary embodiment comprises a III-nitride transistor attached to a package support surface and having an anode of a diode stacked over a source of the III-nitride transistor, a first conductive clip coupled to a gate of the III-nitride transistor and the anode of the diode, and a second conductive clip coupled to a drain of the III-nitride transistor. The conductive clips are connected to the package support surface and expose respective flat portions that are surface mountable. In this manner, reduced package footprint, improved surge current capability, and higher performance may be achieved compared to conventional wire bonded packages. Furthermore, since a low cost printed circuit board (PCB) may be utilized for the package support surface, expensive leadless fabrication processes may be avoided for cost effective manufacturing. | 11-06-2014 |
Patent application number | Description | Published |
20080255686 | Delivering Podcast Content - Systems and methods for delivering audio content to listeners. In general, one aspect can be a method that includes receiving a request to download a podcast, and determining a targeted advertisement to be inserted into the podcast. The method also includes inserting the targeted advertisement into the podcast dynamically at a predetermined time. Other implementations of this aspect include corresponding systems, apparatus, and computer program products. | 10-16-2008 |
20080255904 | Estimating Off-Line Advertising Impressions - A computer-implemented method for monitoring the effectiveness of advertisements broadcast is described. The method includes detecting that an advertisement has been aired by a broadcast station, monitoring a network for a duration subsequent to the airing of the advertisement for activity attributable to the airing of the advertisement, and developing a quantitative relationship between the activity and a number of listeners of the advertisement. | 10-16-2008 |
20080256109 | Dynamic Podcast Content Delivery - Systems and methods for delivering podcast content dynamically in an automated podcast platform. In general, one aspect can be a method that includes receiving a request to download a podcast, and determining an item of audio content to be inserted into the podcast. The method also includes inserting the item of audio content into the podcast dynamically at a predetermined time. Other implementations of this aspect include corresponding systems, apparatus, and computer program products. | 10-16-2008 |
20110119126 | Online Monitoring Systems to Determine Offline Advertising Effectiveness - Methods, systems, and apparatuses for online monitoring systems to determine offline advertising effectiveness. Information related to an advertisement for a product is received. The advertisement is presented through offline media. The information includes an advertising schedule. Communications related to the product that are received from the consumers in the market at the time the advertisement is presented, are detected. Data responsive to the detected communications are collected; the data represent a number of consumers in the market. A statistical correlation between the collected data and the advertising schedule is determined and provided to the advertiser as a report of the effectiveness of the advertising. | 05-19-2011 |
20130173379 | Estimating Off-Line Advertising Impressions - A computer-implemented method for monitoring the effectiveness of advertisements broadcast is described. The method includes detecting that an advertisement has been aired by a broadcast station, monitoring a network for a duration subsequent to the airing of the advertisement for activity attributable to the airing of the advertisement, and developing a quantitative relationship between the activity and a number of listeners of the advertisement. | 07-04-2013 |
Patent application number | Description | Published |
20100040079 | MULTICASTING IN A NETWORK USING NEIGHBOR INFORMATION - In one aspect, a method to multicast in a network includes determining using a processor a least amount of relay nodes for use in multicasting a message to nodes in the network by using a neighbor matrix of a source node used in Node Activation Multiple Access (NAMA) scheduling. The method may include designating a one-hop neighbor that exclusively accesses the two-hop neighbor of the source node as a relay node. The method may also include designating a one-hop neighbor of the source node with accessibility to a maximum number of two-hop neighbors of the source node as a relay node. | 02-18-2010 |
20100182978 | COMMUNICATION SCHEDULING OF NETWORK NODES USING A CLUSTER COEFFICENT - In one aspect, a method includes scheduling network communications in a network comprising nodes connected by links, receiving at a first node updated bandwidth values from the other nodes, determining a cluster coefficient based on a number of one-hop neighbors of the first node and a number of neighbors N-hops and less of the first node, adjusting the cluster coefficient to form an adjusted cluster coefficient and determining a wait period based on the adjusted cluster coefficient. The method also includes implementing the updated bandwidth values received to determine updated node weight values of the other nodes after the wait period has expired. | 07-22-2010 |
20100265955 | CROSS LAYER ROUTING (XRP) PROTOCOL - In one aspect, a method includes receiving a packet at a first node, the first node comprising a processor, determining, at the first node, whether a destination node of the packet is within a zone of the first node, using, at the first node, an on-demand routing protocol to route data from the first node to the destination node if the destination node is outside the zone of the first node and using a network topology, stored at the first node, to route the packet from the first node to the destination node if the destination node is within the zone of the first node. | 10-21-2010 |
20100290338 | Determining Paths That Satisfy A Reliability Requirement - In certain embodiments, a method includes receiving path information. A reliability requirement is established, and paths that satisfy the reliability requirement are determined. Each path comprises nodes. Configuration of the nodes of the paths according to the reliability requirement is facilitated. | 11-18-2010 |