Patent application number | Description | Published |
20080200811 | Ultrasonic transducer, method for manufacturing ultrasonic transducer, and ultrasonic endoscope - An ultrasonic transducer according to the invention includes a flexible sheet, a rigid body portion including a lower electrode made of at least a thin-film conductive material on a surface of the flexible sheet, a dividing portion which divides the rigid body portion into segments, and a plurality of transducer elements including the divided rigid body portion, has at least one transducer cell composed of one of the segments, an insulating partition portion bonded to the segment, an air gap portion surrounded by the partition portion, an upper electrode opposed to the lower electrode extending to the partition portion to sandwich the air gap portion therebetween, and an upper insulating layer formed on the upper electrode, and includes an upper protection film which continuously covers a surface portion of the transducer elements and the dividing portion. | 08-21-2008 |
20080217743 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - According to a method of manufacturing a semiconductor device, a short-circuit wiring is formed in a region on a wafer including a dicing region, and electrode pads for input and output signals of a plurality of devices disposed in a semiconductor device forming region are electrically short-circuited by the short-circuit wiring, so that occurrence of plasma damage is suppressed even if the wafer is subjected to various plasma processes. When the wafer subjected to the plasma processes is cut along the dicing region to separate a semiconductor device, the electrical short-circuit of the electrode pads by the short-circuit wiring is released, so that the functionally unwanted short-circuit of the devices or the like is appropriately released. | 09-11-2008 |
20080217791 | SEMICONDUCTOR DEVICE - In a semiconductor device of the present invention, an electrode pad is formed on a surface of a semiconductor substrate, and in the electrode pad, two different areas: a connection area of through wiring electrically connected to a through wiring; and a pad area for inspection that keeps away from an opening on the surface of a through hole, are set. Accordingly, the electrode pad can be adequately prevented from being damaged due to contact of a probe, providing a high yield and reliability of the semiconductor device. That is, because the through hole is not opened directly below the pad area for inspection with which the probe is in contact upon operation inspection of devices, a mechanical strength of the electrode pad against the probe can be maintained in a high level. | 09-11-2008 |
20090058228 | ULTRASONIC TRANSDUCER, METHOD OF MANUFACTURING ULTRASONIC TRANSDUCER, ULTRASONIC DIAGNOSTIC APPARATUS, AND ULTRASONIC MICROSCOPE - A ultrasonic transducer of the invention comprises: a transducer cell including a first electrode and a second electrode disposed separated from the first electrode by an air gap portion; and an electret for applying a potential difference between the first electrode and the second electrode. The electret is disposed in a region where at least a part thereof does not overlap with the transducer cell when viewed from a transmitting direction of ultrasonic waves. | 03-05-2009 |
20090231477 | SOLID-STATE IMAGE PICKUP APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A solid-state image pickup apparatus includes: a first major surface on which a light receiving portion is formed; a second major surface opposed to the first major surface, and a hermetic seal portion formed on the first major surface, for sealing the light receiving portion, the hermetic seal portion being formed by a flat plate portion made of a transparent inorganic insulating member and a frame portion made of an inorganic insulating film. | 09-17-2009 |
20090262605 | ULTRASOUND TRANSDUCER AND ELECTRONIC DEVICE - An ultrasound transducer includes a substrate, an ultrasound transducer cell placed on one surface of the substrate and having a lower electrode, a first gap portion placed on the lower electrode and an upper electrode placed on the first gap portion, a first conductive layer placed on the other surface of the substrate and electrically connected to one of the lower electrode and the upper electrode, an electret film placed on the first conductive layer, an insulating layer placed on the electret film, and a second conductive layer placed on the insulating layer and electrically connected to the one of the lower electrode and the upper electrode not electrically connected to the first conductive layer. | 10-22-2009 |
20110036808 | ULTRASONIC TRANSDUCER, ULTRASONIC TRANSDUCER FABRICATION METHOD, AND ULTRASONIC ENDOSCOPE - An ultrasonic transducer according to the present invention includes: two or more ultrasonic transducer cells, each of which has a lower electrode, a first insulating layer placed on the lower electrode, a cavity placed on the first insulating layer, a second insulating layer placed on the cavity, and an upper electrode placed above the second insulating layer; channels which communicate the cavities with each other; the second insulating layer placed on the channels; holes formed in the second insulating layer placed on the channels; and sealing portions which seal the holes, where that part of the sealing portions which enters the channels is the same in cross-sectional shape as the holes. | 02-17-2011 |
20120029328 | FLUORESCENCE SENSOR, NEEDLE-TYPE FLUORESCENCE SENSOR, AND METHOD FOR MEASURING ANALYTE - A needle-type fluorescence sensor that measures glucose based on fluorescence produced by excitation light is provided. The needle-type fluorescence sensor includes a needle body section including a sensor portion disposed in a needle distal end portion and metal lines disposed from the sensor portion to a needle proximal end portion, and a connector which is integrated with the needle body section and in which the metal lines extend. The sensor portion includes a silicon substrate having first and second principal surfaces, a PD device that converts fluorescence into an electric signal, an LED device that transmits fluorescence and emits excitation light, and an indicator layer that interacts with an analyte under the excitation light to produce fluorescence. The PD device, the LED device, and the indicator layer overlap with each other above the first principal surface of the silicon substrate. | 02-02-2012 |
20130018269 | ULTRASOUND TRANSDUCER AND ULTRASOUND DIAGNOSTIC APPARATUS - An ultrasound transducer includes a substrate and a lower electrode layer, a lower insulating layer, an upper insulating layer, and an upper electrode layer. The lower insulating layer and the upper insulating layer are arranged to be opposed to each other via an air gap section. The upper insulating layer and the lower insulating layer are different in a material and thickness and satisfy Equation 1 below. In Equation 1, K | 01-17-2013 |
20130286786 | ULTRASOUND TRANSDUCER ARRAY, METHOD OF MANUFACTURING ULTRASOUND TRANSDUCER ARRAY AND ULTRASOUND ENDOSCOPE - An ultrasound transducer array according to an embodiment includes a substrate, a plurality of groove-like recesses arranged at a predetermined interval on one surface of the substrate, a cell region arranged between the recesses on the one surface side of the substrate, a flexible film configured to cover the substrate and the cell region and having fragility lower than fragility of the substrate, and a dividing groove having a width smaller than a width of the recess and reaching from the other surface of the substrate to the flexible film in the recess. | 10-31-2013 |
20140017799 | SENSING METHOD AND SENSING DEVICE - This invention relates to a sensing method and a sensing device for quantifying the concentration of an analyte by using the property that interaction between an analyte and a labeled compound changes fluorescence intensity. A fluorescence sensor is used to acquire fluorescence intensity at predetermined quantification time points. Then, the concentration of an analyte is quantified in accordance with a non-steady concentration quantification law comprising the relationship between the acquired fluorescence intensity and the time derivative quantity thereof. | 01-16-2014 |
20140114195 | ULTRASOUND UNIT AND ULTRASOUND ENDOSCOPE - An ultrasound unit includes an ultrasound array that has a plurality of ultrasound elements, each of which has a first principal surface that is rectangular where a transmitting and receiving portion, a signal electrode terminal, and a ground electrode terminal are arranged in a longer side direction, longer sides of the ultrasound elements being coupled, one or more short-lines that are connected to a plurality of ground electrode terminals, a ground line that is connected to the short-line, and a plurality of signal lines, each of which is connected to one of the signal electrode terminals, and adjoining ultrasound elements of the ultrasound elements are coupled such that the signal electrode terminals are arranged alternately on opposite sides in the longer side direction of the transmitting and receiving portions that are rectangular. | 04-24-2014 |
20140121526 | ULTRASOUND ELEMENT AND ULTRASOUND ENDOSCOPE - A US element includes a silicon substrate, wherein a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities are formed, an upper electrode layer that has a plurality of upper electrode sections and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential for detecting a capacitance signal, and a protection layer are sequentially stacked on the silicon substrate, and the US element further includes a shield electrode section that is formed at least at an upper side of the lower wiring sections, and is connected to a shield electrode terminal at a ground potential. | 05-01-2014 |
20140128741 | ULTRASOUND ELEMENT AND ULTRASOUND ENDOSCOPE - An ultrasound element includes a silicon substrate, a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities smaller than the respective lower electrode sections are formed, an upper electrode layer that has a plurality of upper electrode sections that are disposed to face the respective lower electrode sections via the respective cavities, and are smaller than the lower electrode sections and larger than the cavities, and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential that detects a capacitance signal, and a protection layer. | 05-08-2014 |