Patent application number | Description | Published |
20100059886 | Carrier structure of SoC with custom interface - The present invention discloses a carrier structure of a System-on-Chip (SoC) with a custom interface. The carrier structure includes a substrate, at least one common die, at least one custom interface and a molding compound. The common die and the custom interface are disposed on the substrate. The molding compound is used to package the common die which electrically connects to the substrate and the custom interface respectively. The carrier structure which includes the common die can form a complete SoC by connecting to an expansive die through the custom interface. The carrier structure with the common die which can be tested and certified in advance allows reducing and simplifying the developing procedures of the SoC. | 03-11-2010 |
20100330741 | FABRICATION METHOD FOR SYSTEM-ON-CHIP (SOC) MODULE - A fabrication method for a system-on-chip (SoC) module is provided. The fabrication method includes the steps of providing at least two SoC sub-modules and connecting the SoC sub-modules. The SoC sub-modules are electrically connected with each other by connection interfaces of the SoC sub-modules so as to form the SoC module. As the SoC sub-modules have been verified in advance, the time required for verifying the resulting SoC module can be significantly reduced. As for application-specific SoC modules, they are fabricated by connecting with application-specific SoC sub-modules via the appropriate connection interfaces. Thus, the time and costs for developing SoC modules can both be minimized. | 12-30-2010 |
20110096506 | MULTI-LAYER SOC MODULE STRUCTURE - A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure. | 04-28-2011 |
20110138248 | METHOD FOR ARRANGING MEMORIES OF LOW-COMPLEXITY LDPC DECODER AND LOW-COMPLEXITY LDPC DECODER USING THE SAME - A method for arranging memories of a low-complexity low-density parity-check (LDPC) decoder and a low-complexity LDPC decoder using the same method are provided. The main idea of the method for arranging memories of a low-complexity LDPC decoder is to merge at least one or two small-capacity memory blocks into one memory group, so that the memory area can be reduced and the power consumption in reading or writing data is lowered. Besides, as the merged memory group shares the same address line in reading or writing data, at least one delay unit is used to adjust the reading or writing order and thereby ensure data validity. A low-complexity LDPC decoder using the disclosed method can meet the demands of high processing rate and low power consumption. | 06-09-2011 |
20110188210 | THREE-DIMENSIONAL SOC STRUCTURE FORMED BY STACKING MULTIPLE CHIP MODULES - A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements. | 08-04-2011 |
20130081681 | PHOTOVOLTAIC DEVICE - This disclosure discloses a light-emitting device. The light-emitting device comprises a substrate; a first photovoltaic cell disposed over the substrate comprising a base layer having a first conductivity type; an emitter layer having a second conductivity type; a window layer having the second conductivity type; an intermediate structure between the emitter layer and the window layer having the second conductivity type, and comprising a first portion adjacent to the emitter layer and a second portion on the first portion. The first portion comprises a bandgap energy higher than that of the emitter layer and the intermediate structure is substantially lattice matched with the emitter layer. | 04-04-2013 |
20130259772 | MINIATURE SIEVE APPARATUS AND MANUFACTURING METHOD THEREOF - A miniature sieve apparatus is described and includes a first sieve, a separator and a second sieve from top to bottom. The first and second sieves are formed with at least one first mesh and a plurality of second meshes, respectively. The first and second meshes are misaligned with each other in a vertical direction of the first and second sieves. The miniature sieve apparatus is provided to separate or screen microparticles with different sizes, such as target cells, bio-medical particles, organic or inorganic microparticles. Additionally, the invention also provides a manufacturing method of the miniature sieve apparatus, and the same material is applied to manufacture the sieves and the separators. Thus, the problem caused by the residual thermal stress due to different material can be solved. Therefore, the cost of the miniature sieve apparatus can be lowered as the yield rate thereof is improved. | 10-03-2013 |
20130291628 | MICROPARTICLE DETECTING APPARATUS - A microparticle detecting apparatus is disclosed and includes at least one detection unit, each of which includes: a first sieve having at least a first mesh, a separator stacked on one side of the first sieve and having a separator hole, and a second sieve stacked on one side of the separator and having several second meshes. The diameter of the second mesh is smaller than that of the first mesh, and the first and second meshes are misaligned with each other in a vertical direction of the first and second sieves. The detection unit further includes at least a sensor aligned with the first or second mesh for detecting microparticles trapping into the first mesh or passing through the second mesh. Therefore, the microparticle detecting apparatus is suitably used for detecting or counting any microparticles with different size, to effectively shorten the detection processes of sample fluids. | 11-07-2013 |
20140061881 | INTEGRATED CIRCUIT - An integrated circuit (IC) includes a packaging body, multiple interface connectors, a functional chip, and an electrostatic discharge (ESD) protection chip. The interface connectors are located on an outer surface of the packaging body. The functional chip has an electronic functional circuit, and the ESD protection chip has an ESD protection circuit. The ESD protection circuit is connected electrically to an interface connector serving as a data exchange path. | 03-06-2014 |
20140217359 | Light-Emitting Apparatus - The present application discloses a light-emitting apparatus comprising a first light-emitting semiconductor stack, a first intermediate layer formed on the first light-emitting semiconductor stack and a second light-emitting semiconductor stack formed on the first intermediate layer. The first intermediate layer comprises a first conductive semiconductor layer, a second conductive semiconductor layer and an intermediate region. The intermediate region has a discontinuous structure located between the first conductive semiconductor layer and the second conductive semiconductor layer. | 08-07-2014 |
20150034155 | OPTOELECTRONIC DEVICE AND THE MANUFACTURING METHOD THEREOF - An optoelectronic device includes: a semiconductor stack including an upper surface and a side surface; a first electrode formed on the upper surface of the semiconductor stack; a first anti-reflection structure formed on the first electrode and the upper surface; and a second anti-reflection structure different from the first anti-reflection structure formed on the side surface. | 02-05-2015 |
20150054677 | METHOD AND APPARATUS FOR SENSING BOUNDARY BETWEEN MATERIALS - A method and apparatus for sensing boundaries between materials are provided. The method for sensing boundaries between materials comprises the steps of: fixing sensing modules in place; transmitting and receiving radio frequency signals; and analyzing radio frequency signals. The method enables real-time detection of positions of the boundaries between materials and handling and monitoring of changes in the boundary positions. The apparatus for sensing boundaries between materials comprises at least two sensing modules, or a radio frequency transmitting unit and a plurality of radio frequency signals receiving unit, or a plurality of radio frequency transmitting unit and a radio frequency signals receiving unit. The radio frequency signals are transmitted, received and analyzed by the radio frequency transmitting unit and the radio frequency signals receiving unit to determine the boundary positions and changes therein. | 02-26-2015 |
Patent application number | Description | Published |
20090070108 | METHOD AND SYSTEM FOR IDENTIFYING SPEECH SOUND AND NON-SPEECH SOUND IN AN ENVIRONMENT - In a method and system for identifying speech sound and non-speech sound in an environment, a speech signal and other non-speech signals are identified from a mixed sound source having a plurality of channels. The method includes the following steps: (a) using a blind source separation (BSS) unit to separate the mixed sound source into a plurality of sound signals; (b) storing spectrum of each of the sound signals; (c) calculating spectrum fluctuation of each of the sound signals in accordance with stored past spectrum information and current spectrum information sent from the blind source separation unit; and (d) identifying one of the sound signals that has a largest spectrum fluctuation as the speech signal. | 03-12-2009 |
20090322559 | WARNING SOUND DIRECTION DETECTING APPARATUS - A direction detecting apparatus is adapted for installation on a vehicle, and includes a first sound collecting unit, a second sound collecting unit, an identifying unit, a direction estimating unit, and a notifying unit. The first and second sound collecting units collect sounds from roads. The identifying unit identifies the types of the sounds collected by the first and second sound collecting units. The direction estimating unit determines whether a warning sound comes from the front when the sound type identified by the identifying unit is a warning sound. The direction estimating unit estimates the direction of the warning sound when the warning sound comes from the front, and estimates a lane in which the warning sound is located when the warning sound comes from behind. The notifying unit is for providing notification of the estimation result of the direction estimating unit. | 12-31-2009 |
20100290633 | METHOD AND APPARATUS FOR AUTOMATIC NOISE COMPENSATION USED WITH AUDIO REPRODUCTION EQUIPMENT - A method and an apparatus for automatic noise compensation used with audio reproduction equipment are provided. The method comprises: (a) collecting a plurality of mixed audio signals, each mixed audio signal including equipment sound output by the audio reproduction equipment, and background noise; (b) removing the equipment sound from the mixed audio signals to obtain the background noise therein; (c) determining whether or not a plurality of mixed audio signals under inspection include a significant sound; and (d) adjusting the volume of the audio reproduction equipment according to whether or not a significant sound has been generated in the surrounding area and the magnitude of the background noise in the mixed audio signals under inspection to satisfy a plurality of predetermined compensation conditions. | 11-18-2010 |
Patent application number | Description | Published |
20100039145 | HYBRID DRIVING APPARATUS AND METHOD THEREOF - A hybrid driving apparatus and a method thereof are provided. The hybrid driving apparatus includes a first driving unit, a second driving unit, and a resistor. The first driving unit has a first output end. The second driving unit has a second output end coupled to a first bonding pad. The resistor is coupled between the first output end and the first bonding pad to serve as a matching impedance. When the driving apparatus operates in a first transmission mode, the first driving unit and the second driving unit jointly drive the first bonding pad. When the driving apparatus operates in a second transmission mode, the first driving unit and the second driving unit drive the first bonding pad and a second bonding pad respectively. | 02-18-2010 |
20120223736 | TRANSCEIVING CIRCUIT AND TRANSCEIVING CIRCUIT RESISTANCE CALIBRATION METHOD - A transceiving circuit resistance calibrating method, which is applied to a transceiving circuit. The method includes: inputting a first current to a transmitter to generate a first output voltage, wherein the first current is generated according to a ratio between a predetermined voltage and an inner resistor of a chip; inputting a second current to a transmitter to generate a second output voltage, wherein the first current is generated according to a ratio between the predetermined voltage and a predetermined resistor; and adjusting a first adjustable resistance module according to a difference between the first output voltage and the second output voltage. | 09-06-2012 |
20120229940 | INTEGRATED CIRCUIT HAVING ESD PROTECTION CAPABILITY - The present invention provides an integrated circuit having a better ESD protection capability and capable of reducing a circuit layout area. The integrated circuit comprises: an internal circuit, a first pad, and at least a first impedance matching unit. The first impedance matching unit is coupled between the internal circuit and the first pad, and the first impedance matching unit comprises: a first switch unit and a first resistance unit. The first switch unit is coupled to the internal circuit, and the first resistance unit is coupled between the first switch unit and the first pad, wherein the first resistance unit has a first terminal and a second terminal. The first terminal is directly electrically connected to the first pad and the second terminal is coupled to the first switch unit. | 09-13-2012 |
Patent application number | Description | Published |
20110282831 | DEVICE INCLUDING A VIRTUAL DRIVE SYSTEM - A device including a virtual drive system is provided. An image file can be identified as an ordinary physical disk drive via the device. The device includes a storage unit, an image management unit, and an operating-system interface. The storage unit is configured to store at least one image file. The image management unit includes an image management program which can manage the image files to be selected. The operating-system interface is connected by electrical signals with an operating-system apparatus and is controlled by the image management program to send a controlling signal to the operating-system apparatus. Therefore, the operating-system apparatus can identify as many physical disk drives as the corresponding selected image files. | 11-17-2011 |
20120102254 | Virtualized Peripheral Hardware Platform System - The present invention discloses a virtualized peripheral hardware platform system. The virtualized peripheral hardware platform system includes a first hardware platform and a software platform, which is executed in a second hardware platform. The first hardware platform is in signal communication with the second hardware platform. The software platform not only simulates the operation of the peripheral device of the first hardware platform but also simulates input signals of virtual peripheral devices and then transmits the input signals to the first hardware platform to conduct further calculations. Furthermore, the input/output (I/O) interface of the second hardware platform can be simulated as the I/O interface of the first hardware platform, so as to decrease the number of the I/O interface which the first hardware platform needed and downsize the first hardware platform. | 04-26-2012 |
20130100966 | SYSTEM FOR TRANSFERRING ELECTRIC POWER AND SIGNALS VIA POWER LINE BY TIME-DIVISION MULTIPLEXING - A system for transferring electric power and signals via a power line by time-division multiplexing includes a power line, electronic-circuit units, and controllers. The power line includes a first transmission line and a second transmission line. The first transmission line is connected with a first switch in series and is therefore divided into a source end and a loading end. The electronic-circuit units are connected in series between the loading end and the second transmission line. The controllers are electrically connected with and are configured for synchronously controlling the first switch and the electronic-circuit units. When the first switch is closed, electric power is transferred from an electric power source to the loading end, and when the first switch is opened, the electronic-circuit units transfer signals via the loading end. The system features simple circuitry and effectively reduces noise in signal transmission. | 04-25-2013 |
20130110465 | CHIP STRUCTURE HAVING HISTORY RECORDING UNIT | 05-02-2013 |
20140012483 | VEHICLE IDLE-SPEED WARNING SYSTEM AND IDLE-SPEED DETECTION METHOD - A vehicle idle-speed warning system and vehicle idle-speed detection method thereof are provided. It is non-invasive, that is, there is no need to change or modify any part of the constructing parts in the engine compartment. The present invention can be adopted stand-alone, or be applied to existing popular apparatuses, such as GPS, driving recorders, smart handheld devices, and vehicle electronic equipments. With the composing elements of a motion information module, an input module, an output module, a timer module and an information processing module, the present invention can accurately determine whether the vehicle under surveillance is in idle state and for how long it is in the idle state, and send an alarm signal automatically. With the implementation of the present invention, drivers can always be alarmed with the vehicle idling situations to prevent possible dangers or coming tickets due to the violation of traffic regulations in certain countries. | 01-09-2014 |
20140035815 | 3D POINTING DEVICE - A three-dimensional (3D) pointing device includes a housing, an inertial measurement unit, a data processing unit, a communication unit, and a power unit. The housing has a rough surface, and the inertial measurement unit is provided inside the housing and in contact with the housing. The inertial measurement unit includes a gyroscope and an accelerometer. The data processing unit is used to integrate data from the gyroscope and the accelerometer to generate an output data, so as for the communication unit to send out the output data. The power unit provides power to the 3D pointing device. The 3D pointing device enables the user to execute pointing control in a 3D space and allows the user to input commands by means of the rough surface. Thus, the 3D pointing device features both convenience of use and a small physical volume. | 02-06-2014 |