Patent application number | Description | Published |
20120015773 | Vehicle Power Switching Device - A power switching device includes a power transmission unit and a driving unit. The transmission unit includes a differential, an axle aligned with the differential, and a coupler sleeved movably on one of the differential and the axle. The driving unit includes a controller, a first transmission mechanism driven by the controller, and a second transmission mechanism driven by the first transmission mechanism. The controller is a solenoid or an electric actuator, and is operable to activate the second transmission mechanism. The coupler can be moved by the second transmission mechanism to interconnect the differential and the axle, so as to allow for co-rotation of the axle with the differential. | 01-19-2012 |
20120175887 | Vehicle Having Two Generators - A vehicle includes an engine having a crankshaft, a charging generator disposed on the crankshaft, a power-supplying generator driven by the engine and including a rotating shaft misaligned from the crankshaft, and a vehicle power generating apparatus. The power generating apparatus includes a clutch unit and a driving unit. The clutch unit includes a clutch disposed on the crankshaft, a driving gear disposed on the clutch, and a switching mechanism operable for driving the clutch. The motion transmitting unit includes a driven gear meshing with the driving gear, and an input shaft driven by the driven gear and connected to and co-rotatable with the rotating shaft of the power-supplying generator. | 07-12-2012 |
20130104832 | VEHICLE AIR INTAKE MECHANISM | 05-02-2013 |
20130125860 | CONTROL STRUCTURE OF ENGINE THROTTLE VALVE - A control structure is provided for a throttle valve of engine. The throttle valve includes a throttle plate arranged inside the valve body and mounted to a control shaft having an end extending outside the valve body and received in a control seat mounted outside the valve body and having a shaft hole seat, a constraint block, a coupling hole seat, and a cable outlet section. A control assembly includes a return spring and a control rocker arm that includes a connection section forming a connection hole to be fit over the control shaft and a cable connection section, a positioning section, and a push section. The control motor is mounted to the coupling hole seat of the control seat and has a driving rod having a front tip section positioned against the push section of the control rocker arm. The control seat lid is secured to the control seat. | 05-23-2013 |
20130309955 | COOLING AIR INTAKE DEVICE FOR VEHICLE - A cooling air intake device is mounted to a frame of a vehicle and includes a base plate and an intake box. The intake box is mounted on the base plate that includes a first admission section and a blocking section adjacent to the first admission section. The intake box includes a first intake compartment and a second intake compartment. The first intake compartment corresponds to the first admission section of the base plate. The first intake compartment includes a first baffle plate mounted therein. The first intake compartment has a side wall in which a first discharge section is formed. The second intake compartment is arranged above the first intake compartment in such a way that a second baffle plate is arranged between the first intake compartment and the second intake compartment. The second intake compartment includes a second admission section and a second discharge section. | 11-21-2013 |
20150065284 | VEHICLE POWER SWITCHING DEVICE - A power switching device includes a power transmission unit and a driving unit. The transmission unit includes a differential, an axle aligned with the differential, and a coupler sleeved movably on one of the differential and the axle. The driving unit includes a controller, a first transmission mechanism driven by the controller, and a second transmission mechanism driven by the first transmission mechanism. The controller is a solenoid or an electric actuator, and is operable to activate the second transmission mechanism. The coupler can be moved by the second transmission mechanism to interconnect the differential and the axle, so as to allow for co-rotation of the axle with the differential. | 03-05-2015 |
Patent application number | Description | Published |
20090054516 | COMPOSITION FOR TREATING CANCER CELLS AND SYNTHETIC METHOD FOR THE SAME - A pharmaceutical composition having a cytotoxic effect to a cancer cell and a method for the same are provided. The pharmaceutical composition comprises a flavonoid compound having at least one of the following formulas: | 02-26-2009 |
20090088412 | COMPOSITION FOR TREATING CANCER CELLS AND PREPARATION METHOD THEREOF - A composition for treating cancer cells and a preparation method therefore is provided. The composition includes novel withanolide compounds derived from a Solanaceae plant, which the novel withanolide compounds have the cytotoxicity to the cancer cells. | 04-02-2009 |
20090221696 | COMPOSITION FOR TREATING CANCER CELLS AND PREPARATION METHOD FOR THE SAME - A composition for treating cancer cells and a preparation method therefor are provided. The novel flavonoid compounds are obtained from natural plants, and more particularly the compounds have a cytotoxicity on cancer cells. | 09-03-2009 |
20100056812 | COMPOSITION FOR TREATING CANCER CELLS AND PREPARATION METHOD FOR THE SAME - A composition for treating cancer cells and a preparation method therefor are provided. The novel flavonoid compounds are obtained from natural plants, and more particularly the compounds have a cytotoxicity on cancer cells. | 03-04-2010 |
20100062078 | PHARMACEUTICAL COMPOSITION FOR TREATING CANCER AND THE SIGNALING PATHWAY THEREOF - A pharmaceutical composition, composed of protoapigenone (formula I), for treating gynecological cancers, prostate cancer, urinary bladder cancer and hepatocarcinoma is provided. Protoapigenone has cytotoxicity on these cancers, and arrests the cell cycle at S and G2/M phases. In addition, protoapigenone regulates cell signaling pathways, such as caspase-3, PARP, p-38 MAPK and JNK½, to induce apoptosis. Protoapigenone significantly inhibits the xenograft tumor growth on nude mice, without major side effects. Co-treatment o protoapigenone of protoapigenone and cisplatin shows synergistic cytotoxicity of MDAH-2774 ovarian cancer cells. | 03-11-2010 |
20100081832 | COMPOSITION FOR TREATING CANCER CELLS AND PREPARATION METHOD FOR THE SAME - A composition for treating cancer cells and a preparation method therefor are provided. The novel flavonoid compounds are obtained from natural plants, and more particularly the compounds have a cytotoxicity on cancer cells. | 04-01-2010 |
20100210869 | ETHANOL EXTRACT OF ANTRODIA CAMPHORATA FOR INDUCING APOPTOSIS AND PREPARATION METHOD THEREOF - A preparation method for an ethanol extract of the fruiting body of | 08-19-2010 |
20100227404 | WATER EXTRACT OF ANTRODIA CAMPHORATA FOR IMMUNOSTIMULATORY EFFECT AND PREPARATION METHOD THEREOF - A preparation method for a water extract of the fruiting body of | 09-09-2010 |
20110159127 | EXTRACT OF TOONA SINENSIS FROM SUPERCRITICAL FLUID EXTRACTION FOR TREATING DIABETES AND METABOLIC DISEASES, THE PREPARATION METHOD AND THE USE THEREOF | 06-30-2011 |
20110196029 | COMPOSITION FOR TREATING INFLUENZA A (H1N1) VIRUS AND A PREPARATION METHOD THEREFOR - New pharmaceutical compositions extracted from | 08-11-2011 |
20120141524 | ETHANOL EXTRACT OF ANTRODIA CAMPHORATA FOR INDUCING APOPTOSIS AND PREPARATION METHOD THEREOF - A preparation method for an ethanol extract of the fruiting body of | 06-07-2012 |
20120178945 | BENZENOID COMPOUNDS OF ANTRODIA CINNAMOMEA, PREPARATION AND ANALYSIS METHOD THEREOF - Disclosed are a method for preparing an n-hexane extract of the fruiting body of | 07-12-2012 |
20120190871 | TRITERPENOID COMPOSITION OF ANTRODIA CINNAMOMEA, PREPARATION AND ANALYSIS METHOD THEREOF - Disclosed are the isolation, purification and analysis of the triterpenoid compositions (including ergostane and lanostane) in the fruiting body of | 07-26-2012 |
20120321566 | INHIBITION OF BIOFILM FORMATION BY 1,2,3,4,6-PENTA-O-GALLOYL-D-GLUCOPYRANOSE - Disclosed herein are an anti-biofilm composition and a method to inhibit or prevent cell adhesion and/or biofilm formation by a microorganism, in which use of 1,2,3,4,6-penta-O-galloyl-D-glucopyranose (PGG) is involved therein. | 12-20-2012 |
20130000389 | CHEMICAL PROFILE OF DETECTING BIOACTIVE COMPONENTS OF QUINONES, STILBENES, FLAVONES AND ALKALOIDS - Disclosed are a method for analyzing chemical profiles of components from a herbal medicine product. Components may include quinone (including rhein, sennoside A and/or aloe-emodin), stilbene containing resveratroloside, flavone including baicalin, and/or alkaloid including berberine and/or palmatine. The method includes steps of: (a) respectively chromatographing a methanol extract of product and standard(s) corresponding to the component(s) using HPLC; (b) comparing HPLC chromatogram of extract and standard(s); and (c) analyzing the chemical profiles of the product from the comparison results. | 01-03-2013 |
20130040996 | COMPOSITION FOR TREATING ATHEROSCLEROSIS AND A PREPARATION METHOD THEREOF - Disclosed are a composition for preventing and treating atherosclerosis which includes chalcone compound. In particular, the chalcone compound bound with 2-hydroxyl in ring A and 4′-methyoxy in ring B has versatile therapeutic potentials on anti-atherosclerosis by acting as PPARγ inducer, p44/42 MAPK inhibitor and cell cycle blocker and does not show toxicity to human aortic smooth muscle cells (HASMCs). In addition, the chalcone compound exhibits synergistic effect with the PPARγ ligand (rosiglitazone) to inhibit cell proliferation and the upregulation of cyclin D1, cyclin D3, interleukin-1β (IL-1β) and interleukin-6 (IL-6) induced by oxidized low density lipoprotein (Ox-LDL). | 02-14-2013 |
20130245114 | COMPOSITION FOR TREATING INFLUENZA A (H1N1) VIRUS AND A PREPARATION METHOD THEREFOR - New pharmaceutical compositions extracted from | 09-19-2013 |
20140194474 | COMPOSITION FOR TREATING ATHEROSCLEROSIS AND A PREPARATION METHOD THEREOF - Disclosed are a composition for preventing and treating atherosclerosis which includes chalcone compound. In particular, the chalcone compound bound with 2-hydroxyl in ring A and 4′-methyoxy in ring B has versatile therapeutic potentials on anti-atherosclerosis by acting as PPARγ inducer, p44/42 MAPK inhibitor and cell cycle blocker and does not show toxicity to human aortic smooth muscle cells (HASMCs). In addition, the chalcone compound exhibits synergistic effect with the PPARγ ligand (rosiglitazone) to inhibit cell proliferation and the upregulation of cyclin D1, cyclin D3, interleukin-1β (IL-1β) and interleukin-6 (IL-6) induced by oxidized low density lipoprotein (Ox-LDL). | 07-10-2014 |
20140221470 | COMPOUND FOR INHIBITING GLUTATHIONE S-TRANSFERASE OMEGA 1 ACTIVITY, PHARMACEUTICAL COMPOSITION CONTAINING THEREOF, AND METHOD FOR SYNTHESIZING THE SAME - A compound for inhibiting activity of glutathione s-transferase omega 1 is provided and is represented by the following Formula 1: | 08-07-2014 |
20140350304 | COMPOSITION FOR TREATING DIABETES AND METABOLIC DISEASES AND A PREPARATION METHOD THEREOF - Disclosed is a chalcone composition for treating diabetes and metabolic syndromes. In particular, the chalcone compound bound with 2-halogen in ring A significantly decreases the blood glucose level in the in vitro anti-diabetic effect experiment. In the in vivo animal model, the leading chalcone compound can prevent the progression of diabetes and control the blood glucose level, and there is no significant difference in the gains in body weight. Throughout the seven-week administration, there are no hepatic or renal toxicity observed. | 11-27-2014 |
Patent application number | Description | Published |
20100139757 | PHOTOVOLTAIC CELL STRUCTURE - A photovoltaic cell structure includes a substrate, a metal layer, a high resistivity layer, a p-type semiconductor layer, an n-type semiconductor layer and a transparent conductive layer. The metal layer may include molybdenum and be formed on the substrate to be a back contact metal layer of the cell. The high resistivity layer (e.g., V | 06-10-2010 |
20100139758 | PHOTOVOLTAIC CELL STRUCTURE AND MANUFACTURING METHOD THEREOF - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer and a transparent conductive layer. The substrate has a rough surface. The metal layer may include molybdenum and be formed on the rough surface. The p-type semiconductor layer is formed on the metal layer and may include CIGSS, CIGS, CIS, or compound of two or more of copper, selenium, sulfur. The n-type semiconductor layer is formed on the p-type semiconductor layer thereby forming a rough p-n junction surface. The n-type semiconductor layer may include CdS. The transparent conductive layer is formed on the n-type semiconductor layer. In an embodiment, the roughness Ra of the rough surface is between 0.01 to 100 μm. | 06-10-2010 |
20100243044 | PHOTOVOLTAIC CELL STRUCTURE - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a transparent conductive layer and a high resistivity layer. The metal layer is formed on the substrate. The p-type semiconductor layer is formed on the metal layer and may include a compound of copper indium gallium selenium sulfur (CIGSS), copper indium gallium selenium (CIGS), copper indium sulfur (CIS), copper indium selenium (CIS) or a compound of at least two of copper, selenium or sulfur. The n-type semiconductor layer exhibits photo catalyst behavior that can increase carrier mobility by receiving light, and is formed on the p-type semiconductor layer, thereby forming a p-n junction. The transparent conductive layer is formed on the n-type semiconductor layer. The high resistivity layer is formed between the metal layer and the transparent conductive layer. | 09-30-2010 |
20100258167 | PHOTOVOLTAIC CELL STRUCTURE AND MANUFACTURING METHOD - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a high resistivity layer, an assistant electrode layer, and a transparent conductive layer. The metal layer is formed on the substrate, and comprises a plurality of p-type electrode units separated from each other. The p-type semiconductor layer is formed on the metal layer. The n-type semiconductor is formed on the p-type semiconductor layer, thereby forming a p-n junction. The high resistivity layer is formed on the n-type semiconductor layer. The assistant electrode layer is formed on the high resistivity layer and the p-type electrode units. The transparent conductive layer is formed on the assistant electrode layer, the high resistivity layer and the p-type electrode units. Accordingly, at least one cell is formed on each of the p-type electrode units. The assistant electrode layer and the transparent conductive layer are connected to the cells in series. | 10-14-2010 |
20110297225 | PHOTOVOLTAIC CELL STRUCTURE - A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a transparent conductive layer and a high resistivity layer. The metal layer is formed on the substrate. The p-type semiconductor layer is formed on the metal layer and may include a compound of copper indium gallium selenium sulfur (CIGSS), copper indium gallium selenium (CIGS), copper indium sulfur (CIS), copper indium selenium (CIS) or a compound of at least two of copper, selenium or sulfur. The n-type semiconductor layer exhibits photo catalyst behavior that can increase carrier mobility by receiving light, and is formed on the p-type semiconductor layer, thereby forming a p-n junction. The transparent conductive layer is formed on the n-type semiconductor layer. The high resistivity layer is formed between the metal layer and the transparent conductive layer. | 12-08-2011 |
Patent application number | Description | Published |
20090051048 | Package structure and manufacturing method thereof - A package structure and a manufacturing method thereof are provided. The package structure includes a carrier, a chip-bonding structure and a chip. The chip-bonding structure is formed on a first surface of the carrier. The chip-bonding structure includes a cavity, a dam, several via holes and several solder bumps. The solder bumps are received in the via holes and are correspond to the first connecting pads located on the carrier. The chip is embedded in the cavity of the chip-bonding structure. An active surface of the chip is tightly pasted on the first surface of the chip-bonding structure, and the first solder pads form electrical contact with the corresponding solder bumps. The chip of the package structure is precisely disposed on the carrier, not only simplifying the manufacturing process but also forming stable electrical connection between the chip and the carrier of the package structure. | 02-26-2009 |
20090175312 | BONDING STRENGTH MEASURING DEVICE - A bonding strength measuring device for measuring the bonding strength between a substrate and a molding compound disposed on the substrate is provided. The measuring device includes a heating platform, a heating slide plate, and a fixing bracket. The heating platform has a first heating area and a first replaceable fixture. The substrate is disposed on the first heating area, and the first replaceable fixture is used to fix the substrate and has an opening exposing the molding compound. The heating slide plate has a second heating area and a second replaceable fixture. The second heating area is used to heat the molding compound, and the second replaceable fixture has a cavity for accommodating the molding compound. The fixing bracket is used to fix the heating slide plate above the heating platform. | 07-09-2009 |
20090230526 | ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING A PROTECTIVE LAYER TO ENHANCE SURFACE MOUNTING AND MANUFACTURING METHODS THEREOF - A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, multiple leads, a chip, a package body, and a protective layer. The die pad includes an upper sloped portion, a lower sloped portion, and a peripheral edge region defining a cavity with a cavity bottom. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body. The protective layer substantially covers the lower sloped portion and the lower surface of at least one lead. | 09-17-2009 |
20100007004 | WAFER AND SEMICONDUCTOR PACKAGE - A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad. | 01-14-2010 |
20100007009 | SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE - A copper bonding wire includes a line portion and a non-spherical block portion. The non-spherical block portion is physically connected to the line portion, and the cross-sectional area of the non-spherical block portion is bigger than that of the line portion. | 01-14-2010 |
20100007010 | SEMICONDUCTOR PACKAGE, METHOD FOR ENHANCING THE BOND OF A BONDING WIRE, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE - A wire bonding structure of a semiconductor package includes a bonding wire, a pad and a non-conductive adhesive material. The bonding wire includes a line portion and a block portion, wherein the block portion is physically connected to the line portion, and the sectional area of the block portion is bigger than that of the line portion. The pad is bonded to the block portion. The non-conductive adhesive material covers the pad and seals the whole block portion of the bonding wire. | 01-14-2010 |
20100007011 | SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING A SEMICONDUCTOR PACKAGE - A wire bonding structure includes a chip and a bonding wire. The chip includes a base material, at least one first metallic pad, a re-distribution layer and at least one second metallic pad. The first metallic pad is disposed on the base material. The re-distribution layer has a first end and a second end, and the first end is electrically connected to the first metallic pad. The second metallic pad is electrically connected to the second end of the re-distribution layer. The bonding wire is bonded to the second metallic pad. | 01-14-2010 |
20110156243 | SEMICONDUCTOR PACKAGE - A semiconductor package is provided. The semiconductor package includes an organic substrate, a stiffness layer, and a chip subassembly. The stiffness layer is formed on the organic substrate. The chip subassembly is disposed on the stiffness layer. The chip subassembly includes at least a first chip, a second chip, and a third chip. The second chip is disposed between the first chip and the third chip in a stacked orientation. The first chip, the second chip, and the third chip have the function of proximity communication. | 06-30-2011 |
20110156739 | TEST KIT FOR TESTING A CHIP SUBASSEMBLY AND A TESTING METHOD BY USING THE SAME - A test kit for testing a chip subassembly and a testing method by using the same is provided. The chip subassembly includes at least two stacked chips each having a number of electric contacts is provided. The test kit includes a test socket and a test plate. The test socket is configured to electrically engage the electric contacts on a first side of the chip subassembly. The test plate has at least a number of first probes configured for electrically engaging the electric contacts on a second side of the chip subassembly. At least one of the test socket and the test plate has a number of second probes for electrically connecting the test socket and the test plate. | 06-30-2011 |
20110227212 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a first substrate, a second substrate, two active chips, a bridge chip and a connection structure. The first substrate has a first surface facing a second surface of the second substrate. The active chips are disposed on and electrically connected to the first surface, and spaced apart from each other by an interval, wherein the active chips respectively have a first active surface. The bridge chip is mechanically and electrically connected to the second surface, and has a second active surface partially overlapped with the first active surfaces of the active chips, such that the bridge chip is used for providing a proximity communication between the active chips. The connection structure is disposed between the first surface and the second surface for combining the first substrate and the second substrate. | 09-22-2011 |
20110233749 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively. | 09-29-2011 |
20110233764 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a substrate, a buffer structure, two active chips and a bridge chip. The substrate has a cavity, a first surface and a second surface opposite to the first surface. The cavity is extended from the first surface toward the second surface, and the buffer structure is disposed in the cavity. The active chips are mechanically disposed on and electrically connected to the first surface and around the cavity, wherein the active chips both have a first active surface. The bridge chip is disposed in the cavity and above the buffer structure, wherein the bridge chip has a second active surface, the second active surface faces the first active surfaces and is partially overlapped with the first active surfaces, the bridge chip is used for providing a proximity communication between the active chips. | 09-29-2011 |
20120119342 | ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads are designed to possess incurved sidewalls for enhancing the adhesion between the inner leads and the surrounding molding compound. | 05-17-2012 |
20140254181 | LIGHT EMITTING PACKAGE AND LED BULB - A light emitting package includes a metal plate, a plurality of LED chips, a plurality of leads and a molding compound. The metal plate has a first surface and a second surface, and is bent into two chip mounting portions, wherein an inclination angle is between the chip mounting portions. The LED chips are mounted on the first surface and the second surface of the chip mounting portions. The leads are disposed adjacent to the metal plate and electrically connected to the LED chips. The molding compound encapsulates the LED chips and a part of the lead. | 09-11-2014 |
Patent application number | Description | Published |
20110306775 | SYNTHESIS AND BIOLOGICAL EVALUATION OF 2',5'-DIMETHOXYCHALCONE DERIVATIVES AS MICROTUBULE-TARGETED ANTICANCER AGENTS - Disclosed are a serious of 2′,5′-dimethoxychalcone derivatives for treating cancer, wherein 2,5-dimethoxyacetophenone and methyl 4-formylbenzoate are condensed to form 4-carboxyl-2′,5′-dimethoxychalcone (compound 1), which is further reacted with alkyl halides or amines to synthesize the chalcone derivatives of compounds 2-17. In addition, 2,5-dimethoxyacetophenone is reacted with 5-formyl-2-thiophenecarboxylic acid to form compound 18 (3-(3-thiophene)carboxyl-1-(2,5-dimethoxyphenyl)prop-2-en-1-one). The synthesized 2′,5′-dimethoxychalcone derivatives can be acted as microtubule-targeted tubulin-polymerizing agents. | 12-15-2011 |
20120196290 | METHOD FOR DIAGNOSING SPINAL MUSCULAR ATROPHY - A method for diagnosing spinal muscular atrophy is provided. The method includes providing a biological sample of a subject containing a nucleotide of SMN gene, amplifying SMN exons 1, 2a, 2b, 3, 4, 5, 6, 7, and 8 by a universal multiplex PCR using the nucleotide as a template and the primers to obtain fragments of the SMN exons 1, 2a, 2b, 3, 4, 5, 6, 7, and 8, labeling the fragments of the SMN exons 1, 2a, 2b, 3, 4, 5, 6, 7, and 8 by a fluorescent primer to obtain fluorescence-labeled exon fragments, and analyzing the fluorescence-labeled exon fragments by a capillary electrophoresis under a optimized separation condition. If the SMN1/SMN2 ratios in exon 7 and 8 are different, it indicates that the subject is susceptible to spinal muscular atrophy. Additionally, if the peak of certain exon fragment appears crossed, it indicates an intragenic mutation in the exon. | 08-02-2012 |
20120214860 | METHOD OF REGULATING THE EXPRESSION LEVEL OF SURVIVAL OF MOTOR NEURON 1 (SMN1) AND DETECTING ENZYME ACTIVITY OF UBIQUITIN CARBOXYL-TERMINAL HYDROLASE L1 (UCHL1) - The present invention relates to a method of regulating the expression level of survival of motor neuron 1 (SMN1) comprising administering to a subject in need thereof a therapeutically effective amount of ubiquitin carboxyl-terminal hydrolase L1 (UCHL1) regulator and a pharmaceutically acceptable carrier. The present invention also relates to a method of detecting enzyme activity of ubiquitin carboxyl-terminal hydrolase L1 (UCHL1) in human fibroblasts comprising detecting protein expression level of survival of motor neuron 1 (SMN1). | 08-23-2012 |
20130067605 | hnRNP A1 KNOCKOUT ANIMAL MODEL AND USE THEREOF - A nucleic acid construct comprising a genetic engineered heterogeneous nuclear ribonucleoprotein (hnRNP) A1 gene is provided. A transgenic mouse in which the expression of hnRNP A1 gene has been disrupted is also provided. The mouse is useful for studying the role of hnRNP A1 gene in normal and disease states of a neurodegenerative disease or a cancer for developing therapies to treat any of these diseases. Therefore, a method of screening a compound for potential use in prevention and/or treatment of neurodegenerative disease or cancer is further provided. | 03-14-2013 |
20140123329 | hnRNP A1 KNOCKOUT ANIMAL MODEL AND USE THEREOF - A nucleic acid construct comprising a genetic engineered heterogeneous nuclear ribonucleoprotein (hnRNP) A1 gene is provided. A transgenic mouse in which the expression of hnRNP A1 gene has been disrupted is also provided. The mouse is useful for studying the role of hnRNP A1 gene in normal and disease states of a developmental disorder and muscular diseases. Therefore, a method of screening a compound for potential use in prevention and/or treatment of developmental disorder and muscular diseases is further provided. | 05-01-2014 |
Patent application number | Description | Published |
20120086126 | PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF - A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening. | 04-12-2012 |
20120086127 | PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF - A package system includes a first substrate. A second substrate is electrically coupled with the first substrate. At least one electrical bonding material is disposed between the first substrate and the second substrate. The at least one electrical bonding material includes a eutectic bonding material. The eutectic bonding material includes a metallic material and a semiconductor material. The metallic material is disposed adjacent to a surface of the first substrate. The metallic material includes a first pad and at least one first guard ring around the first pad. | 04-12-2012 |
20120223613 | ELECTRICAL BYPASS STRUCTURE FOR MEMS DEVICE - An apparatus including a bypass structure for complementary metal-oxide-semiconductor (CMOS) and/or microelectromechanical system (MEMS) devices, and method for fabricating such apparatus, is disclosed. An exemplary apparatus includes a first substrate; a second substrate that includes a MEMS device; an insulator disposed between the first substrate and the second substrate; and an electrical bypass structure disposed in the insulator layer that contacts a portion of the first substrate, wherein the electrical bypass structure is electrically isolated from the MEMS device in the second substrate and any device included in the first substrate. | 09-06-2012 |
20120261830 | MEMS DEVICE ETCH STOP - The present disclosure provides a micro-electro-mechanical systems (MEMS) device and a method for fabricating such a device. In an embodiment, a MEMS device includes a substrate, a dielectric layer above the substrate, an etch stop layer above the dielectric layer, and two anchor plugs above the dielectric layer, the two anchor plugs each contacting the etch stop layer or a top metal layer disposed above the dielectric layer. The device further comprises a MEMS structure layer disposed above a cavity formed between the two anchor plugs and above the etch stop layer from release of a sacrificial layer. | 10-18-2012 |
20120313235 | Semiconductor Devices With Moving Members and Methods for Making the Same - The present disclosure provides an embodiment of a micro-electro-mechanical system (MEMS) structure, the MEMS structure comprising a MEMS substrate; a first and second conductive plugs of a semiconductor material disposed on the MEMS substrate, wherein the first conductive plug is configured for electrical interconnection and the second conductive plug is configured as an anti-stiction bump; a MEMS device configured on the MEMS substrate and electrically coupled with the first conductive plug; and a cap substrate bonded to the MEMS substrate such that the MEMS device is enclosed therebetween. | 12-13-2012 |
20130015743 | MEMS Structure And Method Of Forming Same - A microelectromechanical system (MEMS) device that reduces or eliminates stiction includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. A protrusion extends from the substrate and is configured to contact the movable element when the moving element moves in the at least one degree of freedom. The protrusion comprises a surface having a low surface energy relative a silicon oxide surface. The protrusion may be coupled to a voltage potential node to avoid or counteract electrostatic forces. | 01-17-2013 |
20130140653 | MEMS DEVICE ETCH STOP - The present disclosure provides a micro-electro-mechanical systems (MEMS) device and a method for fabricating such a device. In an embodiment, a MEMS device includes a substrate, a dielectric layer above the substrate, an etch stop layer above the dielectric layer, and two anchor plugs above the dielectric layer, the two anchor plugs each contacting the etch stop layer or a top metal layer disposed above the dielectric layer. The device further comprises a MEMS structure layer disposed above a cavity formed between the two anchor plugs and above the etch stop layer from release of a sacrificial layer. | 06-06-2013 |
20130181355 | Support Structure for TSV in MEMS Structure - An embodiment is a method for forming a microelectromechanical system (MEMS) device. The method comprises forming a MEMS structure over a first substrate, wherein the MEMS structures comprises a movable element; forming a bonding structure over the first substrate; and forming a support structure over the first substrate, wherein the support structure protrudes from the bonding structure. The method further comprises bonding the MEMS structure to a second substrate; and forming a through substrate via (TSV) on a backside of the second substrate, wherein the overlying TSV is aligned with the bonding structure and the support structure. | 07-18-2013 |
20130193527 | MICRO-ELECTRO MECHANICAL SYSTEM (MEMS) STRUCTURES WITH THROUGH SUBSTRATE VIAS AND METHODS OF FORMING THE SAME - The present disclosure includes micro-electro mechanical system (MEMS) structures and methods of forming the same. Substrates of the MEMS structures are bonded together by fusion bonding at high processing temperatures, which enables more complete removal of chemical species from the dielectric materials in the substrates prior to sealing cavities of the MEMS structures. Fusion bonding of MEMS structures reduces outgassing of chemical species and is compatible with the cavity formation process. The MEMS structures bonded by fusion bonding are mechanically stronger compared to eutectic bonding due to a higher bonding ratio. In addition, fusion bonding enables the formation of through substrate vias (TSVs) in the MEMS structures. | 08-01-2013 |
20140035158 | Integrated Semiconductor Device and Wafer Level Method of Fabricating the Same - The present disclosure provides one embodiment of a stacked semiconductor device. The stacked semiconductor device includes a first substrate; a first bond pad over the first substrate; a second substrate including a second electrical device fabricated thereon; a second bond pad over the second electrical device over the second substrate, the second bond pad electrically connecting to the second electrical device; a second insulation layer over the second bond pad having a top surface, the second insulation layer being bonded toward the first bond pad of the first substrate; and a through-substrate-via (“TSV”) extending from a surface opposite to the first bond pad through the first substrate and through the top surface of the second insulation layer to the second bond pad. | 02-06-2014 |
20140117510 | Semiconductor Bonding Structure and Process - A system and method for bonding semiconductor devices is provided. An embodiment comprises halting the flow of a eutectic bonding material by providing additional material of one of the reactants in a grid pattern, such that, as the eutectic material flows into the additional material, the additional material will change the composition of the flowing eutectic material and solidify the material, thereby stopping the flow. Other embodiments provide for additional layouts to put the additional material into the path of the flowing eutectic material. | 05-01-2014 |
20140131818 | Method for the Prevention of Suspended Silicon Structure Etching During Reactive Ion Etching - The present disclosure is directed to a device and its method of manufacture in which a protective region is formed below a suspended body. The protective region allows deep reactive ion etching of a bulk silicon body to form a MEMS device without encountering the various problems presented by damage to the silicon caused by backscattering of oxide during overetching periods of DRIE processes. | 05-15-2014 |
20140170849 | PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF - A method of forming a package system includes providing a first substrate having a metallic pad and at least one metallic guard ring. The method further includes bonding the metallic pad of the first substrate with a semiconductor pad of a second substrate, wherein the at least one metallic guard ring is configured to at least partially interact with the semiconductor pad to form at least a first portion of an electrical bonding material between the first and second substrates. | 06-19-2014 |
20140183611 | METHOD TO INTEGRATE DIFFERENT FUNCTION DEVICES FABRICATED BY DIFFERENT PROCESS TECHNOLOGIES - The present disclosure is directed to an apparatus and method for manufacture thereof. The apparatus includes a first passive substrate bonded to a second active substrate by a conductive metal interface. The conductive metal interface allows for integration of different function devices at a wafer level. | 07-03-2014 |
20140264644 | MEMS Method and Structure - MEMS structures and methods utilizing a locker film are provided. In an embodiment a locker film is utilized to hold and support a moveable mass region during the release of the moveable mass region from a surrounding substrate. By providing additional support during the release of the moveable mass, the locker film can reduce the amount of undesired movement that can occur during the release of the moveable mass, and preventing undesired etching of the sidewalls of the moveable mass. | 09-18-2014 |
20140322894 | Method for Handling a Thin Substrate and for Substrate Capping - An embodiment is a method for bonding. The method comprises bonding a handle substrate to a capping substrate; thinning the capping substrate; etching the capping substrate; and after the thinning and the etching the capping substrate, bonding the capping substrate to an active substrate. The handle substrate has an opening therethrough. The method also comprises removing the handle substrate from the capping substrate. The removing comprises providing an etchant through the opening to separate the handle substrate from the capping substrate. Other embodiments further include forming a bonding material on a surface of at least one of the handle substrate and the capping substrate such that the capping substrate is bonded to the handle substrate by the bonding material. The bonding material may be removed by using a dry etching to remove the handle substrate from the capping substrate. | 10-30-2014 |
20140361412 | Cavity Structure Using Patterned Sacrificial Layer - A method includes forming a sacrificial layer over a bottom substrate. The sacrificial layer is patterned based on a desired etching distance. A top layer is formed over the sacrificial layer. At least one release hole is formed through the top layer. The sacrificial layer is etched through the at least one release hole. | 12-11-2014 |
20140374885 | NARROW GAP DEVICE WITH PARALLEL RELEASING STRUCTURE - The present disclosure relates to a method of etching a narrow gap using one or more parallel releasing structures to improve etching performance, and an associated apparatus. In some embodiments, the method provides a semiconductor substrate with a narrow gap having a sacrificial material. One or more parallel releasing structures are formed within the semiconductor substrate at positions that abut the narrow gap. An etching process is then performed to simultaneously remove the sacrificial material from the narrow gap along a first direction from the one or more parallel releasing structures and along a second direction, perpendicular to the first direction. By simultaneously etching the sacrificial material from both the direction of the narrow gap and from the direction of the one or more parallel releasing structures, the sacrificial material is removed in less time, since the etch is not limited by a size of the narrow gap. | 12-25-2014 |
20150054161 | Semiconductor Bonding Structure and Process - A system and method for bonding semiconductor devices is provided. An embodiment comprises halting the flow of a eutectic bonding material by providing additional material of one of the reactants in a grid pattern, such that, as the eutectic material flows into the additional material, the additional material will change the composition of the flowing eutectic material and solidify the material, thereby stopping the flow. Other embodiments provide for additional layouts to put the additional material into the path of the flowing eutectic material. | 02-26-2015 |
20150061046 | WAFER LEVEL METHOD OF SEALING DIFFERENT PRESSURE LEVELS FOR MEMS SENSORS - The present disclosure relates to a method of forming a plurality of MEMs device having a plurality of chambers with different pressures on a substrate, and an associated apparatus. In some embodiments, the method is performed by providing a device wafer having a plurality of microelectromechanical system (MEMs) devices. A cap wafer is bonded onto the device wafer in a first ambient environment having a first pressure. The bonding forms a plurality of chambers abutting the plurality of MEMs devices, which are held at the first pressure. One or more openings are formed in one or more of the plurality of chambers. The one or more openings in the one or more of the plurality of chambers are then sealed in a different ambient environment having a different pressure, thereby causing the one or more of the plurality of chambers to be held at the different pressure. | 03-05-2015 |
20150076710 | INTEGRATED SEMICONDUCTOR DEVICE AND WAFER LEVEL METHOD OF FABRICATING THE SAME - The present disclosure provides one embodiment of a stacked semiconductor device. The stacked semiconductor device includes a first substrate; a first bond pad over the first substrate; a second substrate including a second electrical device fabricated thereon; a second bond pad over the second electrical device over the second substrate, the second bond pad electrically connecting to the second electrical device; a second insulation layer over the second bond pad having a top surface, the second insulation layer being bonded toward the first bond pad of the first substrate; and a through-substrate-via (“TSV”) extending from a surface opposite to the first bond pad through the first substrate and through the top surface of the second insulation layer to the second bond pad. | 03-19-2015 |
Patent application number | Description | Published |
20110029721 | Cascaded combination structure of flash disks to create security function - Disclosed is a cascaded combination structure of flash disks to create security function, comprising of a plurality of data disks and a key disk. Each of the data disks includes a public zone and a private zone matched with the key disk. When the key disk is series-connected with the data disks, the private zone can be displayed and load/save by a public program in the key disk. Accordingly, there can be secured and hid the data in the private zone so that the data in the private zone is unable to be embezzled by other illegal users. | 02-03-2011 |
20110202625 | Storage device, system and method for data share - The present invention is one storage device for data share which comprises a device body with a USB communications interface unit, a memory unit, and a control unit wherein the memory unit has an executive file/program comprising a group management module used to manage a group/peer list and the group list has at least a group ID and a peer ID. Accordingly, the storage devices with the same group ID can be referred to as “peers” inside the group and mutually share files saved in respective storage devices when at least two storage devices with the same group ID are separately plugged onto computers and complete login on the central server via Internets. | 08-18-2011 |
20110296207 | Combinative encryption flash disk - A combinative encryption flash disk with two data disks and an encryption system at least for digital data encrypted and accessed via an operating system is characteristic of (1) Function of keeping digital data secret and safe; (2) Consumer's reduced cost and a specific plug-in sequence for a promoted secrecy function by two cascaded data disks at least plugged into a single port; (3) Plain interface and simple operation in favor of one user configuring and operating. | 12-01-2011 |
20120011372 | Encryption flash disk - An encryption flash disk comprises a memory module, an encryption system, and a switch device wherein the memory module has a substrate accommodating an inner surface provided with a memory chip as well as a control device at least and a plurality of metal contacts; the encryption system is installed in the memory chip electrically connected to the control device and comprises a public zone and a private zone at least and a public program wherein the public program has a password configure module used to configure, input, and clear a password; the switch device is electrically connected to the memory module's control device. Accordingly, the encryption flash disk is capable of keeping digital data secret and safe. | 01-12-2012 |
20120026672 | Folding Structure - The present invention relates to a folding structure comprising a storage device with an electronic component at least and a plurality of metal contacts and is configured with electronic component(s), metal contacts, and a plug board or a folding kit to embody the present invention's space effectively used and saved, match the present product's design requirements for lightness, thinness, shortness, and smallness, and integrate with other relevant products to become a combinational product with both multiple functions and its shape advantageous to lightness, thinness, shortness, and smallness. | 02-02-2012 |
20120057309 | USB device structure - A USB device structure comprises a first package component and a second package component at least wherein the second package component is installed on the first package component; in addition, the first package component comprises an electronic device at least which is attached on a substrate; the second package component comprises an electronic device at least which is attached on a substrate; the first package component is electrically connected to the second package component for promoted product yield rate, customer's early delivery date, and reduced manufacturing and material costs. | 03-08-2012 |
20120075332 | Portable storage device and its operating method - A portable storage device along with its operating method comprises a data disc with at least a memory chip and an application program installed into the memory chip. The data disc with superior mobility is provided with a plurality of metal contacts connected to a computer. The application program comprises a screen capture module or a video module, an interception module and a storage space. The present invention could be applied to any computer by one user who intends to record current status shown on a display panel for this action rapidly and conveniently executed. The present invention is effective in not only data on a display panel rapidly and easily recorded but also high transitivity & mobility. | 03-29-2012 |
20120075790 | USB device structure - A USB device structure has a memory module and at least one support element. A combined thickness of the memory module and the support element complies with a height of a male connector having at least one data transmission interface of USB, Mini USB, Micro USB and e-SATA. Accordingly, the USB device structure of the present invention can effectively reduce the thickness of a storage device and can be extensively applied to advertisement and promotion and properly stored. | 03-29-2012 |
20120120585 | Screen storage device - The present invention is to provide a screen storage device comprising at least an integrated circuit module and a carrier plate folded to be at least two folding sections in which the height of the integrated circuit module plus the heights of folding sections is not more than the height unit of a Universal Serial Bus (USB) male connector to embody the height of the integrated circuit module in the present invention effectively reduced and the present invention extensively employed, conveniently used, and properly accommodated with the folding section and the integrated circuit module oppositely stacked. | 05-17-2012 |
20120178307 | USB port - The present invention provides a USB port comprising a support pad for the support pad's both first surface and second surface compatible to the data transfer interface of the USB Series A male connector and plugged into a female socket for fewer costs spent in purchasing any device attributed to any damaged USB port or female socket in the past and a USB port plugged along a restricted direction. | 07-12-2012 |
20120182685 | Data Storage Device - A data storage device which allows one user to plug the present invention onto any computer is provided with an integrated circuit module in which a control element's virtual device module can issue a request to the computer and makes the present invention become a virtual device when the integrated circuit module is electrically connected to a memory card module. Accordingly, the present invention developed to be a thin structure conforms to an electronic product's structural style featuring lightness, thinness, shortness, and smallness and delivers information fast transmitted and received by a virtual device, a plurality of data storage devices plugged onto a computer, and multiple types of software simultaneously executed. | 07-19-2012 |
20120216047 | DIGITAL KEY FEATURING ENCRYPTION AND WEB GUIDE - The present invention targets at providing a digital key featuring encryption and web guide. When users electrically connect the digital key to a computer, the computer can automatically execute to activate a browser program and automatically key in (simultaneously read) a specific web address and specific log-on data without users' operation so as to prevent the attack tricks of unscrupulous persons from stealing information at user end and secure digital information security at user end. Additionally, users don't need to memorize specific log-on data and won't forget or lose log-on information, thereby rendering sufficient convenience. | 08-23-2012 |
20120258610 | Cascade data storage device - The present invention is to provide a cascade data storage device comprising at least an integrated circuit module and a connecting structure wherein the integrated circuit module has a substrate, at least an electronic device, a package body and a USB metal contact and the connecting structure has at least a male connector and at least a female connector; the connecting structure is installed on a lateral edge of the package body and allows the male connector to couple with the female connector and then the integrated circuit modules freely connected, which are stacked high enough and keep the USB metal contact electrically contact with a USB port of a computer. | 10-11-2012 |
20120262871 | Thin data storage device - The present invention is to provide a thin data storage device with a support pad's length positioned at a USB port's height in a way for a supporting segment securely supported and a USB metal contact effectively and electrically connected to a female connector of the USB port without problems such as invalid electrical connection or poor contact between a USB metal contact and a female connector of a computer's USB port affected by the integrated circuit module's thinned thickness. Relying on the lowered thickness of the integrated circuit module, the present invention is effective in extensive applications to other products. | 10-18-2012 |
20130001294 | STORAGE DEVICE WITH AN ICON AND ITS IDENTIFICATION SYSTEM - The present invention fulfills an icon on a storage device accessed by one user and the icon's saved content, e.g., digital data saved in the storage device, displayed or a specific program corresponding to the saved content executed; as a result, the digital data in the storage device is quickly and effectively accessed by one user without any electronic data exchange device required. | 01-03-2013 |
20130019294 | DATA SHARING SYSTEM WITH A DIGITAL KEYAANM Yu; Hong-ChiAACI Kaohsiung CityAACO TWAAGP Yu; Hong-Chi Kaohsiung City TWAANM Chang; Mao-TingAACI Kaohsiung CityAACO TWAAGP Chang; Mao-Ting Kaohsiung City TW - The present invention provides a data sharing system with a digital key in order to deliver data sharing via Internet or a local area network by means of either at least one data storage device electrically connected to a digital box or a storage space inside a memory unit of the digital box which links a server. At the moment, a computer user could use one digital key only to link a server and further complete read-out, write-in, modification, deletion or addition of data/files in the data storage device or the storage space with the digital key's peer identification code and the digital box's peer authentication code belonging to the same group validated by the server. | 01-17-2013 |
20130080589 | IMAGE-BASED DATA SHARING SYSTEM AND ITS EXECUTIVE METHOD - The present invention is intend for data sharing completed via Internet or local area networks when at least one data storage device is electrically connected to a digital box and the digital box links a server. At the moment, an image is caught by one image capture device of a computer which is equipped with one application program and decoded by a decoder module in order to get a peer authentication code. Then, one command to read out, write in, modify, delete or add any data/file in a data storage device which is electrically connected to a digital box or any data/file in a storage space is executed by one user via the computer when peer authentication codes of the computer and the digital box are identified as the same group by the server. | 03-28-2013 |
20130086221 | IMAGE SHARING STORAGE DEVICE AND ITS EXECUTIVE METHOD - The present invention provides an image sharing storage device and its executive method for image shared by local storage devices or remote servers and comprises at least an integrated circuit module and an application program. Any image could be recorded by one user who uses an image recording module of the application program and an image capture device of one computer when the integrated circuit module is electrically connected to the computer; the recorded image could be conveniently replayed by switching operational modes of the integrated circuit module via software or hardware. | 04-04-2013 |
20130132715 | STORAGE DEVICE WITH A COMMUNICATIONS FUNCTION - The present invention relates to a storage device with a communications function which comprises an integrated circuit module and an application program. The integrated circuit module comprises at least a USB connector, at least a substrate, at least a controller and at least a memory in which there is at least an authentication code; the application program comprises a communications module and a transmission module wherein the communications module is used to receive digital information of at least a data input device in a computer for both the authentication code and the digital information, which has been received by the communications module, transmitted to at least a server or at least a peer by the transmission module. | 05-23-2013 |
20130259293 | APPLICATION PROGRAM EXECUTION METHOD - The present invention relates to an application program execution method which allows information held in an image to be analyzed by means of a mobile device's image recognition function, depends on specific content of information held in the image to call a corresponding application program, and complete an execution. The information held in the image comprises the application program's exclusive username, password and connecting mode, for instance, a web hard drive, network video, or a decoding key. | 10-03-2013 |
Patent application number | Description | Published |
20090283822 | NON-VOLATILE MEMORY STRUCTURE AND METHOD FOR PREPARING THE SAME - A non-volatile memory structure includes a substrate having two doped regions, a charge-trapping structure positioned substantially between the two doped regions, and a conductive structure positioned on the charge-trapping structure, wherein the charge-trapping structure includes a silicon-oxy-nitride layer and metallic nano-dots embedded in the silicon-oxy-nitride layer. The non-volatile memory structure formed by performing a first thermal oxidation process to form a high-k dielectric layer on a substrate, forming a metal-containing semiconductor layer including silicon or germanium on the high-k dielectric layer, forming a silicon layer on the metal-containing semiconductor layer, and performing a second thermal oxidation process to convert the metal-containing semiconductor layer to a silicon-oxy-nitride layer with embedded metallic nano-dots, wherein at least one of the first thermal oxidation process and the second thermal oxidation process is performed in a nitrogen-containing atmosphere. | 11-19-2009 |
20100034027 | Method for programming a nonvolatile memory - A method for programming a nonvolatile memory is provided. The method includes applying at least a voltage to a source or a drain, so as to inject carriers of the source or drain into a substrate; applying a third voltage to a gate or the substrate, so that the carriers which are in the substrate having enough energy can surmount an oxide layer to reach a charge storage device. | 02-11-2010 |
20110103155 | OPERATION METHOD OF MEMORY DEVICE - One embodiment of the present invention provides an operation method of a memory device. The memory device includes a source, a drain, and a channel region between the source and the drain, a gate dielectric with a charge storage layer on the channel region, and a gate on the gate dielectric, wherein the source, the drain and the channel region are located in a substrate. The operation method includes the following steps: applying a reverse bias between the gate and the drain of the memory device to generate band-to-band hot holes in the substrate near the drain; injecting the band-to-band hot holes to a drain side of the charge storage layer; and performing a program/erase operation upon the memory device. The band-to-band hot holes in the drain side of the charge storage layer are not completely vanished by the program/erase operation. | 05-05-2011 |
20110205799 | OPERATION METHOD OF MEMORY DEVICE - A method for operating a memory device is provided. In accordance with the method, the charges are stored in a source storage region, a drain storage region, and a channel storage region of a charge storage layer which respectively correspond to a source, a drain, and a channel of a SONOS transistor, thereby achieving 3-bit information storage in one cell. The channel storage region is programmed and erased by FN tunneling. Both of the source storage region and the drain storage region are programmed by channel hot electrons and erased by source-side or drain-side FN tunneling. The present invention can store three-bit data per cell, such that the storage density of the memory device can be substantially increased. | 08-25-2011 |
20130009124 | RESISTIVE RAM HAVING THE FUNCTION OF DIODE RECTIFICATION - A type of resistance random access memory structure having the function of diode rectification includes a first electrode, a second electrode and a resistance conversion layer. The resistance conversion layer is disposed between the first electrode and the second electrode; and it includes a first oxidized insulating layer which is adjacently connected to the first electrode; a second oxidized insulating layer which is adjacently connected to the second electrode; as well as an energy barrier turning layer disposing between the first oxidized insulating layer and the second oxidized insulating layer. An energy barrier high can be adjusted and controlled to change the resistance by voltage between the energy barrier turning layer and the first oxidized insulating layer. A fixed energy barrier is formed between the second oxidized insulating layer and the energy barrier turning layer, so that the resistance random access memory element features the function of diode rectification. | 01-10-2013 |
20130169351 | TRANSISTOR OPERATING METHOD - A transistor operating method is applicable to a transistor including a first gate, a first gate insulating layer, a semiconductor layer, a source, a drain, a second gate insulating layer and a second gate. The transistor operating method includes: grounding the first gate and the source, applying a negative bias to the second gate and applying a positive bias to the drain, so that the transistor acts as an optical detector; alternatively, grounding the source, grounding or floating the second gate, applying a bias to the first gate and applying a positive bias to the drain, so that the transistor acts as a pixel switch. | 07-04-2013 |
20130234094 | Methods and Apparatus for Resistive Random Access Memory (RRAM) - Methods and apparatuses for a resistive random access memory (RRAM) device are disclosed. The RRAM device comprises a bottom electrode, a resistive switching layer disposed on the bottom electrode, and a top electrode disposed on the resistive switching layer. The resistive switching layer is made of a composite of a metal, Si, and O. There may be an additional tunnel barrier layer between the top electrode and the bottom electrode. The top electrode and the bottom electrode may comprise multiple sub-layers. | 09-12-2013 |
20140043899 | MOSFET HAVING MEMORY CHARACTERISTICS - A method for performing a programming operation to a first memory bit and a second memory bit of a device is described. The method includes applying a pulse train voltage to a metal gate of the device and grounding a substrate of the device. By floating/grounding a drain of the device and/or by floating/grounding the source of the device, the first memory and the second memory bit are programmed. The pulse train voltage includes 10 to 1000 pulses. One pulse includes a peak voltage and a base voltage. The peak voltage ranges from 0.5 V to 10 V. A duration of the peak voltage ranges from 1 nanosecond to 1 millisecond. The base voltage is 0 V. A duration of the base voltage ranges from 1 nanosecond to 1 millisecond. | 02-13-2014 |
20140063903 | RESISTIVE RANDOM ACCESS MEMORY, CONTROLLING METHOD AND MANUFACTURING METHOD THEREFOR - A resistive random access memory (RRAM), a controlling method for the RRAM, and a manufacturing method therefor are provided. The RRAM includes a first electrode layer; a resistance switching layer disposed on the first electrode layer; a diffusion metal layer disposed on the resistance switching layer; and a second electrode layer disposed on the diffusion metal layer, wherein at least one extension electrode is disposed in the resistance switching layer. | 03-06-2014 |
Patent application number | Description | Published |
20120069506 | ELECTRONIC DEVICE - An electronic device is provided. The electronic device includes a transparent glass substrate, an inductive charge element and a power storage element. The inductive charge element includes a transparent conductive coil and a transparent protective layer. The transparent conductive coil disposed on the transparent glass substrate is a spiral structure. The transparent protective layer covers the transparent conductive coil. The power storage element is electrically connected to the inductive charge element. | 03-22-2012 |
20130100072 | Touch Panel - A touch panel including a capacitance touch structure and a pressure sensing touch structure is provided. The pressure sensing touch structure includes a first conductive film, a second conductive film, an electric field generator and a spacer structure. The spacer structure is disposed between the first conductive film and the second conductive film. The spacer structure includes a plurality of insulating spacers, a plurality of conductive spacers and a soft medium. The plurality of the conductive spacers and the plurality of the insulating spacers are alternately distributed in the soft medium. The plurality of the conductive spacers and the second conductive film are separated by a gap distance by the plurality of the insulating spacers. | 04-25-2013 |
20130147740 | TOUCH DISPLAY DEVICE - A touch display device includes a display panel, a touch panel, and a non-self-luminescent display panel. The display panel includes at least one luminescent unit for generating a display image. The touch panel is disposed correspondingly to the display panel. The non-self-luminescent display panel is disposed between the touch panel and the display panel. The non-self-luminescent display panel includes a display medium layer for generating a non-self-luminescent display image or for being transparent to let the display image from the display panel pass through the display medium layer. | 06-13-2013 |
20130155059 | SWITCHABLE TOUCH STEREOSCOPIC IMAGE DEVICE - A switchable touch stereoscopic image device includes a stereoscopic image generating module and a touch sensing module. The stereoscopic image generating module includes a first substrate, a second substrate, a light-path converting layer, driving electrodes and a common electrode. The first and second substrates are disposed corresponding to each other. The first substrate has a top surface. The second substrate has a top surface and a bottom surface facing the top surface of the first substrate. The light-path converting layer is disposed between the first and second substrates. The driving electrodes are disposed on the top surface of the first substrate. The common electrode is disposed on the bottom surface of the second substrate. The touch sensing module is disposed on a side of the second substrate of the stereoscopic image generating module and includes sensing electrodes disposed on a side of the top surface of the second substrate. | 06-20-2013 |
20130206568 | TOUCH PANEL - A touch panel including a first substrate, a second substrate, a first sensing layer, a second sensing layer, and a plurality of spacers is provided. The second substrate is parallel to and opposite to the first substrate in a top-bottom manner. The first sensing layer is disposed on the first substrate and located between the first substrate and the second substrate. The second sensing layer is disposed on the second substrate. The spacers are located between the first sensing layer and the second sensing layer, and the spacers includes a plurality of movable first spacers and a plurality of second spacers fixed on the second substrate, wherein each of the first spacers is surrounded by a portion of the second spacers. | 08-15-2013 |
20130257927 | DISPLAY HAVING LIGHTING DEVICES INTEGRATED WITH AN E-BOOK AND DRIVING METHOD THEREOF - A display having lighting devices integrated with an E-Book includes a display panel, and the display panel includes a plurality of pixels. Each pixel of the plurality of pixels includes a control unit, a lighting device driving unit, a first switch unit, a second switch unit, and an E-Book unit. The lighting device driving unit includes a lighting device. The control unit, the lighting device driving unit, the first switch unit, the second switch unit, and the E-Book unit are used for performing corresponding operations to let the lighting device or the E-Book unit properly display an image corresponding to an image signal when the display receives the image signal. | 10-03-2013 |
20130265341 | METHOD FOR ADJUSTABLE OUTPUTTING GAMMA REFERENCE VOLTAGES AND SOURCE DRIVER FOR ADJUSTABLE OUTPUTTING GAMMA REFERENCE VOLTAGES - A method for adjustable outputting Gamma reference voltages includes generating a polarity control signal corresponding to one of plural predetermined display panel types, where a plurality of polarity control signals corresponding to the panel types of the plurality of display panels are different; generating a polarity signal corresponding to the display panel according to the polarity control signal; and generating and outputting a plurality of Gamma reference voltages according to the polarity signal. The plurality of Gamma reference voltages include a positive polarity Gamma reference voltage set and a negative polarity Gamma reference voltage set, and a voltage number of the positive polarity Gamma reference voltage set is the same as a voltage number of the negative polarity Gamma reference voltage set. | 10-10-2013 |
20130314372 | DISPLAY STRUCTURE WITH TOUCH CONTROL FUNCTION - An organic light emitting diode display structure with touch control function includes a plurality of organic light emitting diodes arranged in a matrix form, a plurality of first switches, a plurality of first sensing stripes arranged along a first direction, a plurality of second sensing stripes arranged along a second direction, and a touch control circuit. Each of the first switches is coupled between a first end of one of the plurality of organic light emitting diodes and a voltage source. Each of the second sensing stripes is coupled to a plurality of second ends of at least one of rows of the plurality of organic light emitting diodes. The touch control circuit is for generating touch signals according to capacitance values between the plurality of first sensing stripes and the plurality of second sensing stripes. | 11-28-2013 |
20140071637 | TOUCH PANEL AND TOUCH DISPLAY DEVICE - A touch panel includes a first substrate and a first composite material conductive layer. The first composite material conductive layer has a first multilayer structure. The first multilayer structure includes a first refraction index compensating layer, a second refraction index compensating layer, and a first metal conductive layer. The first refraction index compensating layer, the first metal conductive layer, and the second compensation layer are stacked on the first substrate, and an equivalent refraction index of the first composite material conductive layer is substantially between a refraction index of the first substrate and 1.1 times the refraction index of the first substrate. | 03-13-2014 |
20140152615 | CAPACITIVE TOUCH PANEL - A capacitive touch panel including a substrate and a plurality of approach sensing units disposed on the substrate is provided. Each approach sensing unit comprises a first driving electrode, a second driving electrode, a first sensing electrode unit and a second sensing electrode unit. The first and second driving electrodes are arranged in parallel along an axis. The first and second sensing electrode units are arranged along an axis and sense the approach of an object to generate a first approach sensing signal and a second approach sensing signal, respectively. The first and second sensing electrode units are adjacent to each other and disposed between the first and second driving electrodes or the first and second driving electrodes are adjacent to each other and disposed between the first and second sensing electrode units. | 06-05-2014 |
20140160374 | CAPACITIVE TOUCH PANEL AND METHOD OF MAKING THE SAME - A capacitive touch panel includes a first conductive layer, a second conductive layer and an insulating layer. The first conductive layer includes a plurality of first sensing electrodes, first bridge electrodes and second sensing electrodes. Each of the first sending electrodes and each of the second sending electrodes include a meshed electrode, which has a plurality of openings. The second conductive layer includes a plurality of second bridge electrodes, and each second bridge electrode is electrically connected to two adjacent second sensing electrodes. The insulating layer is disposed between the first conductive layer and the second conductive layer to electrically insulating the first conductive layer from the second conductive layer. | 06-12-2014 |
20140285468 | TOUCH CONTROL DEVICE, TOUCH CONTROL DISPLAY DEVICE, DISPLAY DEVICE AND CONTROL METHOD THEREOF - A touch control device includes a touch area, a border area, a inductive coil, a proximity sensing unit, a near field communication unit, and a switch module. The touch area is for sensing touch input. The border area is located at periphery of the touch area. The inductive coil is located on the border area. The proximity sensing unit is for transmitting a driving signal to the inductive coil when being coupled to a first end of the inductive coil, and determining whether the inductive coil is close to an object according to a sensing signal generated by the inductive coil. The near field communication unit is for performing near field communication when being coupled to the first end and a second end of the inductive coil. The switch module is for controlling coupling statuses of the proximity sensing unit and the near field communication unit to the inductive coil. | 09-25-2014 |
20150029422 | TOUCH PANEL AND TOUCH DISPLAY PANEL - The present invention provides a touch panel and a touch display panel including an insulating layer, a first conductive pattern, and a second conductive pattern. The first conductive pattern and the second conductive pattern are respectively disposed on two sides of the insulating layer. The first conductive pattern includes a plurality of first electrode strips, wherein each first electrode strip includes a strip portion and a plurality of protrusion portions protruding from two sides of the strip portion. The second conductive pattern includes a plurality of second electrode strips, crossing the first electrode strips. | 01-29-2015 |
20150083569 | TOUCH PANEL - A touch panel including a substrate, a touch-sensing element, transmission lines, a ground electrode, a first electrode layer, an insulation layer and a second electrode layer is provided. The transmission lines are electrically connected to the touch-sensing element. The ground electrode surrounds the touch-sensing element and the transmission lines. The first electrode layer is located around and electrically connected to the ground electrode. The insulation layer is at least disposed on the first electrode layer. The second electrode layer is disposed on the insulation layer to form at least one capacitance storage unit, so that the electro static discharge can be conducted to the ground electrode through the capacitance storage unit. | 03-26-2015 |
Patent application number | Description | Published |
20110317860 | Assembly Structure for Speaker System - An assembly structure for a speaker system is disclosed. The assembly structure includes an iron grille, a speaker frame, a plurality of magnets and a plurality of pads. The speaker frame is covered with the iron grille and includes a plurality of through-holes on one face thereof. Each of the through-holes includes a first receiving portion and a second receiving portion. The speaker frame further includes a plurality of magnets, each being received in the first receiving portion of a respective one of the through-holes. The speaker frame further includes a plurality of pads, each being received in the second receiving portion of the respective one of the through-holes. | 12-29-2011 |
20120275627 | Sandwich-type Woofer with Two Sound Wave Propagation Directions - A sandwich-type woofer with two sound wave propagation directions includes a first magnetic-conducting plate unit, a second magnetic-conducting plate unit, a magnet unit, a coil frame, a first vibrating unit, a second vibrating unit, a first coil and a second coil. The magnet unit is sandwiched between the first and second magnetic-conducting plate units. The coil frame extends through the first and second magnetic-conducting plate units and the magnet unit, and has first and second ends. The first vibrating unit is disposed at the first end of the coil frame and the second vibrating unit is disposed at the second end of the coil frame. The first coil is arranged on a portion of the coil frame corresponding to the first magnetic-conducting plate unit and the second coil is arranged on another portion of the coil frame corresponding to the second magnetic-conducting plate unit. | 11-01-2012 |
20120275638 | Sandwich-Type Woofer with Two Sound Wave Propagation Directions and a Magnetic-Looped Device Thereof - A sandwich-type woofer with two sound wave propagation directions includes a first magnetic-conducting plate unit, a second magnetic-conducting plate unit, a magnet unit, a coil frame, a first vibrating unit, a second vibrating unit, a first coil and a second coil. The magnet unit is sandwiched between the first and second magnetic-conducting plate units. The coil frame extends through the first and second magnetic-conducting plate units and the magnet unit, and has first and second ends. The first vibrating unit is disposed at the first end of the coil frame and the second vibrating unit is disposed at the second end of the coil frame. The first coil is arranged on a portion of the coil frame corresponding to the first magnetic-conducting plate unit and the second coil is arranged on another portion of the coil frame corresponding to the second magnetic-conducting plate unit. | 11-01-2012 |
20150086065 | Loudspeakers With Double Dampers - A loudspeaker with double dampers include a magnetic circuit forming a magnetic field, a voice coil passing through the magnetic field of the magnetic circuit, a vibration module connected with the voice coil, a frame connected with the vibration module, and a supporting module having a pillar and first and second dampers. The pillar of the supporting module is arranged inside the voice coil and mounted on the magnetic circuit. The first damper of the supporting module is connected between the pillar and an inner surface of the voice coil, and the second damper is connected between an outer surface of the voice coil and an inner surface of the frame. | 03-26-2015 |
Patent application number | Description | Published |
20080303966 | PIXEL STRUCTURE - A pixel structure including a substrate, a scan line, a data line, a first and a second switching device, a first and a second pixel electrode, a first and a second bended pixel electrode, a first and a second connecting conductive layer, and a first and a second common line is provided. The scan line and data line demarcate a first and a second areas on the substrate, and the scan line is located between the two areas. The first and second switching devices are electrically connected to the scan line and the data line and are also electrically connected to the first and second pixel electrodes on the first and second areas respectively. The first and second bended pixel electrodes on the second and first areas are electrically connected to the first and second pixel electrodes through the first and second connecting conductive layers on the scan line respectively. | 12-11-2008 |
20080303970 | PIXEL STRUCTURE - A pixel structure includes a gate, a source, a first drain, a second drain, a third drain, a first pixel electrode, a second pixel electrode, a scan line and a data line. The gate, the source and the first drain form a first thin film transistor. The gate, the source and the second drain form a second thin film transistor. The gate, the second drain and the third drain form a sub-thin film transistor (sub-TFT). Additionally, the first pixel electrode is electrically connected to the first drain, and the second drain extends to a portion between the second pixel electrode and the substrate such that a capacitor-coupling electrode is formed. Moreover, the second pixel electrode is electrically connected to the third drain of the sub-TFT. The scan line is disposed on the substrate and electrically connected to the gate, and the data line is electrically connected to the source. | 12-11-2008 |
20100237350 | PIXEL STRUCTURE - A pixel structure suitable for being disposed on a substrate includes a thin film transistor (TFT), a first pixel electrode, a second pixel electrode, a scan line and a data line. The TFT disposed on the substrate includes a gate, a source, a first drain and a second drain. A main TFT is formed by the gate, the source and the first drain. A sub-thin film transistor (sub-TFT) is formed by the gate, the first drain and the second drain. The first pixel electrode is electrically connected to the first drain, and a portion of the first drain extends between the second pixel electrode and the substrate to form capacitor-coupling electrode. The second pixel electrode is electrically connected to the second drain of the sub-TFT. The scan line is disposed on the substrate and electrically connected to the gate, and the data line is electrically connected to the source. | 09-23-2010 |