Ming-Hai
Ming-Hai Chang, Taoyuan County TW
Patent application number | Description | Published |
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20150113784 | METHOD OF MANUFACTURING PARTICLE-BASED IMAGE DISPLAY - A method of manufacturing a particle-based image display having a plurality of imaging cells is disclosed. The method includes filling the plurality of imaging cells with a plurality of first particles, identifying a defect associated with one or more of the imaging cells, and repairing the defect within a unit corresponding to part of the plurality of imaging cells. | 04-30-2015 |
Ming-Hai Hsu, Taichung City TW
Patent application number | Description | Published |
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20150300368 | FAN - A fan is provided, including a driving member, a fan bracket, a main fan and a main cover. The fan bracket is assembled with the driving member. The main fan is disposed on a first connecting portion of the fan bracket. The main cover is disposed on a second connecting portion of the fan bracket. An airflow space is formed between the main fan and the main cover. The main cover is formed with a first wind-guiding cover. Thereby, when the driving member drives the main fan to rotate, air can be inhaled through the first wind-guiding cover into the airflow space, and air will be exhaled toward a periphery of the airflow space by using a guidance of the first wind-guiding cover. | 10-22-2015 |
Ming-Hai Tsai, Chu-Nan TW
Patent application number | Description | Published |
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20100035380 | Method for fabricating package structure of stacked chips - The invention relates to a method for fabricating a package structure of stacked chips, comprising the following steps: firstly, providing a substrate; attaching a first chip and a second chip on the upper surface of the substrate, in which the second chip is stacked on the upper side of the first chip; then connecting a first bonding wire between a second solder pad of the second chip and a first region of a first solder pad of the first chip; and connecting a second bonding wire between a second region of the first solder pad of the first chip and the metal contact of the substrate, whereby the invention is capable of tremendously reducing the volume as a whole, effectively solving the problem of having much bonding wire circuit, and reducing the volume and quantity occupied by the solder pads on the substrate, thereby reducing complexity of the circuit layout on the substrate. | 02-11-2010 |