Patent application number | Description | Published |
20080296731 | ENHANCED ON-CHIP DECOUPLING CAPACITORS AND METHOD OF MAKING SAME - An apparatus including a capacitor formed between metallization layers on a circuit, the capacitor including a bottom electrode coupled to a metal layer and a top electrode coupled to a metal via wherein the capacitor has a corrugated sidewall profile. A method including forming an interlayer dielectric including alternating layers of dissimilar dielectric materials in a multilayer stack over a metal layer of a device structure; forming a via having a corrugated sidewall; and forming a decoupling capacitor stack in the via that conforms to the sidewall of the via. | 12-04-2008 |
20090324164 | Waveguide photodetector device and manufacturing method thereof - Embodiments of the present invention describe a waveguide-based photodetector device and its methods of fabrication. The waveguide photodetector device comprises a substrate having a cladding structure formed thereon. A waveguide element for receiving optical signals is disposed within the cladding structure. A portion of the waveguide element is encapsulated by a photodetector element that detects the optical signal received by the waveguide element and generates an electrical signal based on the optical signal. Encapsulating the waveguide element in the photodetector element improves coupling efficiency and enables a waveguide photodetector device with higher speeds and higher responsivity. | 12-31-2009 |
20100260453 | QUALITY FACTOR (Q-FACTOR) FOR A WAVEGUIDE MICRO-RING RESONATOR - The waveguide in the ring and the bus waveguide in the immediate vicinity of the ring are made wider than the optimal single mode size. The bus waveguide has adiabatic tapers which serve to connect single mode portions in the bus waveguide to the wider portion of the bus waveguide to expand the mode from the narrower waveguide to the wider waveguide. Since the light is now spread out over a larger area in the wider waveguides, the scattering loss from the sidewalls is reduced and the loss is lower. This lower loss gives rise to a higher Q in the ring since the Q of the ring is directly proportional to the round trip loss. | 10-14-2010 |
20100304514 | EFFICIENT LIGHT COUPLER FROM OFF-CHIP TO ON-CHIP WAVEGUIDES - In an embodiment, light from a single mode light source may be deflected into a low index contrast (LIC) waveguide in an opto-electronic integrated circuit (OEIC) (or “opto-electronic chip”) by a 45 degree mirror. The mirror may be formed by polishing an edge of the die at a 45 degree angle and coating the polished edge with a metal layer. Light coupled into the LIC waveguide may then be transferred from the LIC waveguide to a high index contrast (HIC) waveguide by evanescent coupling. | 12-02-2010 |
20110075962 | WAVEGUIDE COUPLED SURFACE PLASMON POLARITION PHOTO DETECTOR - A metal-semiconductor-metal (MSM) device couples light from an optical mode in a waveguide to a surface plasmon polarition (SPP) mode on an electrode surface of the MSM device. Once in an SPP mode, the absorption of light in the semiconductor can take place in a very small area. This may allow for a shrinking of the active detector area and allow for low capacitance, very short transit distance for the electrical carriers and allow for very low voltage devices and/or very high frequency. | 03-31-2011 |
20120251029 | OPTICAL WAVEGUIDE STRUCTURE - Embodiments of the invention describe a multi-segment optical waveguide that enables an optical modulator to be low-power and athermal by decreasing the device length needed for a given waveguide length. Embodiments of the invention describe an optical waveguide that is folded onto itself, and thus includes at least two sections. Thus, embodiments of the invention may decrease the device size of a modulator by at least around a factor of two if the device is folded twofold (device size may be further reduced if the modulator is folded threefold, four-fold, five-fold, etc.). | 10-04-2012 |
20130279845 | FABRICATION OF PLANAR LIGHT-WAVE CIRCUITS (PLCS) FOR OPTICAL I/O - PLC architectures and fabrication techniques for providing electrical and photonic integration of a photonic components with a semiconductor substrate. In the exemplary embodiment, the PLC is to accommodate optical input and/or output (I/O) as well as electrically couple to a microelectronic chip. One or more photonic chip or optical fiber terminal may be coupled to an optical I/O of the PLC. In embodiments the PLC includes a light modulator, photodetector and coupling regions supporting the optical I/O. Spin-on electro-optic polymer (EOP) may be utilized for the modulator while a photodefinable material is employed for a mode expander in the coupling region. | 10-24-2013 |
20130287333 | WAVEGUIDE COUPLED SURFACE PLASMON POLARITION PHOTO DETECTOR - A metal-semiconductor-metal (MSM) device couples light from an optical mode in a waveguide to a surface plasmon polarition (SPP) mode on an electrode surface of the MSM device. Once in an SPP mode, the absorption of light in the semiconductor can take place in a very small area. This may allow for a shrinking of the active detector area and allow for low capacitance, very short transit distance for the electrical carriers and allow for very low voltage devices and/or very high frequency. | 10-31-2013 |
20130336346 | OPTICAL COUPLING TECHNIQUES AND CONFIGURATIONS BETWEEN DIES - Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an opto-electronic assembly includes a first semiconductor die including a light source to generate light, and a first mode expander structure comprising a first optical material disposed on a surface of the first semiconductor die, the first optical material being optically transparent at a wavelength of the light, and a second semiconductor die including a second mode expander structure comprising a second optical material disposed on a surface of the second semiconductor die, the second material being optically transparent at the wavelength of the light, wherein the second optical material is evanescently coupled with the first optical material to receive the light from the first optical material. Other embodiments may be described and/or claimed. | 12-19-2013 |
20140086523 | POLING STRUCTURES AND METHODS FOR PHOTONIC DEVICES EMPLOYING ELECTRO-OPTICAL POLYMERS - EOP-based photonic devices employing coplanar electrodes and in-plane poled chromophores and methods of their manufacture. In an individual EOP-based photonic device, enhanced performance is achieved through in-plane poled chromophores having opposing polarities, enabling, for example, a push-pull optical modulator with reduced operational voltage and switching power relative to a conventional MZ modulator. For a plurality of EOP-based photonic devices, enhanced manufacturability is achieved through a sacrificial interconnect enabling concurrent in-plane poling of many EOP regions disposed on a substrate. | 03-27-2014 |
20140203175 | OPTICAL I/O SYSTEM USING PLANAR LIGHT-WAVE INTEGRATED CIRCUIT - Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor. | 07-24-2014 |
Patent application number | Description | Published |
20080234652 | Apparatus and methods for making, storing, and administering freeze-dried materials such as freeze-dried plasma - A freeze-dried material is stored in a first chamber of a container along with a reconstituting liquid for the freeze-dried material, which is stored in a second chamber of the container. A sealing wall within the container forms a barrier between the first chamber and the second chamber preventing contact between the freeze-dried material and the reconstituting liquid. At least one valve assembly in the sealing wall selectively opens a region of the sealing wall to establish fluid flow communication between the first and second chambers, allowing the freeze dried material to be reconstituted. The reconstituted freeze-dried material can be administered from the same container to a recipient. | 09-25-2008 |
20080234653 | Apparatus and methods for making, storing, and administering freeze-dried materials such as freeze-dried plasma - A freeze-dried material is stored in a first chamber of a container along with a reconstituting liquid for the freeze-dried material, which is stored in a second chamber of the container. A sealing wall within the container forms a barrier between the first chamber and the second chamber preventing contact between the freeze-dried material and the reconstituting liquid. At least one valve assembly in the sealing wall selectively opens a region of the sealing wall to establish fluid flow communication between the first and second chambers, allowing the freeze dried material to be reconstituted. The reconstituted freeze-dried material can be administered from the same container to a recipient. | 09-25-2008 |
20080234654 | Apparatus and methods for making, storing, and administering freeze-dried materials such as freeze-dried plasma - A vessel receives a liquid material, which is freeze-dried in situ within the vessel. A gas permeable material carried by the vessel provides gas transport for sublimation during drying. After freeze drying, an oxygen-free inert gas is introduced into the vessel through the gas permeable material, to occupy the interior of the vessel with the freeze-dried material. The gas permeable material is covered, to trap the oxygen-free inert gas within the vessel with the freeze-dried material. The freeze-dried material is stored in the entrapped oxygen-free inert gas within the vessel for a storage period. The vessel receives a reconstituting liquid for mixing with the freeze-dried material, and conveys the reconstituted freeze-dried material from the vessel for administration to an individual. | 09-25-2008 |