Patent application number | Description | Published |
20130207132 | SOLID STATE WHITE LIGHT EMITTER AND DISPLAY USING SAME - A light emitting assembly comprising a solid state device coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first, relatively shorter wavelength radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and which in exposure to said first, relatively shorter wavelength radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is down-converted to white light by packaging the diode with fluorescent organic and/or inorganic fluorescers and phosphors in a polymeric matrix. | 08-15-2013 |
20130309792 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, light-emitting dies are fabricated on a substrate, separated from at least a portion of the substrate, and coated with a wavelength-conversion material. | 11-21-2013 |
20140034960 | ELECTRONIC DEVICES WITH YIELDING SUBSTRATES - In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts. | 02-06-2014 |
20140061705 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 03-06-2014 |
20140062302 | FAILURE MITIGATION IN ARRAYS OF LIGHT-EMITTING DEVICES - In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string. | 03-06-2014 |
20140062315 | WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES - In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements. | 03-06-2014 |
20140062316 | WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES - In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements. | 03-06-2014 |
20140077686 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 03-20-2014 |
20140167611 | LIGHT-EMITTING ELEMENT REPAIR IN ARRAY-BASED LIGHTING DEVICES - In accordance with certain embodiments, patches with replacement light-emitting elements thereon are utilized to repair lighting-system fault locations. | 06-19-2014 |
20140175481 | WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon. | 06-26-2014 |
20140175993 | WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES - In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements. | 06-26-2014 |
20140191257 | ELECTRONIC DEVICES WITH YIELDING SUBSTRATES - In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts. | 07-10-2014 |
20140203308 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 07-24-2014 |
20140231848 | ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS - In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies. | 08-21-2014 |
20140231850 | ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS - In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies. | 08-21-2014 |
20140246747 | POLYMERIC BINDERS INCORPORATING LIGHT-DETECTING ELEMENTS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 09-04-2014 |
20140264404 | ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS - In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence. | 09-18-2014 |
20140264427 | THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES - In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation. | 09-18-2014 |
20140312788 | ILLUMINATION DEVICE CONTROL SYSTEMS AND METHODS - In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load. | 10-23-2014 |
20140319560 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 10-30-2014 |
20140362566 | SEALED AND SEALABLE LIGHTING SYSTEMS INCORPORATING FLEXIBLE LIGHT SHEETS AND RELATED METHODS - In accordance with certain embodiments, lighting systems include flexible light sheets and one or more sealed regions containing light-emitting elements, the sealed regions defined by seals between a top housing and a bottom housing and/or the light sheet. | 12-11-2014 |
20140369033 | PORTABLE LIGHTING SYSTEMS INCORPORATING DEFORMABLE LIGHT SHEETS - In accordance with certain embodiments, illumination systems include a flexible light sheet that may be wound within and unwound from, or folded within and unfolded from, a storage unit having a power source for powering light-emitting elements on the light sheet. | 12-18-2014 |
20140369038 | LIGHTING SYSTEMS INCORPORATING FLEXIBLE LIGHT SHEETS DEFORMABLE TO PRODUCE DESIRED LIGHT DISTRIBUTIONS - In accordance with certain embodiments, lighting systems include flexible light sheets having light-emitting elements with first luminous intensity distributions disposed thereover, and the light sheets are curved or folded to produce a second luminous intensity distribution different from the first luminous intensity distribution. | 12-18-2014 |
20150008460 | STRESS RELIEF FOR ARRAY-BASED ELECTRONIC DEVICES - In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate. | 01-08-2015 |
20150036339 | CONTROL OF LUMINOUS INTENSITY DISTRIBUTION FROM AN ARRAY OF POINT LIGHT SOURCES - In various embodiments, a lens array comprises a plurality of aspheric lens elements each optically coupled to a light-emitting element and producing an out-of-focus image thereof. The images combine to generate a target luminous intensity distribution, e.g., providing constant illuminance on a plane. | 02-05-2015 |
20150042231 | FAILURE MITIGATION IN ARRAYS OF LIGHT-EMITTING DEVICES - In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string. | 02-12-2015 |
20150075607 | POLYMERIC BINDERS INCORPORATING LIGHT-DETECTING ELEMENTS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 03-19-2015 |
20150076551 | METHODS OF FABRICATING WAFER-LEVEL FLIP CHIP DEVICE PACKAGES - In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon. | 03-19-2015 |
20150077991 | WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES - In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements. | 03-19-2015 |
20150079709 | LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS - In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder. | 03-19-2015 |