Mcshane, US
Charles P. Mcshane, Waukesha, WI US
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20130113588 | ADDITIVE FOR DIELECTRIC FLUID - A dielectric fluid comprising hydrocarbon liquid admixed with an ester-based compound, wherein the ester-based compound is present in an effective amount to impart breakdown inhibiting properties to a paper insulation material when the dielectric fluid is in contact with the paper material. | 05-09-2013 |
Charles Patrick Mcshane, Waukesha, WI US
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20080283803 | Vegetable oil dielectric fluid composition - An electrical device having therein a dielectric fluid composition, wherein the dielectric fluid composition includes at least one refined, bleached and deodorized vegetable oil and at least one antioxidant, wherein the dielectric fluid composition has a pour point of less than about −20° C. as measured according to either of ASTM D97 or ASTM D5950. | 11-20-2008 |
C. Patrick Mcshane, Waukesha, WI US
Patent application number | Description | Published |
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20090194748 | ADDITIVE FOR DIELECTRIC FLUID - A dielectric fluid comprising hydrocarbon liquid admixed with an ester-based compound, wherein the ester-based compound is present in an effective amount to impart breakdown inhibiting properties to a paper insulation material when the dielectric fluid is in contact with the paper material. | 08-06-2009 |
20100097167 | VEGETABLE OIL BASED DIELECTRIC COOLANT - In one aspect, the present invention provides a dielectric fluid for use in electrical equipment comprising a vegetable oil or vegetable oil blend. In another aspect the invention provides devices for generating and distributing electrical energy that incorporate a dielectric fluid comprising a vegetable oil or vegetable oil blend. Methods of retrofilling electrical equipment with vegetable oil based dielectric fluids also are provided. | 04-22-2010 |
20110012071 | ADDITIVE FOR DIELECTRIC FLUID - A dielectric fluid comprising hydrocarbon liquid admixed with an ester-based compound, wherein the ester-based compound is present in an effective amount to impart breakdown inhibiting properties to a paper insulation material when the dielectric fluid is in contact with the paper material. | 01-20-2011 |
20120139679 | ADDITIVE FOR DIELECTRIC FLUID - A dielectric fluid comprising hydrocarbon liquid admixed with an ester-based compound, wherein the ester-based compound is present in an effective amount to impart breakdown inhibiting properties to a paper insulation material when the dielectric fluid is in contact with the paper material. | 06-07-2012 |
David J. Mcshane, Westlake Village, CA US
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20100039043 | ADVANCED LOW VOLTAGE LIGHTING SYSTEM - Disclosed is a lighting system supporting multiple independently controlled zones utilizing a plurality of semiconductor switches coupled to a plurality of transformers to produce a non-sinusoidal power output and controlled by a digital controller that receives feedback from each zone in order to auto-sense the proper voltage for a plurality of connected loads. | 02-18-2010 |
David James Mcshane, Glencoe, IL US
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20130205807 | MOTOR AND SYSTEM CONTROLLER - A beverage cooler has a low voltage DC supply ( | 08-15-2013 |
Earl E. Mcshane, Springfield, MO US
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20090005202 | BELT TENSIONER AND METHOD FOR MAKING A BELT-TENSIONER ARM AND A SPRING CASE - A belt tensioner includes an arm, a spring case, and a helical spring having inwardly projecting first and second end portions. Another belt tensioner includes a spring, an arm, a spring case, and a pivot bushing surrounding the spring. An additional belt tensioner includes an idler pulley having a bearing with a mounting hole and includes an arm having a post. The post is positioned in the mounting hole, and an annular rim of the post is deformed radially outward and over the bearing. A method for manufacturing an arm and a spring case of a belt-tensioner includes obtaining a belt-tensioner-arm casting mold including a first section and a second section and obtaining a belt-tensioner-spring-case casting mold including a first segment and a second segment. | 01-01-2009 |
Edward Mcshane, Collegeville, PA US
Patent application number | Description | Published |
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20080294202 | Bone Anchor With Locking Cap and Method of Spinal Fixation - A bone anchor ( | 11-27-2008 |
20100137913 | ADJUSTABLE ROD ASSEMBLY - An adjustable rod for spinal corrective surgery is provided that includes a first elongate member and a second elongate member, each having rod portions couplable to one or more bone connecting elements and expansion portions slidably moveable with respect to one another. A plurality of holes in each expansion portion are alignable with one another to choose the length of the adjustable rod and a locking element is inserted through a pair of aligned holes to couple the first and second elongate members and secure or fix the length of the expandable rod. | 06-03-2010 |
20100217333 | SPLINE DRIVE FOR THREADED POST-TYPE BONE ANCHORS - A threaded bone anchor includes a plurality of recesses formed lengthwise along an exterior cylindrical surface for engagement with a driver instrument through which a user applies clockwise or counterclockwise torque for the insertion or removal of the bone anchor into and from bone. The bone anchor includes a cross-sectional geometry that minimizes the anchor's outer diameter, survives high insertion/removal torque without compromising the anchor's bending/shear strength, and allows a mating clamp to be attached to the entire non-threaded surface, including the recessed portion. | 08-26-2010 |
20100268279 | CLAMPS USED FOR INTERCONNECTING A BONE ANCHOR TO A ROD - The present invention relates to a clamp, and, more particularly, to a clamp for securing the position of a bone anchor with respect to a longitudinal rod, preferably for use in the spine. The clamp may include a housing, a rod clamping assembly, and a bone anchor clamping assembly. The clamp preferably enables the longitudinal axis of the rod to be offset or laterally displaced from the longitudinal axis of the bone anchor. The rod clamping assembly and the bone anchor clamping assembly are preferably moveably coupled to the housing in order to provide increased flexibility to better accommodate the location and geometry of the longitudinal rod and to better accommodate bone positioning. | 10-21-2010 |
20120253409 | BONE ANCHOR WITH LOCKING CAP AND METHOD OF SPINAL FIXATION - A bone anchor ( | 10-04-2012 |
20140249590 | BONE ANCHOR WITH LOCKING CAP AND METHOD OF SPINAL FIXATION - A bone anchor ( | 09-04-2014 |
Edward Mcshane, West Chester, PA US
Patent application number | Description | Published |
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20100305625 | SURGICAL INSTRUMENT FOR FIXING A CLAMP TO A BONE FIXATION DEVICE - A surgical instrument for moving a clamp relative to a bone anchor to properly position and secure the clamp to the bone anchor. The surgical instrument including a housing, a socket assembly, a manipulating assembly, a gripping assembly and a reduction assembly. | 12-02-2010 |
Edward J. Mcshane, West Chester, PA US
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20150134002 | Adjustable Rod Assembly - An adjustable rod for spinal corrective surgery is provided that includes a first elongate member and a second elongate member, each having rod portions couplable to one or more bone connecting elements and expansion portions slideably movable with respect to one another. A plurality of holes in each expansion portion are alignable with one another to choose the length of the adjustable rod and a locking element is inserted through a pair of aligned holes to couple the first and second elongate members and secure or fix the length of the expandable rod. | 05-14-2015 |
Erik A. Mcshane, Phoenix, AZ US
Patent application number | Description | Published |
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20080238390 | Dynamically adjusted multi-phase regulator - In some embodiments, a multi-phase converter with dynamic phase adjustment is provided. | 10-02-2008 |
20080238655 | Arrangements for integrated circuit power management - A configurable power control system is disclosed. The power control system can include a control module, an enable/disable module coupled to a power rail (i.e. an internal power line) to enable and disable power to the power rail. The system can also include a sequencer module coupled to the first and a second power rail to sequence power to the power rail(s). The system can also include a fault detect module to detect system parameters. Additionally, the system can include a memory module to store user input and can store detected faults to be utilized by the control module and other modules to control interrelationships between the enable module, the sequencer module, the fault detect module, power in, and power provided via the power rails. | 10-02-2008 |
20100033236 | PACKAGED VOLTAGE REGULATOR AND INDUCTOR ARRAY - Inductors packaged with a voltage regulator for an integrated circuit within the same package are deposited to a sufficient thickness to reduce resistance and improve the quality factor. Furthermore, the voltage regulator switches currents through the inductors at a relatively high frequency such that the overall size and inductances of the inductors may be reduced. As a consequence, integrating both the integrated circuits including a voltage regulator and associated inductor array in a single package is facilitated. Other embodiments are described and claimed. | 02-11-2010 |
James Mcshane, Wake Forest, NC US
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20090136564 | MICELLES - The present invention provides micelles, solutions comprising micelles, methods for preparing micelles, and methods for delivering micelles to patients. The micelles have fixed, preselected hydrodynamic diameters and are formed from basic or acidic amphiphilic compounds. | 05-28-2009 |
John Bernard Mcshane, Washington, DC US
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20080268391 | Safety candle - A self-extinguishing candle comprising wax and a wick embedded therein, the improvement comprising providing at least one fire resistant area on the wick to control interval burning. | 10-30-2008 |
John Matthew Mcshane, Olney, MD US
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20140083365 | CAGE FOR GROWING MOLLUSKS, ASSEMBLY KIT, AND METHOD OF HARVESTING MOLLUSKS - A cage for use in farming mollusks comprises a meshed wall with end caps that are snapped into place on the wall during construction. The end caps include removable portions for gaining access to the interior of the cage. A vessel for farming mollusks is fitted to receive a cage for processing of the cage and the mollusks therein. A method of using the vessel and cage includes the on-board treatment of the cages and mollusks. | 03-27-2014 |
Marjorie Joan Mcshane, Reisterstown, MD US
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20140113263 | Clinical Training and Advice Based on Cognitive Agent with Psychological Profile - A method and apparatus for a clinical simulation system targets psychological phenomena that can negatively impact the decision making of both a clinician and a patient. Techniques include identifying an independently reasoning agent in a medical clinical information processing system configured to simulate interactions between a clinician and a patient. The method also includes determining, on the system, psychological profile data that indicates one or more personality traits for the agent. The method further includes storing psychological profile data on the system in a hierarchical data structure for a natural language processing system. The method still further includes determining simulation output from the system based at least in part on the psychological profile data. | 04-24-2014 |
Matthew Mcshane, Upton, MA US
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20110131326 | Arrangements and Methods for Access to Stored Data - An access server generates a handshake with storage servers resulting in more rapid access to the stored data, for example, video data, by a user. The handshake also results in load balancing effects. | 06-02-2011 |
20130117450 | ARRANGEMENTS AND METHODS FOR ACCESS TO STORED DATA - An access server generates a handshake with storage servers resulting in more rapid access to the stored data, for example, video data, by a user. The handshake also results in load balancing effects. | 05-09-2013 |
Michael A. Mcshane, Columbus, OH US
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20120277881 | TIBIAL COMPONENT - Methods, systems, and apparatuses are disclosed for a tibial component having shock absorbing features. | 11-01-2012 |
20140316527 | TIBIAL COMPONENT - Methods, systems, and apparatuses are disclosed for a tibial component having shock absorbing features. | 10-23-2014 |
Michael B. Mcshane, Austin, TX US
Patent application number | Description | Published |
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20090196086 | HIGH BANDWIDTH CACHE-TO-PROCESSING UNIT COMMUNICATION IN A MULTIPLE PROCESSOR/CACHE SYSTEM - A processor/cache assembly has a processor die coupled to a cache die. The processor die has a plurality of processor units arranged in an array. There is a plurality of processor sets of contact pads on the processor units, one processor set for each processor unit. Similarly, the cache die has a plurality of cache units arranged in an array. There is a plurality of cache sets of contact pads on the cache die, one cache set for each cache unit. Each cache set is in contact with one corresponding processor set. | 08-06-2009 |
20100117242 | TECHNIQUE FOR PACKAGING MULTIPLE INTEGRATED CIRCUITS - A semiconductor device includes an intermediate substrate having a first surface and a second surface, a first die attached to the first surface of the intermediate substrate. The first die has a first active surface, and the first active surface faces the intermediate substrate. A second die is attached to the second surface of the intermediate substrate, has a second active surface, faces the intermediate substrate, and is coupled to the first die through an electrically conductive material in the intermediate substrate. An organic material encapsulates at least an edge of the intermediate substrate. There is also a method of forming the semiconductor device. | 05-13-2010 |
20110057306 | EDGE MOUNTED INTEGRATED CIRCUITS WITH HEAT SINK - A module has a substrate, first and second integrated circuits, and a heat sink. The integrated circuits each have a first major surface, a second major surface, a first edge, a second edge, and a third edge and have optical circuits having ports on the first edge and electronic circuits having ports on the second edge. The second edges are connected to the substrate. The first major surface of the second integrated circuit is parallel with the second major surface of the first integrated circuit. The heat sink has a backplane adjacent to the third edge, a first portion along the first major surface of the first integrated circuit, a second portion along the second major surface of the second integrated circuit extending from the backplane, and an insert between the first major surface of the second integrated circuit and the second major surface of the first integrated circuit. | 03-10-2011 |
20110108965 | SEMICONDUCTOR DEVICE PACKAGE - A method for forming a semiconductor device package includes providing a lead frame array having a plurality of leads. Each of the plurality of leads includes an opening extending through the lead from a first surface of the lead to a second surface of the lead, opposite the first surface, and each of the openings is at least partially filled with a solder wettable material. A plurality of semiconductor devices are attached to the lead frame array. The plurality of semiconductor devices are encapsulated, and, after encapsulating, the plurality of semiconductor devices are separated along separation lines which intersect the openings | 05-12-2011 |
20120020040 | Package-to-package stacking by using interposer with traces, and or standoffs and solder balls - The present invention discloses the structure and process for fabrication of an electronic package to contain and protect Package-to-Package (P2P) stacked module of integrated circuit (IC) chips. The process includes a step of providing an interposer that includes conductive traces interconnected between pre-designated contact pads disposed on a top and/or bottom surfaces for mounting at least a top or bottom packages of the IC chips with electric terminals contacting the contact pads disposed on the top and/or bottom surface of the interposer. Standoffs and passive components can also be added onto interposer in order to improve solder joints reliability, electrical performance and main board density at the same time. The inclusion of passive components on the interposer could enhance the electrical performance and the testability of the finished package stack. | 01-26-2012 |
20130087926 | STACKED SEMICONDUCTOR DEVICES - A stacked semiconductor device includes a first, a second, a third, and a fourth semiconductor device. A first major surface of each of the first and second semiconductor devices which includes the active circuitry directly face each other, and a first major surface of each of the third and fourth semiconductor devices which includes the active circuitry directly face each other. A second major surface of the second semiconductor device directly faces a second major surface of the third semiconductor device. The stacked semiconductor device includes a plurality of continuous conductive vias, wherein each continuous conductive via extends from the second major surface of the first device, through the first device, second device, third device, and fourth device to the second major surface of the fourth device. Each of the semiconductor devices may include a beveled edge at the first major surface on at least one edge of the device. | 04-11-2013 |
20130088255 | STACKED SEMICONDUCTOR DEVICES - A stacked semiconductor device includes a first and a second semiconductor device. A first major surface of each of the first and second devices which includes the active circuitry directly face each other. The first major surface of each of the devices includes a beveled edge on at least one edge, and a probe pad which extends onto the beveled edge. A first opening is located between the beveled edges of the first and second devices on a vertical side of the stacked semiconductor device. | 04-11-2013 |
20130181350 | SEMICONDUCTOR DEVICES WITH NONCONDUCTIVE VIAS - An electric device with vias that include dielectric structures to prevent conductive material in the vias from electrically connecting conductive structures on a top of the vias with conductive structures on the bottom of the vias. The dielectric structures are formed in selected vias where other vias do not include the dielectric structures. | 07-18-2013 |
20130320480 | METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENSITIVE SEMICONDUCTOR DEVICES - A semiconductor device comprises an integrated circuit (IC) die having a top side and a back side. The circuit substrate includes a heat source circuit, a heat sensitive circuit, a package substrate coupled to the top side of the circuit substrate, and a plurality of thermally conductive through-silicon vias (TSVs) formed from the back side of the circuit substrate to near but not through the top side of the circuit substrate. | 12-05-2013 |
20140001641 | METHODS AND STRUCTURES FOR REDUCING HEAT EXPOSURE OF THERMALLY SENSITIVE SEMICONDUCTOR DEVICES | 01-02-2014 |
20140071652 | TECHNIQUES FOR REDUCING INDUCTANCE IN THROUGH-DIE VIAS OF AN ELECTRONIC ASSEMBLY - An electronic assembly includes a processor die assembly, a first die assembly, and a second die assembly. The first die assembly is positioned on a first side of the processor die assembly. The second die assembly is positioned on a second side of the processor die assembly opposite the first side of the processor die assembly. Through-die vias couple the first and second die assemblies to the processor die assembly. | 03-13-2014 |
20140197541 | MICROELECTRONIC ASSEMBLY HAVING A HEAT SPREADER FOR A PLURALITY OF DIE - A microelectronic assembly ( | 07-17-2014 |
20140252487 | Gate Security Feature - An anti-counterfeiting security circuit is incorporated into an authentic integrated circuit device to induce failure in a counterfeited integrated circuit device by forming the security circuit (e.g., | 09-11-2014 |
20140362425 | Communication System Die Stack - A high density, low power, high performance information system, method and apparatus are described in which perpendicularly oriented processor and memory die stacks ( | 12-11-2014 |
20140363119 | Integration of a MEMS Beam with Optical Waveguide and Deflection in Two Dimensions - A high density, low power, high performance information system, method and apparatus are described in which an integrated circuit apparatus includes a plurality of deflectable MEMS optical beam waveguides (e.g., | 12-11-2014 |
20140363120 | Optical Backplane Mirror - An integrated circuit optical backplane die and associated semiconductor fabrication process are described for forming optical backplane mirror structures for perpendicularly deflecting optical signals out of the plane of the optical backplane die by selectively etching an optical waveguide semiconductor layer ( | 12-11-2014 |
20140363124 | Optical Redundancy - A high density, low power, high performance information system, method and apparatus are described in which an integrated circuit apparatus includes a first integrated circuit link element ( | 12-11-2014 |
20140363153 | Optical Die Test Interface - An integrated circuit optical die test interface and associated testing method are described for using scribe area optical mirror structures ( | 12-11-2014 |
20140363172 | Die Stack with Optical TSVs - A high density, low power, high performance information system, method and apparatus are described in which a laser source ( | 12-11-2014 |
20140363905 | Optical Wafer and Die Probe Testing - An optical die probe wafer testing circuit arrangement and associated testing methodology are described for mounting a production test die ( | 12-11-2014 |
20150008567 | USING AN INTEGRATED CIRCUIT DIE CONFIGURATION FOR PACKAGE HEIGHT REDUCTION - A semiconductor device includes a semiconductor die having a first major surface and a second major surface opposite the first major surface, a first minor surface and a second minor surface opposite the first minor surface, a plurality of contact pads on the first major surface, and a notch which extends from the first minor surface and the second major surface into the semiconductor die. The notch has a notch depth measured from the second major surface into the semiconductor die, wherein the notch depth is less than a thickness of the semiconductor die, and a notch length measured from the first minor surface into the semiconductor die, wherein the notch length is less than a length of the semiconductor die measured between the first and second minor surfaces. The device includes a lead having a first end in the notch, and an encapsulant over the first major surface. | 01-08-2015 |
20150061097 | EDGE COUPLING OF SEMICONDUCTOR DIES - Edge coupling of semiconductor dies. In some embodiments, a semiconductor device may include a first semiconductor die, a second semiconductor die disposed in a face-to-face configuration with respect to the first semiconductor die, and an interposer arranged between the first semiconductor and second semiconductor dies, the interposer having an edge detent configured to allow an electrical coupling between the first and second semiconductor dies. In other embodiments, a method may include coupling a first semiconductor die to a surface of an interposer where an edge of the interposer includes detents and the first semiconductor die includes a first pad aligned with a first detent, coupling a second semiconductor die to an opposite surface of the interposer where the first and second semiconductor dies are in a face-to-face configuration and the second semiconductor die includes a second pad aligned with a second detent, and coupling the first and second pads together. | 03-05-2015 |
20150115463 | STACKED SEMICONDUCTOR DEVICES - A stacked semiconductor device includes a first and second semiconductor device having a first major surface and a second major surface opposite the first major surface, the first major surface of the first and second semiconductor devices include active circuitry. The first and second semiconductor devices are stacked so that the first major surface of the first semiconductor device faces the first major surface of the second semiconductor device. At least one continuous conductive via extends from the second major surface of the first semiconductor device to the first major surface of the second semiconductor device. Conductive material fills a cavity adjacent to the contact pad and is in contact with one side of the contact pad. Another side of the contact pad of the first semiconductor device faces and is in contact with another side of the contact pad of the second semiconductor device. | 04-30-2015 |
20150115474 | WIREBOND RECESS FOR STACKED DIE - A first semiconductor device die is provided having a bottom edge incorporating a notch structure that allows sufficient height and width clearance for a wire bond connected to a bond pad on an active surface of a second semiconductor device die upon which the first semiconductor device die is stacked. Use of such notch structures reduces a height of a stack incorporating the first and second semiconductor device die, thereby also reducing a thickness of a semiconductor device package incorporating the stack. | 04-30-2015 |
Molly Mcshane, Los Altos, CA US
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20140271095 | STAIR TRAVERSING DELIVERY APPARATUS - According to an aspect of the invention, an apparatus for transporting objects comprises a frame for receiving at least one object, at least one handle coupled to the frame, at least one set of wheels coupled to the frame, at least one track coupled to the frame, wherein the track allows movement of the apparatus in addition to the wheels, and at least one brake mechanism coupled to the frame. | 09-18-2014 |
Niall John Mcshane, Arlington Heights, IL US
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20150039666 | DISTRIBUTED STORAGE NETWORK WITH CLIENT SUBSETS AND METHODS FOR USE THEREWITH - A method includes identifying a plurality of DST client modules affiliated with data for storage in the DST network. A corresponding subset of a plurality of DST execution units are identified for each of the plurality of DST client modules. The data is encoded into a plurality of slices based on at least one dispersal parameter, the number of the plurality of slices corresponding to a number of the plurality of DST execution units included in a superset formed from the union of each subset of a plurality of DST execution units corresponding to each of the plurality of DST client modules. The plurality of slices are sent for storage in the superset formed from the union of each subset of a plurality of DST execution units. | 02-05-2015 |
Robert J. Mcshane, Chicago, IL US
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20100079570 | Apparatus for electrostatic coating - The present invention generally relates to an electrostatic coating apparatus for spraying a stream of particles onto a medium, and in particular to an apparatus equipped with a powder coating suspension device such as a multivolume chamber, or a air stream creation device. What is also contemplated is the use of a plurality of variable openings in the enclosure, used in conjunction with a plurality of conductors, to dispose a stream of particles onto a moving medium in successive layers. In yet another embodiment, the stream of particles is directed in a directional electrical field created by electrodes placed adjacent to directional shields. The present disclosure relates to an in-line industrial device able to coat paint, starch, thermoplastic materials, or any other powder material onto a medium by successively controlling a plurality of parameters. | 04-01-2010 |
Ryan Patrick Mcshane, Raleigh, NC US
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20140101675 | COMMUNICATING BETWEEN A FIRST OPERATING ENVIRONMENT AND A SECOND OPERATING ENVIRONMENT IN AN OPERATING SYSTEM - An apparatus for communicating between a first operating environment and a second operating environment in an operating system includes a storage device storing machine-readable code and a processor executing the machine-readable code. The machine-readable code includes a receiving module receiving a request in a first operating environment from an application executing in a second operating environment. The first and second operating environments are provided by a common operating system. The request is communicated through a first communication path. The machine-readable code includes a response module sending a response from the first operating environment to the application in the second operating environment through a second communication path distinct from the first communication path. | 04-10-2014 |
Ryan Patrick Mcshane, Durham, NC US
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20140092143 | CONTENT BOUND GRAPHIC - A method can include accessing content stored in a data store where the content includes a bound and content adjacent to the bound; rendering a portion of the content to a display; receiving a scroll command that calls for rendering the content adjacent to the bound; and, responsive to receipt of the scroll command, rendering a bound graphic. Various other apparatuses, systems, methods, etc., are also disclosed. | 04-03-2014 |
Stephen J. Mcshane, Oak Brook, IL US
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20080204030 | Battery tester with promotion feature - Battery maintenance equipment is provided for use in maintaining storage batteries. The battery maintenance equipment includes battery maintenance circuitry. A redemption code output is provided and configured to provide an output having a redeemable value in response to the battery maintenance circuitry. A method includes outputting a redemption code in response to usage of battery maintenance equipment. | 08-28-2008 |
20090024266 | BATTERY TESTER FOR ELECTRIC VEHICLE - Testing or diagnostics are performed on an electric vehicle. The vehicle is operated and current flow through a system of the vehicle is monitored. A voltage related to the system is also monitored. Diagnostics are provided based upon the monitored voltage and the monitored current. | 01-22-2009 |
20100289498 | BATTERY TESTER WITH PROMOTION FEATURE - Battery maintenance equipment is provided for use in maintaining storage batteries. The battery maintenance equipment includes battery maintenance circuitry. A redemption code output is provided and configured to provide an output having a redeemable value in response to the battery maintenance circuitry. A method includes outputting a redemption code in response to usage of battery maintenance equipment. | 11-18-2010 |
20120182132 | SYSTEM FOR AUTOMATICALLY GATHERING BATTERY INFORMATION - A method and apparatus is provided in which a radio frequency identification (RIFD) tag is associated with the storage battery and is used in conjunction with a battery test, battery charger, or other battery maintenance. A cable configured to be affixed to the storage battery. The cable is configured to store information and wirelessly communicate the information to a battery tester. A battery maintenance device configured to couple to the battery and to perform battery maintenance on the battery through the cable. The battery maintenance device includes wireless communication circuitry configured to communicate with a memory of the cable. | 07-19-2012 |
20130158782 | BATTERY TESTER FOR ELECTRIC VEHICLE - Testing or diagnostics are performed on an electric vehicle. The vehicle is operated and current flow through a system of the vehicle is monitored. A voltage related to the system is also monitored. Diagnostics are provided based upon the monitored voltage and the monitored current. | 06-20-2013 |