Patent application number | Description | Published |
20100316682 | Biodegradable Hyaluronic Acid Derivative, Biodegradable Polymeric Micelle Composition and Pharmaceutical or Bioactive Composition - The invention provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C═O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C | 12-16-2010 |
20120283429 | Biodegradable Hyaluronic Acid Derivative - The description provides a biodegradable hyaluronic acid derivative including at least one modified hyaluronic acid repeating unit represented by the formula (HA)-[O(C═O)NH-M]p, wherein HA is a unit including N-acetyl-D-glucosamine and D-glucuronic acid, M is a modifying moiety containing a C | 11-08-2012 |
20130149542 | BRUSH POLYMER AND MEDICAL USE THEREOF - The present disclosure provides a brush polymer, including: a linear polymer main chain; and brush structural side chains, including: a hydrophobic molecular branch, and a hydrophilic molecular branch and/or an anti-biofilm/or an anti-microbial molecular branch, wherein the linear polymer main chain is conjugated to the side chains by covalent bonds formed between a hydroxyl group and a reactive functional group, wherein the reactive functional group includes: isocyanate, carboxyl, or epoxy. The present disclosure also provides a medical application of the brush polymer. | 06-13-2013 |
Patent application number | Description | Published |
20120043115 | FLEXIBLE CIRCUIT STRUCTURE WITH STRETCHABILITY AND METHOD OF MANUFACTURING THE SAME - In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate. | 02-23-2012 |
20120150078 | MEDICAL DRESSING AND NEGATIVE PRESSURE WOUND THERAPY APPARATUS USING THE SAME - A medical dressing is provided. The medical dressing includes a first and a second woven layers respectively having a fiber of polyurethane or a yarn of polyurethane; and a plurality of linear support portions woven between the first and second woven layers. | 06-14-2012 |
20140084413 | PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME - A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a top surface and a bottom surface opposing the top surface; an insulating protective layer formed on the top surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and passive components provided on or embedded in the interposer. By integrating the passive components into the package substrate, when a chip is provided on the interposer, the conductive path between the chip and the passive components can be shortened, and the pins of the chip have a stable voltage. Therefore, the overall electrical performance is enhanced. | 03-27-2014 |
20140117557 | PACKAGE SUBSTRATE AND METHOD OF FORMING THE SAME - A package substrate and a method for forming the package substrate are disclosed. The package substrate includes an interposer having a plurality of conductive through vias and a first insulating layer formed on the sidewalls of the conductive through vias, a second insulating layer formed on one side of the interposer, and a plurality of conductive vias formed in the second insulating layer and electrically connected to the conductive through vias. By increasing the thickness of the first insulating layer, the face diameter of the conductive through vias can be reduced, and the layout density of the conductive through vias in the interposer can thus be increased. | 05-01-2014 |
Patent application number | Description | Published |
20100102421 | INTEGRATED CIRCUIT CHIP WITH SEAL RING STRUCTURE - An integrated circuit chip includes an analog and/or RF circuit block and a seal ring structure surrounding the analog and/or RF circuit block. The seal ring structure comprises a continuous outer seal ring and an inner seal ring, wherein the inner seal ring comprises a gap that is situated in front of the analog and/or RF circuit block. | 04-29-2010 |
20110049671 | BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP USING SUCH BONDING PAD STRUCTURE - An integrated circuit chip includes a substrate; a topmost metal layer over the substrate; a lower metal layer on or over the substrate and lower than the topmost metal layer; and at least one bonding pad in the lower metal layer. | 03-03-2011 |
20110156260 | PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE - An integrated circuit chip includes a substrate; a topmost metal layer overlying the substrate; and a pad in the topmost metal layer. A thickness of the pad is less than a thickness of the topmost metal layer. | 06-30-2011 |
20120313217 | SEAL RING STRUCTURE WITH CAPACITOR - A semiconductor device is disclosed. The semiconductor device includes a semiconductor substrate of a conductivity type having a chip region enclosed by a seal ring region. An insulating layer is on the semiconductor substrate. A seal ring structure is embedded in the insulating layer corresponding to the seal ring region. A capacitor is disposed under the seal ring structure and is electrically connected thereto, wherein the capacitor includes a body of the semiconductor substrate. | 12-13-2012 |
20130026718 | DIE SEAL RING STRUCTURE - The invention provides a die seal ring structure. The die seal ring structure includes an inner seal ring portion surrounding an integrated circuit region. An outer seal ring portion is surrounded by a scribe line, surrounding the inner seal ring portion, wherein the outer seal ring portion has an outer top metal layer pattern with a first width extending over the inner seal ring portion and connecting to an inner next-to-top metal layer pattern of the inner seal ring portion. A first redistribution pattern is disposed on the outer top metal layer pattern, having a second width which is narrower than the first width. A second redistribution pattern is disposed on the first redistribution pattern. A redistribution passivation layer covers the second redistribution pattern and the inner seal ring portion, wherein the redistribution passivation layer is separated from the scribe line by a second distance. | 01-31-2013 |
20130037937 | BUMP PAD STRUCTURE - A bump pad structure for a semiconductor package is disclosed. A bump pad structure includes a conductive pad disposed on an insulating layer. A ring-shaped conductive layer is embedded in the insulating layer and is substantially under and along an edge of the conductive pad. At least one conductive via plug is embedded in the insulating layer and between the conductive pad and the ring-shaped conductive layer, such that the conductive pad is electrically connected to the ring-shaped conductive layer. | 02-14-2013 |
20130264676 | SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA INTERCONNECT AND METHOD FOR FABRICATING THE SAME - The invention provides a semiconductor package with a through silicon via (TSV) interconnect and a method for fabricating the same. An exemplary embodiment of the semiconductor package with a TSV interconnect includes a semiconductor substrate. A through hole is formed through the semiconductor substrate. A TSV interconnect is disposed in a through hole. A conductive layer lines a sidewall of the through hole, surrounding the TSV interconnect. | 10-10-2013 |
20130270670 | SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA INTERCONNECT - The invention provides a semiconductor package with a through silicon via (TSV) interconnect. An exemplary embodiment of the semiconductor package with a TSV interconnect includes a semiconductor substrate, having a front side and a back side. A contact array is disposed on the front side of the semiconductor substrate. An isolation structure is disposed in the semiconductor substrate, underlying the contact array. The TSV interconnect is formed through the semiconductor substrate, overlapping with the contact array and the isolation structure. | 10-17-2013 |
20140021619 | PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE - An integrated circuit chip includes a substrate; at least one inter-metal dielectric layer over the substrate; a topmost metal layer overlying the inter-metal dielectric layer; a bonding pad in the topmost metal layer, the bonding pad comprising a central thinner portion and a peripheral thicker portion surrounding the central thinner portion; and a passivation layer covering the peripheral thicker portion. | 01-23-2014 |
20140070346 | RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME - The invention provides a radio-frequency (RF) device package and a method for fabricating the same. An exemplary embodiment of a radio-frequency (RF) device package includes a base, wherein a radio-frequency (RF) device chip is mounted on the base. The RF device chip includes a semiconductor substrate having a front side and a back side. A radio-frequency (RF) component is disposed on the front side of the semiconductor substrate. An interconnect structure is disposed on the RF component, wherein the interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure. A through hole is formed through the semiconductor substrate from the back side of the semiconductor substrate, and is connected to the interconnect structure. A TSV structure is disposed in the through hole. | 03-13-2014 |
20140070416 | GUARD RING STRUCTURE AND METHOD FOR FORMING THE SAME - A guard ring structure is provided, including a semiconductor substrate with a circuit region encircled by a first ring and a second ring. In one embodiment, the semiconductor substrate has a first dopant type, and the first and second ring respectively includes a plurality of separated first doping regions formed in a top portion of the semiconductor substrate, having a second dopant type opposite to the first conductivity type, and an interconnect element formed over the semiconductor substrate, covering the first doping regions. | 03-13-2014 |
20140312470 | SEAL RING STRUCTURE WITH CAPACITOR - A semiconductor device includes a semiconductor substrate of a first conductivity type having a chip region enclosed by a seal ring region. An insulating layer is on the semiconductor substrate. A seal ring structure is embedded in the insulating layer corresponding to the seal ring region. And, a plurality of doping regions are located beneath the first seal ring structure. | 10-23-2014 |
20150091158 | PACKAGE STRUCTURE - A package structure, comprising: a substrate, having at least one conductive units provided at a first surface of the substrate; at least one first die, provided on a second surface of the substrate; a connecting layer; a second die, provided on the connecting layer, wherein the connecting layer comprises at least one bump for connecting the first die to the second die such that the first die and the second die are electrically connected; and at least one bonding wire, for electrically connecting the first die to the conductive units or the substrate. | 04-02-2015 |
20150162242 | RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a electronic device package provides a electronic device chip, wherein the electronic device chip includes a semiconductor substrate having a front side and a back side, wherein the semiconductor substrate has a first thickness, an electronic component disposed on the front side of the semiconductor substrate, and an interconnect structure disposed on the electronic component. The method further performs a thinning process to remove a portion of the semiconductor substrate from the back side thereof The method then removes a portion of the thinned semiconductor substrate and a portion of a dielectric layer of the interconnect structure from a back side of the thinned semiconductor substrate until a first metal layer pattern of the interconnect structure is exposed, thereby forming a through hole. Finally, the method forms a TSV structure in the through hole, and mounts the electronic device chip on a base. | 06-11-2015 |
20150162267 | RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME - An electronic device package has a base and an electronic device chip mounted on the base. The electronic device chip includes a semiconductor substrate having a front side and a back side, a electronic component disposed on the front side of the semiconductor substrate, an interconnect structure disposed on the electronic component, a through hole formed through the semiconductor substrate from the back side of the semiconductor substrate, connecting to the interconnect structure, and a TSV structure disposed in the through hole. The interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure. | 06-11-2015 |
Patent application number | Description | Published |
20090160539 | Voltage reference circuit - A voltage reference circuit comprises a current mirror set, a first resistor, a first MOS transistor, and a second MOS transistor. The output end of the current mirror set is coupled to a first resistor, and the node of the current mirror set is coupled to the first MOS transistor, furthermore, the second MOS transistor is coupled to the first MOS transistor, and the first end and the gate of the second MOS transistor are coupled each other, such that a stable voltage reference will be obtained between the first MOS transistor and the second MOS transistor. | 06-25-2009 |
20090167574 | Amplifier gain control circuit for the wireless transceiver - An amplifier gain control circuit for the wireless transceiver comprises at least one amplifier, an analog to digital converter (ADC), a digital to analog converter (DAC) and a bias circuit, wherein the ADC is used for receiving an analog gain control voltage to generate a digital control signal that can be used for controlling the gain of the amplifier, the DAC is used for receiving the digital signal to generate an analog signal, and the bias circuit is used for receiving the analog signal and the analog gain control voltage to further fine-tune the gain of the amplifier by the analog process for correcting the least bit error during the digital process, therefore, the amplifier during the gain adjustment will be prevented to operate in the nonlinear area. | 07-02-2009 |
20100015937 | GAIN CONTROL CIRCUIT OF THE WIRELESS RECEIVER - A gain control circuit of the wireless receiver comprises a plurality of stages-amplifier, an analog gain control circuit, and a digital gain control circuit, wherein the analog gain control circuit generates an analog controlling voltage for regulating the gain of the post-amplifier by an analog gain controlling process, and the digital gain control circuit is used for determining a plurality of gain curves for the pre-amplifier, and the gain curves are all operating between the first default voltage and second default voltage. While the analog controlling voltage is over the first default voltage or second default voltage, the gain curve will be switched, thereby, the analog gain controlling process can be with the digital gain controlling process therein for improving the linearity of the gain regulation and reducing the transient response during the gain switching process. | 01-21-2010 |
20150108942 | CHARGEABLE DEVICE - A chargeable device is disclosed. The chargeable device of the present invention comprises a main circuit module with a coil, and at least one integrated circuit module with a compensation capacitor operated with the coil. | 04-23-2015 |
20150181150 | METHOD AND SYSTEM FOR RECEPTION OF DIGITAL TELEVISION SIGNAL - The present invention provides a digital television signal reception system, comprising a chip having a low-noise amplifier and a master receiver, at least one slave receiver, and at least one local-oscillator leakage processing unit. The chip receives at least one digital input signal of television channel. The low-noise amplifier amplifies and sends the input signal of television channel to the master/slave receiver. The input signal of television channel is frequency-mixed by the master/slave receiver so as to output an output signal of second television channel and an output signal of second television channel. The local-oscillator leakage processing unit detects and removes local-oscillator leakage of the master receiver included in the output signal of second television channel, so as to avoid interference of the local leakage of master receiver on sensitivity of receiving the output signal of second television channel of slave receiver by the slave television. | 06-25-2015 |
Patent application number | Description | Published |
20130147740 | TOUCH DISPLAY DEVICE - A touch display device includes a display panel, a touch panel, and a non-self-luminescent display panel. The display panel includes at least one luminescent unit for generating a display image. The touch panel is disposed correspondingly to the display panel. The non-self-luminescent display panel is disposed between the touch panel and the display panel. The non-self-luminescent display panel includes a display medium layer for generating a non-self-luminescent display image or for being transparent to let the display image from the display panel pass through the display medium layer. | 06-13-2013 |
20130201348 | CAPACITIVE TOUCH PANEL - A capacitive touch panel includes a substrate, a plurality of first axis electrodes, and a plurality of second axis electrodes. Each of the first axis electrodes includes at least one first sensing electrode, and the first sensing electrode has a first electrode pattern region and a second electrode pattern region. Each of the second axis electrodes includes at least one second sensing electrode, and the second sensing electrode has a third electrode pattern region and a fourth electrode pattern region. A pattern density of the first electrode pattern region is higher than a pattern density of the second electrode pattern region, and a pattern density of the third electrode pattern region is higher than a pattern density of the fourth electrode pattern region. | 08-08-2013 |
20130206568 | TOUCH PANEL - A touch panel including a first substrate, a second substrate, a first sensing layer, a second sensing layer, and a plurality of spacers is provided. The second substrate is parallel to and opposite to the first substrate in a top-bottom manner. The first sensing layer is disposed on the first substrate and located between the first substrate and the second substrate. The second sensing layer is disposed on the second substrate. The spacers are located between the first sensing layer and the second sensing layer, and the spacers includes a plurality of movable first spacers and a plurality of second spacers fixed on the second substrate, wherein each of the first spacers is surrounded by a portion of the second spacers. | 08-15-2013 |
20130306946 | TOUCH DISPLAY PANEL - A touch display panel including a array substrate, an opposite substrate, an organic light emitting diode (OLED) structure, a plurality of conductive spacers and a sealant is provided. The OLED structure is disposed on the opposite substrate and located between the array substrate and the opposite substrate. The OLED structure includes a first electrode layer, an organic light emitting layer and a second electrode layer which are sequentially disposed. The first electrode layer is located on the opposite substrate and includes a plurality of touch sensing electrode. The second electrode layer is electrically connected to the array substrate via the conductive spacers. The sealant is sealed the OLED structure and the conductive spacers between the array substrate and the opposite substrate. | 11-21-2013 |
20130342891 | ELECTROWETTING DISPLAY DEVICE - An electrowetting display device includes a lower substrate, an upper substrate, a medium layer, a lower electrode, an upper electrode, and a molecular chain layer. The medium layer is disposed between the lower substrate and the upper substrate. The medium layer includes a first medium and a second medium separated from each other. The first medium is a light transmission medium, and the second medium is a light-shielding medium. The lower electrode is disposed between the medium layer and the lower substrate. The molecular chain layer is disposed between the medium layer and the lower electrode. The molecular chain layer includes molecular chains. Each molecular chain has a first section and a second section. The first section is used to attract the first medium or repel the second medium. The second section is used to attract the second medium or repel the first medium. | 12-26-2013 |
20140320352 | TOUCH PANEL MODULE AND TOUCH DISPLAY PANEL WITH ANTENNA STRUCTURE - A touch panel module with antenna structure includes a touch panel, a structure layer and an antenna coil. The structure layer includes a first surface and a second surface that are opposite to each other, and the first surface of the structure layer faces the touch panel. The antenna coil is disposed on the first surface of the structure layer. | 10-30-2014 |
20140354907 | COMPOSITE TOUCH COVER PLATE - A composite touch cover plate defined with a touch surface and an inner surface is provided. The composite touch cover plate includes a substantially homogeneous polymer layer and a fibrous layer. The fibrous layer is located at one side of the polymer layer and near the touch surface. A ratio of a thickness of the fibrous layer to a thickness of the polymer layer lies between 1:9 and 1:49. | 12-04-2014 |
Patent application number | Description | Published |
20120278063 | ELECTRONIC DEVICE AND METHOD FOR SUPPORTING MULTIPLE LANGUAGES IN IMAGE MEASUREMENT PROGRAMS - An electronic device connected to a measurement machine is installed with an image measurement program. The electronic device records detailed information in relation to a new language file added to a template file provided by the image measurement program, and creates one or more executable files for the image measurement program based on the template file. When the image measurement program is started, the electronic device adds the new language to a language selection menu of a user interface of the image measurement program by executing the one or more executable files, displays all languages available to the image measurement program under the language selection menu of the user interface, and after selection and displays all information in a user-selected language. | 11-01-2012 |
20130027544 | ELECTRONIC DEVICE AND METHOD FOR REGULATING COORDINATES OF PROBE MEASUREMENT SYSTEM - In a method for regulating coordinates of a probe measurement system using an electronic device, the method determines a first center of a reference object using a probe measurement system, and a second center of the reference object using an image measurement system. The method further determines regulation values between the probe measurement system and the image measurement system by calculating difference values between coordinates of the first center and the second center of the reference object, and stores the regulation values in a storage device of the electronic device. | 01-31-2013 |
20130124135 | COMPUTING DEVICE AND METHOD FOR AUTOMATICALLY REPLACING PROBES FOR COORDINATE MEASURING MACHINES - In a computing device, computerized method, and a non-transitory storage medium, correction data of a probe holder is read. The probe holder comprises one or more slots that houses all available probes and is placed on the coordinate measuring machine. The correction data comprises coordinates of the slots. A coordinate of one of the slots is obtained from the correction data. A Z-axis of the coordinate measuring machine moves to a position that corresponds to the extracted coordinates, to detach a probe which is currently installed on the Z-axis and to place the detached probe into the slot, and/or to pick up and install another probe which is currently housed in the slot onto the Z-axis. | 05-16-2013 |
20130139046 | COMPUTING DEVICE AND METHOD FOR GENERATING MEASUREMENT REPORT OF OBJECTS - A method generates a measurement report of an object using a computing device. The method obtains measurement data of feature elements of the object, processes the measurement data to obtain output data, and outputs the measurement data of the output data to the measurement report according to a report output way corresponding to a report format, wherein the report format is received from a selection of the user. The measurement report is stored in a storage device of the computing device, or displayed on a display device that is connected to the computing device. | 05-30-2013 |