Matayabas
Chris Matayabas, Chandler, AZ US
Patent application number | Description | Published |
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20080233396 | METHODS OF FORMING CARBON NANOTUBES ARCHITECTURES AND COMPOSITES WITH HIGH ELECTRICAL AND THERMAL CONDUCTIVITIES AND STRUCTURES FORMED THEREBY - Methods and associated structures of forming microelectronic devices are described. Those methods may include method of forming a layered nanotube structure comprising a wetting layer disposed on a nanotube, a Shottky layer disposed on the wetting layer, a barrier layer disposed on the Shottky layer, and a matrix layer disposed on the barrier layer. | 09-25-2008 |
20080237843 | Microelectronic package including thermally conductive sealant between heat spreader and substrate - A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder. | 10-02-2008 |
20100190302 | Electronic Packages with Fine Particle Wetting and Non-Wetting Zones - Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics. | 07-29-2010 |
20110163445 | Electronic Packages With Fine Particle Wetting and Non-Wetting Zones - Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics. | 07-07-2011 |
20120148842 | METHODS OF FORMING CARBON NANOTUBES ARCHITECTURES AND COMPOSITES WITH HIGH ELECTRICAL AND THERMAL CONDUCTIVITES AND STRUCTURES FORMED THEREBY - Methods and associated structures of forming microelectronic devices are described. Those methods may include method of forming a layered nanotube structure comprising a wetting layer disposed on a nanotube, a Shottky layer disposed on the wetting layer, a barrier layer disposed on the Shottky layer, and a matrix layer disposed on the barrier layer. | 06-14-2012 |
James C. Matayabas, Chandler, AZ US
Patent application number | Description | Published |
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20080237841 | Microelectronic package, method of manufacturing same, and system including same - A microelectronic package includes a substrate ( | 10-02-2008 |
20130341379 | HYBRID LOW METAL LOADING FLUX - Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed. | 12-26-2013 |
20140264818 | POLYMER THERMAL INTERFACE MATERIAL HAVING ENHANCED THERMAL CONDUCTIVITY - A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example. | 09-18-2014 |
James C. Matayabas, Gilber, AZ US
Patent application number | Description | Published |
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20140264827 | METHODS OF FORMING WAFER LEVEL UNDERFILL MATERIALS AND STRUCTURES FORMED THEREBY - Methods of forming microelectronic packaging structures and associated structures formed thereby are described. Those methods and structures may include forming a wafer level underfill (WLUF) material comprising a resin material, and adding at least one of a UV absorber, a sterically hindered amine light stabilizer (HALS), an organic surface protectant (OSP), and a fluxing agent to form the WLUF material. The WLUF is then applied to a top surface of a wafer comprising a plurality of die. | 09-18-2014 |
James Christopher Matayabas, Chandler, AZ US
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20080237897 | Microelectronic device having liquid crystalline epoxy resins - Liquid crystalline epoxy compounds, compositions including the compounds, and methods of using the compositions are disclosed. In one aspect, an epoxy compound may have a melting point that is less than 140° C. and may be liquid crystalline at a temperature greater than 150° C. | 10-02-2008 |
James C.j Matayabas, Gilbert, AZ US
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20150279804 | LPS SOLDER PASTE BASED LOW COST FINE PITCH POP INTERCONNECT SOLUTIONS - Embodiments describe high aspect ratio and fine pitch interconnects for a semiconductor package, such as a package-on-package structure. In an embodiment, the interconnects are formed with a no-slump solder paste. In an embodiment, the no-slump solder paste is printed in an uncured state, and is then cured with a liquid phase sintering process. After being cured, the no-slump solder paste will not reflow at typical processing temperatures, such as those below approximately 400° C. According to embodiments, the no-slump solder paste includes Cu particles or spheres, a solder matrix component, a polymeric delivery vehicle, and a solvent. In an embodiment, the liquid phase sintering produces a shell of intermetallic compounds around the Cu spheres. In an embodiment, the sintering process builds a conductive metallic network through the no-slump solder paste. | 10-01-2015 |