Patent application number | Description | Published |
20100013011 | VERTICAL MOSFET WITH THROUGH-BODY VIA FOR GATE - In an embodiment, set forth by way of example and not limitation, a MOSFET power chip includes a first vertical MOSFET and a second vertical MOSFET. The first vertical MOSFET includes a semiconductor body having a first surface defining a source and a second surface defining a drain and a gate structure formed in the semiconductor body near the second surface. A via is formed within the semiconductor body and is substantially perpendicular to the first surface and the second surface. The via has a first end electrically coupled to the first surface and a second end electrically coupled to the gate structure. The second vertical MOSFET includes a semiconductor body having a first surface defining a source, a second surface defining a drain and a gate structure formed in the semiconductor body near the first surface. The first surface of the first vertical MOSFET and the second surface of the second vertical MOSFET are substantially co-planar and an electrically conductive can substantially surrounds the MOSFETS and shorts the first surface of the first vertical MOSFET to the second surface of the second vertical MOSFET. | 01-21-2010 |
20100102416 | Integrated Circuit Packages Incorporating an Inductor and Methods - Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a first area for receiving the integrated circuit, and a second area having a plurality of connections from one side to the other side of the lead frame, thereby forming coil segments. After mounting the integrated circuit and wire bonding its connections, the lead frame is placed on a ferrite plate, the assembly is encapsulated in resin, and the leads trimmed and bent. Mounting of the packaged integrated circuit on a properly prepared printed circuit interconnects the coil segments in the package to coil segments on the printed circuit, thereby forming a single, multi-turn coil around the ferrite plate. Various embodiments are disclosed. | 04-29-2010 |
20110227153 | Vertical Mosfet with Through-Body Via for Gate - In an embodiment, set forth by way of example and not limitation, a MOSFET power chip includes a first vertical MOSFET and a second vertical MOSFET. The first vertical MOSFET includes a semiconductor body having a first surface defining a source and a second surface defining a drain and a gate structure formed in the semiconductor body near the second surface. A via is formed within the semiconductor body and is substantially perpendicular to the first surface and the second surface. The via has a first end electrically coupled to the first surface and a second end electrically coupled to the gate structure. The second vertical MOSFET includes a semiconductor body having a first surface defining a source, a second surface defining a drain and a gate structure formed in the semiconductor body near the first surface. The first surface of the first vertical MOSFET and the second surface of the second vertical MOSFET are substantially co-planar and an electrically conductive can substantially surrounds the MOSFETS and shorts the first surface of the first vertical MOSFET to the second surface of the second vertical MOSFET. | 09-22-2011 |
20120292691 | VERTICAL MOSFET WITH THROUGH-BODY VIA FOR GATE - A MOSFET power chip includes a first vertical MOSFET and a second vertical MOSFET. The first vertical MOSFET includes a semiconductor body having a first surface defining a source and a second surface defining a drain and a gate structure formed in the semiconductor body near the second surface. A via is formed within the semiconductor body and is substantially perpendicular to the first surface and the second surface. The via has a first end electrically coupled to the first surface and a second end electrically coupled to the gate structure. The second vertical MOSFET includes a semiconductor body having a first surface defining a source, a second surface defining a drain and a gate structure formed in the semiconductor body near the first surface. | 11-22-2012 |
20130161817 | TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES - Semiconductor package device, such as wafer-level package semiconductor devices, are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar. | 06-27-2013 |
20140312458 | METHODS AND APPARATUS RELATED TO AN IMPROVED PACKAGE INCLUDING A SEMICONDUCTOR DIE - In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar. | 10-23-2014 |
20150028475 | TECHNIQUE FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES - Semiconductor package device, such as wafer-level package semiconductor devices, are described that have pillars for providing electrical interconnectivity. In an implementation, the wafer-level package devices include an integrated circuit chip having at least one pillar formed over the integrated circuit chip. The pillar is configured to provide electrical interconnectivity with the integrated circuit chip. The wafer-level package device also includes an encapsulation structure configured to support the pillar. | 01-29-2015 |
Patent application number | Description | Published |
20100072615 | High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture Thereof - The present invention has various aspects relating to the maximization of current carrying capacity of wafer level packaged chip scale solder pad mounted integrated circuits. In one aspect, the solder pad areas are maximized by using rectangular solder pads spaced as close together as reliable mounting to a circuit board will allow. In another aspect, multiple contact pads may be used for increasing the current capacity without using contact pads of different areas. In still another aspect, vias are used to directly connect one lead of high current component or components to a contact pad directly above that component, and to route a second lead of the high current component to an adjacent contact pad by way of a thick metal interconnect layer. | 03-25-2010 |
20130089951 | Wafer Level Packaging Using a Lead-Frame - Wafer level packaging using a lead-frame. When used to package two or more chips, a final product having QFN package-like finish. The final product will also have a performance rivaling or exceeding that of a corresponding monolithic chip because of the very close connection of the two or more chips and the ability to tailor the fabrication processing of each chip to only that required for the devices on that chip. The wafer level packaging can also be used to package monolithic chips, as well as chips having active devices on one chip and passive devices on a second chip. Various exemplary embodiments are disclosed. | 04-11-2013 |
20130089953 | Wafer Level Packaging Using a Lead-Frame - Wafer level packaging using a lead-frame. When used to package two or more chips, a final product having QFN package-like finish. The final product will also have a performance rivaling or exceeding that of a corresponding monolithic chip because of the very close connection of the two or more chips and the ability to tailor the fabrication processing of each chip to only that required for the devices on that chip. The wafer level packaging can also be used to package monolithic chips, as well as chips having active devices on one chip and passive devices on a second chip. Various exemplary embodiments are disclosed. | 04-11-2013 |
20150035384 | LOAD BALANCING IN DISCRETE DEVICES - In a general aspect, an apparatus can include a temperature measurement circuit configured to produce a first signal indicating a first operating temperature of a first semiconductor device and a temperature comparison circuit operationally coupled with the temperature measurement circuit. The temperature comparison circuit can be configured to compare the first signal with a second signal indicating a second operating temperature of at least a second semiconductor device and produce a comparison signal indicating whether the indicated first operating temperature is higher, lower or equal to the indicated second operating temperature. The apparatus can also include an adjustment circuit configured to adjust operation of the first semiconductor device based on the comparison signal. | 02-05-2015 |
Patent application number | Description | Published |
20130118027 | VARIABLE AIRFLOW IN LAUNDRY DRYER HAVING VARIABLE AIR INLET - A laundry treating appliance and a method for operating the appliance to supply air into a treating chamber through an air inlet and controlling the supplied air by varying the effective area of the air inlet. | 05-16-2013 |
20130174353 | LAUNDRY TREATING APPLIANCE WITH CONTROLLED RECIPROCATING MOVEMENT - A laundry treating appliance having a motor to rotate a drum about the horizontal axis of rotation and an axial drive mechanism to reciprocate the drum relative to the horizontal axis of rotation. | 07-11-2013 |
20130283633 | LAUNDRY TREATING APPLIANCE WITH BULKY ITEM DETECTION - A laundry treating appliance and method for controlling the operation of a laundry treating appliance having a rotatable drum at least partially defining a treating chamber for receiving laundry for treatment in accordance with a treating cycle of operation by determining the presence of a bulky laundry item based on image data of the laundry within the treating chamber. | 10-31-2013 |
20140033556 | LAUNDRY TREATING APPLIANCE WITH CONTROLLED MECHANICAL ENERGY - A laundry treating appliance and a method for operating a laundry treating appliance having a rotatable drum defining a chamber for receiving laundry. The operation of the laundry treating appliance may be based on the mechanical energy due to the falling action of the laundry. | 02-06-2014 |
20140057213 | BOIL AND BOIL-DRY DETECTION SYSTEMS FOR COOKING APPLIANCES USING VIBRATION SENSORS - A cooking sensor system that includes a burner assembly; and a vibration sensor assembly configured to generate a vibration signal that corresponds to vibrations of cookware situated on the burner assembly. The cooking sensor system also includes a processor to receive the vibration signal and determine at least one of a boiling condition and a boil-dry condition for a liquid contained within the cookware, wherein the determination is based at least in part on the vibration signal. The cooking sensor system further includes an indicator element coupled to the processor to indicate the at least one of a boiling condition and a boil-dry condition. The cooking sensor system may also include a control element coupled to the processor to operate the burner assembly based at least in part on the at least one of a boiling condition and a boil-dry condition. | 02-27-2014 |
20140057214 | BOIL AND BOIL-DRY DETECTION METHODS FOR COOKING APPLIANCES USING VIBRATION SENSORS - A method of boil and boil-dry detection for appliances. The method includes the steps: detecting vibrations that correspond to cookware situated on a burner assembly; generating a vibration signal based on the vibrations; and performing signal processing on the vibration signal. The method also includes the steps: collecting vibration data related to the vibration signal; and detecting boiling and boil-dry conditions for a liquid contained within the cookware based at least in part on an evaluation of the vibration data. The method may also include the steps: indicating the boiling and boil-dry conditions; and controlling the burner assembly based at least in part on the boiling and boil-dry conditions. | 02-27-2014 |
20140123514 | LAUNDRY TREATING APPLIANCE WITH TUMBLE PATTERN CONTROL - An apparatus and a method of operating a laundry treating appliance treating laundry according to a cycle of operation having by determining a parameter indicative of a change in packing density of the laundry in a treating chamber and taking an operating action based on the determined parameter. | 05-08-2014 |
20140317953 | LAUNDRY TREATING APPLIANCES AND METHODS OF CONTROLLING THE SAME TO DETERMINE AN END-OF-CYCLE CONDITION - Laundry treating appliances and methods of controlling the same to determine an end-of-cycle condition are disclosed. An example method of operating a laundry treating appliance having a treating chamber in which laundry is received for treatment, and a heated air system having a supply conduit coupled to the treating chamber and an exhaust conduit coupled to the treating chamber includes supplying heated air to the treating chamber via the supply conduit, exhausting air from the treating chamber via the exhaust conduit, repeatedly determining exhaust air temperatures of the air exhausted from the exhaust conduit, determining a windowed derivative of the exhaust air temperature values, determining a zero crossing of the windowed derivative, and initiating the termination of the supplying of heated air in response to the determination of the zero crossing. | 10-30-2014 |
20140319168 | HANDS FREE, CONTROLLED AUTOFILL FOR A DISPENSER - A dispensing system includes one or more digital image capture devices for capturing images in a dispenser well and a digital image analyzer operatively coupled to the digital image capture device(s) for analyzing the images for use in regulating a dispensing operation. The digital image analyzer evaluates digital images captured by the digital image capture device(s) to determine various characteristics of a container, such as the height and position of the container. | 10-30-2014 |
20140350728 | METHOD OF OPERATING A HOME APPLIANCE - A method of operating a home appliance having a treating chamber for receiving an article for treatment according to an automatic cycle of operation stored in memory of a programmable controller operably controlling one or more actuators to implement the cycle of operation, the method includes implementing the cycle of operation, receiving sensor feedback, calculating gradients from the sensor feedback, and controlling an actuator based thereon. | 11-27-2014 |
20140366398 | LAUNDRY TREATING APPLIANCE WITH FLUFFING-STATE DETECTION - The invention relates to a method of determining a fluffing state of laundry based on a determined temperature indicative of the surface of the laundry. | 12-18-2014 |
20140366586 | EFFICIENT ENERGY USAGE FOR A LAUNDRY APPLIANCE - A laundry treating appliance has a rotatable drum at least partially defining a treating chamber for receiving a laundry load for treatment according to at least one cycle of operation and operated such that the extraction of liquid from the laundry load is controlled based on the inertia of the laundry load so that the total energy usage by the laundry treating appliance and a laundry drying appliance with which it is operably coupled may be minimized. | 12-18-2014 |