Yoshino, US
Fumiyo Yoshino, Santa Clara, CA US
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20100012631 | TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER - Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. | 01-21-2010 |
20100084384 | TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER - Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. | 04-08-2010 |
20100086741 | TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER - Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. | 04-08-2010 |
Fumiyo Yoshino, San Jose, CA US
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20100025387 | TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER - Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed. | 02-04-2010 |
Fumiyo Yoshino, Hillsboro, OR US
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20110147620 | LASER PATTERNING USING A STRUCTURED OPTICAL ELEMENT AND FOCUSED BEAM - Various embodiments provide for laser patterning using a structured optical element and a focused beam. In some embodiments a structured optical element may be integrally formed on a single substrate. In some embodiments, multiple optical components may be combined in an optical path to provide a desired pattern. In at least one embodiment, a projection mask is utilized to control exposure of an object to a laser output, in combination with the controlled motion of the projection mask, the controlled motion of the object and the controlled motion of the laser beam. In some embodiments, a projection mask is utilized to control exposure of an object, and the projection mask may absorb, scatter, reflect, or attenuate a laser output. In some embodiments, the projection mask may include optical elements that vary the optical power and polarization of the transmitted laser beam over regions of the projection mask. In various embodiments, the laser system may modify material of the object. In various embodiments, the laser system may be used to probe a physical property of an object. | 06-23-2011 |
20130095260 | TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER - Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. | 04-18-2013 |
Fumiyo Yoshino, Portland, OR US
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20140004318 | TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER | 01-02-2014 |
Fumiyo Yoshino, Hillsborough, OR US
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20130183474 | TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER - A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. | 07-18-2013 |
Hideki Yoshino, Lake Zurich, IL US
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20140118189 | Systems and Methods for Generating Compensated Speed Values for Doppler-Enabled Device - Implementations relate to systems and methods for generating compensated speed values for a Doppler-enabled device. A portable wireless device can contain a GPS navigation engine ( | 05-01-2014 |
20150031416 | Method and Device For Command Phrase Validation - A method on a mobile device for a wireless network is described. An audio input is monitored for a trigger phrase spoken by a user of the mobile device. A command phrase spoken by the user after the trigger phrase is buffered. The command phrase corresponds to a call command and a call parameter. A set of target contacts associated with the mobile device is selected based on respective voice validation scores and respective contact confidence scores. The respective voice validation scores are based on the call parameter. The respective contact confidence scores are based on a user context associated with the user. A call to a priority contact of the set of target contacts is automatically placed if the voice validation score of the priority contact meets a validation threshold and the contact confidence score of the priority contact meets a confidence threshold. | 01-29-2015 |
20150032238 | Method and Device for Audio Input Routing - A method on a mobile device for processing an audio input is described. A trigger for the audio input is received. At least one parameter is determined for an audio processor based on at least one input characteristic for the audio input. The audio input is routed to the audio processor with the at least one parameter. | 01-29-2015 |
Keisuke Yoshino, Ann Arbor, MI US
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20080279916 | Liposome Preparation - A liposome preparation is provided. This liposome preparation is capable of stably encapsulating a drug which is unstable under an acidic condition, and such stable encapsulation is realized without detracting the effect realized by the modification of the membrane by a hydrophilic macromolecule such as stability in blood. More specifically, the liposome preparation comprises a unilamellar vesicle formed from a lipid bilayer comprising a phospholipid as its main membrane component, and an interior aqueous phase of the vesicle at a pH of up to 5. The liposome has a drug loaded therein, and the vesicle is modified with a hydrophilic macromolecule only on its exterior surface. | 11-13-2008 |
20090232883 | METHOD OF SEPARATING VESICLE, PROCESS FOR PRODUCING MEDICINAL PREPARATION, AND METHOD OF EVALUATION - A method of separating vesicles whose membrane has been modified with a hydrophilic polymer (polyethylene glycol, etc.). In the method, vesicles (liposome, etc.) differing in the degree of membrane modification are separated by ion-exchange chromatography using a concentration gradient in which the ionic intensity of an eluent is changed with time. Also provided are: a process for producing vesicles purified so as to have a desired degree of modification with a hydrophilic polymer which comprises utilizing the separation method in the step of purifying vesicles; a method of evaluating a medicinal vesicle preparation containing a drug therein, the method comprising using the separation method; and vesicles in which the membrane has been modified with a hydrophilic polymer and which include no vesicle having a degree of membrane modification less than 0.5 mol %. | 09-17-2009 |
20100021531 | METHOD FOR PRODUCTION OF LIPOSOME PREPARATION - Disclosed is a method which permits simple and easy production of a stable, high-quality liposome preparation suppressed in lipid degradation. This method can significantly shorten production time and can achieve a substantial cost cut-down in medium- to large-scale production, and can also attain the incorporation of a drug in uniform amounts. Specifically disclosed is a method for producing a liposome preparation by using a remote loading method. This method includes a drug incorporation step that heats a mixture of a suspension of liposomes and a drug, the mixture having been prepared beforehand, by rapid heating means to a temperature from not lower than a phase transition point of membranes of the liposomes to not higher than 80° C. to incorporate the drug into the liposomes. | 01-28-2010 |
Tetsuya Yoshino, Novi, MI US
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20150361605 | SUPPORT GUIDE FOR MAKING DECK SEAMS AND FRENCH SEAMS WITH SLIDE FASTENER - Disclosed is a support guide for sewing a decorative topstitch on a seam with a slide fastener, the support guide including a first top surface; and a second top surface, the first top surface coplanar with the second top surface and spaced apart from the second top surface by a distance sized to accept the slide fastener. | 12-17-2015 |
Toshiaki Yoshino, Fremont, CA US
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20090058695 | ARCHITECTURE FOR MULTI-STAGE DECODING OF A CABAC BITSTREAM - Techniques for optimizing the Context-based Adaptive Binary Arithmetic Coding (CABAC) bitstream decoding are disclosed. In one configuration, a device has a first processing circuit operative to decode a Context-based Adaptive Binary Arithmetic Coding (CABAC) bitstream into an intermediate signal having a CABAC decoded standard format and a decoded order. A second processing circuit decodes the intermediate signal using a non-CABAC decoding standard. A buffer is provided between the first and second processing circuits to improve processing speeds. | 03-05-2009 |
20120033742 | TWO-STAGE ENTROPY DECODING - The subject matter of this specification can be implemented in, among other things, a method of decoding video data that includes decoding compressed input video data using a first entropy coding technique to obtain first decoded data. The method further includes re-encoding the first decoded data using a second entropy coding technique that is different from the first entropy coding technique to obtain re-encoded data. The method further includes storing the re-encoded data in a storage device. The method further includes decoding the re-encoded data using the second entropy coding technique to obtain second decoded data. | 02-09-2012 |
Yutaka Yoshino US
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20090129037 | PRINTED WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT, AND PROCESS FOR PRODUCING THE SAME - The present invention provides a printed wiring board with a built-in semiconductor element in which an insufficient or excessive amount of filled sealing material does not affect excellent adhesion of the printed wiring board to an overlying wiring board. The printed wiring board with a built-in semiconductor element comprises a built-in semiconductor element, in which at least the lower surface, the upper surface, or the side surface of the semiconductor element is covered with an insulating film, and an insulating layer is provided in the side and upper portions of the semiconductor element. There is also provided a process for producing a printed wiring board with a built-in semiconductor element, comprising the steps of mounting a semiconductor element on a base substrate and covering at least the lower surface, the upper surface, or the side surface of the semiconductor element with an insulating film, disposing and stacking a semicured insulating sheet in the side portion of the semiconductor element, and disposing and stacking a semicured insulating sheet in the upper portion of the semiconductor element. | 05-21-2009 |