Shin, Yuseong-Gu
Bu Gon Shin, Yuseong-Gu KR
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20120026305 | OPTICAL FILTER - An optical filter for stereoscopic image display device and a stereoscopic image display device may be provided. In one embodiment, the optical filter for stereoscopic image display device may include a plastic substrate; an alignment layer; and a retardation layer, and the stereoscopic image display device may include the optical filter. | 02-02-2012 |
20120183739 | HIGH ULTRAVIOLET TRANSMITTING DOUBLE-LAYER WIRE GRID POLARIZER FOR FABRICATING PHOTO-ALIGNMENT LAYER AND FABRICATION METHOD THEREOF - There are provided a UV high-transmittance double-layer wire grid polarizer for a photo-alignment film and a method for manufacturing the same. The UV high-transmittance double-layer wire grid polarizer for a photo-alignment film includes: a substrate; an anti-reflection layer disposed on the substrate; a patterned photoresist layer disposed on the anti-reflection layer; and metal thin films disposed on the photoresist layer and the anti-reflection layer. | 07-19-2012 |
Chae-Ho Shin, Yuseong-Gu KR
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20100099936 | COMPLEX OXIDE CATALYST OF BI/MO/FE FOR THE OXIDATIVE DEHYDROGENATION OF 1-BUTENE TO 1,3-BUTADIENE AND PROCESS THEREOF - The present invention relates to a complex oxide catalyst of Bi/Mo/Fe and an oxidative dehydrogenation of 1-butene in the presence of a catalyst herein. A catalyst of the present invention is superior to the conventional Bi/Mo catalyst in thermal and mechanical stabilities, conversion and selectivity toward 1,3-butadiene, while showing a long-term catalytic activity. | 04-22-2010 |
Dong-Cho Shin, Yuseong-Gu KR
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20160092619 | SYSTEM AND METHOD FOR SIMULATING REAL-TIME VISUALIZABLE ELECTRONIC WARFARE - Disclosed herein is a system and method for simulating real-time visualizable electronic warfare. The system includes a location calculation unit for calculating location coordinates of the aircraft and the missile for each frame according to a display frame rate, a display unit for visualizing, for each frame, movement of the aircraft and the missile depending on the location coordinates thereof, a precise tracking unit for, when a relative distance between the aircraft and the missile is less than a dangerous distance, dividing an interval between a current frame and a subsequent frame into sub-intervals based on the display frame rate, and sampling locations of the aircraft and the missile, and a proximity fuse control unit for processing the missile to explode when a relative distance between sampled locations of the aircraft and the missile, is less than or equal to a maximum explosible distance of a proximity fuse of the missile. | 03-31-2016 |
Dong Yeol Shin, Yuseong-Gu KR
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20090026845 | SWITCHING DEVICE FOR TRANSFORMER HAVING UNINTERRUPTIBLE POWER SUPPLY FUNCTION, AND METHODS OF CONTROLLING TURN RATIO AND VOLTAGE OF THE TRANSFORMER USING THE SAME - A switching device for a transformer allows stable power supply without power interruption when a secondary winding voltage of the transformer is changed in the case of voltage drop on a distribution line due to a load characteristic. The switching device having an uninterruptible power supply function includes a plurality of switches operated by an external signal, a current circulation unit for multiple switches electrically connected to a large-current path of the switches to perform a switch-on function in place of the switches upon switching on and off between the switches, and a control unit electrically connected to the switches and current circulation unit to read voltage values and to apply signals to the switches depending on the voltage values to sequentially switch the switches. Accordingly, the switching device can stably supply power to power consumption sources without power interruption. | 01-29-2009 |
Hosuk Shin, Yuseong-Gu KR
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20130119323 | CATHODE ACTIVE MATERIAL FOR SECONDARY BATTERY - Disclosed is a cathode active material for secondary batteries comprising, a compound having a transition metal layer containing lithium as at least one compound selected from the following Formula 1: Li(Li | 05-16-2013 |
Hyeon Cheol Shin, Yuseong-Gu KR
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20130084330 | COMPOSITION FOR THE TREATMENT OF ARTHRITIS CONTAINING A DIBENZO-P-DIOXIN DERIVATIVE AS THE ACTIVE INGREDIENT - Disclosed is a composition for treating arthritis containing a dibenzo-p-dioxin derivative as an active ingredient. This dibenzo-p-dioxin derivative is very effective in inhibiting NF-kB and AP-1 activity, alleviates the symptoms of degenerative arthritis and rheumatoid arthritis without irritating the skin or causing side effects, and can continue to exhibit improvement effects for a considerable period of time after discontinuation of treatment. Additionally, when the dibenzo-p-dioxin derivative is contained in liposomes, the composition of the invention exhibits much greater effects on treating arthritis by absorption through skin, and thus is useful for the treatment of degenerative arthritis and rheumatoid arthritis. | 04-04-2013 |
Jae-Won Shin, Yuseong-Gu KR
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20100105178 | Method of manufacturing a flash memeory device - Provided may be a method of fabricating a flash memory device having metal nano particles. The method of manufacturing a flash memory device may include forming a metal oxide thin layer on a semiconductor substrate, forming a floating gate of an amorphous metal silicon oxide thin layer by performing a thermal treatment process on the semiconductor substrate where the metal oxide thin layer is formed, and forming metal nano particles in the floating gate by projecting an electron beam on the floating gate, the metal nano particles being surrounded by a silicon oxide layer. | 04-29-2010 |
Jae Yong Shin, Yuseong-Gu KR
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20120238682 | CLAY-REINFORCED POLY(LACTIC ACID)-POLYOLEFIN ALLOY COMPOSITION - The present invention relates to a clay-reinforced poly(lactic acid)-polyolefin alloy composition comprising 5-50 wt % of a clay-reinforced poly(lactic acid) resin, 40-90 wt % of a polyolefin, and 5-20 wt % of a compatibiliser. A clay-poly(lactic acid) nanocomposite according to the present invention is used with a polyolefin resin to enable the easy distribution of the clay-poly(lactic acid) nanocomposite into microstructure in the polyolefin resin, thereby showing excellent gas and moisture barrier characteristics, so that the composition is suitable for a molded product requiring barrier properties such as a sheet and a film for food packaging, a fuel tank and a portable fuel tank. | 09-20-2012 |
Joon Ho Shin, Yuseong-Gu KR
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20120267233 | ENERGY-SAVING DISTILLATION COLUMN ASSEMBLY - Provided is a distillation column assembly combining two distillation columns used in a distillation process. The distillation column assembly is characterized in that a dividing wall column (DWC) that has one inflow point, three outflow points and an internal dividing wall and a typical distillation column that has two inflow points and two outflow points are sequentially connected to each other, and in that streams of the two outflow points of the DWC are introduced into the two inflow points of the typical distillation column. The distillation column assembly improves an existing process apparatus based on two distillation columns, so that it can be easily installed, has a high energy-saving effect, and can be applied to the case where a separation pressure difference and a utility temperature difference are great. | 10-25-2012 |
Ju Ri Shin, Yuseong-Gu KR
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20130345119 | MULTIMERIC ANTIMICROBIAL PEPTIDE COMPLEX WHICH IS DISPLAYED ON CELL SURFACE - The present invention provides an antimicrobial peptide polymer comprising at least one monomer which is digested by pepsin, a multimeric antimicrobial peptide complex comprising the polymer and a cell surface anchoring motif linked to the polymer, an antimicrobial microorganism displaying the multimeric antimicrobial peptide complex, an antimicrobial composition comprising the same, a method of treating an infectious disease caused by bacteria, yeast or fungi by administering the antimicrobial composition, and a method for producing the antimicrobial microorganism. According to the invention, living microorganisms displaying an antimicrobial peptide on the cell surface thereof may be administered in vivo without having to lyse the microbial cell and isolate and purify the antimicrobial peptide, so that the antimicrobial peptide exhibits antimicrobial activity. Thus, the antimicrobial peptide may be produced at significantly reduced costs so that it may have widespread use. | 12-26-2013 |
Won-Yong Shin, Yuseong-Gu KR
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20090003416 | Apparatus and method for canceling interference in wireless communication system - An apparatus and a method for canceling interference using a space-frequency block coding in a multi-antenna system. The method includes confirming a code for coding to minimize a Pairwise Error Probability (PEP) of a transmit signal of which the PEP is maximized according to a time variation; and coding the transmit signal with the code and transmitting the coded signal via at least two antennas. Accordingly, the interference cancellation can be accomplished while lowering the complexity of the receiver without degrading the spectral efficiency. | 01-01-2009 |
Yoochul Shin, Yuseong-Gu KR
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20100154589 | METHOD OF PRODUCING NITRIDE/TUNGSTEN NANOCOMPOSITE POWDER AND NITRIDE/TUNGSTEN NANOCOMPOSITE POWDER PRODUCED USING THE SAME - Provided is a method of producing a nitride/tungsten nanocomposite powder. The method includes mixing nitride with tungsten or a tungsten alloy, and mechanically alloying the mixture in an inert atmosphere using a milling machine. | 06-24-2010 |
Young-Hwan Shin, Yuseong-Gu KR
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20100012364 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD - An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process. | 01-21-2010 |
20100090351 | ELECTRO COMPONENT PACKAGE - An electro component package is disclosed. The electro component package in accordance with an embodiment of the present invention includes a first package substrate having a first chip mounted on an upper surface thereof, the first chip having a through-via formed therein; a second package substrate being separated from the first package substrate and having a second chip mounted on an upper surface thereof; and a connection substrate having one end connected with an upper surface of the first chip and the other end connected with an upper surface of the second chip, the connection substrate electrically connecting the first chip with the second chip. | 04-15-2010 |
20100122842 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board including a via, which is configured to electrically connect both sides of an insulator, and a pad part, which is formed in one side of the insulator to be directly in contact with the via, can include forming a seed layer part on one side of the insulator, a portion of the seed layer part being bulged, forming a via hole by processing the other side of the insulator, corresponding to the bulged portion of the seed layer part, forming the via inside the via hole, and forming a plating layer, corresponding to the pad part, on the seed layer part. With the present invention, it is possible to form a pattern having a finer pitch, maintaining a VOP structure and to prevent a lower side of a substrate from being penetrated through when a via hole is processed. | 05-20-2010 |
20100147575 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board can include: processing a first hole, which has a tapered shape, in one side of a substrate by using a laser drill; processing a second hole, which has a tapered shape and which connects with the first hole, in the other side of the substrate by using a laser drill in a position corresponding to that of the first hole; and forming a conductive portion, which electrically connects both sides of the substrate through the first hole and the second hole, by performing plating. This method may be used for providing reliable interlayer connections. | 06-17-2010 |
20120134125 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD - An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process. | 05-31-2012 |