Patent application number | Description | Published |
20110151678 | NOVEL GAP FILL INTEGRATION - Novel gap fill schemes involving depositing both flowable oxide films and high density plasma chemical vapor deposition oxide (HDP oxide) films are provided. According to various embodiments, the flowable oxide films may be used as a sacrificial layer and/or as a material for bottom up gap fill. In certain embodiments, the top surface of the filled gap is an HDP oxide film. The resulting filled gap may be filled only with HDP oxide film or a combination of HDP oxide and flowable oxide films. The methods provide improved top hat reduction and avoid clipping of the structures defining the gaps. | 06-23-2011 |
20120273130 | Internal Faraday Shield Having Distributed Chevron Patterns and Correlated Positioning Relative to External Inner and Outer TCP Coil - Plasma processing chambers having internal Faraday shields with defined groove configurations, are defined. In one example, the chamber includes an electrostatic chuck for receiving a substrate and a dielectric window connected to a top portion of the chamber, where the dielectric window disposed over the electrostatic chuck. Also included is a Faraday shield disposed inside of the chamber and defined between the electrostatic chuck and the dielectric window. The Faraday shield includes an inner zone having an inner radius range, a middle zone having a middle radius range, an outer zone having an outer radius range, where the inner zone is adjacent to the middle zone, and the middle zone being adjacent to the outer zone. Further defining the Faraday shield is a first set of radial slots (A) extending through the inner zone, the middle zone, and the outer zone, a second set of radial slots (C) extending through only the outer zone; and a third set of radial slots (B) extending through the middle zone and outer zone. In this configuration, the first, second and third radial slots are arranged radially around the Faraday shield in a repeating pattern of slots A, C, B, and C. | 11-01-2012 |
20130114181 | Substrate Clamping System and Method for Operating the Same - An electrostatic chuck includes an electrically conductive baseplate and an electrically non-conductive substrate support member disposed on the baseplate. First and second sets of clamp electrodes are disposed within the support member. A power supply system includes a clamp power supply, a center tap power supply, and a baseplate power supply. The clamp power supply generates a positive output voltage and a negative output voltage, each of which is equidistant from a center tap voltage. The positive output voltage is electrically connected to the first set of clamp electrodes. The negative output voltage is electrically connected to the second set of clamp electrodes. The center tap power supply is defined to control the center tap voltage of the clamp power supply. The baseplate power supply is defined to generate a baseplate output voltage independent from the center tap voltage. The baseplate output voltage is electrically connected to the baseplate. | 05-09-2013 |
20130186568 | Faraday Shield Having Plasma Density Decoupling Structure Between TCP Coil Zones - A Faraday shield and a plasma processing chamber incorporating the Faraday shield is are provided. The plasma chamber includes an electrostatic chuck for receiving a substrate, a dielectric window connected to a top portion of the chamber, the dielectric window disposed over the electrostatic chuck, and a Faraday shield. The Faraday shield is disposed inside of the chamber and defined between the electrostatic chuck and the dielectric window. The Faraday shield includes an inner zone having an inner radius range that includes a first and second plurality of slots and an outer zone having an outer radius range that includes a third plurality of slots. The inner zone is adjacent to the outer zone. The Faraday shield also includes a band ring separating the inner zone and the outer zone, such that the first and second plurality of slots do not connect with the third plurality of slots. | 07-25-2013 |
20140302689 | METHODS AND APPARATUS FOR DIELECTRIC DEPOSITION - Methods for depositing flowable dielectric films are provided. In some embodiments, the methods involve introducing a silicon-containing precursor to a deposition chamber wherein the precursor is characterized by having a partial pressure:vapor pressure ratio between 0.01 and 1. In some embodiments, the methods involve depositing a high density plasma dielectric film on a flowable dielectric film. The high density plasma dielectric film may fill a gap on a substrate. Also provided are apparatuses for performing the methods. | 10-09-2014 |
20150020969 | Air Cooled Faraday Shield and Methods for Using the Same - A processing chamber and a Faraday shield system for use in a plasma processing chambers are provided. One system includes a disk structure defining a Faraday shield, and the disk structure has a process side and a back side. The disk structure extends between a center region to a periphery region. The disk structure resides within the processing volume. The system also includes a hub having an internal plenum for passing a flow of air received from an input conduit and removing the flow of air from an output conduit. The hub has an interface surface that is coupled to the back side of the disk structure at the center region. A fluid delivery control is coupled to the input conduit of the hub. The fluid delivery control is configured with a flow rate regulator. The regulated air can be amplified or compressed dry air (CDA). | 01-22-2015 |
Patent application number | Description | Published |
20120100289 | INSULATING COMPOSITIONS COMPRISING EXPANDED PARTICLES AND METHODS FOR APPLICATION AND USE - Compositions and methods for their application are described herein. The compositions include a plurality of particles having a density of 1000 kg/m | 04-26-2012 |
20140115988 | Prefabricated Wall Assembly Having An Insulating Foam Layer - A prefabricated wall assembly receives an exterior covering of a building. The prefabricated wall assembly includes a frame assembly and an insulating foam layer. The frame assembly includes a top member, a bottom member opposite the top member, and a plurality of vertical members coupled to and extending between the top and bottom members. The frame assembly also has an interior side and an exterior side opposite the interior side. The insulating foam layer is disposed between the plurality of vertical members of the frame assembly and also extends from the exterior side of the frame assembly terminating in a plurality of integral ribs. An exterior surface of the insulating foam layer is presented between the plurality of ribs. The ribs space the exterior covering from the exterior surface of the insulating foam layer for allowing airflow and drainage between the prefabricated wall assembly and the exterior covering. | 05-01-2014 |
20140115989 | Prefabricated Wall Assembly Having An Outer Foam Layer - A prefabricated wall assembly receives an exterior covering of a building. The prefabricated wall assembly comprises a frame assembly and an outer foam layer. The outer foam layer is coupled to the frame assembly. The outer foam layer extends from the frame assembly to an exterior surface of the outer foam layer. The exterior surface of the outer foam layer is configured to receive the exterior covering of the building. The outer foam layer comprises a plurality of particles and a binder that define a plurality of pathways. The pathways extend vertically through the prefabricated wall assembly from the top member to the bottom member of the frame assembly for allowing airflow and drainage between the frame assembly and the exterior covering. | 05-01-2014 |
20140115991 | High Performance Wall Assembly - A high performance wall assembly receives an exterior covering of a building. The high performance wall assembly includes a frame assembly having a top member, a bottom member opposite the top member, and a plurality of vertical members. The vertical members are coupled to and extend between the top and bottom members. The high performance wall assembly also includes a rigid foam insulating panel coupled to the frame assembly. A structural foam layer is disposed on the plurality of vertical members and on the rigid foam insulating panel. The structural foam layer couples the rigid foam insulating panel to the frame assembly and couples the plurality of vertical members to the top and bottom members such that the high performance wall is free of fasteners. | 05-01-2014 |