Patent application number | Description | Published |
20080217752 | Functional Device Package - A packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si substrate having a concave portion metallized on its internal surface and a second Si substrate metallized at a position opposed to said concave portion are used, the metallization applied to the internal surface of the concave portion of the first Si substrate and the metallization applied to the second Si substrate at the position opposed to the concave portion are connected by molten solder to hermetically seal the functional device between the first Si substrate and the second Si substrate, whereby the wettability of the solder for the two Si substrates is improved, the bondability between the Si substrates is enhanced, and the yield at which the package is manufactured is improved. | 09-11-2008 |
20080233349 | Functional Device - The present invention provides a low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS based functional devices. The MEMS functional device comprises a function element section formed by processing a substrate mainly made of Si, a metallized film for sealing formed around the functional element, and a glass substrate jointed to the metallized film for sealing by anode junction. Formed on a surface of the metallized film for sealing is a metallized film containing at least one of Sn and Ti as a main component. | 09-25-2008 |
20080259337 | BIOLOGICAL OPTICAL MEASURING APPARATUS AND LIGHT DETECTION MODULE - A cerebral function measuring apparatus houses a light detector in a package that can be set on the head of the subject examinee with light detection elements, amplifiers, and high voltage power supplies sealed in the package. Each amplifier and each high voltage power supply are united into one and covered with a high polymer material with high dielectric strength, and further enclosed by a metallic shield so as to be insulated. The high voltage power supply consists of a very small coil and an integrated circuit to generate a voltage required to drive the light detection element in the package. A removable and safe module type light detector is thus realized. | 10-23-2008 |
20080277589 | SEMICONDUCTOR RADIOACTIVE RAY DETECTOR, RADIOACTIVE RAY DETECTION MODULE, AND NUCLEAR MEDICINE DIAGNOSIS APPARATUS - The present invention provides a semiconductor radioactive ray detector having the excellent energy resolution or time precision, a radioactive detection module, and a nuclear medicine diagnosis apparatus. The semiconductor radioactive ray detector has a structure in which plate-like elements made of cadmium telluride and conductive members are alternately laminated and the plate-like element made of cadmium telluride and the conductive member are adhered to each other with a conductive adhesive agent, and the Young's modulus of the conductive adhesive agent is in the range from 350 MPa to 1000 MPa, while the conductive members are made from a material with the linear expansion coefficient of the conductive members in the range from 5×10 | 11-13-2008 |
20080310854 | CONNECTED BODY AND OPTICAL TRANSCEIVER MODULE - An optical element amounted structure includes an optical element having an electrode such as a bump formed on a surface thereof, and a substrate having an electrode that is joined to the optical element formed on the surface. The structure of the electrode of the substrate has a substantially ring configuration or a substantially ring configuration a part of which is notched, and the optical element and the substrate are joined to each other in a configuration where a joining material such as a bump is inserted into an opening portion. | 12-18-2008 |
20090054789 | Head-coupled holder for living body optical measurement - A head-coupled holder for living body optical measurement that securely brings a light irradiation module and a light detection module in close contact with a scalp, and gives the person to be examined no excessive pressure feeling. Each of the light irradiation module and the light detection module includes a contactor having a contact portion that comes in contact with a scalp of the person to be examined at a leading end thereof, and exposes a leading end of a light guide to the contact portion to form the light guide, and a package having a lower portion to which the contactor is attached. The contactor is fixed to the lower portion of the package through an elastic body, and the package is fixed to an inner upper wall of the insertion hole with a series structure of the elastic body and the viscoelastic body. | 02-26-2009 |
20090126991 | SUBSTRATE FOR MOUNTING ELECTRONIC PART AND ELECTRONIC PART - The present invention is characterized by a structure having a substrate | 05-21-2009 |
20090180732 | Junction Structure Between Optical Element and Substrate, Optical Transmission/Receiving Module, and Method of Manufacturing the Optical Module - The present invention provides a junction structure between an optical element and a substrate. The junction structure is formed by supplying an under-fill resin not containing a filler to a portion functioning as a light path for light emitted from or incoming into the optical element on the substrate, then jointing a conductive bump of the optical element to electric wiring on the substrate, and then thermally hardening the under-fill resin not containing a filler to bond the resin not containing a filler to the optical element and to the substrate so that the under-fill resin containing a filler will not enter a space between the optical element and the substrate when the under-fill resin containing a filler is filled in portions other than the light path between the optical element and the substrate. | 07-16-2009 |
20090219728 | SUBMOUNT AND ITS MANUFACTURING METHOD - Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided. | 09-03-2009 |
20090294158 | ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME - To provide an electronic circuit board in which a conductive wire is excellently connected to a bonding pad formed directly on a polyimide film. The electronic circuit includes: a first layer metal pattern | 12-03-2009 |
20100002987 | OPTICAL MODULE MOUNTED WITH WDM FILTER - A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process. | 01-07-2010 |
20100047588 | Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same - A technique for bonding a glass plate to an insulating material or a nonoxidized semiconductor substrate such as SiC without a bonding agent is provided. A metallized layer is formed on the insulating material or the nonoxidized semiconductor substrate such as SiC serving as a first substrate, and the metallized layer of the first substrate is bonded to a second glass substrate, which serves as a second substrate and contains ions capable of being diffused by a voltage, by anodic bonding. | 02-25-2010 |
20100209041 | PHOTOELECTRIC COMPOSITE WIRING MODULE AND METHOD FOR MANUFACTURING THE SAME - A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer. | 08-19-2010 |