Yen-Chang
Yen-Chang Chen, Taoyuan County TW
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20140103713 | COOLING SYSTEM OF SERVER WITH AC AND DC POWER SOURCES AND METHOD OF OPERATING THE SAME - A cooling system of a server with an AC power source and a DC power source includes an AC input subsystem, a DC input subsystem, and a driving control subsystem. The AC input subsystem receives an external AC power source and provides a first DC voltage and a second DC voltage. The DC input subsystem receives an external DC power source and provides a third DC voltage and a fourth DC voltage. When the external AC power source normally works, the driving control subsystem controls the first DC voltage and the second DC voltage to supply a high-voltage cooling apparatus and a low-voltage cooling apparatus, respectively. When the external DC power source normally works, the driving control subsystem controls the fourth DC voltage and the third DC voltage to supply the high-voltage cooling apparatus and the low-voltage cooling apparatus, respectively. | 04-17-2014 |
Yen-Chang Chen, New Taipei City TW
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20130151881 | BRIDGING DEVICE AND POWER SAVING METHOD THEREOF - A bridging device and a power saving method thereof are disclosed. When a bridging chip of the bridging device receives a power saving command transferred from a host and thereby enters a power saving state, a voltage converter of the bridging device is disabled accordingly and a selection circuit selects to couple a bus voltage to the bridging chip to power the bridging chip. The bus voltage is transferred from the host through a power pin of a connector of the bridging device. The connector is coupled to the host. | 06-13-2013 |
Yen-Chang Chen, Taipei TW
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20100033746 | Document management device and document management method with identification, classification, search, and save functions - The present invention provides a document management device including a file receiving device for receiving a document; an optical identification device for performing optical identification on a non-textural content in the received document; a feature mark identifier for setting up a feature mark for the document; and a database for storing the document, which can be output from the database directly or through the file receiving device. The present invention also discloses a document management method. The device and method of the present invention have functions of identification, classification, search, and save. | 02-11-2010 |
20100034460 | Document management system and remote document management method with identification, classification, search, and save functions - The present invention provides a document management system including a webpage server, a file receiving server for receiving a document through the webpage server; an optical identification device for performing optical identification on a non-textural content in the received document; a feature mark identifier for setting up a feature mark for the document; and a database for storing the document, which can be output from the database directly or through the file receiving device. The present invention also discloses a remote document management method. The device and method of the present invention have functions of identification, classification, search, and save. | 02-11-2010 |
Yen-Chang Chen, Taipei City TW
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20120187107 | SYSTEM AND METHOD FOR CONTROLLING QUASI-RESONANT INVERTER AND ELECTRIC HEATING DEVICE EMPLOYING THE SAME - A quasi-resonant inverter control system includes a mains zero-crossing detection circuit and a controller. The mains zero-crossing detection circuit is operable to detect a plurality of zero-crossing points of an input alternating-current voltage and output a zero-crossing detection signal based on the zero-crossing points. The controller is operable to control a plurality of burst mode period and receives the zero-crossing detection signal. Each of the burst mode periods includes a working duration and a non-working duration. Each of the working durations includes a start point and an end point. The controller is operable to determine the start points and the end points of the working durations based on the zero-crossing detection signal and outputs a control signal based on the start points and the end points of the working durations. An electric heating device and a method for controlling the quasi-resonant inverter are also disclosed herein. | 07-26-2012 |
Yen-Chang Chen, Shu Lin TW
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20080266883 | Recessed lamp structure - A recessed lamp structure comprises: a lamp bulb, a lamp holder, a rotatory carrier and an outer mounting base. The rotatory carrier is securely screwed onto a track frame, which has a hollow sliding slot on the center of the bended body thereof. The track frame is securely positioned on the axially connecting base of the rotatory carrier via two axial plates that locate on the rearward of the track frame. The lamp holder is rotatably coupled with the rotatory carrier by two bolts. The bolts are mounted in the limited connection space between the lamp holder and the rotatory carrier. Besides, the lamp holder is shiftable along the sliding slot for adjusting the lighting angle within approximate 70 degrees. Consequently, the recessed lamp structure of the present invention has simplified components and is easy to practice. | 10-30-2008 |
Yen-Chang Chen, Taoyuan TW
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20140118989 | BACKLIGHT MODULE AND KEYBOARD - A backlight module includes a light guide plate, a light source, a light shielding sheet, a light reflecting sheet and a light shielding member. The light guide plate has a hole formed thereon and the hole has a side wall. The light source is disposed neighboring to the light guide plate and used for emitting light into the light guide plate. The light shielding sheet is disposed on the light guide plate. The light reflecting sheet is disposed below the light guide plate. The light shielding member is disposed in the hole and covers the side wall of the hole, so as to block the light guided by the light guide plate from being emitted out of the hole. | 05-01-2014 |
20140133182 | LIGHT GUIDE PLATE STRUCTURE AND LIGHT-GUIDE-PLATE MANUFACTURING METHOD THEREOF - A light guide plate structure includes a light guide plate, a first medium layer, a micro structure, a second medium layer, and a reflection layer. The light guide plate has a light exit surface and a bottom surface opposite to the light exit surface. The first medium layer is formed on the light exit surface. The micro structure is formed on the bottom surface for redirecting light inside the light guide plate to emit from the light exit surface. The second medium layer is formed on the micro structure. The refractive index of the first medium layer and the refractive index of the second medium layer are less than the refractive index of the light guide plate but greater than the refractive index of air. The reflection layer is formed on the second medium layer for reflecting light inside the light guide plate to emit from the light exit surface. | 05-15-2014 |
20150014136 | POINTING STICK CURSOR KEY AND ILLUMINATED KEYBOARD THEREWITH - The illuminated keyboard includes a base plate, a backlight module, a plurality of input keys and a mask layer. The backlight module and the plurality of input keys are disposed on opposite sides of the base plate. The mask layer is disposed between the base plate and the backlight module. A pointing stick cursor key includes a holding structure, an opening and a masking portion. The holding structure with a hole is disposed on the base plate. The opening is formed on the mask layer in a position corresponding to the holding structure. The holding structure is extended into the backlight module via the opening. The at least one masking portion is connected to a periphery of the opening for bendably attaching against the holding structure for covering the hole when the holding structure is extended into the backlight module via the opening. | 01-15-2015 |
Yen-Chang Chiu, Linkou Township TW
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20090009366 | Method for scroll bar control on a touchpad and touchpad with scroll bar control function - A touchpad includes a controller connected to a touch sensor. The controller detects the fingers touching on the touch sensor to determine to start up and terminate a scroll bar control function. In the scroll bar control function, the movement of the finger or fingers touching on the touch sensor is detected for scrolling on a window, and the vertical distance and the horizontal distance of the movement are evaluated for determining the scrolling amount of a vertical scroll bar or a horizontal scroll bar of the window. | 01-08-2009 |
20100001966 | Two dimensional application of a one dimensional touch sensor in a capacitive touchpad - A capacitive touchpad includes a controller, a plurality of scan lines and a plurality of sensor pads distributed over a one dimensional touch sensor. Each of the sensor pads is connected to the controller by a respective one of the scan lines to transmit a sensed value to the controller. The controller uses the sensed values and the positions of some of the sensor pads in an interpolation to determine the two dimensional coordinates of one or more touched positions. Based on the sensed values, the controller selects one or more of the sensor pads as one or more reference points for the interpolation. | 01-07-2010 |
20100328260 | CAPACITIVE TOUCHPAD OF MULTIPLE OPERATIONAL MODES - A capacitive touchpad provides multiple operational modes including at least a key input mode, a handwriting input mode, and a mouse control mode. To switch the capacitive touchpad between the operational modes, a first pattern is defined as a mode switch for users to touch thereon. For each operational mode, specific second patterns are defined for indication of their corresponding functions, and several regions are defined corresponding to the positions of the second patterns to receive touch input from the second patterns. | 12-30-2010 |
Yen-Chang Hu, Tai-Chung City TW
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20130270682 | Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections - Methods and apparatus for package on package structures having stud bump through via interconnections. A structure includes an interconnect layer having a plurality of through via assemblies each including at least one stud bump are formed on conductive pads; and encapsulant surrounding the through via assembly, a first redistribution layer formed over a surface of the encapsulant and coupled to the through via assemblies and carrying connectors, and a second redistribution layer over interconnect layer at the other end of the through via assemblies, the through via assemblies extending vertically through the interconnect layer. In an embodiment the interconnect layer is mounted using the connectors to a lower package substrate to form a package on package structure. A first integrated circuit device may be mounted on the second redistribution layer of the interconnect layer. Methods for forming the interconnect layer and the package on package structures are disclosed. | 10-17-2013 |
20130307140 | PACKAGING WITH INTERPOSER FRAME - The mechanisms of using an interposer frame to package a semiconductor die enables fan-out structures and reduces form factor for the packaged semiconductor die. The mechanisms involve using a molding compound to attach the semiconductor die to the interposer frame and forming a redistribution layer on one or both sides of the semiconductor die. The redistribution layer(s) in the package enables fan-out connections and formation of external connection structures. Conductive columns in the interposer frame assist in thermal management. | 11-21-2013 |
20140027901 | PACKAGE-ON-PACKAGE STRUCTURES HAVING BUFFER DAMS AND METHODS FOR FORMING THE SAME - A device includes a device die and a plurality of metal posts at a surface of the device die and electrically coupled to the device die. The device further includes a plurality of through-assembly vias (TAVs), a dam member between the device die and the plurality of TAVs, and a polymer layer encompassing the device die, the plurality of metal posts, the plurality of TAVs, and the dam member. | 01-30-2014 |
20140061937 | Fan-Out Package Comprising Bulk Metal - A device includes a polymer, a device die in the polymer, and a plurality of Through Assembly Vias (TAVs) extending from a top surface to a bottom surface of the polymer. A bulk metal feature is located in the polymer and having a top-view size greater than a top-view size of each of the plurality of TAVs. The bulk metal feature is electrically floating. The polymer, the device die, the plurality of TAVs, and the bulk metal feature are portions of a package. | 03-06-2014 |
20140070422 | Semiconductor Device with Discrete Blocks - A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers. | 03-13-2014 |
20140077394 | Wafer Level Embedded Heat Spreader - Disclosed herein are a device having an embedded heat spreader and method for forming the same. A carrier substrate may comprise a carrier, an adhesive layer, a base film layer, and a seed layer. A patterned mask is formed with a heat spreader opening and via openings. Vias and a heat spreader may be formed in the pattern mask openings at the same time using a plating process and a die attached to the head spreader by a die attachment layer. A molding compound is applied over the die and heat spreader so that the heat spreader is disposed at the second side of the molded substrate. A first RDL may have a plurality of mounting pads and a plurality of conductive lines is formed on the molded substrate, the mounting pads may have a bond pitch greater than the bond pitch of the die contact pads. | 03-20-2014 |
20140127857 | Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods - Carrier wafers, methods of manufacture thereof, and packaging methods are disclosed. In one embodiment, a carrier wafer includes a first glass layer. The carrier wafer includes a second glass layer coupled to the first glass layer. The first glass layer has a first coefficient of thermal expansion (CTE), and the second glass layer has a second CTE. | 05-08-2014 |
20140210099 | Packaged Semiconductor Devices and Packaging Methods - Packaged semiconductor devices and packaging methods are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die and through-vias disposed in a molding compound. A first redistribution layer (RDL) is disposed over a first side of the through-vias, the integrated circuit die, and the molding compound. A second RDL is disposed over a second side of the through-vias, the integrated circuit die, and the molding compound. Contact pads are disposed over the second RDL. An insulating material of the second RDL includes a recess around a perimeter of one of the contact pads. | 07-31-2014 |
20140239507 | Peripheral Electrical Connection of Package on Package - Various embodiments of mechanisms for forming a die package using through sidewall vias (TsVs), which are formed by sawing through substrate via (TSV) in half, at edges of dies described enable various semiconductor dies and passive components be electrically connected to achieve targeted electrical performance. Redistribution structures with redistribution layers (RDLs) are used along with the TsVs to enable the electrical connections. Since the TsVs are away from the device regions, the device regions do not suffer from the stress caused by the TSV formation. In addition, electrical connections between upper and lower dies by the TsVs increases the efficiency of the area utilization of the die package. | 08-28-2014 |
20140252647 | Warpage Reduction and Adhesion Improvement of Semiconductor Die Package - Various embodiments of mechanisms for forming a die package and a package on package (PoP) structure using one or more compressive dielectric layers to reduce warpage are provided. The compressive dielectric layer(s) is part of a redistribution structure of the die package and its compressive stress reduces or eliminates bowing of the die package. In addition, the one or more compressive dielectric layers improve the adhesion between redistribution structure and the materials surrounding the semiconductor die. As a result, the yield and reliability of the die package and PoP structure using the die package are improved. | 09-11-2014 |
20140264930 | Fan-Out Interconnect Structure and Method for Forming Same - A method embodiment includes forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface. The die is attached to a carrier, and a molding compound is formed over the die and the sacrificial film layer. The molding compound extends along sidewalls of the die. The sacrificial film layer is exposed. The contact pad is exposed by removing at least a portion of the sacrificial film layer. A first polymer layer is formed over the die, and a redistribution layer (RDL) is formed over the die and electrically connects to the contact pad. | 09-18-2014 |
20140335662 | METHODS FOR FORMING PACKAGE-ON-PACKAGE STRUCTURES HAVING BUFFER DAMS - Package-on-Package (PoP) structures and methods of forming the same are disclosed. In some embodiments, a method of forming a PoP structure may include: placing a device die having a plurality of metal posts over a release layer, wherein the release layer is over a first carrier; forming a plurality of through-assembly vias (TAVs) over the release layer; forming a dam member between the device die and the plurality of TAVs; molding the device die, the dam member, and the plurality of TAVs in a molding compound; and grinding the molding compound to expose ends of the plurality of metal posts and ends of the plurality of TAVs, wherein a top surface of the molding compound is substantially level with the exposed ends of the plurality of metal posts and exposed ends of the plurality of TAVs. | 11-13-2014 |
20150072476 | Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections - Methods and apparatus for package on package structures having stud bump through via interconnections. A structure includes an interconnect layer having a plurality of through via assemblies each including at least one stud bump are formed on conductive pads; and encapsulant surrounding the through via assembly, a first redistribution layer formed over a surface of the encapsulant and coupled to the through via assemblies and carrying connectors, and a second redistribution layer over interconnect layer at the other end of the through via assemblies, the through via assemblies extending vertically through the interconnect layer. In an embodiment the interconnect layer is mounted using the connectors to a lower package substrate to form a package on package structure. A first integrated circuit device may be mounted on the second redistribution layer of the interconnect layer. Methods for forming the interconnect layer and the package on package structures are disclosed. | 03-12-2015 |
20150123268 | 3D Die Stacking Structure with Fine Pitches - A package includes package includes a first package component including a first plurality of electrical connectors at a top surface of the first package component, and a second plurality of electrical connectors longer than the first plurality of electrical connectors at the top surface of the first package component. A first device die is over the first package component and bonded to the first plurality of electrical connectors. A second package component is overlying the first package component and the first device die. The second package component includes a third plurality of electrical connectors at a bottom surface of the second package component. The third plurality of electrical connectors is bonded to the second plurality of electrical connectors. A fourth plurality of electrical connectors is at a bottom surface of the second package. The second and the fourth plurality of electrical connectors comprise non-solder metallic materials. | 05-07-2015 |
20150243636 | Packaged Semiconductor Devices and Packaging Methods - Packaged semiconductor devices and packaging methods are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die and through-vias disposed in a molding compound. A first redistribution layer (RDL) is disposed over a first side of the through-vias, the integrated circuit die, and the molding compound. A second RDL is disposed over a second side of the through-vias, the integrated circuit die, and the molding compound. Contact pads are disposed over the second RDL. An insulating material of the second RDL includes a recess around a perimeter of one of the contact pads. | 08-27-2015 |
20150303158 | Warpage Reduction and Adhesion Improvement of Semiconductor Die Package - A method of forming a die package includes forming a conductive column over a first side of a carrier, attaching a semiconductor die to the first side of the carrier, and forming a molding compound over the first side of the carrier. The semiconductor die and the conductive column are embedded in the molding compound. A second side of the carrier opposite the first side is under a compressive stress. The method also includes forming a first compressive dielectric layer over the semiconductor die, the conductive column, and the molding compound, forming a first redistribution layer (RDL) over the first compressive dielectric layer, and forming a first passivation layer over the first RDL. | 10-22-2015 |
Yen-Chang Huang, New Taipei City TW
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20130021603 | OPTICAL SIGNAL INSPECTION DEVICE - An optical signal inspection device includes a housing, a diagnostic unit, an optical specimen holder, a light-shielding module, and a guiding unit. A receiving space is defined internally of the housing. The housing has an optical fiber holding area formed thereon. The optical specimen holder has an upper jaw member and a lower jaw member. The light shielding module has a main body and two lateral shielding members disposed thereon. Two side portions of the lower jaw member are formed matchingly to the lateral shielding members. The guiding unit is secured to the upper or lower jaw member. When the upper and lower jaw members are used to clamp the optical fiber for inspection, interference due to ambient lighting can be prevented by the light shielding module. Thus, quick and accurate inspection results can be obtained by the user. | 01-24-2013 |
20140002103 | CABLE DIAGNOSTIC DEVICE | 01-02-2014 |
20140259477 | OPTIC CONNECTOR CLEANING APPARATUS - An optic connector cleaning apparatus includes a driving assembly, a cleaning tape and a casing. The driving module includes a reel assembly. The cleaning tape includes a first surface and a second surface opposite the first surface, the cleaning tape winds at the reel assembly; the casing includes an inverting structure and a cleaning region. The cleaning tape winds about the inverting structure. The first surface of the cleaning tape is exposed to the cleaning region, the cleaning tape winds about the inverting structure to expose the second surface through the cleaning region. | 09-18-2014 |
Yen-Chang Huang, Taipei County TW
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20090303408 | BACKLIGHT MODULE - A backlight module including a back bezel, a frame, and a backlight source is provided. The back bezel has a bottom carrier and a side wall extending upward from an edge of the bottom carrier so as to define a containing space. The side wall has a through hole and a reverse bending structure. The reverse bending structure is bent downward into the containing space for shielding a portion of the through hole. Parts of the region of the back bezel are covered with the frame and a portion of the frame extends from the containing space into the through hole and covers the reverse bending structure. The backlight source is disposed in the containing space located over the back bezel and the frame. | 12-10-2009 |
Yen-Chang Huang, Lukang Township TW
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20130299043 | BI-DIRECTIONAL INFLATING DEVICE - A bi-directional inflating device, comprising: a handle rod comprising an inner tube and an outer tube, an adapter tube communicating with the inner tube, two inflating fittings each having a passage communicating with the adapter tube, a bushing fixed with the outer tube and slidable in parallel to the passages, and two detent assemblies located between two step portions in the bushing and the adapter tube respectively. The inflating fittings each have two grooves formed with a through hole respectively. The detent assemblies each comprise two detents and an elastic piece. The detents each have a body disposed in a corresponding one of the grooves and two end portions extending outwards from the outer surface of the corresponding inflating fitting respectively. The body has an abutting portion that extends through the through hole of the corresponding inflating fitting and is located inside the corresponding passage. | 11-14-2013 |
Yen-Chang Lai, Taipei TW
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20100134969 | PORTABLE COMPUTER AND HINGE MECHANISM THEREOF - A portable computer and a hinge mechanism thereof are provided. The portable computer includes a display monitor, a host and a hinge mechanism. The hinge mechanism for rotating the display monitor and the host relatively includes a bottom board, a pivot, a power adapter, a locking bracket, a slanting board and a parallel board. The pivot is disposed on the bottom board. Two ends of the pivot are connected with the host and the display monitor respectively. The power adapter is disposed on the bottom board. The locking bracket having a locking hole is disposed on the bottom board. The slanting board disposed on the bottom board slants to the pivot. The slanting board has a first opening which exposes the power adapter. The parallel board disposed on the bottom board is parallel to the pivot. The parallel board has a second opening which exposes the locking hole. | 06-03-2010 |
20100134970 | PORTABLE COMPUTER AND HINGE MECHANISM THEREOF - A portable computer and a hinge mechanism thereof are provided. The portable computer includes a display screen, a host and a hinge mechanism. The hinge mechanism is connected with the display screen and the host. The hinge mechanism is used for rotating the display screen around the host. The hinge mechanism includes a bottom board, a pivot, a network connecter and a slanting board. The pivot is disposed on the bottom board, wherein one end of the pivot is connected with the host and the other end of the pivot is connected with the display screen. The network connecter is disposed on the bottom board. The slanting board is disposed on the bottom board and slants to the pivot. The slanting board has an opening which exposes the network connecter. | 06-03-2010 |
20100136398 | PORTABLE COMPUTER AND LOCKING MECHANISM THEREOF - A portable computer and a locking mechanism thereof are provided. The portable computer includes a battery, a host and a locking mechanism. The battery has a locking hole. The battery includes a restraining protrusion. The host has a receiving through. The locking mechanism is disposed in the receiving through. The locking mechanism includes a main body and a locking protrusion. The main body has a first restraining concave and a second restraining concave. The locking protrusion is connected to the main body. When the restraining protrusion is placed in the first restraining concave, the locking protrusion is locked in the locking hole, so that the battery is locked in the receiving through. When the restraining protrusion is placed in the second restraining concave, the locking protrusion leaves the locking hole, so that the battery is dismounted from the receiving through. | 06-03-2010 |
Yen-Chang Liu, Hsinchu TW
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20120103967 | Burn-in oven having inverter fan and heat regulator - A burn-in oven having an inverter fan and a heat regulator includes a housing, a frame, a heater, a temperature sensor, an inverter fan, and a control unit. The housing includes an air-in port and an air-out port. The frame is fixedly arranged inside the housing, and is divided into a variety of partitions. In addition, the heater and the temperature sensor are also fixedly arranged inside the housing. The inverter fan is provided for supplying a forced air-flow toward inside of the housing. The control unit is electrically connected with the temperature sensor, the heater, and the inverter fan. The control unit is provided for controlling the temperature inside the housing not to exceed a predetermined value. Thereby, the present invention saves energy and shortens effectively the time required for burn-in temperature rising and lowering, and saves working hours and manpower as well. | 05-03-2012 |
20120206157 | Structure of burn-in oven - An improved structure of a burn-in oven includes a housing, a loading support, a cooling-fan assembly, and a motor-fan assembly. A circuit-board-space and an exhaust channel are defined inside of the housing, wherein the exhaust channel is provided with a plurality of venting holes such that the circuit-board-space and the exhaust channel are communicated with each other through the venting holes. The loading support is disposed in the circuit-board-space for loading a plurality of circuit boards. The cooling-fan assembly is arranged at one side of the loading support and beside the exhaust channel. The motor-fan assembly is arranged at the exhaust channel. Thereby, a phenomenon of heat accumulation locally at a back panel side of the oven can be improved so as to enhance cooling effect of the oven, let alone the number of fans installed on the oven can be decreased. | 08-16-2012 |
Yen-Chang Wang, Hsin-Chu County TW
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20150022360 | INPUT DEVICE AND COMPUTER SYSTEM WITH OPERATING PATTERN ANALYSIS - There is provided an input device including at least one input unit, a trigger detection unit, a storage unit and an analysis and processing unit. The at least one input unit is for inputting a plurality of trigger events by a user. The trigger detection unit is configured to detect the trigger events of the at least one input unit and generate a trigger signal corresponding to each of the trigger events. The storage unit is configured to record an operating condition associated with the user. The analysis and processing unit is configured to analyze an operating pattern of the trigger signals and determine a warning time according to the operating condition and the operating pattern. | 01-22-2015 |
Yen-Chang Wang, Taoyuan County TW
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20160044216 | IMAGE PICKUP DEVICE AND LIGHT FIELD IMAGE PICKUP LENS - An image pickup device including an imaging lens, an image sensor, and a multiple aperture optical element is provided. The multiple aperture optical element is disposed on a light path between the imaging lens and the image sensor, and includes aperture elements arranged in an array. The image pickup device satisfies: | 02-11-2016 |
Yen-Chang Wang, Hsin-Chu TW
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20140028561 | OPTICAL DISPLACEMENT DETECTION APPARATUS AND OPTICAL DISPLACEMENT DETECTION METHOD THEREOF - The present invention discloses an optical displacement detection apparatus and an optical displacement detection method. The optical displacement detection apparatus includes: a light source for projecting light on a surface; an image capturing unit for generating an image signal according to light reflected from the surface; and a processing unit for generating an auto-exposure (AE) state value and an image quality (IQ) value according to the image signal, and determining an AE range according to an initial AE range, the AE state value and the IQ value. | 01-30-2014 |
20140218280 | PERIPHERAL DEVICE WITH MULTI-TRANSMISSION CAPABILITY - The present disclosure provides a wireless peripheral device with multi-transmission capability. The wireless peripheral device wirelessly transmits a control signal to a wireless receiver. The wireless peripheral device comprises a first wireless transmitting unit, a second transmitting unit, and a processing unit. The second transmitting unit receives a responding signal from the wireless receiver. The capable transmission distance of the first transmitting unit is larger than the capable transmission distance of the second transmitting unit. The processing unit is coupled to the first transmitting unit and the second transmitting unit. The processing unit transmits the control signal through the second transmitting unit to the wireless receiver when the strength of the responding signal is at a high intensity range. The processing unit transmits the control signal through the first transmitting unit to the wireless receiver when the strength of the responding signal is at a low intensity range. | 08-07-2014 |