Patent application number | Description | Published |
20100001309 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND HORIZONTAL SIGNAL ROUTING - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer. | 01-07-2010 |
20100001395 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND VERTICAL SIGNAL ROUTING - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly through an opening in the adhesive into an aperture in the substrate, and the base extends laterally and supports the substrate. The adhesive extends between the post and the substrate and between the base and the substrate. The substrate includes first and second conductive layers and a dielectric layer therebetween, and the assembly provides vertical signal routing between a pad at the first conductive layer and a terminal below the adhesive. | 01-07-2010 |
20100003787 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND HORIZONTAL SIGNAL ROUTING - The present invention provides a method of making a semiconductor chip assembly that includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer. | 01-07-2010 |
20100003788 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND VERTICAL SIGNAL ROUTING - The present invention provides a method of making a semiconductor chip assembly that includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween, and the assembly provides the vertical signal routing between a pad at the first conductive layer and a terminal below the adhesive. | 01-07-2010 |
20100052005 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CONDUCTIVE TRACE - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal. | 03-04-2010 |
20100055811 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A SUBSTRATE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. | 03-04-2010 |
20100055812 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CONDUCTIVE TRACE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 03-04-2010 |
20100059786 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND SUBSTRATE - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The assembly provides signal routing between a pad and a terminal. | 03-11-2010 |
20100072510 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/CAP HEAT SPREADER - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post, a base and a cap. The post extends upwardly from the base into an opening in the adhesive, the base extends below and laterally from the post, and the cap extends above and laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal and the heat spreader provides thermal dissipation between the cap and the base. | 03-25-2010 |
20100072511 | SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base that include a copper surface layer and an aluminum core. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal. | 03-25-2010 |
20100075448 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/CAP HEAT SPREADER - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a cap on the post, mounting a semiconductor device on a heat spreader that includes the post, the base and the cap, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 03-25-2010 |
20100087020 | SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER - A method of making a semiconductor chip assembly includes providing a post and a base that include a copper surface layer and an aluminum core, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 04-08-2010 |
20100096662 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND SIGNAL POST - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive. | 04-22-2010 |
20100155768 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY IN POST - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The semiconductor device extends into a cavity in the post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal. | 06-24-2010 |
20100155769 | SEMICONDUCTOR CHIP ASSEMBLY WITH BASE HEAT SPREADER AND CAVITY IN BASE - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a base. A cavity extends through the adhesive into the base. The semiconductor device extends into the cavity, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal. | 06-24-2010 |
20100163921 | SEMICONDUCTOR CHIP ASSEMBLY WITH ALUMINUM POST/BASE HEAT SPREADER AND SILVER/COPPER CONDUCTIVE TRACE - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader is aluminum and includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace includes a silver coating and a copper core and provides signal routing between a pad and a terminal. | 07-01-2010 |
20100167436 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A SIGNAL POST - A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive into and upward in a first gap located in the first aperture between the thermal post and the conductive layer and in a second gap located in the second aperture between the signal post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, the signal post and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 07-01-2010 |
20100167438 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH AN ALUMINUM POST/BASE HEAT SPREADER AND A SILVER/COPPER CONDUCTIVE TRACE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a copper layer on the adhesive including aligning the post with an aperture in the copper layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the copper layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a silver coating and a copper core that is a selected portion of the copper layer, mounting a semiconductor device on the post, wherein an aluminum heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 07-01-2010 |
20100181594 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY OVER POST - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device extends into a cavity in the adhesive, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and is located below the cavity, and the base extends laterally from the post. The cavity extends to the post. The adhesive extends between the cavity and the conductive trace and between the base and the conductive trace. The conductive trace is located outside the cavity and provides signal routing between a pad and a terminal. | 07-22-2010 |
20100190297 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CAVITY IN THE POST - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. | 07-29-2010 |
20100190300 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BASE HEAT SPREADER AND A CAVITY IN THE BASE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post and the base to form a cavity that extends through the adhesive into the base, then mounting a semiconductor device on the base, wherein a heat spreader includes the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. | 07-29-2010 |
20100193830 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND DUAL ADHESIVES - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base through an opening in the first adhesive, and the base extends laterally from the post. The first adhesive extends between the base and the conductive trace and the second adhesive extends between the post and the conductive trace. The conductive trace provides signal routing between a pad and a terminal. | 08-05-2010 |
20100203679 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A CAVITY OVER THE POST - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a substrate on the adhesive including aligning the post with an aperture in the substrate, then flowing the adhesive into and upward in a gap located in the aperture between the post and the substrate, solidifying the adhesive, then etching the post to form a cavity in the adhesive above the post, then mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base and the semiconductor device extends into the cavity, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. | 08-12-2010 |
20100210049 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND DUAL ADHESIVES - A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 08-19-2010 |
20100289054 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND ADHESIVE BETWEEN BASE AND TERMINAL - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive. The adhesive extends above the base and between the base and the terminal. | 11-18-2010 |
20100327310 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/FLANGE HEAT SPREADER AND CAVITY IN FLANGE - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the flange, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the flange extends upwardly from the post in the opening and extends laterally above the adhesive, the cavity extends into the opening and the base extends laterally from the post. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal. | 12-30-2010 |
20110003437 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/FLANGE HEAT SPREADER AND A CAVITY IN THE FLANGE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a first conductive layer on the adhesive including aligning the post with an aperture in the first conductive layer, then flowing the adhesive between the post and the first conductive layer, solidifying the adhesive, then etching the post to form a first cavity in the adhesive above the post, depositing a second conductive layer into the first cavity to form a second cavity that extends into the first cavity, providing a conductive trace that includes a pad, a terminal and a selected portion of the first conductive layer, providing a heat spreader that includes the post, the base and a flange that includes a selected portion of the second conductive layer that defines the second cavity, mounting a semiconductor device on the flange in the second cavity, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 01-06-2011 |
20110037094 | SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND CAVITY IN BUMP - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal. | 02-17-2011 |
20110039357 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND AN ADHESIVE BETWEEN THE BASE AND A TERMINAL - A method of making a semiconductor chip assembly includes providing a thermal post, a signal post, a base and a terminal, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer and downward between the base and the terminal, solidifying the adhesive, providing a conductive trace that includes a pad, the terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 02-17-2011 |
20110039374 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BUMP/BASE HEAT SPREADER AND A CAVITY IN THE BUMP - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump, a base and a flange. The conductive trace includes a pad and a terminal. The semiconductor device extends into a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal. | 02-17-2011 |
20110049558 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER, SIGNAL POST AND CAVITY - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a thermal post and a base. The conductive trace includes a pad, a terminal and a signal post. The semiconductor device extends into a cavity in the thermal post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The thermal post extends upwardly from the base into a first opening in the adhesive, and the signal post extends upwardly from the terminal into a second opening in the adhesive. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal. | 03-03-2011 |
20110059578 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER, A SIGNAL POST AND A CAVITY - A method of making a semiconductor chip assembly includes providing a thermal post, a signal post and a base, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer, solidifying the adhesive, providing a conductive trace that includes a pad, a terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on the thermal post, wherein a heat spreader includes the thermal post and the base and the semiconductor device extends into a cavity in the thermal post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 03-10-2011 |
20110065241 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BUMP/BASE HEAT SPREADER AND A DUAL-ANGLE CAVITY IN THE BUMP - A method of making a semiconductor chip assembly includes providing a bump and a ledge, wherein the bump includes first, second and third bent corners that shape a cavity, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the ledge, providing a heat spreader that includes the bump, then mounting a semiconductor device on the bump within the cavity, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 03-17-2011 |
20110079811 | SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND DUAL-ANGLE CAVITY IN BUMP - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump that includes first, second and third bent corners that shape a cavity. The conductive trace includes a pad and a terminal. The semiconductor device is located within the cavity, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends into an opening in the adhesive and provides a recessed die paddle and a reflector for the semiconductor device. The conductive trace provides signal routing between the pad and the terminal. | 04-07-2011 |
20110089465 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER WITH ESD PROTECTION LAYER - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base, an ESD protection layer and an underlayer. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace, electrically isolated from the underlayer and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ESD protection layer is sandwiched between the base and the underlayer. The conductive trace provides signal routing between the pad and the terminal. | 04-21-2011 |
20110101410 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal. | 05-05-2011 |
20110104855 | Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer - A method of making a semiconductor chip assembly includes providing a post, a base, an ESD protection layer and a metal layer, wherein the post extends above the base and the ESD protection layer is sandwiched between the base and the metal layer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the ESD protection layer and an underlayer that includes at least a portion of the metal layer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 05-05-2011 |
20110104856 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/POST HEAT SPREADER - A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives and a base, wherein the first post extends from the base in a first vertical direction into a first opening in the first adhesive, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts, then flowing the first adhesive in the first vertical direction and the second adhesive in the second vertical direction, solidifying the adhesives, then providing a conductive trace that includes a pad and a terminal, wherein the pad extends beyond the base in the first vertical direction and the terminal extends beyond the base in the second vertical direction, providing a heat spreader that includes the posts and the base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 05-05-2011 |
20110151626 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS - A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives and a base, wherein the first post extends from the base in a first vertical direction into a first opening in the first adhesive and is located within a periphery of the second post, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts, then flowing and solidifying the adhesives, then providing a conductive trace that includes a pad and a terminal, wherein the pad extends beyond the base in the first vertical direction and the terminal extends beyond the base in the second vertical direction, providing a heat spreader that includes the posts and the base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 06-23-2011 |
20110156090 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive and is located within a periphery of the second post, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal. | 06-30-2011 |
20110163348 | SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND INVERTED CAVITY IN BUMP - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump and a base. The conductive trace includes a pad and a terminal. The semiconductor device is mounted on the bump opposite a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends from the base into an opening in the adhesive and the base extends laterally from the bump. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal. | 07-07-2011 |
20110171785 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BUMP/BASE HEAT SPREADER AND AN INVERTED CAVITY IN THE BUMP - A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then mounting a semiconductor device on the bump opposite a cavity in the bump, wherein a heat spreader includes the bump and a base that includes a portion of the ledge adjacent to the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 07-14-2011 |
20110175136 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND PLATED THROUGH-HOLE - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal and a plated through-hole. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the plated through-hole. | 07-21-2011 |
20110183472 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A PLATED THROUGH-HOLE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal, a plated through-hole and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 07-28-2011 |
20110198662 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND MULTILEVEL CONDUCTIVE TRACE - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace, a substrate and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal, a conductive pattern and first and second vias. The substrate includes the conductive pattern and a dielectric layer. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the conductive pattern and the vias. | 08-18-2011 |
20110201157 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A MULTILEVEL CONDUCTIVE TRACE - A method of making a semiconductor chip assembly includes providing a post and a base, mounting a second adhesive on the base, mounting a substrate with a conductive pattern on the second adhesive, mounting a first adhesive on the substrate and mounting a conductive layer on the first adhesive, then flowing the first adhesive upward between the post and the conductive layer and flowing the second adhesive upward between the post and the substrate, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal, the conductive pattern, first and second vias and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 08-18-2011 |
20110227122 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER WITH THERMAL VIA - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace, an adhesive and a support layer. The heat spreader includes a post, a base, an underlayer and a thermal via. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post, the support layer is sandwiched between the base and the underlayer and the thermal via extends from the base through the support layer to the underlayer. The conductive trace provides signal routing between the pad and the terminal. | 09-22-2011 |
20110275180 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER WITH A THERMAL VIA - A method of making a semiconductor chip assembly includes providing a post, a base, a support layer and an underlayer, wherein the post extends above the base and the support layer is sandwiched between the base and the underlayer, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive upward between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, providing a heat spreader that includes the post, the base, the underlayer and a thermal via that extends from the base through the support layer to the underlayer, then mounting a semiconductor device on the post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 11-10-2011 |
20110278638 | SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a dielectric base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive, the second post extends from the dielectric base in a second vertical direction into a second opening in the second adhesive and the dielectric base contacts and is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal. | 11-17-2011 |
20110287563 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/DIELECTRIC/POST HEAT SPREADER - A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer, the second post extends from the dielectric base in a second vertical direction into a second opening in the second adhesive and is aligned with a second aperture in the second conductive layer and the dielectric base is sandwiched between and extends laterally from the posts, then flowing the first adhesive in the first vertical direction and the second adhesive in the second vertical direction, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal and selected portions of the conductive layers, wherein the pad extends beyond the dielectric base in the first vertical direction and the terminal extends beyond the dielectric base in the second vertical direction, providing a heat spreader that includes the posts and the dielectric base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 11-24-2011 |
20120064672 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER AND A SUBSTRATE USING GRINDING - A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate, then flowing the adhesive between the post and the substrate in the aperture, solidifying the adhesive, then grinding the post and the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. | 03-15-2012 |
20120091493 | SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE/LEDGE HEAT SPREADER, DUAL ADHESIVES AND CAVITY IN BUMP - A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and dual adhesives. The heat spreader includes a bump, a base and a ledge. The conductive trace includes a pad and a terminal. The semiconductor device is mounted on the bump in a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The bump extends into an opening in the first adhesive and is aligned with and spaced from an opening in the second adhesive. The base and the ledge extend laterally from the bump. The first adhesive is sandwiched between the base and the ledge, the second adhesive is sandwiched between the conductive trace and the ledge and the ledge is sandwiched between the adhesives. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal. | 04-19-2012 |
20120094442 | METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BUMP/BASE/LEDGE HEAT SPREADER, DUAL ADHESIVES AND A CAVITY IN THE BUMP - A method of making a semiconductor chip assembly includes providing a bump and a ledge, mounting a first adhesive on the ledge including inserting the bump into an opening in the first adhesive, mounting a conductive layer on the first adhesive including aligning the bump with an aperture in the conductive layer, then flowing the first adhesive between the bump and the conductive layer, solidifying the first adhesive, then providing a heat spreader that includes the bump, a base and the ledge, then mounting a second adhesive on the ledge, mounting a conductive trace that includes a pad and a terminal on the second adhesive, then mounting a semiconductor device on the bump in a cavity in the bump, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader. | 04-19-2012 |
20120126401 | STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING - A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device. | 05-24-2012 |
20120129299 | METHOD OF MAKING THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY - A method of making a semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive and a build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry includes a dielectric layer and conductive traces on the semiconductor device and the flange. The conductive traces provide signal routing for the semiconductor device. | 05-24-2012 |
20120129300 | METHOD OF MAKING STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY - A method of making a stackable semiconductor assembly that includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry is disclosed. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device. | 05-24-2012 |
20130032388 | METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVITY SUBSTRATE MANUFACTURED THEREBY - The present invention relates to a method of making a cavity substrate. The method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier, an adhesive and an electrical pad, wherein the adhesive bonds the stiffener to the sacrificial carrier; forming a coreless build-up circuitry on the supporting board in contact with the bump and the stiffener; and removing the bump to form a cavity and expose the electrical pad from a closed end of the cavity, wherein the cavity is laterally covered and surrounded by the adhesive. A semiconductor device can be mounted on the cavity substrate and electrically connected to the electrical pad. The coreless build-up circuitry provides signal routing for the semiconductor device while the built-in stiffener can provide adequate mechanical support for the coreless build-up circuitry and the semiconductor device. | 02-07-2013 |
20130032938 | THREE DIMENSIONAL SEMICONDUCTOR ASSEMBLY BOARD WITH BUMP/FLANGE SUPPORTING BOARD, CORELESS BUILD-UP CIRCUITRY AND BUILT-IN ELECTRONIC DEVICE - A semiconductor assembly board includes a supporting board, a coreless build-up circuitry and a built-in electronic device. The supporting board includes a bump, a flange and a via hole in the bump. The built-in electronic device extends into the via hole and is electrically connected to the build-up circuitry. The build-up circuitry extends from the flange and the built-in electronic device and provides signal routing for the built-in electronic device. The supporting board provides mechanical support, ground/power plane and heat sink for the coreless build-up circuitry. | 02-07-2013 |
20130277832 | METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVITY SUBSTRATE MANUFACTURED THEREBY - The present invention relates to a method of making a cavity substrate. In accordance with a preferred embodiment, the method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier; forming a coreless build-up circuitry on the supporting board in contact with the bump and the stiffener; and removing the bump and a portion of the flange to form a cavity and expose a conductive via of the coreless build-up circuitry from a closed end of the cavity, wherein the cavity is laterally covered and surrounded by the adhesive. A semiconductor device can be mounted on the cavity substrate and electrically connected to the conductive via. The coreless build-up circuitry provides signal routing for the semiconductor device while the stiffener can provide adequate mechanical support for the coreless build-up circuitry and the semiconductor device. | 10-24-2013 |
20130292826 | METHOD OF MAKING SEMICONDUCTOR ASSEMBLY WITH BUILT-IN STIFFENER AND SEMICONDUCTOR ASSEMBLY MANUFACTURED THEREBY - The present invention relates to a method of making a semiconductor assembly. In accordance with a preferred embodiment, the method includes: preparing a dielectric layer and a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier and the dielectric layer covers the supporting board; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; then mounting a semiconductor device into the cavity; and then forming a build-up circuitry that includes a first conductive via in direct contact with the semiconductor device and provides signal routing for the semiconductor device. Accordingly, the direct electrical connection between the semiconductor device and the build-up circuitry is advantageous to high I/O and high performance, and the stiffener can provide adequate mechanical support for the build-up circuitry and the semiconductor device. | 11-07-2013 |
20130337648 | METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVITY - The present invention relates to a method of making a cavity substrate. In accordance with a preferred embodiment, the method includes: providing a sacrificial carrier and optionally an electrical pad that extends from the sacrificial carrier in the first vertical direction; providing a dielectric layer that covers the sacrificial carrier in the first vertical direction; removing a selected portion of the sacrificial carrier; attaching a stiffener to the dielectric layer from the second vertical direction; forming a build-up circuitry from the first vertical direction; and removing the remaining portion of the sacrificial carrier to expose electrical contacts from the second vertical direction. A semiconductor device can be mounted on the cavity substrate and electrically connected to the electrical contacts within the built-in cavity of the cavity substrate. The stiffener can provide mechanical support for the build-up circuitry and the semiconductor device. | 12-19-2013 |
20140048313 | THERMALLY ENHANCED WIRING BOARD WITH THERMAL PAD AND ELECTRICAL POST - A thermally enhanced wiring board with thermal pad and electrical post includes a metal slug, a metal pillar, a patterned interconnect substrate, an adhesive, a build-up circuitry and optionally a plated through hole. The metal slug and the metal pillar extend into apertures of the patterned interconnect substrate and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slug, the metal pillar and the patterned interconnect substrate and can provide signal routing. The metal slug can provide thermal contact surface, and the metal pillar can serve as power/ground plane or signal vertical transduction pathway. | 02-20-2014 |
20140048319 | WIRING BOARD WITH HYBRID CORE AND DUAL BUILD-UP CIRCUITRIES - A wiring board with built-in metal slugs includes a dielectric hybrid core and build-up circuitries. The metal slugs extend into apertures of a stiffener of the hybrid core and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slugs and the stiffener and provides signal routing. The metal slugs can serve as power and ground planes for the wiring board. | 02-20-2014 |
20140048324 | HYBRID WIRING BOARD WITH BUILT-IN STOPPER, INTERPOSER AND BUILD-UP CIRCUITRY - A hybrid wiring board includes an interposer, a stopper, a stiffener and a build-up circuitry. The stopper is laterally aligned with and laterally extends beyond peripheral edges of the interposer in lateral directions. The interposer extends into an aperture of the stiffener and is electrically connected to the build-up circuitry. The build-up circuitry covers the stopper, the interposer and the stiffener and provides signal routing for the interposer. The stiffener provides mechanical support, ground/power plane and heat sink for the build-up circuitry. | 02-20-2014 |
20140048326 | MULTI-CAVITY WIRING BOARD FOR SEMICONDUCTOR ASSEMBLY WITH INTERNAL ELECTROMAGNETIC SHIELDING - A multi-cavity wiring board includes a coreless substrate, an adhesive, and a stiffener having a plurality of apertures with lateral shielding sidewalls. The coreless substrate covers the stiffener and includes electrical pads exposed from the apertures of the stiffener as electrical contacts for semiconductor devices packaged within the apertures. The aperture sidewalls of the stiffener can serve as effective lateral electromagnetic shields for the semiconductor devices within the apertures. | 02-20-2014 |
20140048914 | WIRING BOARD WITH EMBEDDED DEVICE AND ELECTROMAGNETIC SHIELDING - In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a shielding frame, a semiconductor device, a stiffener, a first build-up circuitry and a second build-up circuitry with a shielding lid. The first and second build-up circuitries cover the semiconductor device, the shielding frame and the stiffener in the opposite vertical directions. The shielding frame and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the first build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor devices within the aperture of the stiffener. | 02-20-2014 |
20140048916 | WIRING BOARD WITH SHIELDING LID AND SHIELDING SLOTS AS ELECTROMAGNETIC SHIELDS FOR EMBEDDED DEVICE - In a preferred embodiment, a wiring board with embedded device and electromagnetic shielding includes a semiconductor device, a core layer, a shielding lid, shielding slots and build-up circuitry. The build-up circuitry covers the semiconductor device and the core layer. The shielding slots and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor devices. | 02-20-2014 |
20140048944 | INTERCONNECT SUBSTRATE WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAME - The present invention relates to an interconnect substrate with an embedded device, a built-in stopper and dual build-up circuitries and a method of making the same. In accordance with one preferred embodiment of the present invention, the method includes: forming a stopper on a dielectric layer; mounting a semiconductor device on the dielectric layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the dielectric layer; forming a first build-up circuitry and a second build-up circuitry that cover the semiconductor device, the stopper and the stiffener at both sides; and providing a plated through-hole that provides an electrical connection between the first and second build-up circuitries. Accordingly, the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry. | 02-20-2014 |
20140048949 | THERMALLY ENHANCED INTERCONNECT SUBSTRATE WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAME - The present invention relates to a thermally enhanced interconnect substrate and a method of making the same. In accordance with one preferred embodiment, the method includes: forming a stopper on a metal layer of a laminate substrate; removing a selected portion of the metal layer to form a paddle layer; mounting a semiconductor device on the paddle layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the laminate substrate; forming first and second build-up circuitries that cover the semiconductor device, the paddle layer and the stiffener at both sides; and providing a plated through-hole that provides an electrical connection between the first and second build-up circuitries. Accordingly, the paddle layer can provide excellent heat spreading, and the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry. | 02-20-2014 |
20140048950 | THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAME - The present invention relates to a thermally enhanced semiconductor assembly and a method of making the same. In accordance with one preferred embodiment, the method includes: forming a stopper on a metal layer; mounting a semiconductor device on the metal layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the metal layer; forming a build-up circuitry that covers the stopper, the semiconductor device and the stiffener; providing a plated through-hole that provides an electrical connection between the build-up circuitry and the metal layer; and removing selected portions of the metal layer to form a thermal pad and a terminal. Accordingly, the thermal pad can provide excellent heat spreading, and the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry. | 02-20-2014 |
20140048951 | SEMICONDUCTOR ASSEMBLY WITH DUAL CONNECTING CHANNELS BETWEEN INTERPOSER AND CORELESS SUBSTRATE - A semiconductor assembly includes a semiconductor device, a through-via interposer, a coreless substrate and a stiffener. The semiconductor device is flip mounted on the interposer, and the interposer is affixed on the coreless substrate by adhesive and extends into an aperture of a stiffener which provides mechanical support for the coreless substrate. The electrically connection between the interposer and the coreless substrate includes bond wire and conductive micro-via. The coreless substrate can provide fan-out routing for the interposer. | 02-20-2014 |
20140048955 | SEMICONDUCTOR ASSEMBLY BOARD WITH BACK-TO-BACK EMBEDDED SEMICONDUCTOR DEVICES AND BUILT-IN STOPPERS - In a preferred embodiment, a semiconductor assembly board with back-to-back embedded devices and built-in stoppers includes an intermediate layer, a first stopper, a first semiconductor device, a first core layer, a second stopper, a second semiconductor device, a second core layer, a first build-up circuitry, a second build-up circuitry and a plated through hole. The first and second semiconductor devices are mounted on opposite surfaces of the intermediate layer using the first and second stoppers as placement guides that are laterally aligned with peripheral edges of the first and second semiconductor devices. The first and second core layers laterally cover the first and second semiconductor devices. The first and second build-up circuitries cover the semiconductor devices and the core layers in the opposite vertical directions and provide signal routing for the first and second semiconductor devices. | 02-20-2014 |
20140061877 | WIRING BOARD WITH EMBEDDED DEVICE, BUILT-IN STOPPER AND ELECTROMAGNETIC SHIELDING - In a preferred embodiment, a wiring board with embedded device, built-in stopper and electromagnetic shielding includes a stopper, a semiconductor device, a stiffener with shielding sidewalls, a first build-up circuitry and a second build-up circuitry with a shielding lid. The first and second build-up circuitries cover the semiconductor device, the stopper and the stiffener in the opposite vertical directions. The shielding sidewalls and the shielding lid are electrically connected to at least one ground contact pad of the semiconductor device by the first build-up circuitry and can respectively serve as effective horizontal and vertical electromagnetic shields for the semiconductor device within the aperture of the stiffener. | 03-06-2014 |
20140157593 | METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STOPPER, INTERPOSER AND BUILD-UP CIRCUITRY - The present invention relates to a method of making a hybrid wiring board with built-in stopper and interposer. In accordance with one preferred embodiment of the present invention, the method includes: forming a stopper on a dielectric layer; mounting an interposer on the dielectric layer using the stopper as a placement guide for the interposer; attaching a stiffener to the dielectric layer; and forming a build-up circuitry that covers the interposer, the stopper and the stiffener and provides signal routing for the interposer. Accordingly, the stopper can accurately confine the placement location of the interposer and avoid the electrical connection failure between the interposer and the build-up circuitry. | 06-12-2014 |
20140175633 | THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED CHIP AND INTERPOSER AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a method of making a thermally conductive semiconductor assembly. In accordance with a preferred embodiment, the method includes: providing a chip; providing an interposer that includes a through via, a first contact pad on a first surface and a second contact pad on an opposite second surface; electrically coupling the chip to the first contact pad of the interposer by a conductive bump or a wire; providing a heat sink with a cavity; then attaching the chip and the interposer on the heat sink using an adhesive with the chip inserted into the cavity; and then forming a build-up circuitry on the second surface of the interposer. Accordingly, the heat sink can provide essential thermal dissipation for the embedded chip, and the interposer and build-up circuitry can respectively provide first and second level fan-out routing/interconnection for the embedded chip. | 06-26-2014 |
20140183752 | SEMICONDUCTOR ASSEMBLY WITH BUILT-IN STOPPER, SEMICONDUCTOR DEVICE AND BUILD-UP CIRCUITRY AND METHOD OF MAKING THE SAME - The present invention relates to a semiconductor assembly with a built-in stopper and a method of making the same. In accordance with one preferred embodiment of the present invention, the method includes: forming a stopper on a dielectric layer; mounting a semiconductor device on the dielectric layer using the stopper as a placement guide for the semiconductor device; attaching a stiffener to the dielectric layer; and forming a build-up circuitry that covers the semiconductor device, the stopper and the stiffener and provides signal routing for the semiconductor device. Accordingly, the stopper can accurately confine the placement location of the semiconductor device and avoid the electrical connection failure between the semiconductor device and the build-up circuitry. | 07-03-2014 |
20140246227 | METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVITY SUBSTRATE MANUFACTURED THEREBY - The present invention relates to a method of making a cavity substrate. In accordance with a preferred embodiment, the method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier; then attaching an interconnect substrate to the supporting board using a dielectric layer; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; and then forming a via opening in the dielectric layer to expose a selected portion of the interconnect substrate. A semiconductor device can be mounted on the cavity substrate and electrically connected to the exposed portion of the interconnect substrate. The interconnect substrate provides signal routing for the semiconductor device while the stiffener can provide adequate mechanical support for the interconnect substrate and the semiconductor device. | 09-04-2014 |
20140251658 | THERMALLY ENHANCED WIRING BOARD WITH BUILT-IN HEAT SINK AND BUILD-UP CIRCUITRY - A thermally enhanced wiring board includes a heat sink, a stiffener and a build-up circuitry. The heat sink extends into an aperture of the stiffener and is thermally connected to the build-up circuitry. The build-up circuitry covers the heat sink and the stiffener and provides signal routing for the stiffener. The stiffener provides signal routing and mechanical support for the build-up circuitry. | 09-11-2014 |
20140291001 | METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND INTERPOSER AND HYBRID WIRING BOARD MANUFACTURED THEREBY - The present invention relates to a method of making a hybrid wiring board. In accordance with a preferred embodiment, the method includes: preparing a dielectric layer and a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier and the dielectric layer covers the supporting board; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; then mounting an interposer into the cavity; and then forming a build-up circuitry that includes a first conductive via in direct contact with the interposer and provides signal routing for the interposer. Accordingly, the direct electrical connection between the interposer and the build-up circuitry is advantageous to high I/O and high performance, and the stiffener can provide adequate mechanical support for the build-up circuitry and the interposer. | 10-02-2014 |