Patent application number | Description | Published |
20100000779 | BONDED STRUCTURE AND METHOD OF PRODUCING THE SAME - The invention provides a bonded body including: a ceramic base that is mainly composed of alumina, includes a printed electrode embedded therein and composed of a high-melting-point conductive carbide and alumina, and has a concavity concaved at one surface concaved toward the printed electrode, and a terminal hole extending from the bottom of the concavity to the printed electrode; a terminal that is made of a sintered body of niobium carbide (NbC) /alumina (Al | 01-07-2010 |
20150353428 | Insulating Substrates Including Through Holes - It is provided an insulating substrate including through holes | 12-10-2015 |
20150357221 | Handle Substrate and Composite Wafer for Semiconductor Device - In a handle substrate for a composite wafer for a semiconductor, particles from the wafer with a notch formed therein are reduced. The handle substrate | 12-10-2015 |
20150364548 | Handle Substrates of Composite Substrates for Semiconductors, and Composite Substrates for Semiconductors - A handle substrate of a composite substrate for a semiconductor is provided. The handle substrate is composed of polycrystalline alumina. The handle substrate includes an outer peripheral edge part with an average grain size of 20 to 55 μm and a central part with an average grain size of 10 to 50 μm. The average grain size of the outer peripheral edge part is 1.1 times or more and 3.0 times or less of that of the central part of the handle substrate. | 12-17-2015 |
20160005643 | Handle Substrate, Composite Substrate for Semiconductor, and Semiconductor Circuit Board and Method for Manufacturing the Same - It is provided a handle substrate of a composite substrate for a semiconductor. The handle substrate is composed of a translucent polycrystalline alumina. A purity of alumina of the translucent polycrystalline alumina is 99.9% or higher, an average of a total forward light transmittance of the translucent polycrystalline alumina is 60% or higher in a wavelength range of 200 to 400 nm, and an average of a linear light transmittance of the translucent polycrystalline alumina is 15% or lower in a wavelength range of 200 to 400 nm. | 01-07-2016 |
20160007461 | Insulating Substrates Including Through Holes - It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 μm, and a diameter of the through hole is 20 to 100 μm. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 μm in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 μm. | 01-07-2016 |