Patent application number | Description | Published |
20090244849 | HEAT DISSIPATION DEVICE - A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device. | 10-01-2009 |
20090303718 | LED LAMP - An LED lamp includes a lamp cover consisting of a plurality of sector-shaped connecting bodies, a plurality of fins attached to the lamp cover and a plurality of LED modules attached to the lamp cover and opposing the fins. A locking device is pivotably mounted to the lamp cover and comprises a supporting pole extending in the lamp cover, a plurality of branches pivotably mounted to the lamp cover and the supporting pole. The branches are movable along the supporting pole to be locked at a desired position, whereby an illumination angle of the LED modules of the lamp cover relative to the supporting pole is changeable via movement of the branches along the supporting pole of the locking device. Thus, an illumination area and an illumination intensity of the LED lamp are adjustable. | 12-10-2009 |
20090314465 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan. | 12-24-2009 |
20090316358 | HEAT DISSIPATION DEVICE WITH A FAN HOLDER ATTACHED WITH A POSITION-ADJUSTABLE AIR GUIDING MEMBER - A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink. | 12-24-2009 |
20100000715 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a sleeve coupling with the base, and a fastener engaging with the base and the sleeve. The base defines a hole extending therethrough. The sleeve includes a first portion coupling with the hole of the base and a second portion extending from an end of the first portion. The second portion is located at a first side of the base. The fastener includes a body portion extending through the sleeve and the base, a head portion and a foot portion formed at two ends of the body portion, respectively. The head portion is located at the first side of the base. A spring member is compressed between the head portion and the second portion. A compressed length of the spring member is adjustable by adjusting a coupling length of the first portion with the hole of the base. | 01-07-2010 |
20100002381 | HEAT DISSIPATION DEVICE AND METHOD FOR MOUNTING THE SAME - A heat dissipation device used for dissipating heat generated by an electronic device comprises a base defining two cutouts recessed from two opposite sides thereof, two fasteners mounted in through holes of the base via the two cutouts and two elastic members coiled around the two fasteners. Each of the two fasteners comprises a shaft, a head and a threaded pole located at two ends of the shaft, a latching portion interconnecting the shaft and the threaded pole and a mounting portion which is formed on the shaft and located a distance above the latching portion. The mounting portion extends through the cutout and makes the elastic member be sandwiched elastically between the head and a top face of the base. The latching portion abuts against a bottom face of the base, thereby the two fasteners being mounted on the base. | 01-07-2010 |
20100116462 | HEAT DISSIPATION SYSTEM - A heat dissipation system comprises a printed circuit board and at least a heat dissipation device mounted on the printed circuit board for dissipating heat generated by an electronic member mounted on the printed circuit board. The at least a heat dissipation device comprises a base, a plurality of fins extending upwardly from the base and an air guiding member located at a corner of the base. These fins are spaced from each other to define a plurality of heat exchange passages. Non-fins are disposed at a side of the base to define a cooling air passage. The cooling air passage is parallel to the heat exchange passages of the fins. The air guiding member is located in the cooling air passage for controlling open and close of the cooling air passage. | 05-13-2010 |
20100239385 | LOCKING DEVICE AND ELECTRONIC DEVICE USING THE SAME - An electronic device comprises a printed circuit board, a heat sink and a plurality of locking devices securing the heat sink to the printed circuit board. Each locking device comprises a shaft, a knob and an elastic member. The shaft has a plurality of outer teeth protruding outwardly from an outer surface of a top end thereof. The outer teeth are arranged along an axial direction of the shaft. The knob has an inner tooth meshing with the outer teeth of the shaft. The elastic member is compressed between a bottom of the knob and the heat sink. A length of the elastic changes when the inner tooth of the knob meshes with different outer teeth along the axial direction of the shaft to adjust a pressure of the locking device on the heat sink. | 09-23-2010 |
20100259897 | HEAT DISSIPATION DEVICE - A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader. | 10-14-2010 |
20100314073 | HEAT DISSIPATION DEVICE AND CLIP ASSEMBLY THEREOF - A heat dissipation device includes a heat sink, a positioning member and a wire clip. The heat sink includes a base and a plurality of fins. Two of the fins each form a hook. The positioning member includes a seat and two positioning arms each forming two opposite fingers. A receiving groove is defined under the seat, and a positioning slot is defined through a central portion of the seat. The seat is laterally sandwiched between the two fins and vertically sandwiched between the base and the hooks. Each of the two fins is sandwiched between the two fingers. The wire clip includes a resisting portion forming a protrusion and two clipping arms. The resisting portion rests on the base and is received in the receiving groove. The protrusion is received in the positioning slot. | 12-16-2010 |
20110032680 | HEAT SINK ASSEMBLY HAVING CLIP - A clip is adapted for securing a heat sink on a printed circuit board (PCB). The clip includes a linking portion, an operating portion, a handle, and a pressing portion. The linking portion is located at a lateral side of the heat sink. The operating portion pivotally engages with the linking portion and the heat sink. The handle connects the operating portion. The pressing portion connects the linking portion. A fastener mounted on the PCB extends through the heat sink and the pressing portion. The pressing portion is slidable from a first position to a second position. When the pressing portion is in the second position the handle is operable to drive the operating portion to move upwardly and urge the pressing portion to move along the fastener until the pressing portion abuts against a top portion of the fastener and simultaneously presses the heat sink. | 02-10-2011 |
20120057278 | CONSUMER ELECTRONIC PRODUCT ASSEMBLY WITH BRACKET - A consumer electronic product assembly includes a consumer electronic product and a bracket holding the consumer electronic product. The bracket includes a supporting seat, a holding member and a connecting bar. The holding member holds the consumer electronic product. Opposite ends of the connecting bar hinge on the holding member and the supporting seat, respectively. The connecting bar is rotatable with respect to the supporting seat, and the holding member is rotatable with respect to the connecting bar, whereby the consumer electronic product held by the holding member can be adjusted to various positions with respect to the supporting seat. | 03-08-2012 |
20120087069 | ELECTRONIC DEVICE ASSEMBLY WITH TWO-PART BRACKET - An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation. | 04-12-2012 |
20120312509 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base; and a heat pipe including an evaporating section sandwiched between the first base and the second base, a condensing section sandwiched between the second base and the fin set, and a connecting section interconnecting the evaporating section and the condensing section. | 12-13-2012 |
20120318481 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base, a first heat pipe and a second heat pipe. The first heat pipe includes a first evaporating section sandwiched between the first base and the second base, a first condensing section sandwiched between the second base and the fin set, and a first connecting section interconnecting the first evaporating section and the first condensing section. The second heat pipe includes a second evaporating section located adjacent to a bottom end of the fin set, a second condensing section located adjacent to a top end of the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section. | 12-20-2012 |
20130048251 | HEAT DISSIPATION DEVICE INCORPORATING HEAT SPREADER - An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat spreader and a fin set placed on the heat spreader. The heat spreader includes a base, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board. A first chamber is defined between the base and the partition board, and a second chamber is defined between the partition board and the covering plate. | 02-28-2013 |