Patent application number | Description | Published |
20080305427 | Lithographic Printing Plate - It relates to a processless lithographic printing plate requiring no post treatments after exposure to laser, wherein a difference between the lightness (L*1) of a laser unexposed area and the lightness (L*2) of a laser exposed area after irradiation with laser is 10□(L*2−L*1)<100. An object of the present invention is to provide plate bodies having excellent printing plate inspection in a lithographic printing plate in which drawing with laser light and processless are realized. When the lithographic printing plate of the present invention is used, it is possible to provide a processless lithographic printing plate, which is excellent in sensitivity and resolution, requires no treatments such as development, wiping-off or the like and is excellent in printing plate inspection in the laser exposed area by changing only the surface of the laser exposed area into the oleophilicity. | 12-11-2008 |
20090087783 | Original plate for lithography, and resin composition for photosensitive layer in original plate for lithography - The present invention provides a precursor that may provide a lithographic printing plate having an excellent image forming capability and having not only good hydrophilicity in a non-image part but also excellent printing resistance. Specifically, the present invention provides a lithographic printing plate precursor having a photosensitive layer containing a hydrophilic polymer, a crosslinking agent, hydrophobic polymer particles and a photo-thermal converter, wherein the hydrophilic polymer does not substantially contain, in its polymer chain, any of alcoholic hydroxyl groups and carboxyl groups (for example, 1.5% or less by mol of the repeating units of the hydrophilic polymer contain an alcoholic hydroxyl or carboxyl group). | 04-02-2009 |
Patent application number | Description | Published |
20100255568 | CULTURING APPARATUS - A culturing apparatus has a culture vessel having a first elastic seal bonded on its upper surface and a culture space formed thereon, and a joint for supplying solution such as a medium to the culture vessel and a second elastic seal having microprojection formed at the lower face. The first elastic seal has a valve for supplying or discharging solution. The second elastic seal is formed with microprojection at the position corresponding to a valve for preventing a spill. The culture vessel and the joint are sucked between the first elastic seal and the second elastic seal, thereby forming an integral seeding device. | 10-07-2010 |
20110209815 | Manufacturing Method of Combined Sensor - A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer. | 09-01-2011 |
20120327493 | MIRROR DEVICE - In a biaxial mirror device where beams for connecting a first movable frame to a second movable frame and the second movable frame to a fixed frame pass a center of the mirror along an axis, an actuator for moving the second movable frame is composed of two first and second actuators and in a state that rotational angles of the movable frames are zero, the first actuator permits the second movable frame to start rotation and when it reaches a specific rotational angle, the second actuator permits the second movable frame to rotate, thus a large deflection angle is obtained even by the dissonance drive. | 12-27-2012 |
20130068020 | Combined Sensor and Method for Manufacturing the Same - An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors. | 03-21-2013 |
Patent application number | Description | Published |
20080221362 | Optically-active bis(alkynylphosphino) ethane-borane derivative and process for producing the same - An optically-active bis(alkynylphosphino)ethane-borane derivative represented by formula (1): | 09-11-2008 |
20090030200 | PROCESS OF PREPARING OPTICALLY ACTIVE ALLYL COMPOUND - Disclosed is a process of preparing an optically active allyl compound comprising asymmetrically coupling an allyl compound with an organic nucleophilic compound in the presence of a catalyst. The catalyst is preferably a transition metal complex compound having a phosphine ligand. The phosphine ligand is preferably a 2,3-bis(dialkylphosphino)pyrazine derivative. The pyrazine derivative is preferably a quinoxaline derivative. The transition metal is preferably palladium. | 01-29-2009 |
20090030231 | PROCESS OF PREPARING OPTICALLY ACTIVE B-HYDROXYCARBOXYLIC ACID DERIVATIVE - Disclosed is a process of preparing an optically active β-hydroxycarboxylic acid derivative comprising asymmetrically hydrogenating a β-keto compound in the presence of a catalyst comprising a transition metal complex compound having a 2,3-bis(dialkylphosphino)pyrazine derivative as a ligand. The pyrazine derivative is preferably a quinoxaline derivative, and the transition metal is preferably ruthenium. Preferred examples of the quinoxaline derivative are (S,S)-2,3-bis(tert-butylmethylphosphino)quinoxaline, (R,R)-bis(tert-butylmethylphosphino)quinoxaline, (S,S)-bis(tert-adamantylmethylphosphino)quinoxaline, and (R,R)-bis(adamantylmethylphosphino)quinoxaline. | 01-29-2009 |
Patent application number | Description | Published |
20090087206 | IMAGE FORMING APPARATUS AND IMAGE FORMING METHOD - An image forming apparatus includes: an image holding body that is rotatable, and holds a first toner image and a second toner image; an image forming unit that forms the first toner image and the second toner image on the image holding body; a transfer unit that transfers the first toner image onto a transfer medium; a cleaning unit that has a cleaning member for freely coming into contact with and separating from the image holding body, and that brings the cleaning member into contact with the image holding body so as to clean a residual toner remaining on a surface of the image holding body; and a cleansing control unit that controls forming the second toner image for cleaning the cleaning member, opposing between the cleaning member and the second toner image, and cleaning of the second toner image by the cleaning member that is in a contact state with the image holding body. | 04-02-2009 |
20120114395 | IMAGE FORMING APPARATUS AND COMPUTER READABLE MEDIUM STORING PROGRAM - An image forming apparatus includes a transfer member onto a front side of which an image is transferred, a rotary member around which the transfer member is wrapped, a guide member provided at an end portion of an axial direction of the rotary member, a regulating member, a first reference mark, a second reference mark, a first detector, a second detector, and a controller. The regulating member is located on a reverse side of the transfer member, and restricts skew of the transfer member by contacting the guide member. The first and second reference marks are on edge sides of the transfer member in the axial direction of the rotary member. The first and second detectors detect the first and second reference marks, respectively. The controller controls alignment of the image on the transfer member in accordance with a detection result of the first and second detectors. | 05-10-2012 |
Patent application number | Description | Published |
20080265706 | EMBEDDED MAGNET TYPE MOTOR - An embedded magnet type motor is disclosed. The rotor core of the motor has radially extending first accommodation holes and V-shaped accommodation holes. Each V-shaped accommodation hole includes a second accommodation hole and a third accommodation hole. A first gap is formed in each first accommodation hole. The first gap is not occupied by the corresponding first magnet. A second gap is formed in each second accommodation hole. The second gap is not occupied by the corresponding second magnet. A third gap is formed in each third accommodation hole at a radially outer portion. The third gap is not occupied by the corresponding third magnet. Each second gap and the adjacent third gap form one V-shaped gap. The angular width θa of each first gap and the angular width θb of each V-shaped gap are determined to satisfy the expression: 0.60<θa/θb<1.60. | 10-30-2008 |
20110140562 | MOTOR - A motor having a rotor and a stator is disclosed. The rotor is a consequent-pole rotor having a rotor core, a plurality of magnets, and a plurality of salient poles. The stator includes a plurality of teeth. A first auxiliary groove is formed in a surface of each salient pole that is opposed to the teeth. Each first auxiliary groove has first and second side surfaces facing each other in the circumferential direction. The first side surface is closer to a circumferential center of the salient pole than the second side surface. When the angle from the circumferential center line to the first side surface of each salient pole about the axis of the rotor is represented by KC1, the opening angle between the circumferential ends of the distal end of each tooth about the axis is represented by KA, and the opening angle between the circumferential ends of each salient pole about the axis is represented by KB, the following expression is satisfied: KC1=KA−KB/2. | 06-16-2011 |
20110148240 | MOTOR - A motor having a rotor and a stator is disclosed. The rotor is a consequent-pole rotor having a rotor core, a plurality of magnets, and a plurality of salient poles. The stator includes a stator core and multiphase coils. Each coil is wound about the teeth by distributed winding, in such a manner as to wind two or more consecutive teeth in single winding. The opening degree each of salient pole opposed to the distal ends of the teeth is set greater than or equal to twice the opening angle of the distal end of each tooth. | 06-23-2011 |
20110193440 | MOTOR - A motor having a rotor and a stator is disclosed. A motor having a rotor and as stator is disclosed. The rotor is a consequent-pole rotor having a rotor core, a plurality of magnets, and a plurality of salient poles. The stator includes a plurality of teeth. The stator is arranged to be opposite to the rotor with a gap along the radial direction. The gap between the stator and the rotor is set to satisfy an expression 1 | 08-11-2011 |
20110309707 | MOTOR - There is provided a motor including a rotor and a stator arranged outside the rotor in the radial direction. The rotor includes a rotor core, a plurality of magnets arranged at equal intervals in the circumferential direction of the rotor core and functioning as one magnetic pole, and salient poles integrated with the rotor core, each arranged between adjacent magnets and at a distance from the magnets. The salient poles function as the other magnetic pole. A stator has a stator core having a plurality of teeth extending in the radial direction of the stator and arranged at equal intervals in the circumferential direction, and multi-phase coils attached to the teeth. The plurality of salient poles are arranged to have center portions arranged at equal intervals in the circumferential direction, and each have an outer surface extending in the circumferential direction in a range of a predetermined opening angle having an axis of the rotor as a center. A first opening angle serving as an opening angle of an outer surface of a first salient pole is different from a second opening angle serving as an opening angle of an outer surface of a second salient pole. | 12-22-2011 |
20120001509 | MOTOR AND ROTOR - A motor including a stator and a rotor. The stator includes teeth and windings. Each tooth has a distal portion defined by a radially inward side of the stator. The rotor, which is arranged inward in the radial direction from the stator, includes a rotor core, magnets, and salient poles. Each salient pole is separated by a void from the magnet that is adjacent in the circumferential direction. The distal portion of each tooth is longer than a radially outward side of each magnet. | 01-05-2012 |
20120019089 | MOTOR - A motor including a rotor and a stator. The rotor includes a rotor core, magnet pole portions, and core pole portions. First magnetic pole portions, which are the magnet pole portions or the core pole portions, each include a first and second opposing parts arranged in an axial direction. Each first opposing part includes an auxiliary groove, and each second opposing part does not include an auxiliary groove. Where M (°) represents an open angle of the first magnetic pole portion, G (°) represents an open angle of the void, and L represents the number of teeth, an angle D | 01-26-2012 |
Patent application number | Description | Published |
20090081928 | BLASTING TREATING METHOD - A method of blasting hazardous substance or explosive in a pressure vessel is provided to improve efficiency while suppressing enlargement of the pressure vessel. To achieve it, the method includes an installing step of installing two or more articles to be treated at a certain spacing in the pressure vessel, an initial blasting step of blasting one of the articles to be treated, and a following blasting step of blasting the article to be treated next to the previously blasted article to be treated after a particular time from the instant of the previous blast. Each of the articles is blasted sequentially through the initial and following blasting steps. | 03-26-2009 |
20090095146 | PRESSURE-RESISTANT VESSEL AND BLASTING FACILITY HAVING THE SAME - An object of the present invention is to improve durability of a pressure vessel for blasting an article to be treated such as hazardous substance or explosive therein. The pressure vessel | 04-16-2009 |
20120024133 | BLAST TREATMENT METHOD AND BLAST TREATMENT DEVICE - A blast treatment method capable of performing blast treatment of a treatment subject with a simple structure, with high efficiency, and at low cost, while inhibiting scattering of harmful substances or the like to the outside. The method includes: inside disposing an inside explosive for blasting a treatment subject around the treatment subject; disposing an outside explosive having a detonation velocity greater than that of the inside explosive at a position outside the inside explosive; and detonating the outside explosive using an initiation device, and initiating the inside explosive by detonation of the outside explosive, thereby performing blast treatment of the treatment subject by initiation of the inside explosive. The outside explosive disposing includes arranging a cord-like explosive member containing the outside explosive and having a shape extending in one direction so that a detonation propagation velocity in a specific direction of the inside explosive initiated by the outside explosive is greater than a detonation propagation velocity in the specific direction of the inside explosive. | 02-02-2012 |
20120137860 | BLAST TREATMENT METHOD AND BLAST TREATMENT DEVICE - Provided is a blast treatment method that can be implemented simply and efficiently blast a treatment subject while preventing fragments of the subject from scattering outward. The blast treatment method is used to blast a treatment subject | 06-07-2012 |
20130160635 | BLAST TREATMENT METHOD AND BLAST TREATMENT DEVICE - A blast treatment method capable of more reliably treating an object to be treated which is accommodated in an outer container is provided. The blast treatment method includes: a step for spacing a plurality of blasting explosives ( | 06-27-2013 |
Patent application number | Description | Published |
20090079062 | SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE - A semiconductor package is provided. The semiconductor package includes: a package substrate on which a semiconductor device is mounted; a heat spreader at least bonded to a surface of the semiconductor device and having a thermal expansion coefficient value equal to or less than a thermal expansion coefficient value of the package substrate; a metal layer provided on a bonding face of the heat spreader bonded to the semiconductor device; and a solder layer formed between the metal layer and semiconductor device, and bonding the heat spreader to the semiconductor device. | 03-26-2009 |
20110042806 | MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a multi-chip module includes: securing a plurality of chips on a surface of a flat-shaped member through a solder bump; connecting the plurality of chips with each other by a bonding wire, at surfaces, opposite to the flat-shaped member side, of the plurality of chips; and electrically connecting the plurality of chips with a board, at the surfaces, opposite to the flat-shaped member side, of the plurality of chips. | 02-24-2011 |
20110042824 | MULTI-CHIP MODULE AND METHOD OF MANUFACTURING THE SAME - A multi-chip module includes a package board, a plurality of chips, and a wiring board. The plurality of chips are horizontally disposed on the package board. The plurality of chips are electrically connected with the package board, and respectively provided with via holes which penetrate through the plurality of chips. The plurality of chips are respectively provided with circuits at surfaces facing the package board. The wiring board is disposed on an opposite side to the package board across the plurality of chips. The wiring board includes a wiring pattern which is electrically connecting adjacent chips one another. The circuit is electrically connected to the wiring pattern through the via holes. | 02-24-2011 |
20110044015 | MULTICHIP MODULE AND METHOD FOR MANUFACTURING THE SAME - A multichip module comprising: a base substrate; a wiring board disposed on the base substrate and having a wiring pattern; an adhesive layer configured to bond the base substrate to the wiring board while maintaining an electrical connection between the base substrate and the wiring board; and a plurality of chips connected to a surface of the wiring board, the surface being opposite the adhesive layer, wherein, assuming that α is a coefficient of thermal expansion of the wiring board, β is a coefficient of thermal expansion of the base substrate, and γ is a coefficient of thermal expansion of the adhesive layer, the relationship α<γ<β is satisfied. | 02-24-2011 |
20110080717 | INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD - An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a conductive plate including a connection terminal to be electrically connected to a power supply terminal or a ground terminal of each of the first circuit board and the second circuit board, an insulating member wrapping the conductive plate except for the connection terminal, and a conductive member penetrating the insulating member to electrically connect a signal terminal of the first circuit board to a signal terminal of the second circuit board. | 04-07-2011 |
20110080718 | INTERCONNECT BOARD, PRINTED CIRCUIT BOARD UNIT, AND METHOD - An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a first conductive plate including a first connection terminal, a first insulating member wrapping the first conductive plate except for the first connection terminal, a second conductive plate including a second connection terminal, a second insulating member wrapping the second conductive plate except for the second connection terminal, an insulating substrate arranged between the first insulating member and the second insulating member, and a conductive member penetrating the first insulating member, the second insulating member and the insulating substrate. | 04-07-2011 |
20110089579 | MULTI-CHIP MODULE - A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board. | 04-21-2011 |
20110220398 | METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-MOUNTING BOARD, AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component. | 09-15-2011 |
20130341767 | SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate. | 12-26-2013 |
20140008114 | METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-MOUNTING BOARD, AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component. | 01-09-2014 |
20140193953 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE - A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate. | 07-10-2014 |
20140293566 | CIRCUIT BOARD AND ELECTRONIC DEVICE - A circuit board includes a substrate, a first ground electrode group, and a first pair of signal electrodes. The first ground electrode group includes a plurality of first ground electrodes, where each of the plurality of the first ground electrodes is disposed at a corresponding one of vertexes of a first rectangular area in a surface of the substrate. the first pair of signal electrodes is disposed in the first rectangular area and is arranged in a first direction parallel to a side of the first rectangular area. | 10-02-2014 |
20140376187 | PACKAGE MOUNTING STRUCTURE - A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate. | 12-25-2014 |
Patent application number | Description | Published |
20090101495 | Mn-CONTAINING COPPER ALLOY SPUTTERING TARGET GENERATING FEW PARTICLES - A Mn-containing copper alloy sputtering target is provided. The target generates a small number of particles and is used to form diffusion inhibiting films and seed films of interconnects of semiconductor devices simultaneously. The target is a Mn-containing copper alloy sputtering target that generates few particles, comprising a copper alloy containing 0.6 to 30 mass % of Mn with the balance consisting of copper and impurities, wherein the impurities are controlled to include a total of 40 ppm or less of metallic impurities, 10 ppm or less of oxygen, 5 ppm or less of nitrogen, 5 ppm or less of hydrogen, and 10 ppm or less of carbon. | 04-23-2009 |
20110192719 | SPUTTERING TARGET FOR FORMING THIN FILM TRANSISTOR WIRING FILM - This sputtering target for forming a thin film transistor wiring film has a composition including 0.1 at % to 5 at % of Mg, 0.1 at % to 10 at % of Ca, and the remainder being Cu and inevitable impurities. Either one or both of Mn and Al may further be included at a total amount in a range of 0.1 at % to 10 at %. 0.001 at % to 0.1 at % of P may further be included. | 08-11-2011 |
20120328468 | PROCESSED HIGH-PURITY COPPER MATERIAL HAVING UNIFORM AND FINE CRYSTALLINE STRUCTURE, AND PROCESS FOR PRODUCTION THEREOF - This worked high-purity copper material includes Cu having a purity of 99.9999% by mass or more, wherein an average crystal grain size is in a range of 20 μm or less, and in a grain size distribution of crystal grains, an area ratio of crystal grains having grain sizes that exceed 2.5 times the average crystal grain size is in a range of less than 10% of an area of the entire crystal grains. This method for producing a worked high-purity copper material includes: subjecting an ingot composed of high-purity copper having a Cu purity of 99.9999% by mass or more to hot forging at an initial temperature of 550° C. or higher, and then water-cooling the ingot; subsequently, subjecting the ingot to warm forging at an initial temperature of 350° C. or higher, and then water-cooling the ingot; subsequently, subjecting the ingot to cold cross-rolling at a total reduction ratio of 50% or more; and subsequently, subjecting the ingot to stress relief annealing at a temperature of 200° C. or higher. | 12-27-2012 |
Patent application number | Description | Published |
20090231809 | Electronic Apparatus - According to an aspect of the present invention, an electronic apparatus includes: a plurality of heat generating components; a plurality of heat sinks respectively provided for the plurality of heat generating components; | 09-17-2009 |
20110249403 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plate. | 10-13-2011 |
20120162957 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a first housing, a battery including a projection and configured to be attached to the first housing, a second housing including a display device and an end portion including a recess configured to correspond to the projection, a hinge configured to attach the second housing to the first housing rotatably between a first position in which a display screen of the display device is covered with the first housing and a second position in which the display screen is exposed, and a plurality of cables in the end portion of the second housing, the plurality of cables being arranged in a direction crossing a thickness direction of the second housing. | 06-28-2012 |
20120229982 | DISPLAY DEVICE AND ELECTRONIC DEVICE - According to one embodiment, a display device includes a housing, a circuit board device, a fan, a first wall portion, and a second wall portion. The housing includes an exhaust port. The circuit board device is housed in the housing and includes a circuit board having a first surface and a second surface, a first portion including the first surface, and a second portion including the second surface. The fan includes an ejection port and is housed in the housing at a position separated from the exhaust port to send cooling wind from the ejection port toward the first portion and the second portion. The first wall portion is located between the inner surface of the housing and the first portion, and constitutes a first ventilation path. The second wall portion is located between the inner surface of the housing and the second portion, and constitutes a second ventilation path. | 09-13-2012 |
20120250257 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a circuit board in the housing, a first back plate on the circuit board, a second back plate on the circuit board, and a connecting portion connecting the first back plate with the second back plate. | 10-04-2012 |
20130083253 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, a first radiating portion in the housing, a second radiating portion in the housing, a first heat pipe thermally connected to the first radiating portion, a second heat pipe including a portion crossing the first heat pipe, the second heat pipe thermally connected to the second radiating portion, and a fan configured to blow air to at least one of the first radiating portion and the second radiating portion. | 04-04-2013 |
20130308261 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes a housing, an engagement portion, a module, and a member. The engagement portion is on an inner surface of the housing. The module is in the housing. The member is configured to slide substantially in parallel with the inner surface of the housing in order to engage the engagement portion and to support the module from a side opposite to the inner surface of the housing. | 11-21-2013 |
Patent application number | Description | Published |
20100182209 | Helical antenna and in-vehicle antenna including the helical antenna - A helical antenna includes a ground plate, a first helical portion spirally wound perpendicular to the plate, a second helical portion spirally wound perpendicular to the plate and surrounding the first helical portion radially outward of the first helical portion, and a feeder circuit. The circuit includes an oscillator, a divider connected to the oscillator, a first phase shifter connected between a first output terminal of the divider and a feeding point of the first helical portion, and a second phase shifter connected between a second output terminal of the divider and a feeding point of the second helical portion. Length of one turn of the first helical portion is equal to a result of multiplication of a wavelength of oscillation of the oscillator by N. Length of one turn of the second helical portion is equal to a result of multiplication of the wavelength by M (M>N). | 07-22-2010 |
20110122038 | Deformed folded dipole antenna, method of controlling impedance of the same, and antenna device including the same - In a U-shaped deformed folded dipole antenna, a first parallel section having a feeding point includes first and second L-shape sections, and a second parallel section without a feeding point includes first and second opposing side portions and a connecting side portion coupling ends of the first and second opposing side portions. Portions of the first and second L-shape sections arranged in parallel with the first and second opposing side portions have a width W | 05-26-2011 |
20110215983 | Antenna device including helical antenna - In an antenna device, a first helical part of a first antenna and a second helical part of a second antenna is disposed in a dielectric body on a ground plane. Each helical part is helically wound up in a direction perpendicular to the ground plane and includes a plurality of one-turn portions. Each one-turn portion of the first helical part has a peripheral length of M times a wavelength λ of use, where M is a positive natural number. One of the one-turn portions of the second helical part closest to the ground plane has a peripheral length Ks that is N times the wavelength λ of use, where N is a positive natural number greater than M. One of the one-turn portions of the second helical part farthest away from the ground plane has a peripheral length Ke, and (M·λ)09-08-2011 | |
20130307747 | VEHICULAR ANTENNA - A vehicular antenna includes a transmitting antenna element, a receiving antenna element, a coupling portion, and an adjusting portion. The transmitting antenna element transmits a radio wave as a transmission wave. The receiving antenna element receives a radio wave as a receiving wave. The coupling portion electromagnetically couples a transmitting line through which the transmission wave passes with a receiving line through which the receiving wave passes. The adjusting portion adjusts, within the coupling portion, a mutual coupling amount between the transmission wave in the transmitting line and the receiving wave in the receiving line. The adjusting portion further adjusts a phase of the transmission wave to be coupled with the receiving wave by the coupling portion. | 11-21-2013 |
Patent application number | Description | Published |
20110139192 | SURFACE TREATMENT APPARATUS AND METHOD FOR SEMICONDUCTOR SUBSTRATE - In one embodiment, a surface treatment apparatus for a semiconductor substrate includes a holding unit, a first supply unit, a second supply unit, a third supply unit, a drying treatment unit, and a removal unit. The holding unit holds a semiconductor substrate with a surface having a convex pattern formed thereon. The first supply unit supplies a chemical solution to the surface of the semiconductor substrate, to perform cleaning and oxidation. The second supply unit supplies pure water to the surface of the semiconductor substrate, to rinse the semiconductor substrate. The third supply unit supplies a water repelling agent to the surface of the semiconductor substrate, to form a water repellent protective film on the surface of the convex pattern. The drying treatment unit dries the semiconductor substrate. The removal unit removes the water repellent protective film while making the convex pattern remain. | 06-16-2011 |
20110143541 | APPARATUS AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE - In one embodiment, an apparatus of treating a surface of a semiconductor substrate comprises a substrate holding and rotating unit, first to fourth supplying units, and a removing unit. A substrate holding and rotating unit holds a semiconductor substrate, having a convex pattern formed on its surface, and rotates the semiconductor substrate. A first supplying unit supplies a chemical onto the surface of the semiconductor substrate in order to clean the semiconductor substrate. A second supplying unit supplies pure water to the surface of the semiconductor substrate in order to rinse the semiconductor substrate. A third supplying unit supplies a water repellent agent to the surface of the semiconductor substrate in order to form a water repellent protective film onto the surface of the convex pattern. A fourth supplying unit supplies alcohol, which is diluted with pure water, or acid water to the surface of the semiconductor substrate in order to rinse the semiconductor substrate. A removing unit removes the water repellent protective film with the convex pattern being left. | 06-16-2011 |
20110143545 | APPARATUS AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE - In one embodiment, an apparatus of treating a surface of a semiconductor substrate comprises a substrate holding and rotating unit which holds a semiconductor substrate with a surface having a convex pattern formed thereon and rotates the semiconductor substrate, a first supply unit which supplies a chemical and/or pure water to the surface of the semiconductor substrate, and a second supply unit which supplies a diluted water repellent to the surface of the semiconductor substrate to form a water-repellent protective film on the surface of the convex pattern. The second supply unit comprises a buffer tank which stores the water repellent, a first supply line which supplies a purge gas to the buffer tank, a second supply line which supplies a diluent, a pump which sends off the water repellent within the buffer tank, a third supply line which supplies the water repellent sent off from the pump, and a mixing valve which mixes the diluent and the water repellent to produce the diluted water repellent. | 06-16-2011 |
20110269313 | SEMICONDUCTOR SUBSTRATE SURFACE TREATMENT METHOD - In one embodiment, a method for treating a surface of a semiconductor substrate is disclosed. The semiconductor substrate has a first pattern covered by a resist and a second pattern not covered by the resist. The method includes supplying a resist-insoluble first chemical solution onto a semiconductor substrate to subject the second pattern to a chemical solution process. The method includes supplying a mixed liquid of a water repellency agent and a resist-soluble second chemical solution onto the semiconductor substrate after the supply of the first chemical solution, to form a water-repellent protective film on a surface of at least the second pattern and to release the resist. In addition, the method can rinse the semiconductor substrate using water after the formation of the water-repellent protective film, and dry the rinsed semiconductor substrate. | 11-03-2011 |
Patent application number | Description | Published |
20090141531 | ASSOCIATIVE MEMORY AND SEARCHING SYSTEM USING THE SAME - Associative memories capable of outputting multiple reference data close to search data are provided. A memory array compares each of the multiple reference data with the search data in parallel and generates multiple comparison current signals representing the result of the comparison. A WLA converts the multiple comparison current signals into voltages. During the first cycle, the WLA detects the lowest voltage among the voltages as Winner and detects the remaining voltages as Loser. After the second cycle, based on feedback signals, the WLA detects all the voltages other than a voltage detected as Winner during the last preceding cycle, and detects the lowest voltage among the detected voltages as Winner and detects the remaining detected voltages as Loser. The WLA repeats these operations k times. | 06-04-2009 |
20100085790 | AMPLIFIER CIRCUIT AND ASSOCIATIVE MEMORY - An amplifier circuit according to the present invention includes a plurality of input nodes receiving a plurality of input voltages (VI | 04-08-2010 |
20100179976 | SEMICONDUCTOR DEVICE PERFORMING OPERATIONAL PROCESSING - A semiconductor device includes a decoder receiving first multiplier data of 3 bits indicating a multiplier to output a shift flag, an inversion flag, and an operation flag in accordance with Booth's algorithm, and a first partial product calculation unit receiving first multiplicand data of 2 bits indicating a multiplicand, a shift flag, an inversion flag, and an operation flag to select one of the higher order bit and lower order bit of the first multiplicand data based on the shift flag, invert or non-invert the selected bit based on the inversion flag, select one of the inverted or non-inverted data and data of a predetermined logic level based on the operation flag, and output the selected data as partial product data indicating the partial product of the first multiplier data and the first multiplicand data. | 07-15-2010 |
20100202178 | OFFSET REMOVAL CIRCUIT, ASSOCIATIVE MEMORY INCLUDING THE SAME, AND OFFSET VOLTAGE REMOVAL METHOD - An offset removal circuit ( | 08-12-2010 |
20100202684 | IMAGE SEGMENTATION APPARATUS AND IMAGE SEGMENTATION METHOD - A pixel-value detecting circuit ( | 08-12-2010 |
20130114322 | ASSOCIATIVE MEMORY - An associative memory that can reduce search errors is provided. An associative memory includes R distance/time conversion circuits DT | 05-09-2013 |
Patent application number | Description | Published |
20090059649 | SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC APPARATUS - A semiconductor memory device includes: a memory cell array with m memory cells arranged in a first direction and n memory cells arranged in a second direction in a grid, each memory cell having a capacitor part using a ferroelectric film, and also having a first terminal, a second terminal, and a third terminal; two or more first wirings connecting the first terminals of the m memory cells arranged in the first direction; two or more second wirings connecting the second terminals of the n memory cells arranged in the second direction; and two or more third wirings connecting the third terminals of the m memory cells, the third wirings including, from among unit blocks resulting from dividing the memory cell array into q sections in the first direction and r sections in the second direction, each unit block having s memory cells arranged in the first direction and t memory cells arranged in the second direction in a grid, first to t-th wiring parts connecting the s memory cells arranged in the first direction in a first unit block, first to t-th wiring parts connecting the s memory cells arranged in the first direction in a second unit block located next to the first unit block in the first direction, and connection wiring parts connecting the first to t-th wiring parts in the first unit block and the first to t-th wiring parts in the second unit block so that the wiring parts with the same level are not connected, and also connecting ends on the second unit block side of the wiring parts in the first unit block and ends on the first unit block side of the wiring parts in the second unit block, wherein the connection wiring parts are crossed between the first unit block and the second unit block. | 03-05-2009 |
20090310397 | FERROELECTRIC MEMORY DEVICE, METHOD FOR DRIVING FERROELECTRIC MEMORY DEVICE, AND ELECTRONIC EQUIPMENT - A ferroelectric memory device includes: a memory cell having a ferroelectric capacitor connected between a plate line and a bit line; a first node connected to the bit line through a charge transfer MISFET; a potential generation circuit that has a first capacitor having a first terminal connected to the first node and a first switching MISFET connected to a second terminal of the first capacitor, and is capable of setting the first node to a negative potential; and a sense amplifier connected to the second terminal of the first capacitor. When reading a charge stored in the ferroelectric capacitor, the potential generation circuit sets the first node at a negative potential and then sets the first switching MISFET to an off state, thereby setting the second terminal of the first capacitor to a floating state, and the sense amplifier amplifies a potential on the second terminal of the first capacitor in the floating state. | 12-17-2009 |
20110155910 | INFRARED DETECTION CIRCUIT, SENSOR DEVICE, AND ELECTRONIC INSTRUMENT - An infrared detection circuit includes a charge transferring transistor, a gate control circuit and a negative potential generating circuit. The charge transferring transistor is disposed between a read node configured to be connected to one end of an infrared detection element and a tank node to transfer an electric charge from the infrared detection element to the tank node. The gate control circuit is connected to a gate of the charge transferring transistor. The negative potential generating circuit is connected to the tank node to set the tank node to a negative electric potential when the charge transferring transistor transfers the electric charge. | 06-30-2011 |
Patent application number | Description | Published |
20110112712 | CARGO HANDLING CONTROLLER FOR CARGO HANDLING VEHICLE - A cargo handling controller includes a rotation speed setting unit, an engine control unit, a memory, a rotation speed detection unit, a deviation calculator, an assistance amount setting unit, and a generator-motor control unit. The deviation calculator calculates a deviation of a feedback control rotation speed, which is determined from a target engine rotation speed stored in the memory a predetermined time earlier, and an actual rotation speed of the generator-motor, which is detected by the rotation speed detection unit. The assistance amount setting unit obtains a generator-motor assistance amount in accordance with the deviation. The generator-motor control unit sends a drive signal that is in accordance with the generator-motor assistance amount to the generator-motor. | 05-12-2011 |
20110118922 | DRIVE CONTROLLER FOR CARGO HANDLING VEHICLE - A drive controller for a cargo handling vehicle including an engine, a generator motor, a cargo handling pump, a cargo handling actuator, a travel motor, and a battery. The drive controller includes an engine control unit, a rotation speed detection unit, a deviation calculation unit, and a power generation control unit. The engine control unit controls the engine in accordance with a command rotation speed. The rotation speed detection unit detects an actual rotation speed of the engine. The deviation calculation unit calculates a rotation speed deviation of the command rotation speed for the engine and the actual rotation speed of the engine. The power generation control unit controls the generator motor in accordance with the rotation speed deviation so as to limit power generated by the generator motor to drive the travel motor. | 05-19-2011 |
20110128662 | POWER SUPPLY CONTROL APPARATUS - A power supply control apparatus for controlling a power supply unit including a battery and a load is provided. The power supply control apparatus includes a main relay and a ground relay, a pre-charge relay, an inrush current limiting resistor, a first relay control section, and a time measurement section. The main relay and the ground relay are connected between the battery and the load. The pre-charge relay is connected in parallel with one of the main relay and the ground relay. The inrush current limiting resistor is connected in series with the pre-charge relay, and limits an inrush current from the battery to the load. The first relay control section temporarily turns ON the pre-charge relay and turns ON the main relay and the ground relay upon receiving a power supply connection request from the outside, and turns OFF the main relay and the ground relay upon receiving a power supply interruption request from the outside. The time measurement section chooses a time point in the period from when the pre-charge relay is turned ON to when it is turned OFF, and measures the elapsed time from the chosen time point. Before the elapsed time measured by the time measurement section reaches a predetermined reference period, the first relay control section does not turn OFF the main relay and the ground relay, but maintains the relays ON, even when receiving the power supply interruption request. | 06-02-2011 |
20110137502 | HYBRID INDUSTRIAL VEHICLE - A hybrid industrial vehicle including an engine, generator motor, battery, and a travel motor. A first generated power computation unit computes a deceleration rate based required generated power based on the travel power and charge power of the battery. A second generated power computation unit computes an actual power based required generated power based on used power used by the travel motor and the charge power of the battery. A generated power control unit controls the generator motor so that the generated power of the generator motor becomes equal to a total generated power determined from the deceleration rate based required generated power and actual power based required generated power. An engine rotation speed control unit controls rotation speed of the engine to be greater than or equal to a required cargo handling engine rotation speed. | 06-09-2011 |
20110137503 | TRAVEL CONTROLLER FOR INDUSTRIAL VEHICLE - A travel controller for a hybrid forklift includes an acceleration command reference value generation unit, an acceleration limit value generation unit, an acceleration command value determination unit, and a travel motor control unit. The acceleration command reference value generation unit obtains an acceleration command reference value. The acceleration limit value generation unit obtains an acceleration limit value that limits an acceleration command value to a range that prevents discharge power of the battery from exceeding a battery discharge power limit value. The acceleration command value determination unit determines the acceleration command value for the travel motor from the acceleration command reference value and the acceleration limit value. The travel motor control unit controls the travel motor with the acceleration command value. | 06-09-2011 |
20140331659 | INDUSTRIAL VEHICLE AND METHOD FOR CONTROLLING INDUSTRIAL VEHICLE - An industrial vehicle includes a hydraulic mechanism, an operation lever, and a pump, a hydraulic control valve unit, a lever operation detector, an internal combustion engine controller, and a valve controller that controls the hydraulic control valve unit. When the lever operation detector detects the operation of the operation lever under a situation in which a speed of the internal combustion engine is less than or equal to a predetermined speed, the valve controller operates the hydraulic control valve unit to discharge the hydraulic oil without supplying the hydraulic oil to the hydraulic mechanism and instructs the internal combustion engine controller to increase the speed of the internal combustion engine, and subsequently operates the hydraulic control valve unit to supply the hydraulic mechanism with the hydraulic oil. | 11-13-2014 |
20140336002 | INDUSTRIAL VEHICLE AND METHOD FOR CONTROLLING INDUSTRIAL VEHICLE - An industrial vehicle that includes an engine, a hydraulic actuator, a hydraulic pump, and an instruction member operated to instruct operation of the hydraulic actuator. A supply passage supplies hydraulic oil to the hydraulic actuator. A return passage returns return the hydraulic oil to an oil tank. A controller compares an engine speed and a predetermined comparison threshold value. When the engine speed is less than the comparison threshold value, the controller opens the return passage. The comparison threshold value includes a first threshold value and a second threshold value that is lower than the first threshold value. In response to the operation of the instruction member, the controller opens the return passage, performs revving control to increase the engine speed, and changes the comparison threshold value from the first threshold value to the second threshold value. | 11-13-2014 |