Patent application number | Description | Published |
20080197365 | LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively. | 08-21-2008 |
20080210967 | LIGHT EMITTING DIODE AND METHOD FOR MAKING THE SAME - A light emitting diode includes: a first semiconductor layer; a second semiconductor layer formed on the first semiconductor layer; a light-converting pattern of a phosphor material formed on the second semiconductor layer; and a reflective layer of a metallic material formed on the second semiconductor layer and enclosing the light-converting pattern. | 09-04-2008 |
20090015169 | Method for Driving an LED - A method for driving a light emitting diode (LED), which is operated at a prescribed constant driving voltage and a prescribed constant driving current such that the prescribed power consumption of the LED in a prescribed unit of time is the prescribed constant driving voltage times the prescribed constant driving current, comprises the step of supplying the LED with a driving pulse signal at a cycle equal to the prescribed unit of time, the driving pulse signal having a peak value equal to n times of current value of the prescribed constant driving current and a high voltage level duration of T/n′, wherein T is the prescribed unit of time, n and n′ both are positive integer excluding 0 and 1, and n/n′≦1, thereby the intensity of the light emitted from the LED can be increased by n times while the power consumption is kept unchanged. | 01-15-2009 |
20090015170 | Method for Driving LED - A method for driving a LED and to an illumination system comprising at least one LED. The LED is driven by a pulse signal, wherein the pulse signal comprises pulses of a duration of T/n, wherein T is the duration of a single pulse and the corresponding pause in between two consecutive pulses and n is at least 2, and the current value of the pulses is at least double as much as the nominal constant current of said LED. The light intensity is increased by n times while the power consumption is the same in comparison to driving that LED with a prescribed constant driving voltage and the prescribed constant driving current. | 01-15-2009 |
20090059527 | Heat dissipating device - A heat dissipating device includes a sealed container having hollow floors and floor-spacing assemblies. Each floor-spacing assembly includes hollow spacing walls. Each hollow spacing wall extends from a respective hollow floor and is spaced apart from an adjacent one of the hollow spacing walls of an adjacent one of the floor-spacing assemblies by an air gap. Each two adjacent ones of the hollow floors are interconnected through the hollow spacing walls disposed therebetween. The sealed container defines a liquid reservoir, a condensate reservoir, and a plurality of fluid passages extending through the hollow spacing walls and the hollow floors that are disposed between the liquid reservoir and the condensate reservoir. | 03-05-2009 |
20090194863 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME - A semiconductor package includes: a semiconductor substrate; an inner insulator layer formed on the substrate; at least one internal wiring extending from a front side of the substrate along one of lateral sides of the substrate to a rear side of the substrate; a first outer insulator layer disposed at the front side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole; and a second outer insulator layer disposed at the rear side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole which exposes a portion of the internal wiring. | 08-06-2009 |
20090283788 | Light-Emitting Diode Chip Package Body and Method for Manufacturing Same - A light-emitting diode chip package body with an excellent heat dissipation performance and a low manufacturing cost, and a packaging method of the same are disclosed. A LED chip package body is provided, the LED chip package body comprising: a LED chip having an electrode-side surface and at least two electrodes mounted on said electrode-side surface; an electrode-side insulating layer formed on said electrode-side surface of said LED chip and formed with a plurality of through-holes registered with corresponding said electrodes; a highly heat-dissipating layer formed in each of said through-holes of said insulating layer on said electrode-side surface; and a highly heat-conducting metal layer formed on said highly heat-dissipating layer in each of said through-holes. | 11-19-2009 |
20090321756 | LED Package Structure and Method of Packaging the Same - An LED package structure includes a first LED chip, a second LED chip arranged on the minor light-emitting surface of the first LED chip, a conductive unit connected between the electrode areas for parallel or serially connecting the two LED chips together, and two external electric conduction units for electrically connecting both the first and second electrode areas of the first LED chip with an external circuit. | 12-31-2009 |
20100109551 | Light Source Package - A light source package includes a metal base adapted for engaging a suitable electrical socket; a transparent housing assembled with the base so as to form together with the base an accommodating space; and a light-emitting unit mounted within the accommodating space. The light-emitting unit has an LED die, and the LED die is operatively disposed in the accommodating space such that the light emitted from all of the six surfaces of the LED die is completely collected for illumination. | 05-06-2010 |
20100141132 | LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME - The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker. | 06-10-2010 |
20100200870 | LIGHT-EMITTING DIODE DIE PACKAGE AND METHOD FOR PRODUCING SAME - The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space. | 08-12-2010 |
20110012138 | Light-Emitting Diode Die Packages and Methods for Producing Same - The present invention relates to a light-emitting diode die package. The LED die package includes a semiconductor base, at least two electrodes disposed on an electrode mounting surface of the semiconductor base, an insulation layer formed on the electrode-mounting surface and provided with two through holes for exposing the electrodes, a conductor-forming layer formed on the insulation layer and provided with two conductor-mounting holes in communication with the through holes, and conductor units formed within the through holes and the conductor-mounting holes in a manner electrically connected to the corresponding electrodes. The LED die package further includes a covering layer formed on a surface of the LED die opposite to the electrode-mounting surface and extending to an outer surface of the LED die. The covering layer is made of transparent material doped with phosphor powder. | 01-20-2011 |
20110073159 | Heat Dissipating Device and Module Using Same - The present invention relates to a heat dissipating device adapted for use in combination with a module provided with a mounting board. The heat dissipating device has a metallic heat-dissipating member including a body and a number of spaced-apart heat dissipating fins extending upwardly from the upper surface of the body. The body is formed at its central portion with a through hole adapted for receiving a protrusion block protruding from a back surface of the mounting board of the module opposite to a mounting surface on which electrical devices are mounted. The heat dissipating device further includes a pump unit, a fluid conduit and a fan unit disposed on the heat dissipating fins. | 03-31-2011 |
20110074296 | Light-Emitting Diode Illumination Apparatuses - The present invention relates to an LED illumination apparatus. The apparatus includes a body having a lower portion adapted for coupling to a power socket and an upper portion provided with a power source module accommodating chamber. A heat-dissipating module includes a funnel-shaped hollow case disposed at a top end of the upper portion and filled with a coolant fluid, wherein the hollow case has a small diameter open end adjacent to the body and a large diameter open end remote from the body. A light source module includes amounting substrate disposed at the small diameter open end, an LED mounted on the mounting substrate, and a power source module disposed within the power source module accommodating chamber in a manner electrically connected to and supplying working power to the LED. | 03-31-2011 |
20110291155 | Light-Emitting Diode Chip Package Body and Method for Manufacturing Same - A light-emitting diode chip package body with an excellent heat dissipation performance and a low manufacturing cost, and a packaging method of the same are disclosed. A LED chip package body is provided, the LED chip package body comprising: a LED chip having an electrode-side surface and at least two electrodes mounted on said electrode-side surface; an electrode-side insulating layer formed on said electrode-side surface of said LED chip and formed with a plurality of through-holes registered with corresponding said electrodes; a highly heat-dissipating layer formed in each of said through-holes of said insulating layer on said electrode-side surface; and a highly heat-conducting metal layer formed on said highly heat-dissipating layer in each of said through-holes. | 12-01-2011 |
20120018748 | LIGHT EMITTING DIODE DEVICE AND METHOD FOR FABRICATING THE SAME - A light emitting diode device includes: at least one light emitting diode chip, which includes a semiconductor unit, two electrodes that are disposed on an electrode-mounting surface of the semiconductor unit, a light-transmissive insulating layer that is disposed on the electrode-mounting surface and that has two via holes, a reflective metal layer disposed on a portion of the light-transmissive insulating layer, a protective insulating layer that is disposed on the reflective metal layer, a conductor-receiving insulating layer that has two conductor-receiving holes respectively in communication with the via holes, and two conductor units that are formed respectively in the conductor-receiving holes; and a light-transmissive envelope layer that covers a surface of the light emitting diode chip opposite to the electrode-mounting surface, that extends to cover outer lateral surfaces of the light emitting diode chip, and that is doped with a fluorescence powder. | 01-26-2012 |
20120018760 | LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME - A method for fabricating light emitting diode packages includes: providing a light emitting diode wafer which has a plurality of light emitting diode chips, each of the light emitting diode chips including a semiconductor unit that has p-type and n-type electrode regions, and two electrodes; forming a light-transmissive insulating layer on the light emitting diode chips; forming a reflective metal layer on a portion of the light-transmissive insulating layer; forming a layer of insulating material on the light-transmissive insulating layer and the reflective metal layer, and performing exposing and developing treatments to form the layer of insulating material into a plurality of protective insulating structures; forming a conductor-receiving insulating layer on the light-transmissive insulating layer and the protective insulating structures; and performing a cutting process to obtain a plurality of light emitting diode packages each having at least one of the light emitting diode chips. | 01-26-2012 |
20120061831 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME - A semiconductor package includes: a semiconductor substrate; an inner insulator layer formed on the substrate; at least one internal wiring extending from a front side of the substrate along one of lateral sides of the substrate to a rear side of the substrate; a first outer insulator layer disposed at the front side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole; and a second outer insulator layer disposed at the rear side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole which exposes a portion of the internal wiring. | 03-15-2012 |
20120068358 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME - A semiconductor package includes: a semiconductor substrate; an inner insulator layer formed on the substrate; at least one internal wiring extending from a front side of the substrate along one of lateral sides of the substrate to a rear side of the substrate; a first outer insulator layer disposed at the front side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole; and a second outer insulator layer disposed at the rear side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole which exposes a portion of the internal wiring. | 03-22-2012 |
20120153315 | LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively. | 06-21-2012 |
20120161168 | LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively. | 06-28-2012 |
20120161169 | LIGHT-EMITTING DIODE DIE PACKAGE AND METHOD FOR PRODUCING SAME - The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space. | 06-28-2012 |
20120161173 | LIGHT EMITTING DEVICE - A light emitting device includes: a chip-mounting base formed with a plurality of conductive contacts; a reflector mounted on the chip-mounting base and defining a central hole; a first light emitting chip mounted on the chip-mounting base within the central hole and in electrical contact with respective ones of the conductive contacts for generating light with a first primary wavelength; a second light emitting chip stacked on and in electrical contact with the first light emitting chip for generating light with a second primary wavelength different from the first primary wavelength; and an encapsulant filling the central hole and capable of converting the first and second primary wavelengths into first and second secondary wavelengths, respectively. | 06-28-2012 |
20120161189 | LIGHT-EMITTING DIODE DIE PACKAGE AND METHOD FOR PRODUCING SAME - The present invention relates to a light-emitting diode die package having an LED die and an accommodating housing. The LED die has a first doped layer doped with a p- or n-type dopant and a second doped layer doped with a different dopant from that doped in the first doped layer. Each of the first and second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is formed. The insulation layer is formed with exposure holes for exposing the electrodes corresponding thereto. Each of the exposure holes is formed inside with an electrically conductive linker. The accommodating housing has an open end through which an accommodating space is accessible. The LED die is positioned within the accommodating space in such a manner that the electrically conductive linker protrudes outwardly from the accommodating space. | 06-28-2012 |
20120170272 | LIGHT SOURCE PACKAGE - A light source package includes a metal base adapted for engaging a suitable electrical socket; a transparent housing assembled with the base so as to form together with the base an accommodating space; and a light-emitting unit mounted within the accommodating space. The light-emitting unit has an LED die, and the LED die is operatively disposed in the accommodating space such that the light emitted from all of the six surfaces of the LED die is completely collected for illumination. | 07-05-2012 |
20120261709 | LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME - The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker. | 10-18-2012 |
20120267648 | LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME - The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker. | 10-25-2012 |
20120267649 | LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME - The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker. | 10-25-2012 |
20120267675 | LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME - The present invention relates to an LED die package, which has a light-emitting diode die having a sapphire layer, a first doped layer doped with a p- or n-type dopant, and a second doped layer doped with a different dopant from that doped in the first doped layer. A surface of the sapphire layer opposite to the surface on which the first doped layer is disposed is formed with generally inverted-pyramidal-shaped recesses and overlaid with a phosphor powder layer. Each of the first and the second doped layers has an electrode-forming surface formed with an electrode, on which an insulation layer is disposed and formed with exposure holes for exposing the electrodes. The exposure holes are each filled with an electrically conductive linker. | 10-25-2012 |