Wu, Jhonghe City
Chang-Han Wu, Jhonghe City TW
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20090051769 | METHOD AND SYSTEM FOR REMOTE MONITORING AND SURVEILLANCE - A system for remote monitoring and surveillance is disclosed in this invention. The system comprises a plurality of cameras, a router, and a server. The cameras are connected with the router separately through a wired or wireless communication protocol. The router is connected with the server through a wireless communication protocol. The cameras capture scenes and convert the captured scenes into a plurality of image signals. The router uses a communication protocol to connect with the cameras, and the router transmits the image signals by a first wireless communication protocol. The server receives the image signals by the first wireless communication protocol, processes the image signals to obtain first images, and displays the first images. A method for remote monitoring and surveillance is also disclosed in this invention. | 02-26-2009 |
Chia-Chun Wu, Jhonghe City TW
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20080208458 | Multi-functional map displayer - A multi-functional map displayer is composed of an input interface, a display interface, and a transmission interface, wherein a longitude and latitude of a desired location can be entered on the input interface, and a signal of the entered longitude and latitude can be transmitted to internet through the transmission interface, such that a map of that location can be downloaded from the internet to the display interface, for displaying the map and other map-related data, allowing a user to save a memory space used for storing the complete map, and cost spent in purchasing map software of each place, and achieving purposes of providing the user to check, navigate, and ensuring a safe trip. | 08-28-2008 |
Hung-Chih Wu, Jhonghe City TW
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20100285715 | METHOD OF MANUFACTURING CARBON NANOTUBE (CNT) FIELD EMISSION SOURCE - A method of manufacturing carbon nanotube (CNT) field emission source, comprising the following steps of: providing a substrate; disposing an electrode layer on substrate; applying a mixture on electrode layer by means of screen printing, and mixture is a mixture of CNT paste and carbon powder; performing sinter in proceeding with a heat cracking reaction, and the carbon cracked and obtained in a heat cracking reaction of carbon powder and polymer in CNT paste is used as a carbon source, and that is used to grow a CNT emission layer of a hedgehog-shaped CNT cluster structure, thus obtaining a cathode plate after completion of sinter process. The hedgehog-shaped CNT cluster structure is a carbon nanotube (CNT) emission layer capable of having multi-direction electron emission routes. As such, it can realize the characteristics of high current density, and low turn-on voltage, while raising the stability of electron field emission. | 11-11-2010 |
Kuan-Chun Wu, Jhonghe City TW
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20090188945 | SILICON GEL DISPENSING DEVICE - A silicon gel dispensing device has a barrel connected with a compressor and having a discharging tube, a container mounted inside the barrel and connected securely to the discharging tube and a driver mounted beside the barrel and having an extendable axle attached to a piston of the container. The axle selectively pushes the piston to keep the piston closely abutting the silicon gel inside the container. So that high-pressured air inside the barrel for pressuring the piston is hardly permeating through a slight gap formed between the container and piston. Thus bubbles mixed with the silicon gel are avoided and silicon gel residue and uneven application surface occurring due to bubbles are effectively prevented too. | 07-30-2009 |
Tsai Ying Wu, Jhonghe City TW
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20090320201 | SPA MACHINE WITH A PRESSURE-BALANCING WATERTIGHT ELECTRIC CONTROL DEVICE - A SPA machine includes a housing provided with a water sprayer, a water pump mounted in the housing for pumping water out of the water sprayer, and a pressure-balancing watertight electric control device formed of a box, watertight buttons, an electric control unit, a watertight panel and a locating frame and mounted the housing for controlling the operation of the water pump and having a variable inside space automatically regulated subject to the external water pressure to prevent water penetration and to avoid electric leakage. | 12-31-2009 |
Yi-Tsuo Wu, Jhonghe City TW
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20080254393 | Phosphor coating process for light emitting diode - A phosphor coating process for a light-emitting device is described. A light-emitting diode chip is bonded on a substrate. A light-sensitive layer is formed over the light-emitting diode and the substrate. The light-sensitive layer is patterned by a photolithography process to expose an area of the light-emitting diode chip, on which desires a phosphor coating. A phosphor-adhesive material is filled on the area of the light-emitting diode chip. | 10-16-2008 |
20090014739 | LIGHT-EMITTING DIODE PACKAGE STRUCTURE - The present invention is an improved Light-Emitting Diode (LED) package structure comprising a light-emitting diode chip, a package board of heat conductive semiconductor material, a lead frame, and a circuit. Whereon the package board installs plural thermal vias to conduct the electricity circuit and transmit the heat out of the package due to the LED luminescing as well. | 01-15-2009 |
20090072261 | LIGHT EMITTING DIODE DEVICE - A light emitting diode device includes a substrate, a light emitting diode chip, a plurality of wires, a plurality of lead frames, an insulating body, an encapsulant and a lens. The light emitting diode chip is electrically connected with a lead frame and the substrate. The substrate is electrically connected with another lead frame. Hence, the length of the wires can be decreased, and the reliability of the light emitting diode device can be improved. | 03-19-2009 |
20090168403 | LATERAL LIGHT-EMITTING DIODE BACKLIGHT MODULE - A lateral light-emitting diode backlight module includes a base, a circuit board, and at least a light emitting diode wherein the base having a heat conductor, the circuit board having a conductive pad formed on a surface thereof, and the circuit board disposed on the heat conductor and connected to the heat conductor. Each light emitting diode comprising a substrate, a heat sink fastened to the substrate and connected to the heat conductor, an LED chip disposed on the heat sink and emits light laterally, and a pin mounted on the substrate and extended to the conductive pad of the circuit board. | 07-02-2009 |
20100052001 | LED PACKAGING STRUCTURE - A light emitting diode packaging structure includes a package body, a red LED chip, a blue LED chip, a green LED chip, a package material and a yellow phosphor. Three LED chips are disposed within an accommodating room of the body package and covered by the package material. The yellow phosphor is uniformly mixed with the package material. A white light is formed by a mix of three types of light from the LED chips. Additionally, a yellow light which is generated from the excitement of the yellow phosphor with the blue light is mixed with a part of the blue light to further form the white light. | 03-04-2010 |
20110140157 | Light-Emitting Diode Backlight Module - A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally. | 06-16-2011 |